JP3322979B2 - Imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus such as an optical printer head or an image reading apparatus such as an image sensor.

[0002]

2. Description of the Related Art A conventional image apparatus, for example, an image apparatus used for an image forming apparatus such as an optical printer head, is usually a lens made of a resin such as polycarbonate in which a plurality of lenses are linearly supported at predetermined intervals. A plate and a base plate made of a resin such as polycarbonate in which a large number of light emitting diode element arrays are linearly arranged and mounted on a pair of supports so that each lens and each light emitting diode element array correspond one to one. It has a fixed structure, and allows each light emitting diode element of each light emitting diode element array to selectively and individually emit light in accordance with an external electric signal, and the light emitted by the light emitting diode element is externally transmitted through a lens. By forming an image on the photosensitive member and forming a latent image on the photosensitive member, the device functions as an image forming apparatus.

Incidentally, the light emitting diode element array mounted linearly on the base plate generally has 64 light emitting diode elements linearly arranged therein, and is used in a B4 size image forming apparatus. When used, the light emitting diode element array is mounted on the base plate such that 32 of the light emitting diode elements correspond to the respective lenses on a one-to-one basis.

Each of the light emitting diode element arrays has a common electrode on the lower surface thereof. The common electrode is formed on a common electrode wiring previously formed on the upper surface of the base plate, for example, epoxy resin or silver powder. The common electrode is mounted on the base plate while electrically connecting the common electrode to the common electrode wiring by bonding via a conductive resin adhesive to which is added.

Further, each light-emitting diode element array mounted on the upper surface of the base plate has its individual electrode electrically connected to an individual electrode wiring formed on the upper surface of the base plate via a bonding wire. By connecting the common electrode wiring and the individual electrode wiring on the upper surface of the base plate to an external electric circuit, each light emitting diode element of the light emitting diode element array is electrically connected to the external electric circuit.

However, in this conventional image device, the individual electrodes provided on the light emitting diode element array are connected to the individual electrode wirings of the base plate via bonding wires, and the individual electrodes of the light emitting diode element array are several thousand. Since it is extremely large, it takes a long time to electrically connect the individual electrodes of the light emitting diode element array to the individual electrode wirings of the base plate, and the workability of the image device is poor, and the image device as a product is expensive. Had.

In the above-described embodiment, an image apparatus used for an image forming apparatus such as an optical printer head has been described as an example. However, an image reading apparatus such as an image sensor using a solid-state image sensor array is used. The imaging device used has the same disadvantages.

In order to solve the above-mentioned drawbacks, the applicant of the present invention firstly sets an image element array facing a lens between a first substrate having common electrode wiring and a second substrate having individual electrode wiring and a window. The light emitting / receiving portion of each image element array is arranged so as to face the window, the common electrode of each image element array is connected to the common electrode wiring of the first substrate, and the individual electrode is connected to the individual electrode wiring of the second substrate. Has proposed an image device connected by flip-chip connection.

According to such an image device, the individual electrodes of the image element array and the individual electrode wirings of the second substrate are flip-chip connected, that is, the second substrate is placed on the image element array mounted on the first substrate. Since the individual electrodes of the element array and the individual electrode wirings of the second substrate are placed so as to be in contact with each other, and the individual electrodes and the individual electrode wirings are connected by bonding via solder, the individual elements of the image element array are individually connected. Even if there are thousands of electrodes, all of them are connected to the individual electrode wirings of the second substrate at once and firmly, and as a result, the productivity of the image apparatus becomes extremely excellent.

[0010]

However, in this image apparatus, when flip-chip connecting each individual electrode of the image element array to the individual electrode wiring of the second substrate, there are thousands of individual electrodes of the image element array, and Electrode shape is 5
The image element array is sandwiched between the first substrate and the second substrate, and the contact state between each individual electrode of the image element array and the individual electrode wiring of the second substrate cannot be visually confirmed. For this reason, it is extremely difficult to accurately flip-chip connect the individual electrodes of the image element array to the individual electrode wirings of the second substrate, and it is easy to cause erroneous connection. If erroneous connection occurs, the image device can operate normally. The disadvantage of being unable to do so is induced.

