JP3342394B2 - Jig for electroplating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a jig used for electroplating.

[0002]

2. Description of the Related Art Conventionally, when metalizing a plate-shaped (strip-shaped) component, for example, a component such as a sensor for detecting a human body, by electroplating, a jig for hooking a material to be plated on a wire is used. I attached them and removed them again. Examples of conventional plating apparatuses include JP-A-3-277796 and JP-A-7-6268.

In the conventional jig, there is a problem that the efficiency of the work of mounting the material to be plated on the jig and the work of removing it from the jig is low, and therefore the productivity is low. Therefore, the present inventors have proposed an electroplating apparatus using a material-to-be-plated storage device for solving the above-mentioned problems. FIG. 12 shows an example of the proposed plated material storage tool 1. The illustrated storage tool body 100 is a box-shaped PVC resin molded product,
The upper and lower surfaces are open, and a plurality of long holes 101 having a long longitudinal direction as openings in both side walls are formed in parallel in both end directions.
The electroplating liquid quickly enters the storage tool main body 100, so that the material to be plated 2 mounted inside can be reliably immersed.

As shown in FIG. 13, a vertical groove 102 is formed on the inner side surface of each side wall of the storage device main body 100 between the adjacent elongated holes 101. These grooves 102
Has a closed lower end and an open upper end, and the opposing members form a pair. The pair of opposed grooves 102, 102 serve as a guide when the material to be plated 2 is stored in and taken out of the storage device main body 100 and a holding means at the time of mounting. In mounting the plate 2, both ends of the material to be plated 2 are opposed to each other by a pair of grooves 102, 10.
2 is inserted by sliding from the upper end opening and dropped into the storage device main body 100. When removing the mounted plating target material 2 from the storage tool main body 100, the plating target material 2 may be pulled upward while sliding.

[0005] The storage device main body 100 having the groove 102 formed therein.
A small hole 103 penetrating through the groove 102 and the outside of the storage device main body 100 is formed in the side wall of the container, so that the plating solution sufficiently flows into the groove 102 via the small hole 103. Now, the upper portions of both end walls of the storage device main body 100 extend above the upper surface opening position of the storage device main body 100, and project from the outer wall surface on the upper portion of the extended piece in the direction perpendicular to the wall surface. The extension piece and the horizontal piece constitute a suspension piece 104 for suspending the storage tool body 100 in the plating tank 7 described later.

At the side end of the extending piece of each hanging piece 104, there is formed an insertion hole 105 formed by an obliquely downward cutout which penetrates both ends of a conductive support 6 of a cathode electrode 5 described later in a swingable manner. I have. At the center of both side walls of the storage device main body 100, a support bar 106 extending between the both side walls is a support bar for maintaining a distance between the both side walls. Also, elongated holes 101 'are formed in both end walls.

When the material 2 to be plated is to be mounted in the container 1 for material to be plated, both ends of the material 2 to be plated are inserted into the grooves 102, 102 from the upper end opening and dropped downward as described above. Can be done by In this case, the lower end closed end of the groove 102 is contacted with the lower portion of the side end of the material to be plated 2 in the groove 102, so that the groove 102 is stably held. In order to remove the material to be plated 2 from the jig 1, the upper end of the material to be plated 2 may be lifted upward by hand or the like.

As described above, the groove 1 is formed in the material-to-be-plated container 1.
02 and 102, the mounting and dismounting of the material to be plated 2 can be performed extremely easily, the work efficiency can be improved, and as a result, the productivity of the plating step can be increased. Now, FIG.
The plating object storage device 1 to which the plating object material 2 shown in FIG.
When performing electroplating, as shown in FIG. 13, a conductive support 6 on which a plurality of cathode electrodes 5 that are electrically connected to each of the materials to be plated 2 are mounted.

The conductive support 6 is formed of a metal rod, and a plurality of cathode electrodes 5 are fixed at predetermined intervals corresponding to the mounting position of the material 2 to be plated in the storage body 100 as shown in FIG. Then, both ends are inserted into the insertion holes 105. The cathode electrode 5 is formed of a leaf spring bent in a rectangular shape, and the upper end is mechanically and electrically connected and fixed to the support 6 by welding or the like, and the lower end of the support 6 descends below the insertion hole 105. In this state, as shown in FIG. 14, it is elastically connected to and electrically connected to the upper end portion of the material to be plated 2.

[0010] The material to be packaged 1 on which the material to be plated 2 is mounted and the cathode electrode 5 is mounted as described above is used as it is in processes such as water washing, pickling, and drying. As shown in FIGS. 16 to 18, the plating tank 7 for performing electroplating is provided with pipes 8 and 9 having a blowout port 8a for blowing the electroplating solution and a blowout port 9a for blowing out air at the bottom. Have been. P is a pump for blowing out electroplating.

