JP3386649B2 - Semiconductor stack - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor stack in which a stack body formed by stacking a plurality of semiconductor elements and a plurality of cooling fins is housed in a stack frame.

[0002]

2. Description of the Related Art FIG. 7 is a side view showing a part of a conventional semiconductor stack in section, FIG. 8 is a sectional view of an elastic member guide portion of the semiconductor stack in FIG. 7, and FIG. It is a perspective view of a component.

As shown in the figure, in the semiconductor stack, a plurality of semiconductor elements 1 and a plurality of cooling fins 2 are stacked and pressed by an elastic member 3 to form a stack frame (10, 14).
It is housed inside. Each cooling fin 2 is a cooling pipe 16
Is connected to the condenser 4 through a pipe.

It is necessary to uniformly press each semiconductor element 1, and the component groups to be laminated are arranged so that their centers are aligned. A pin hole 5 is formed at the center of the post surface of the semiconductor element 1, and a pin hole 6 is formed at the center of the post surface of the cooling fin 2. The pin 7 is fitted into the pin holes 5 and 6. By doing so, the structure is aligned with the center of the parts.

Semiconductor device 1 stacked in a semiconductor stack
When exchanging, the pressure applied to the elastic member 3 is released, and both the cooling fins 2 adjacent to the semiconductor element 1 to be exchanged are separated by several mm (as a minimum, the insertion depth of the pin 7 until the pin 7 is removed). It needs to be widened. For this purpose, it is necessary that all the stacked components forming the semiconductor stack can be displaced in the axial direction by several mm.

A plate jig in which a female screw 9 is provided on the end surface of the elastic member guide 8 opposite to the side on which the semiconductor element 1 is pressed, and a through hole 12 through which a bolt jig 11 penetrates is provided outside the first stack side plate 10. By applying 13 and screwing the bolt jig 11 toward the elastic member guide 8, a force acts on the elastic member guide 8 in the direction of compressing the elastic member 3, and the applied pressure is released.

Since the second stack side plate 14 is provided with a female screw 9 at a central position and a center bolt 15 which can be fitted into the female screw 9 is pre-tightened, the semiconductor device 1 is assembled. The semiconductor element 1 can be replaced by loosening the center bolt 15 until the pin 7 for aligning the center is removed.

[0008]

By the way, in the above-mentioned conventional semiconductor stack, the laminated body has the center bolt 15
When loosened, it can move only in one direction on the side of the center bolt 15. However, when actually exchanging elements, when exchanging the semiconductor element 1 that is in contact with or close to the elastic member guide 8, all of the semiconductor element 1 and the cooling fins 2 that do not need to be displaced are moved to the center bolt 15 side. Although it is necessary, the cooling fins 2 are connected to the condenser 4 by piping, so that the cooling fins 2 do not move easily, and as a result, the element cannot be replaced.

Claims 1 to 4 of the present invention have been made in order to solve the above-mentioned conventional problems, and an object thereof is to provide a semiconductor stack in which semiconductor elements can be replaced easily and reliably. It is in.

[0010]

In order to achieve the above object, the first aspect of the present invention is to provide a laminated body in which a plurality of semiconductor elements and a plurality of cooling fins are laminated, and an elastic member having a hole at the center thereof. An elastic member guide having a cylindrical portion penetrating the elastic member and having a female screw, a first stack side plate having a hole through which the cylindrical part of the elastic member guide can slide, and an outer side of the first stack side plate Plate jig provided on the elastic member guide, a bolt jig that penetrates the plate jig and is inserted into the female screw provided on the elastic member guide, and the first jig through the laminated body.
1st stack side plate is provided with a second stack side plate located on the side facing the stack side plate, and a center bolt that can be fitted into a female screw provided on the second stack side plate, and the female screw provided on the elastic member guide is provided with the bolt. inserting a jig, loosen the center bolt while releasing the pressure of the elastic member guide by tightening a semiconductor configured to be able to exchange the semiconductor element by moving the semiconductor element cooling fins to the center bolt side in the stack, while releasing the pressure of the elastic member guide, moving the elastic member guide and the said plate fixture and the bolt fixture the elastic member in the direction of the laminate from the first stack side plate characterized in that it has a moving means which allows moving the laminate in the lateral direction by.