In this image apparatus, the size of the second substrate is larger than that of the image element array mounted on the first substrate (about 25%).
Therefore, the second substrate is placed on the image element array mounted on the first substrate, and each individual electrode of the image element array is
When the flip-chip connection is made between the individual electrode wiring of the substrate and the second substrate, the inclination is easily generated. When the second substrate tilts, the individual electrodes of the image element array and the individual electrode wiring of the second substrate are securely connected. It is difficult to make a strong flip-chip connection, and the second substrate presses the upper corner of the image element array, causing damage such as chipping of the image element array and losing the function as an image device. Triggered.

Further, in this image apparatus, the image element array has a first
Since it is sandwiched between the substrate and the second substrate, when used as an image forming device or an image reading device, an external force that presses the image element array against one of the first substrate and the second substrate is used. Is applied, the external force easily causes breakage, such as chipping or cracking, of the image element array sandwiched therebetween, which also has the disadvantage that the function of the image device is easily lost.

Further, when the first substrate is formed of a low-rigidity material such as a polycarbonate resin, the image substrate may be subjected to thermal stress or thermal stress when used as an image forming apparatus or an image reading apparatus. When an external force is applied, deformation such as warpage or torsion easily occurs, and when deformation occurs in the first substrate, a positional shift occurs between the lens and the image element array arranged and mounted on the first substrate, When used as an image forming apparatus, a clear and accurate latent image cannot be formed on a photoreceptor, and when used as an image reading apparatus, an accurate electric signal corresponding to external image information cannot be generated. Having.

[0014]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to easily, reliably and firmly electrically connect each individual electrode of an image element array to a predetermined individual electrode wiring, and to provide a light emitting diode. The light emitted from the element can be accurately irradiated on the surface of the photoreceptor via the lens to form a latent image with high image quality on the photoreceptor, or external image information can be accurately coupled to the solid-state image sensor array via the lens. It is an object of the present invention to provide a highly reliable and inexpensive image device with good productivity, which can generate an image and generate an accurate electric signal corresponding to external image information in an individual image sensor array.

[0015]

According to the present invention, there is provided an image apparatus comprising a first substrate having a common electrode wiring on an upper surface, and a plurality of image element arrays having a light emitting / receiving section, a common electrode and individual electrodes formed on the first substrate. The common electrode wiring is connected and connected in a straight line so as to be connected via solder, and individual electrode wirings to be flip-chip connected to the individual electrodes are formed on the lower surface of the plurality of image element arrays. A second substrate mounted on the second substrate and having a window facing the light emitting and receiving unit, and a plurality of lenses supported thereon by a lens plate formed of the same material as the first substrate. An image device comprising a member, a spacer member including a metal material layer provided with a hole for individually accommodating the image element array between the first substrate and the second substrate, and an electrically insulating material layer. Intervene, and The insulating material layer is characterized in that for blocking the outflow of the solder is deposited on the lower surface of the metal material layer located in a region between the adjacent image element array.

[0016]

According to the image device of the present invention, the individual electrodes of the image element array are electrically connected to the individual electrode wirings provided on the second substrate by flip-chip connection. If any, all of them are connected to the individual electrode wirings of the second substrate at once and firmly, and as a result, the productivity of the image device becomes extremely excellent, and the image device as a product is It will be cheaper.
Further, according to the image apparatus of the present invention, a spacer member including a metal material layer provided with holes for individually accommodating a large number of image element arrays and an electrical insulating material layer is interposed between the first substrate and the second substrate. Since the electric insulating material layer is attached to the lower surface side of the metal material layer located in the region between the adjacent image element arrays, the outflow of the solder interposed between the common electrode and the common electrode wiring is performed. Can be satisfactorily interrupted by the electric insulating material layer. Therefore, when the common electrodes of a large number of image element arrays and the common electrode wiring on the first substrate are joined by soldering, the molten image elements are adjacent to each other. It is effectively prevented from spreading to the area between the arrays, and it is possible to reliably maintain electrical insulation between adjacent image element arrays and to accurately drive each image element array.

