JP3359725B2 - Base material setting method and base material setting device used for the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for setting a base material for dropping a liquid resin on an original plate, placing a base material made of a flexible sheet on the original resin, and uniformly spreading the liquid resin, and a method for setting the base material. The present invention relates to a substrate setting device to be used.

[0002]

2. Description of the Related Art In an optical recording medium, it is necessary to form a concave-convex optical information recording pattern on a substrate for an optical recording medium in order to achieve high-density recording. As one method of forming such a pattern, a 2P (Photo Polymerization) method, which has a very high transfer accuracy of a fine information recording pattern, is known. In the 2P method, a liquid ultraviolet-curable resin is dropped on an original plate having irregularities on its surface, a substrate for an optical recording medium is superimposed on the resin, and the resin is stretched. The information recording pattern of the curable resin is formed on the substrate by curing the resin and then peeling the master.
In such a process, when setting the base material on the original plate on which the liquid resin is dropped, the base material is curved so as to be convex downward, and the resin is set so that the contact area with the resin is reduced. (See, for example, Japanese Patent Application Laid-Open No. 2-118932).

[0003]

In the above-mentioned conventional substrate setting method, the initial contact between the substrate and the resin is a point or a line, and from this state the contact area is gradually increased so that the substrate is Since it is installed on the upper side, there is an advantage that air bubbles are prevented from being mixed into the resin, but there is a problem that the liquid resin cannot be spread uniformly, and the position of the base material with respect to the original plate is shifted. .

[0004] The present invention has been made in view of the above problems, and an object of the present invention is to be able to uniformly spread a liquid resin without introducing air bubbles, and to improve the base material. It is an object of the present invention to provide a base material setting method capable of preventing displacement of an original and a base material setting device used for the method.

[0005]

In order to achieve the above object, a base material setting method according to the present invention comprises the steps of: dropping a liquid resin on an original plate; and stacking a base material made of a flexible sheet thereon. At the time of setting, the periphery of the substrate is suspended with a suction pad, and the rotating body attached to the tip of a support rod that can swing in a vertical plane is pressed against the substrate, so that the substrate is moved in two directions with respect to the original. After lowering the substrate in this state and bringing it into contact with the liquid resin, the liquid is applied while one end of the substrate is pressed against the original with a sliding rod so that the substrate and the original do not shift. The rotating body is reciprocated while rotating in one direction so as to spread the resin.

The substrate setting apparatus used in the substrate setting method includes four suction pads for sucking and suspending the periphery of the substrate, and swinging in a vertical plane near the center of the suction pads. It comprises a rotating body attached to the tip of a movable supporting rod, and a sliding rod for pressing one end of the substrate so that the substrate and the original do not shift.

[0007]

When the base material contacts the liquid resin while being warped in two directions, the base material comes into point contact with the liquid resin, and the liquid resin is spread from the point contact state by the reciprocating motion of the rotating body. Therefore, the incorporation of bubbles is prevented. Further, during the spreading, the displacement of the base material is prevented by the sliding bar.

[0008]

FIG. 1 is a front view showing an example of a substrate setting apparatus for carrying out the substrate setting method of the present invention, and FIG. 2 is a side view of the same.

The substrate setting device has a frame connected to a moving robot R (not shown), and the frame includes an upper plate 1, a side plate 2 and a lower plate 3. In the figure, reference numeral 4 denotes four suction pads for suspending the base material, each of which is attached to a fixed plate 6 by a spring 5 so as to be able to swing back and forth and right and left. The fixed air cylinder 7 moves up and down along the side plate 2. The spring 5 supporting the suction pad 4 is hollow, and a tube through which air flows passes therethrough and is attached to the suction pad 4. A guide 8 slides vertically along a guide rail 10 provided on the side plate 2 by an air cylinder 9 fixed above the upper plate 1. When the suction pad 4 rises by a, the guide 8 is at the position indicated by the solid line in the drawing, and the fixing plate 6 rises by the air cylinder 7 and comes into contact with the guide 8 and stops. Suction pad 4
Is further raised by b, the guide 8 is raised by b by the air cylinder 9 and the fixing plate 6 is also raised by b by the air cylinder 7. That is, the air cylinder 7
Is a + b, and the stroke of the air cylinder 9 is only b.

Reference numeral 11 denotes a rotating body mounting plate mounted on the lower plate 3. A rotating body supporting rod 13 is rotatably mounted on a lower end of the rotating body supporting rod 13 by a support shaft 12, and a rotating body supporting rod 13 is mounted on a tip of the rotating body supporting rod 13. 14 is rotatably mounted. A rotating body spring 15 is disposed between the rotating body mounting plate 11 and the upper end of the rotating body support bar 13. Thereby, the rotating body 14
Can swing between a solid line position and a dotted line position in the figure.

Reference numeral 16 denotes a sliding rod, which has a conical pressing portion 1 at its lower end.
6a and a fixed ring 16b at the upper end, which passes through a linear bearing 17 attached to the lower plate 3. A sliding spring 18 is provided between the pressing portion 16a and the lower plate 3, and the sliding bar 16 can be moved up and down by pushing from below. The pressing portion 16a of the slide bar 16 is set in a state protruding below the rotating body 14.

Hereinafter, a method of setting a base material on an original using the base material setting apparatus having the above configuration will be described.