According to a second aspect of the present invention, in the semiconductor stack according to the first aspect, the moving means in the first aspect is replaced.
The moving means includes a third stack side plate having a hole through which the elastic member guide is slidable, a cylindrical outer circumference of which is provided with a screw on the outer circumference of the cylindrical shape, and the third stack side plate. The first stack side plate is provided with a hole having a screw thread that can be fitted to a screw on the outer periphery of the side plate.

According to a third aspect of the present invention, in the semiconductor stack according to the first aspect, the moving means in the first aspect is replaced.
The moving means includes a third stack side plate having a hole through which the elastic member guide can slide and a hole provided in the peripheral portion of the flange surface, and a hole on the flange surface of the third stack side plate. The first stack side plate is provided with a female screw at a penetrable position, and a bolt for fastening the female screw of the hole of the first stack side plate and the hole of the flange surface of the third stack side plate. Characterize.

According to a fourth aspect of the present invention, in the semiconductor stack according to the first aspect, the moving means in the first aspect is replaced.
The moving means has a third stack side plate having a hole through which the elastic member guide is slidable, a cylindrical outer periphery of which is provided with a protrusion on a cylindrical outer peripheral portion smaller than the cylindrical shape, and the protrusion. After inserting the insertable keyway and the protrusion into the keyway,
And a first stack side plate having a groove that can be fitted by rotating the third stack side plate.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a peripheral portion of an elastic member guide of a semiconductor stack according to a first embodiment of the present invention (corresponding to claim 1 and claim 2), and FIG. 2 is a perspective view of each component before assembly in FIG.

As shown in the drawing, the third stack side plate 17a
There is a hole 18 at the center of the elastic member guide 8, and the cylindrical portion of the elastic member guide 8 to which the elastic member 3 is attached is slidably attached to the hole 18. Further, a screw hole 19 is provided in the outer peripheral portion of the third stack side plate 17a, and the third stack side plate 17a is assembled by being fitted into a screw thread 20 provided in the inner peripheral portion of the first stack side plate 10a. Further, the female jig 9 is provided on the end surface of the elastic member guide 8 and the plate jig 13 having the hole 12 is provided.
The structure is such that the bolt jig 11 can be fitted through the a.

Also, although not shown, the second stack side plate 1
4 is arranged so as to face the first stack side plate 10a to which the third stack side plate 17a is attached with the laminated body sandwiched therebetween, as in the case of the conventional FIG.

Next, the operation of this embodiment will be described.
When the semiconductor element 1 is replaced, the third stack side plate 17a
Attach the plate jig 13a to the outer surface of the plate jig 1
The pressing force of the elastic member 3 is released by penetrating the hole 12 of 3a, attaching the bolt jig 11 to the female screw 9 provided on the elastic member guide 8 and tightening the bolt.

When the semiconductor element 1 to be replaced is located closer to the elastic member guide 8 than the center of the stack shaft, the third stack side plate 17a is loosened together with the elastic member guide 8, the elastic member 3, the plate jig 13a and the bolt jig 11. By rotating the first stack side plate 10a from the first stack side plate 10a to move the third stack side plate 17a to the outside of the stack frame, a gap is created between the cooling fins 2 and the semiconductor device 1, so that the semiconductor device 1 can be replaced.

If the semiconductor element 1 to be replaced is other than the above, loosening the center bolt 15 previously mounted on the second stack side plate 14 creates a gap between the cooling fin 2 and the semiconductor element 1. The element 1 can be replaced. As described above, according to the present embodiment, even if the semiconductor element 1 to be replaced is in contact with or close to the elastic member guide 8, the semiconductor element 1 can be replaced.