According to the image apparatus of the present invention, since the spacer member is interposed between the first substrate and the second substrate, the second substrate is placed on the image element array mounted on the first substrate. When the individual electrodes of the image element array are flip-chip connected to the individual electrode wirings of the second substrate, even if an inclination is caused due to the size of the second substrate being larger than the image element array, the inclination is Suppressed by the spacer member, it is always parallel, so that each individual electrode of the image element array can be securely and firmly flip-chip connected to the individual electrode wiring of the second substrate, and the second substrate can be connected to the image. It is possible to eliminate the possibility that the upper surface corner of the element array is pressed to cause breakage such as chipping of the image element array.

Further, according to the image device of the present invention, since the spacer member having the hole for accommodating the image element array is interposed between the first substrate and the second substrate, each individual electrode of the image element array can be used. When connecting to the individual electrode wiring of the second substrate by flip chip connection, the spacer member regulates the position of the image element array, and each individual electrode of the image element array is extremely easily connected to the predetermined individual electrode wiring of the second substrate. Flip chip connection can be reliably performed.

Further, according to the image apparatus of the present invention, since the lens plate of the lens member for supporting the plurality of lenses and the first substrate are formed of the same material, the lens plate is used when the image apparatus is used. Even if heat is applied to both the first substrate, the lens plate and the first substrate thermally expand by substantially the same amount, and are mounted on each lens supported by the lens plate and the first substrate. It is possible to effectively prevent a positional deviation from occurring between each image element array. Therefore, when this image apparatus is used in an image forming apparatus such as an optical printer head, the light emitted from the light emitting diode element is accurately and sharply imaged on the surface of the photoconductor through the lens, and a high quality latent image is formed by the photoconductor. It is possible to form an image.On the other hand, when this image device is used for an image reading device such as an image sensor, it is possible to accurately form external image information on a solid-state image sensor array via a lens. As a result, it is possible to generate an accurate electric signal corresponding to the image information.

[0020]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIGS. 1 to 4 show an embodiment in which the image apparatus of the present invention is applied to an optical printer head as an image forming apparatus, wherein 1 is an image element member, 5 is a lens member, and 8 is a support.

The image element member 1 comprises a first substrate 2, a plurality of light emitting diode element arrays 3, and a second substrate 4 having a window 4a in the center.

The first substrate 2 of the image element member 1 is made of, for example, a highly rigid material such as an aluminum oxide sintered body, crystallized glass, quartz, etc., which is unlikely to be deformed such as warpage or twist. A plurality of light emitting diode element arrays 3 are linearly arranged and mounted on the upper surface.

The first substrate 2 functions as a support member for supporting the light emitting diode element array 3. As shown in FIG. 3, a common electrode wiring 2a having a predetermined pattern is previously formed on the upper surface of the first substrate 2. In addition, the light emitting diode element arrays 3 are arranged and mounted on the upper surface of the first substrate 2 by bonding the common electrode 31 on the lower surface of the light emitting diode element array 3 to the common electrode wiring 2a via solder, silver paste or the like.

When the first substrate 2 is made of, for example, an aluminum oxide sintered body, alumina, silica,
Organic solvent suitable for raw material powder such as calcia, magnesia,
A solvent is added and mixed to form a slurry, and a ceramic green sheet (ceramic green sheet) is obtained by employing a conventionally known doctor blade method or calender roll method. Thereafter, the ceramic green sheet is formed into a predetermined shape. The common electrode wiring 2a is formed by sintering at a high temperature (about 1500 ° C.) and a conductive material such as aluminum or copper on the upper surface of the first substrate 2 by vapor deposition or sputtering. At the same time, this is processed into a predetermined pattern by an etching method, and thereafter, nickel plating or gold plating is applied to the surface to form a deposition on the upper surface of the first substrate 2.

The light emitting diode element array 3 mounted on the upper surface of the first substrate 2 is composed of a plurality of light emitting diode elements 3a, and the light emitting diode elements 3a are individually and selectively corresponding to external electric signals. The latent image for forming an image is formed on the photosensitive member P by emitting light and irradiating the emitted light to the surface of the photosensitive member P.