First, one substrate is supplied to a substrate supply stage (not shown). Next, the air cylinder 7 of the substrate setting device is operated to raise the suction pad 4 by a, and in this state, the substrate setting device is moved from the origin position to the supply stage. This is to prevent the suction pad 4 from contacting other members during movement. Next, in the supply stage, the suction pad 4 is lowered by a, the four sides of the base material are suctioned by the suction pad 4, and then the suction pad 4 is again raised by a. In this state, the rotating body 14
The substrate S is suspended in the state shown in FIGS. 3 and 4 without moving the sliding bar 16. In the drawing, S ₁ and S ₂ represent the center (the largest convex portion of the substrate S) and the edge of the substrate S. In this case, the spring 5 to which the suction pad 4 is attached tilts while being shifted inward by receiving the shearing force and the vertical force at the same time due to the bending of the base material S. As described above, the base material S is provided in FIGS.
And then return the substrate setting device to the origin position.

On the other hand, at the dispenser position, the liquid resin L is dropped on the original plate P by the dispenser (see FIG. 7). After dropping the liquid resin L, in the substrate setting device, the air cylinder 9 and the air cylinder 7 are operated to further raise the suction pad 4 by b. Even at this time, the rotating body 14 and the sliding bar 16 do not move, the spring 5 of the suction pad 4 slightly increases in inclination, and the base material S becomes 2 as shown in FIGS.
It bends in a state warped in the direction. Then, in this state, the base material setting device is moved onto the original plate P at the dispenser position.

At the dispenser position, the entire substrate setting device is lowered. In this case, as shown in FIGS. 7 and 8, the lower part of the sliding rod 16 of the base material S contacts the original P before the lower part of the rotating body 14 contacts the liquid resin L.
To fix the base material S so as not to move. here,
In FIG. 7, the angle α between the substrate center S ₁ and the master P is 1
5 ° to 30 ° is preferred. Then, by this lowering operation, the rotating body 14 moves while rotating in one direction on the base material S while the rotating body support rod 13 swings around the support shaft 12. The lowering operation is performed as shown in FIG. 9 and FIG.
Until it is horizontal. At this position, the base material S does not bend and becomes substantially horizontal. Thus, the rotating body 14 moving while rotating on the base material S acts to push and spread the liquid resin L.

When the rotating body 14 has completely moved, the suction of the suction pad 4 is released, the substrate S is separated from the suction pad 4, and the entire substrate setting apparatus is raised. At this time, the rotating body 14 tries to return to the original position while contacting the base material S, and the base material S may be displaced. However, the sliding rod 16 moves the base material S until the rotating body 14 separates from the base material. Plays the role of pressing and fixing. After the setting of the base material S is completed in this way, the base material setting device is moved to the origin position by the robot R, and at the same time, the suction pad 4 is lowered by b. Then, the next substrate set is performed in the same manner.

On the other hand, after the original resin P on which the base material S is set is spread by the flat plate press in the next pressing step, the liquid resin L is spread in the subsequent UV irradiation step.
Is cured. Then, the substrate S is peeled from the original plate P in a peeling step. The peeled substrate S is moved to a discharge stage, and the original plate P after peeling is subjected to electrostatic removal and dust removal, and returns to the dispenser position again.

[0018]

As described above, according to the present invention,
By pressing the rotator against the base material, the base material is warped in two directions with respect to the original plate. In this state, the base material is lowered and brought into contact with the liquid resin. Is reciprocated while rotating in one direction, so that even when air bubbles are mixed in, the liquid resin is spread out so as to escape the air bubbles, so that air bubbles can be prevented from being mixed in and can be evenly expanded. Further, since the liquid resin is spread while the one end of the base material is pressed against the master plate by the sliding bar so that the base material and the master plate do not shift, the displacement of the base member with respect to the master plate can be prevented. .

[Brief description of the drawings]

FIG. 1 is a front view showing an example of a substrate setting device.

FIG. 2 is a side view of FIG.

FIG. 3 is a front view showing a state in which a substrate is suspended.

FIG. 4 is a side view of FIG. 3;

FIG. 5 is a front view showing a hung substrate in a warped state.

FIG. 6 is a side view of FIG. 5;

FIG. 7 is a front view showing a state where the base material is being lowered.

FIG. 8 is a side view of FIG. 7;

FIG. 9 is a front view showing a state where a base material is set.

FIG. 10 is a side view of FIG. 9;

[Explanation of symbols]

 4 Suction pad 13 Support rod 14 Rotating body 16 Sliding rod P Master L Liquid resin S Substrate

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-184801 (JP, A) JP-A-2-18932 (JP, A) JP-A-4-28033 (JP, A) JP-A-4-184 23244 (JP, A) JP-A-61-235133 (JP, A) JP-A-53-116105 (JP, A) JP-A-2-203444 (JP, A) JP-A-57-163534 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) B29C 41/20 B29C 41/12 G11B 7/26 521 B29C 39/10

Claims (2)

(57) [Claims] When a liquid resin is dropped on an original plate and a substrate made of a flexible sheet is set on the original, the periphery of the substrate is suspended by a suction pad, and the substrate is swung in a vertical plane. By pressing a rotating body attached to the tip of a possible support rod against the substrate, the substrate was warped in two directions with respect to the original, and in this state, the substrate was lowered and brought into contact with the liquid resin. Then, the rotating body is reciprocated while rotating in one direction so as to spread the liquid resin while pressing one end of the base material against the master plate with a sliding rod so that the base material and the master plate do not shift. Substrate setting method. 2. A suction body for sucking and suspending the periphery of a base material, and a rotating body attached to a tip of a support rod swingable in a vertical plane near a center of the suction pads. And a sliding rod for holding one end of the base material so that the base plate does not shift.