FIG. 3 is a sectional view of a peripheral portion of an elastic member guide of a semiconductor stack of a second embodiment of the present invention (corresponding to claim 3), and FIG. 4 is a perspective view of each component before assembly of FIG. As shown in the drawing, a female screw 21 is provided on the outer surface portion of the first stack side plate 10b, and a hole 22 through which the female screw 21 can pass is provided in the third stack side plate 17b. The first stack side plate 10b and the third stack side plate 17b are fastened and assembled by a bolt 23 that penetrates the hole 22 and can be fitted into the female screw 21. A female screw 9 is provided on the end surface of the elastic member guide 8, and the structure is such that a bolt jig 11 can be fitted through the plate jig 13 b having a hole 12.

Also, although not shown, the second stack side plate 1
4 is arranged so as to face the first stack side plate 10b to which the third stack side plate 17b is attached with the laminated body sandwiched therebetween, as in the case of the conventional FIG.

Next, the operation of this embodiment will be described.
When the semiconductor element 1 is replaced, the third stack side plate 17b
Attach the plate jig 13b to the outer surface of the plate jig 1
The pressing force of the elastic member 3 is released by penetrating the hole 12 of 3b, attaching the bolt jig 11 to the female screw 9 provided in the elastic member guide 8 and tightening the bolt.

When the semiconductor element 1 to be replaced is located closer to the elastic member guide 8 than the center of the stack shaft, the bolt 23, which fastens the first stack side plate 10b and the third stack side plate 17b, is loosened to remove the third element. The stack side plate 17b is connected to the elastic member guide 8, the elastic member 3, the plate jig 13b,
By moving the bolt jig 11 from the first stack side plate 10b to the outside of the stack frame, a gap is created between the cooling fin 2 and the semiconductor element 1, so that the semiconductor element 1 can be replaced.

If the semiconductor element 1 to be replaced is other than the above, loosening the center bolt 15 previously mounted on the second stack side plate 14 causes a gap between the cooling fin 2 and the semiconductor element 1, so that the semiconductor The element 1 can be replaced.

FIG. 5 is a sectional view of a peripheral portion of an elastic member guide of a semiconductor stack according to a third embodiment of the present invention (corresponding to claim 4), and FIG. 6 is a perspective view of each component before assembly in FIG. As shown in the figure, the outer periphery of the third stack side plate 17c is cylindrical and the protrusion 24 is provided on the outer peripheral portion, and the first stack side plate 10c is provided with a key groove 25 into which the protrusion 24 can be inserted. There is. After the protrusion 24 is inserted into the key groove 25 and then rotated, the outer periphery of the third stack side plate 17c is fitted and assembled into the groove 26 provided on the inner periphery of the first stack side plate 10c. In addition, the female jig 9 is provided on the end surface of the elastic member guide 8 and the plate jig 13c is provided with the hole 12.
The structure is such that the bolt jig 11 can be fitted therein.

Also, although not shown, the second stack side plate 1
4 is arranged so as to face the first stack side plate 10c to which the third stack side plate 17c is attached, sandwiching the laminated body, as in the case of the conventional FIG.

Next, the operation of this embodiment will be described.
When the semiconductor element 1 is replaced, the third stack side plate 17c
Attach the plate jig 13c to the outer surface of the plate jig 1
The pressing force of the elastic member 3 is released by penetrating the hole 12 of 3c and attaching and tightening to the female screw 9 provided in the elastic member guide 8 of the bolt jig 11.

When the semiconductor element 1 to be replaced is on the elastic member guide 8 side with respect to the center of the stack axis, the third stack side plate 17c is rotated and the projection 24 is attached to the first stack side plate 10c.
Of the cooling fin 2 by moving the third stack side plate 17c together with the elastic member guide 8, the elastic member 3, the plate jig 13c, and the bolt jig 11 from the first stack side plate 10c to the outside of the stack frame in accordance with the key groove 25 of FIG. Since a gap is created between the semiconductor element 1 and the semiconductor element 1, the semiconductor element 1 can be replaced.