The light emitting diode element 3a is of GaAsP type, Ga
P-based light-emitting diodes are used.For example, in the case of GaAsP-based light-emitting diodes, a GaAs substrate is first heated to a high temperature in a furnace, and AsH ₃ (arsine), PH ₃ (phosphine), and Ga (gallium) are used. ) To grow a single crystal of n-type semiconductor GaAsP (gallium-arsenide-phosphorus) on the substrate surface, and then form a windowed film of Si ₃ N ₄ (silicon nitride) on the GaAsP single crystal surface. Zn (Zn)
This is formed by exposing a gas of (zinc), diffusing Zn into a part of the n-type semiconductor GaAsP single crystal to form a p-type semiconductor, and having a pn junction.

In the case of a B4 size optical printer head, the number of the light emitting diode elements 3a is 2048 (8 per 1 mm).
Are linearly arranged, specifically, a light emitting diode element array in which 64 light emitting diode elements 3a are one unit.
By arranging 32 pieces of 3 in a straight line, 2048 light emitting diode elements 3a are arranged on the first substrate 2.

The upper surface of the light emitting diode element array 3 mounted on the first substrate 2 is made of, for example, an aluminum oxide sintered body, crystallized glass, quartz, or the like. Window with a width of about 100 μm for forming a light path with the lens 7 to be described later.
2nd substrate having 4a and individual electrode wiring 4b attached to the lower surface
4 is fixedly connected.

The second substrate 4 is provided with each light emitting diode element 3a.
The individual electrode 32 of each light emitting diode element 3a is flipped to the individual electrode wiring 4b attached to the second substrate 4, as shown in FIG. The second substrate 4 was attached to the chip connection, specifically, the upper surface of each light emitting diode element array 3, on the individual electrode 32 of each light emitting diode element 3 a provided on the light emitting diode element array 3 and the second substrate 4. The individual electrode wirings 4b are placed so as to face each other with the solder bumps interposed therebetween, and then the solder bumps are heated and melted, and the individual electrodes 32 of each light emitting diode element 3a and the individual electrode wirings of the second substrate 4 are formed. 4b and the individual electrodes 32 of each light emitting diode element 3a by soldering.
Is the individual electrode wiring of the second substrate 4 connected to the external electric circuit
4b will be electrically connected. In this case, although the total number of the individual electrodes 32 of each light emitting diode element 3a is as large as several thousands, all of them are electrically connected at once and firmly to the individual electrode wiring 4b adhered to the lower surface of the second substrate 4. As a result, the productivity and reliability of the image device become extremely excellent.

The second substrate 4 is made of an aluminum oxide sintered body, crystallized glass, quartz or the like. For example, when the second substrate 4 is made of an opaque material such as an aluminum oxide sintered body, an opening is provided at the center. Aperture is light emitting diode element array 3
A window 42 for forming a light passage between the light emitting diode element array 3 and the lens 7 is formed.
And a lens 7 for forming a light path.

When the second substrate 4 is made of an opaque material such as an aluminum oxide sintered body, the light emitting diode elements 3a are formed by drilling the center of the second substrate 4 using a laser or the like. An opening as a window 42 for transmitting emitted light to the lens 7 side is formed in a predetermined shape.

The individual electrode wiring 4b formed on the lower surface of the second substrate 4 is made of the same material and the same method as the common electrode wiring 2a provided on the upper surface of the first substrate 2. Is formed on the lower surface of the substrate.

Further, a spacer member 9 having a hole 9a for accommodating each light emitting diode element array 3 as shown in FIG. 4 is provided between the first substrate and the second substrate constituting the image element member 1. The light emitting diode element array 3 is interposed in the hole 9a.

The spacer member 9 places the second substrate 4 on the light emitting diode element array 3 mounted on the first substrate 2, and connects the individual electrodes 32 of the light emitting diode element array 3 to the individual electrodes of the second substrate 4. When flip-chip connection is made to the wiring 4b, the size of the second substrate 4 is
The light emitting diode element array 3 mounted on the first substrate 2 and the second substrate 4 are always parallel with each other. Each individual electrode of the light emitting diode element array 3 can be securely and firmly flip-chip connected to the individual electrode wiring 4b of the second substrate 4 and the second substrate 4 Pressing does not cause any damage such as chipping of the light emitting diode element array 3.