On both side flanges of the plating tank 7, there are provided support portions 10 for suspending and supporting the plating material storage device 1 with the horizontal piece of the hanging piece 104 of the plating material storage device 1 interposed therebetween. Thus, the above-mentioned material to be plated 2 is mounted, and the cathode electrode 5
When the material-to-be-plated storage device 1 equipped with is mounted on the plating tank 7, the supporting portions 10 of the flanges on both sides of the plating tank 7
As shown in FIG. 18, the horizontal piece of the hanging piece 104 is sandwiched and suspended from the plating tank 7. Then, as shown in FIG. 19, the + power supply line 12 from the power supply device 11 is connected to the anode electrode provided in the plating tank 7 with the clip 13.

Similarly, a negative power supply line (not shown) is connected to the conductive support 6 by a clip (not shown). After the mounting of the material-to-be-plated storage 1 in this manner, the electroplating solution is poured into the plating tank 7 and the power supply 1
Turning on 1 enables electroplating.

[0013]

By the way, in the above-mentioned electroplating apparatus, as shown in FIG. 20, anode electrodes 20 are disposed on both sides of the container 1 to be plated and electroplating is performed on the plating material 2 on the cathode side. Is performed. In this case, FIG.
(A) As shown in (b), since the entire plating of the material to be plated 2 is plated, material costs (particularly in the case of gold plating)
There was a problem that becomes high. In the case where a plurality of members are cut by cutting after plating, there is a problem that, in the cutting step, a plated portion exerts a large load on the cutting cutter, shortens the life of the cutting cutter, and increases the manufacturing cost accordingly.

When the front surface of the anode electrode 20 is exposed, the current flows as shown in FIG. 20, and the metal ions I are concentrated at both ends of the plating material storage device 1, so that The plating thickness of the plating material 2 stored at both ends of the material storage device 1 becomes large, and the plating thickness varies greatly with the plating material 2 to be plated at the same time. There has been a problem that the plating thickness varies between electronic components (for example, a human body detection sensor) obtained from the material 2 and that the plating thickness also varies greatly within the electronic component (sheet).

An object of the present invention is to provide an electroplating jig capable of appropriately plating a material to be plated in view of the above problems.

[0016]

In order to achieve the above object, according to the first aspect of the present invention, an unnecessary portion of a surface of a material to be plated to be electroplated is covered, and a surface of the material to be plated is plated. It is composed of a mask body having a corresponding opening formed therein, and the mask body is stored in a state in which the plating target material is covered in a plating target material storage tool immersed in a plating solution.

According to a second aspect of the present invention, in the first aspect of the present invention, the material to be plated is a member to be cut after plating is completed, and the portion not requiring plating includes the cut portion. According to a third aspect of the present invention, in the first or second aspect of the invention, the material to be plated is a plate-like material, and the mask body is composed of two plates having substantially the same shape as the material to be plated. It is characterized in that the plating material is stored and held in the plating material storage tool in a state of being overlapped on both side surfaces of the plating material.

According to the fourth aspect of the present invention, an opening is provided on the side surface, and the inside accommodates an object to be plated connected to the cathode of a plating power source and is immersed in a plating solution. And a mask body that houses the anode electrode disposed on the side of the workpiece to be plated and that is immersed in the plating solution together with the anode electrode. An opening is formed in a side surface facing the device.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, a plurality of openings of the mask body are formed so as to respectively oppose the plurality of openings opened on the side surface of the workpiece to be plated. The present invention is characterized by the following.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments. (Embodiment 1) This embodiment corresponds to the invention of claim 1, and is a resin molded product which is superimposed on both side surfaces of a material 2 to be plated as shown in FIGS. 1, 2 (a) and 2 (b). Consisting of 2
This is an electroplating jig composed of a plurality of plate-shaped mask bodies 30.

As shown in the figure, the material 2 to be plated is cut off along the dashed line after the portion enclosed by the dashed line is cut off along the dashed line, and is separated as a part. There is a broken line portion, that is, a cutting line portion, which, when plated, imposes a heavy load on the cutter at the time of cutting, so that plating is unnecessary. The mask bodies 30, 30 have openings 31 only at positions corresponding to the positions of the above-mentioned parts, and when the mask bodies 30 are respectively superimposed on both side surfaces of the plated material 2, the openings 31 are formed. Only the component portion is exposed, and the other portions (excluding the upper and lower end surfaces and both end surfaces) are covered with the mask bodies 30, 30.

The material to be plated 2 in a state where the mask bodies 30, 30 are overlapped is inserted together with the mask bodies 30, 30 into the opposing grooves 102, 102 of the material-to-be-plated storage 1 by sliding both side ends thereof. It is mounted in the object-to-be-plated storage 1 together with the bodies 30 and 30. Note that, in the plating object storage device 1 used in the present embodiment, the width of the groove 102 is set such that the mask bodies 30 are overlapped on both side surfaces of the plating object 2 with the mask bodies 3.
Although it is different from that shown in FIG. 12 in that it can be slid and inserted together with 0 and 30, it is not particularly shown here because the other configuration is the same.

