JP3315155B2 - Printed circuit board manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board, and more particularly to a method for manufacturing a printed circuit board, in which a plurality of printed circuit boards are integrally formed and electronic components are mounted on each printed circuit board. The present invention relates to an improved technique of a method of manufacturing a printed circuit board for separating printed wiring boards.

[0002]

2. Description of the Related Art As is well known, the external shape of a printed wiring board is determined from the relationship between the shape of the equipment used and the available space, etc., and thus has various shapes. However, in such various shapes, in the stage of manufacturing a printed wiring board, the use of raw materials is deteriorated, the manufacturing cost is increased, and the handling in manufacturing is complicated.

Therefore, for example, Japanese Patent Application Laid-Open No. 63-27419 discloses
As disclosed in Japanese Unexamined Patent Publication No. 3 (1999) -2003, at the stage of manufacturing a printed wiring board, a plurality of printed wiring boards are manufactured in an integrated state, and electronic components are mounted on each printed wiring board.
Techniques for separating printed wiring boards have been provided. According to this technique, by appropriately combining the external shapes of various types of printed wiring boards, the shapes are standardized at the manufacturing stage, so that material pick-up is improved and the handling in manufacturing is also improved.

However, in such a conventional method of manufacturing a printed circuit board, not only the above-mentioned advantages are exhibited at the stage of manufacturing a printed wiring board, but also when assembling electronic components, for example, a plurality of identical components can be used. Although the productivity can be improved because they can be simultaneously mounted on the printed wiring board, there are technical problems described below, particularly when separating the printed wiring boards after mounting the electronic components.

[0005]

That is, according to the manufacturing method disclosed in the above-mentioned publication, when a plurality of wiring boards are integrated at a manufacturing stage of the printed wiring board, a plurality of wiring boards are formed along the outline of each printed wiring board. In this method, intermittent slots are formed with the connecting parts left, and after mounting electronic components on each printed wiring board, the connecting parts are removed. The work was performed manually using tools, and the work efficiency was very poor.

Here, as a method of individually separating a plurality of integrated wiring boards after mounting electronic components, a V-shaped groove or an intermittent perforation is provided instead of a slot. However, even in such a method, the work of separating the wiring board is performed manually by the same method as described above, and the end face of the separated wiring board may need to be finished. Was desired.

As a method of improving the work efficiency of separating a plurality of integrated wiring boards, for example, it is conceivable to apply a pressing technique which is well known as an external processing technique of a printed wiring board. When this technology is applied to the separation method, for example, when a relatively hard material such as an epoxy resin laminate is used, a large impact is applied to the printed wiring board on which the components are mounted, and the pattern of the components and the wiring board is In practice, this could hardly be adopted due to the risk of damaging the solder joints connecting the devices and deteriorating the reliability of the connections.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and an object of the present invention is to provide a printed circuit capable of efficiently separating a plurality of integrated wiring boards after mounting electronic components. An object of the present invention is to provide a method for manufacturing a substrate.

[0009]

In order to achieve the above-mentioned object, the present invention provides a method for producing a plurality of printed wiring boards in an integrated state, mounting electronic components on each printed wiring board, and forming the plurality of printed wiring boards. In the method of manufacturing a printed circuit board for separating a printed wiring board, when separating the printed wiring board, a narrow slot continuous along the outline of the printed wiring board by a press device having a saw-toothed blade. To form
A manufacturing method for separating the printed wiring boards individually.
The serrated blades are located on the same circumference and
Includes multiple tips that gradually decrease inward
You .

According to a second aspect of the present invention, there is provided a printed circuit board for producing a plurality of printed wiring boards in an integrated state, mounting electronic components on each printed wiring board, and separating the plurality of printed wiring boards. In the manufacturing method, when creating the printed wiring board, forming an intermittent slot leaving a plurality of connecting portions along the outline of each printed wiring board,
When the printed wiring board is separated after mounting the electronic component, a manufacturing method for removing the connecting portion by a press device having a saw-toothed blade, wherein the saw-toothed blade has the same circumference.
Located on the top, the height gradually decreases inward from both ends
It has a plurality of tips .

[0011]

[0012]

According to the method of manufacturing a printed circuit board having the above structure,
When separating a printed wiring board on which electronic components are mounted,
A continuous narrow slot is formed along the outline of the printed wiring board with a press machine having a saw-toothed blade, and a plurality of printed wiring boards are individually separated. Concentrated at a plurality of tip portions of the blade, a narrow slot can be formed by a relatively small pressing force, and the pressing force of the pressing device is distributed to a plurality of portions of the saw-tooth blade, and In addition, since the pressing force of the press device can be reduced, the impact given to the printed wiring board when forming the slot becomes very small.