The spacer member 9 also has a function of regulating the position of the light emitting diode element array 3 when each individual electrode 32 of the light emitting diode element array 3 is connected to the individual electrode wiring 4b of the second substrate 4 by flip chip connection. Therefore, if the second substrate 4 is placed at a predetermined position on the spacer member 9, the individual electrode wiring 4b of the second substrate 4 can be automatically and accurately brought into contact with each individual electrode 32 of the light emitting diode element array 3. This makes it possible to connect the individual electrodes 32 of the light emitting diode element array 3 to the predetermined individual electrode wirings 4b of the second substrate 4 very easily and reliably by flip-chip bonding.

As shown in FIG. 3, the spacer member 9 is made of an organic film such as polyester or polyimide, paper, or the like.
It has at least a two-layer structure of an electric insulating material layer 9b made of an inorganic material such as glass and a metal material layer 9c made of a metal material such as stainless steel, copper, iron and the like.
9b is located. In this case, since the electric insulating material layer 9b is disposed on the first substrate 2 side, the common electrode 31 on the lower surface of the light emitting diode element array 3 is connected to the common electrode wiring 2a on the first substrate 2 via solder or silver paste. When the solder and the silver paste flow out to the spacer member 9 side at the time of joining, the outflow of the solder and the like is blocked by the electric insulating material layer 9b of the spacer member 9 and the common electrode 31 of the adjacent light emitting diode element array 3 The light emitting diode elements 3a of each light emitting diode element array 3 can emit light individually and accurately by ensuring electrical insulation between the adjacent light emitting diode element arrays 3 without contact with the light emitting diode elements. Also at the same time said electrical insulation layer
A metal material layer 9c made of a metal material such as stainless steel, copper, or iron is provided on the upper portion of 9b, and the metal material layer 9c has an accurate hole corresponding to the outer dimensions of each light emitting diode element array 3 by etching. 9a, the individual electrodes 32 of the light emitting diode element array 3
When connecting to the individual electrode wiring 4b of the substrate 4 by flip-chip connection, if the light emitting diode element array 3 is accommodated in the hole 9a, the position of the light emitting diode element array 3 is regulated and each individual electrode of the light emitting diode element array 3 is 32 second
The individual electrodes 32 of the light emitting diode element array 3 can be very easily and reliably connected to the predetermined individual electrode wirings 4b of the second substrate 4 by being able to abut the individual electrode wirings 4b of the substrate 4 very accurately. It becomes possible to connect.

Further, the spacer member 9 composed of the electric insulating material layer 9b and the metal material layer 9c is provided on the individual electrode wiring 4b of the second substrate 4.
When the surface of the second substrate 4 is not covered with an electrically insulating resist, the metal material layer 9 is brought into contact with the lower surface of the second substrate 4 on which the individual electrode wirings 4b are formed. Since the electrode wiring 4b is electrically short-circuited by the metal material layer 9, an organic film such as polyester or polyimide, paper,
An electrical insulating material 9d made of an inorganic material such as glass may be interposed between the metal material layer 9c and the individual electrode wiring 4b.

Further, if the entire thickness of the spacer member 9 is made substantially the same as the thickness of the light emitting diode element array 3, the light emitting diode element array is provided on one of the first substrate 2 and the second substrate 4. 3 does not act on the light-emitting diode element array 3 sandwiched between the substrates 2 and 4, even if an external force that presses the light-emitting diode element 3 is applied. There is no damage such as cracks, so that the light emitting diode element array 3 can always operate normally and stably. Therefore, it is preferable that the thickness of the spacer member 9 is substantially the same as the thickness of the light emitting diode element array 3.

The image element member 1 composed of the first substrate 2, the light emitting diode element array 3 and the second substrate 4 is also provided with a lens member 5 on the upper part thereof at a predetermined distance.

The lens member 5 comprises a lens plate 6 in which a plurality of holes 6a are linearly arranged and a plurality of lenses 7. The lens 7 is brought into contact with the lens 7 in the hole 6a provided in the lens plate 6. It is formed by bonding and fixing via an adhesive.

The lens plate 6 of the lens member 5 functions as a support member for supporting a plurality of lenses 7 at a predetermined interval on the upper surface.
The light emitted from each of the light emitting diode elements 3a is transmitted to the lens 7.