In the rinsing step, in order to improve the liquid drainage property, the mask body 30 is moved longitudinally on both sides of the back surface of the mask body 30 as shown in FIG.
(A) As shown in (b), a projection 32 may be provided so that a gap can be formed between the projection 32 and the surface of the plating target material 2 when the projection 32 is overlaid. Then, using the electroplating apparatus, the plating material container 1 containing the plating material 2 whose both sides are covered with the mask bodies 30, 30 is placed in the center of the plating tank 7 of the electroplating apparatus shown in FIG. As described above, the electroplating is performed by suspending and arranging the anode electrodes 20 and 20 on both sides thereof in the same manner as the container 1 to be plated. Here, as the anode electrode 20, metal supports 40 and 41 mounted on mounting tables 70 provided on both sides of the plating tank 7 are protruded, and a terminal screw 42 formed on one of the supports 40 is connected to an anode of a power supply device. Is to be connected. Note that the method of connecting the cathode to the material to be plated 2 and the method of attaching the material-to-be-plated container 1 to the plating tank 7 are the same and will not be described here.

As described above, when the mask body 30 of this embodiment is used, as shown in FIGS. 6A and 6B, the surface of the material to be plated 2 exposed through the opening 31 of the mask body 30, that is, The plating is applied to the parts. That is, even if the ion amount is the same as the conventional one,
Therefore, it becomes difficult to perform plating on the surface portion of the material to be plated 2 which does not face the above. In the drawing, I indicates the flow of metal ions.

As described above, in the present embodiment, by using the mask body 30 provided with the opening 31 corresponding to only the portion of the material 2 to be plated, only the portion requiring plating is selectively plated. Therefore, it is possible to reduce the plating material cost, and furthermore, in the case where cutting is performed after plating, by preventing plating from being applied to the cut portion, the load on the cutting cutter is reduced, and The service life can be extended, and as a result, the overall manufacturing cost can be reduced.

(Embodiment 2) In Embodiment 1 described above, the portion to be plated can be selected so as to prevent plating of the material to be plated 2 on a portion not requiring plating. This is for preventing variation, and corresponds to the invention of claim 4. That is, in this embodiment, as shown in FIG. 7, a mask body 50 which is a box-shaped electrode housing made of a synthetic resin such as PVC or PP is provided, and an insoluble metal cage (such as a mesh box) made of Ti or the like is provided on the mask body 50. The anode electrode 20 is housed, and the mask body 50 is used while being suspended from the plating tank 7. The mask body 5 is used here.
The opening 5 is formed in the side surface of the side corresponding to the plating material storage device 1 so as to face the side surface of the plating material storage device 1.
01 is drilled.

In this embodiment, the plating tank 7 shown in FIG. 5 is used. When the plating is carried out by disposing the plating material 20, as shown in FIG.
The metal ions I flow toward the opening 501 in the direction facing the opening 501, as in the prior art.
Therefore, it is possible to eliminate the variation in the plating thickness depending on the storage position of the material to be plated 2 without concentrating at both ends.

The mask 30 of the first embodiment may be used together. (Embodiment 3) In the above-described Embodiment 2, one large opening 501 is formed in the side surface of the mask body 50 corresponding to the plating object storage device 1 so as to face the side surface of the plating object storage device 1. In this embodiment, FIG. 9 and FIG.
As shown in (a) and (b), slit-shaped openings 502 corresponding to the respective long holes 101 opened on the side surface of the material-to-be-plated storage device 1 are perforated.

That is, as shown in FIG. 11, the flow of the metal ions I from the anode electrode 20 to the material to be plated 2 in the material to be plated container 1 is controlled by the length of each of the lengths opening to the side surface of the material to be plated container 1. By corresponding to the holes 101, variations in the plating thickness of each of the materials to be plated 2 in the material to be plated container 1 are further reduced. The width, height, length, pitch, and number of the openings 502 are appropriately adjusted so as to correspond to the long holes 101 opened on the side surface of the workpiece 1 for plating.

The mask 30 of the first embodiment may be used together.

[0031]

According to the first aspect of the present invention, there is provided a mask body which covers an unnecessary portion of the surface of the material to be plated and which has an opening corresponding to the surface of the material to be plated. Since the mask body is stored in a state where the material to be plated is covered in a material-to-be-plated storage immersed in the plating solution, the portion of the material to be plated is a portion corresponding to the opening of the mask body. Therefore, it is possible to eliminate the need for plating or to avoid plating at a portion that is not required to be plated, thereby eliminating unnecessary consumption of plating material, thereby reducing material costs and enabling appropriate plating. There is.