According to the second aspect of the present invention, when the printed wiring board on which the electronic components are mounted is separated, the only part to be removed by the pressing device having the saw-toothed blade is the connecting portion. It is possible to further reduce the pressing force of the press as compared with the method of (1) .

[0014] Furthermore, it is located on the same circumference,
Have multiple tips that gradually decrease inward
Since that employs a serrated blade will be pressure of the press in two places of the distal end portion is added to the printed wiring board, to cancel the moving force to the side of the printed circuit board due to pressure be able to.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. 1 to 4 show one embodiment of a method for manufacturing a printed circuit board according to the present invention. In the manufacturing method shown in the figure, first, as shown in an example in FIG. 1, a plurality of printed wiring boards are formed in an integrated state. In the example shown in FIG. 1, the two printed wiring boards 10 and 12 are formed in an integrated state, and the entire shape is substantially rectangular.

As described above, the plurality of printed wiring boards 10, 1
By integrating the two, the efficiency of taking the material of the laminated board is increased, and the standardization of the wiring board manufacturing process such as through-hole plating is performed. The manufacturing method of the printed wiring boards 10 and 12 is performed by a known etching method or the like. In this case, in this embodiment, an intermittent slot 16 leaving a plurality of connecting portions 14 is formed along the outline L of the printed wiring boards 10 and 12 (indicated by a two-dot chain line in FIG. 1). Have been.

The slot 16 is formed by a known working method such as a normal press working using a mold or a groove working using a router.
The length is about 1 to several mm, and the length of the connecting portion 14 is arbitrarily set in consideration of the weight of electronic components mounted near the connecting portion. When the manufacture of the integrated printed wiring boards 10 and 12 is completed, the printed wiring boards 10 and 12
The electronic component 18 such as a resistor, a capacitor, a coil, an IC, and a connector is mounted thereon, and solder bonding between the electronic component 18 and a pattern provided on the printed wiring boards 10 and 12 is performed by a flow solder.

At this time, the plurality of printed wiring boards 10, 1
Since the components 2 are integrated, the workability of component mounting is improved, and the occurrence of warpage and twisting when heated by a flow solder is reduced. When the mounting of the electronic component 18 is completed and its fixing by soldering is improved,
The integrated printed wiring boards 10 and 12 are separated.

In the present embodiment, the separation operation is performed by using a press device 20. FIG. 2 shows a state where the separation operation is performed by the press device 20. The press device 20 has an upper die 22 and a lower die 24.
The upper die 22 is provided with a holding frame 28 suspended by a spring 26 on the lower surface thereof, and a plurality of sawtooth blades 40 protruding from the lower surface thereof. As shown in the top view of FIG.
2, a shallow recess 32 corresponding to the mounting area of the component 18 and a deep recess 33 into which the blade 30 indents are formed corresponding to the position of the sawtooth blade 30, and the printed wiring board 10,
Twelve positioning pins 34 are implanted.

In this embodiment, the sawtooth blades 40 provided on the upper die 22 are provided with the printed wiring boards 10 and 12 shown in FIG.
Are provided corresponding to the positions of the connecting portions 14. FIG.
The details of the sawtooth blade 40 used in the present embodiment are shown. In the saw-toothed blade 40 shown in the figure, the length 1 is set slightly larger than the length of the corresponding connecting portion 14, and the width w is set to be substantially the same as the width of the slot 16. .

The serrated blade 40 has a flat surface 8
End portions 40a to 40h, and end portions 40 at both ends.
a, the height gradually decreases inward from 40h
ing. The tips 40a to 40h are located on the same circumference.
And the adjacent tips are semicircular arc surfaces 40.
i, the height difference δ between the tips is
G is set slightly larger than the thickness of the wiring boards 10 and 12.
I have.

When removing the connecting portions 14 of the printed wiring boards 10 and 12, the guide holes 19 provided in the printed wiring boards 10 and 12 are inserted into the pins 34 of the lower mold 24 in advance and positioned. In this state, the upper mold 22 is lowered,
The outer peripheral edges of the printed wiring boards 10 and 12 are pressed by the holding frame 28. When the upper die 20 is further lowered, the tips 40a to 40h of the saw-toothed blades 40 sequentially come into contact with the connecting portions 14 of the printed wiring boards 10, 12, and the wiring boards 10, 12
, And into the deep recess 33, the wiring boards 10, 12 are sheared and removed, whereby the plurality of printed wiring boards 10, 12 can be separated individually.