The lens plate 6 is made of the same material as the first substrate 2 on which the light emitting diode element array 3 is mounted, such as crystallized glass or quartz. The lens plate 6 is made of the same material as the first substrate 2. When used as an image forming apparatus, the lens plate 6 and the first
Even if heat is applied to both of the substrates 2, the lens plate 6 and the first substrate 2 thermally expand by substantially the same amount and the lens plate 6
There is no displacement between each lens 7 supported by 6 and each light emitting diode element array 3 mounted on the first substrate 2, and as a result, the light emitted from each light emitting diode element 3a Accurately on the photoconductor P surface via lens 7,
In addition, a clear image is formed, and a high-quality latent image can be formed by the photoconductor P.

Each of the lenses 7 supported by the lens plate 6 receives light emitted from each of the light emitting diode elements 3a.
A lens formed of a transparent resin such as an acrylic resin or a polycarbonate resin or a transparent inorganic material such as a glass, which has a function of irradiating the P-plane, is preferably used.

Each of the lenses 7 is linearly bonded to the lens plate 6 at predetermined intervals by bonding a part of the outer surface of the lens 7 to the lens plate 6 via an epoxy resin-based elastic adhesive.

Further, the image element member 1 and the lens member 5
By fixing each of them to a pair of supports 8, 8, each light emitting diode element array 3 and each lens 7 are provided side by side so as to correspond to each other at a predetermined distance.

The pair of supports 8, 8 are provided with a first
And a second reference surface 8b at a lower portion, and a lens plate of the lens member 5 is provided on the first reference surface 8a of the support 8.
6 on the second reference surface 8b of the support pair 8
By fixing the substrate 2 in contact, each light emitting diode element array 3 and each lens 7 are separated from each other by a predetermined distance.
It corresponds to one-to-one. In this case, the support 8
The first substrate of the image element member 1 contacting the second reference surface 8b
2 is made of a highly rigid material such as an aluminum oxide sintered body which is unlikely to be deformed.
Even when external force or thermal stress is applied to the first substrate 2 when fixing the first substrate 2, the first substrate 2 is not deformed such as warp or twist, and as a result, the first substrate 2 is mounted on the first substrate 2. Each of the light emitting diode element arrays 3 can always accurately face each lens 7.

Thus, according to the imaging apparatus of the present invention, a predetermined power is applied to each of the light emitting diode elements 3a of the image element member 1 to cause each of the light emitting diode elements 3a to selectively and individually emit light. The light emitted by 3a is imaged on the external photoconductor P surface via the lens 7 of the lens member 5,
By forming a predetermined latent image on the photoconductor P, it functions as an image forming apparatus.

It should be noted that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the lens member 5 is used as the lens member 5. A lens plate 6 in which a plurality of holes 6a are linearly arranged and a plurality of lenses 7 are adhered and fixed is used, and this is a so-called Selfoc, in which a number of bar-shaped self-focusing lenses are arranged. You may change to a lens.

Furthermore, in the above-described embodiment, the case where the present invention is used for an image forming apparatus such as an optical printer head has been described as an example. Can also be used.

[0050]

According to the image apparatus of the present invention, the individual electrodes of the image element array are electrically connected to the individual electrode wirings provided on the second substrate by flip-chip connection. Even if there are thousands, all of them will be electrically connected to the individual electrode wirings of the second substrate at once and firmly, and as a result, the productivity of the image device will be extremely excellent, and the image as a product The device becomes cheaper. According to the image device of the present invention, the first substrate-the second substrate
Between the substrates, a spacer member made of a metal material layer and an electric insulating material layer provided with holes for individually accommodating a large number of image element arrays is interposed, and the electric insulating material layer is provided in a region between adjacent image element arrays. Since it is attached to the lower surface side of the metal material layer located, the outflow of the solder interposed between the common electrode and the common electrode wiring will be well blocked by the electric insulating material layer, Therefore, when the common electrodes of many image element arrays and the common electrode wiring on the first substrate are joined by soldering, it is possible to effectively prevent the molten solder from spreading to the region between the adjacent image element arrays, and to prevent the adjacent image from being formed. Electrical insulation between the element arrays can be reliably maintained, and each image element array can be accurately driven.