According to a second aspect of the present invention, in the first aspect of the present invention, the material to be plated is a member that is cut after plating is completed, and the portion not requiring plating includes the cut portion.
In the case of cutting the material to be plated and picking up parts after the completion of plating, the load due to plating is not applied to the cutting cutter, and the life of the cutting cutter can be extended, and as a result, the overall manufacturing cost can be reduced. This has the effect.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the material to be plated is a plate-like material, and the mask body is composed of two plates having substantially the same shape as the material to be plated. Since the body is stored and held in the plating material storage tool in a state of being superimposed on both side surfaces of the plating material, there is an effect that the structure is simple and the mounting is easy. According to a fourth aspect of the present invention, there is provided an object to be plated which is provided with an opening in a side surface and accommodates an object to be plated connected to a cathode of a power source for plating and is immersed in a plating solution. A mask body that houses the anode electrode disposed on the side of the plating material storage device and is immersed in the plating solution together with the anode electrode, and the mask body faces the side surface of the plating material storage device Since the opening is formed on the side surface, metal ions flowing from the anode electrode to the plating material in the plating material storage device are prevented from being concentrated on the plating material disposed in the end portion of the plating material storage device. Appropriate plating can be performed, so that variations in plating thickness can be eliminated between materials to be plated in the same lot.As a result, variations in plating thickness between components cut out from materials to be plated in the same lot and small Plating in There is an effect that Ruru can also variations in smaller.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, a plurality of openings of the mask body are formed so as to respectively face a plurality of openings opened on the side surface of the workpiece to be plated. This has the effect that the variation in plating thickness can be further reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a use state of Embodiment 1 of the present invention.

FIG. 2A is a perspective view of a mask body according to the first embodiment.
(B) is a top view of the mask body same as the above.

FIG. 3 is a perspective view showing a use state of the above.

FIG. 4A is a perspective view of another example of the mask body according to the first embodiment. (B) is a top view of another example of the mask body same as the above.

FIG. 5 is a perspective view of a plating tank of an electroplating apparatus for performing electroplating using the above.

FIG. 6A is an operation explanatory diagram of the above. FIG. 6B is an operation explanatory view in a section taken along line CC ′ of FIG.

FIG. 7 is an exploded perspective view of Embodiment 2 of the present invention.

FIG. 8 is an operation explanatory view of the above.

FIG. 9 is an exploded perspective view of Embodiment 3 of the present invention.

FIG. 10A is a top view in which a part of the mask body is omitted. (A) is a side view which can omit a part of the mask body same as the above.

FIG. 11 is an operation explanatory diagram.

FIG. 12A is a top view of a plating object storage tool used for electroplating. (B) is a front view of the same.
(C) is a side view of the same.

FIG. 13 is a sectional view taken along the line AA in FIG.

FIG. 14 is a perspective view showing a state where the cathode electrode is attached.

FIG. 15 is an enlarged perspective view showing a main part in a state where the above cathode electrode is attached.

FIG. 16 is a perspective view in which a part of the plating tank is omitted.

FIG. 17A is a top view of the plating tank of the above.
(B) is a side view of the same plating tank.

FIG. 18 is a perspective view showing a state where a plating jig is attached to the plating tank.

FIG. 19 is a perspective view showing the entire electroplating apparatus of the above.

FIG. 20 is an explanatory diagram of the operation of the above.

FIG. 21 (a) is an operation explanatory view of the above. (B) is an operation explanatory view in a BB 'section of FIG. 21 (a).

[Explanation of symbols]

 2 Material to be plated 30 Mask body 31 Opening

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C25D 17/08 C25D 5/02

Claims (5)

(57) [Claims] The present invention comprises a mask body which covers an unnecessary portion of the surface of a material to be electroplated and has an opening corresponding to a surface of the material to be plated. A jig for electroplating, wherein the jig is stored in a state in which the material to be plated is covered in a material storage container to be immersed. 2. The electroplating jig according to claim 1, wherein the material to be plated is a member to be cut after plating is completed, and the portion not requiring plating includes the cut portion. 3. The material to be plated is a plate-like material, and the mask body is made of a plate having substantially the same shape as the material to be plated. The jig for electroplating according to claim 1, wherein the jig is stored and held in the jig. 4. An object to be plated which is provided with an opening in a side surface and accommodates a material to be plated connected to a cathode of a power source for plating and is immersed in a plating solution. A mask body that houses the anode electrode disposed on the side of the housing and that is immersed in the plating solution together with the anode electrode, wherein the mask body faces the side surface of the material-to-be-plated storage device, A jig for electroplating, characterized in that an opening is formed in the jig. 5. The jig for electroplating according to claim 4, wherein a plurality of openings are formed in the mask body so as to respectively face the plurality of openings which are opened on the side surfaces of the workpiece to be plated. .