[0023] At this time, in this embodiment, pressure of the pressing device 20, the highest tip 4 0a of serrated blades 4 0, 40
h from the lower side to the lower side in order.
Therefore, the connecting portion 14 can be removed with a lower pressing force than a flat saw-tooth blade. Moreover, in this case, in this embodiment, the height difference δ between the tip portions is
Is slightly larger than the thickness of the printed wiring boards 10 and 12, so that when the printed wiring boards 10 and 12 are sheared, they are sequentially performed at one tip end, and the printed wiring The connecting portion 14 can be removed with little impact on the plates 10 and 12.

In the case of this embodiment, the saw-tooth blade 40
Are eight tip portions 40a to 40h formed on a flat surface.
, And inward from the tip portions 40a, 40h at both ends, respectively.
When the saw-tooth blade 40 having such a configuration is used, the pressing force of the press device 20 is always applied to the printed wiring boards 10 and 12 at the two tip portions. And the printed wiring board 1
The lateral moving forces of 0 and 12 can be offset, and the connection portion 14 can be more smoothly removed.

FIG . 5 shows a modification of the sawtooth blade shown in FIG.
Yes, in this example, the serrated blade 60 has five tips 60
a to 60f, and from the tip portions 60a and 60f at both ends.
The heights are gradually reduced inward. Each tip
The parts 60a to 60f are located on the same circumference and are adjacent to each other.
Are connected by a semi-circular arc surface 60g.
And the difference in height between the tips is
2 is set slightly larger than the thickness.

In the saw-toothed blade 60 shown in FIG . 5 , since each tip is sharply formed, the life is slightly inferior to that of the printed wiring boards 10 and 12;
When the plate thickness is small, it can be used without any problem, and the same operation and effect as the above embodiment can be obtained.

In the above embodiment, the printed wiring board 1
Although the case where the connecting portion 14 is provided at 0 and 12 and only this portion is removed with a saw-toothed blade is illustrated, the embodiment of the present invention is not limited to this, and the connecting portion 14 is not formed at all. It is also possible to form a continuous slot along the outline of the printed wiring boards 10 and 12 with a sawtooth blade and separate them individually.
You.

[0028]

As described above in detail in the embodiments,
ADVANTAGE OF THE INVENTION According to the manufacturing method of the printed circuit board which concerns on this invention, since the integrated printed wiring board can be isolate | separated by the press work after electronic component mounting which was hardly implemented conventionally, the great efficiency of a manufacturing process is large. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an integrated wiring board applied to a method of manufacturing a printed circuit board according to the present invention.

FIG. 2 is an explanatory diagram of a press device of the manufacturing method.

FIG. 3 is a top view of a lower die of the press device.

FIG. 4 is a perspective view of a sawtooth blade used in the press device.

FIG. 5 is a perspective view showing another example of the sawtooth blade used in the press device .

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/00 B26D 1/08 B26D 3/00

Claims (2)

(57) [Claims] 1. A method of manufacturing a printed circuit board, comprising: forming a plurality of printed wiring boards in an integrated state; mounting electronic components on each printed wiring board; and separating the plurality of printed wiring boards. A manufacturing method for forming a continuous narrow slot along the outline of the printed wiring board with a press device having a sawtooth blade when separating the printed wiring board, and separating the printed wiring boards individually. a is, the serrated blade, located on the same circumference, inward from both ends
A method of manufacturing a printed circuit board, comprising: a plurality of tip portions each of which gradually decreases in height toward . 2. A method of manufacturing a printed circuit board, comprising: forming a plurality of printed wiring boards in an integrated state; mounting electronic components on each printed wiring board; and separating the plurality of printed wiring boards. When creating a wiring board, forming an intermittent slot leaving a plurality of connecting portions along the outline of each printed wiring board, when separating the printed wiring board after mounting electronic components, A manufacturing method for removing the connecting portion by a press device having a saw-tooth blade , wherein the saw-tooth blade is located on the same circumference and inward from both ends.
A method of manufacturing a printed circuit board, comprising: a plurality of tip portions each of which gradually decreases in height toward .