According to the image apparatus of the present invention, since the spacer member is interposed between the first substrate and the second substrate, the second substrate is placed on the image element array mounted on the first substrate. When the individual electrodes of the image element array are flip-chip connected to the individual electrode wirings of the second substrate, even if an inclination is caused due to the size of the second substrate being larger than the image element array, the inclination is Suppressed by the spacer member, it is always parallel, so that each individual electrode of the image element array can be securely and firmly flip-chip connected to the individual electrode wiring of the second substrate, and the second substrate can be connected to the image. It is possible to eliminate the possibility that the upper surface corner of the element array is pressed to cause breakage such as chipping of the image element array.

According to the image device of the present invention, since the spacer member having the hole for accommodating the image element array is interposed between the first substrate and the second substrate, each individual electrode of the image element array can be used. When connecting to the individual electrode wiring of the second substrate by flip chip connection, the spacer member regulates the position of the image element array, and each individual electrode of the image element array is extremely easily connected to the predetermined individual electrode wiring of the second substrate. Flip chip connection can be reliably performed.

Further, according to the image apparatus of the present invention, since the lens plate of the lens member for supporting a plurality of lenses and the first substrate are formed of the same material, the lens plate can be used when the image apparatus is used. Even if heat is applied to both the first substrate, the lens plate and the first substrate thermally expand by substantially the same amount, and are mounted on each lens supported by the lens plate and the first substrate. It is possible to effectively prevent a positional deviation from occurring between each image element array. Therefore, when this image apparatus is used in an image forming apparatus such as an optical printer head, the light emitted from the light emitting diode element is accurately and sharply imaged on the surface of the photoconductor through the lens, and a high quality latent image is formed by the photoconductor. It is possible to form an image.On the other hand, when this image device is used for an image reading device such as an image sensor, it is possible to accurately form external image information on a solid-state image sensor array via a lens. As a result, it is possible to generate an accurate electric signal corresponding to the image information.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment in which an image forming apparatus according to the present invention is applied to an optical printer head as an image forming apparatus.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is an enlarged sectional view of a main part for describing an image element member of the image device shown in FIG.

4 is a partial perspective view of a spacer member used in the image device shown in FIG.

[Explanation of symbols]

 1 image element member 2 first substrate 2a common electrode wiring 3 light emitting diode element array 3a light emitting diode element 4 second substrate 4a Window 4b Individual electrode wiring 5 Lens member 7 Lens 9 Spacer member 9a Hole 31 Common electrode 32 Individual electrode

Continuation of front page (56) References JP-A-4-106974 (JP, A) JP-A-4-114479 (JP, A) JP-A-7-183478 (JP, A) JP-A-7-177301 (JP, A) JP-A-7-147621 (JP, A) JP-A-7-115509 (JP, A) JP-A-7-110454 (JP, A) JP-A-7-177304 (JP, A) JP-A-7-132645 (JP, A) JP-A-7-183479 (JP, A) JP-A-7-137337 (JP, A) JP-A-58-128762 (JP, A) JP-A-4-81067 (JP, A A) JP-A-4-111391 (JP, A) JP-A-6-3904 (JP, A) JP-A-5-241399 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) ) H01L 27/14 H01L 27/15 H04N 1/028 H04N 1/036

Claims (1)

(57) [Claims] 1. A large number of image element arrays having a light emitting / receiving section, a common electrode and individual electrodes are connected on a first substrate having a common electrode wiring on an upper surface by soldering the common electrodes and the common electrode wiring. In this manner, a plurality of image element arrays are arranged and mounted in a linear manner, and individual electrode wirings which are flip-chip connected to the individual electrodes are attached on the lower surface of the plurality of image element arrays, and a window opposed to the light emitting / receiving section. Second part
An image apparatus comprising: a substrate; and a lens member on which a plurality of lenses are supported by a lens plate formed of the same material as the first substrate. A spacer member made of a metal material layer and an electric insulating material layer provided with holes for individually receiving the image element arrays is interposed between the second substrates, and the electric insulating material layer is provided between adjacent image element arrays; An image device, which is attached to a lower surface side of the metal material layer located in a region and blocks outflow of the solder.