If the semiconductor element 1 to be replaced is other than the above, loosening the center bolt 15 previously mounted on the second stack side plate 14 creates a gap between the cooling fin 2 and the semiconductor element 1. The element 1 can be replaced.

[0030]

As described above, according to the semiconductor stack of the present invention, the spring fin restraint mechanism and the center bolt mechanism are combined in the left and right base portions of the semiconductor stack, so that the cooling fins are opened when the semiconductor element is replaced. Since the degree of freedom is provided in the above, there is an effect that the semiconductor element can be replaced easily and surely, and at the same time, the quality can be sufficiently secured without increasing the size of the semiconductor stack or making the structure complicated.

[Brief description of drawings]

FIG. 1 is a sectional view of an elastic member guide peripheral portion of a semiconductor stack according to a first exemplary embodiment of the present invention.

FIG. 2 is a perspective view of each component of FIG. 1 before assembly.

FIG. 3 is a sectional view of a portion around an elastic member guide of a semiconductor stack according to a second exemplary embodiment of the present invention.

FIG. 4 is a perspective view of each component before assembly in FIG.

FIG. 5 is a sectional view of a portion around an elastic member guide of a semiconductor stack according to a third exemplary embodiment of the present invention.

FIG. 6 is a perspective view of each component of FIG. 5 before assembly.

FIG. 7 is a side view showing a part of a conventional semiconductor stack in cross section.

FIG. 8 is a cross-sectional view of a peripheral portion of the elastic member guide of FIG.

FIG. 9 is a perspective view of each component of FIG. 8 before assembly.

[Explanation of symbols]

1 ... Semiconductor element, 2 ... Cooling fin, 3 ... Elastic member, 4 ...
Condenser, 5, 6 ... Pin hole, 7 ... Pin, 8 ... Elastic member guide, 9 ... Female screw 10, 10a, 10b, 10c ... 1st
Stack side plate, 11 ... Bolt jig, 12 ... Through hole, 1
3, 13a, 13b, 13c ... Plate jig, 14 ... Second stack side plate, 15 ... Center bolt, 16 ... Cooling pipe, 17, 17a, 17b, 17c ... Third stack side plate, 18 ... Hole, 19 ... Screw hole , 20 ... screw thread, 21 ... female screw, 22 ... female screw through hole, 23 ... bolt, 24 ... protrusion, 25 ... key groove, 26 ... groove.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mutsuro Sekimoto 1-24-2, Harumi-cho, Fuchu-shi, Tokyo Toshiba Transport Engineering Co., Ltd. (72) Inventor Masao Hirata 1-share, Toshiba-cho, Fuchu, Tokyo Company Toshiba Fuchu Factory (72) Inventor Yoshihiro Yamaguchi No. 1 Toshiba-cho, Fuchu-shi, Tokyo Inside Toshiba Fuchu Factory (56) Bibliography Showa 50-78171 (JP, U) Showa 57-102148 (JP, U) Actual development Sho 57-102149 (JP, U) Actual development Sho 62-92651 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23 / 34-23 / 473

Claims (4)

(57) [Claims] 1. A laminated body in which a plurality of semiconductor elements and a plurality of cooling fins are laminated, an elastic member having a hole in a central portion,
An elastic member guide having a cylindrical portion penetrating the elastic member and having a female screw, a first stack side plate having a hole in which the cylindrical part of the elastic member guide is slidable, and provided outside the first stack side plate. A plate jig, a bolt jig that penetrates the plate jig and is inserted into a female screw provided in the elastic member guide, and a bolt jig that is located on a side facing the first stack side plate with the laminated body interposed therebetween. The elastic member is provided with two stack side plates and a center bolt that can be fitted into a female screw provided on the second stack side plate, and the bolt jig is inserted and tightened into the female screw provided on the elastic member guide. A semiconductor device configured such that the semiconductor element can be replaced by loosening the center bolt in a state where the guide is released and moving the semiconductor element and the cooling fin toward the center bolt side. In the lock, the elastic member guide, the elastic member, the plate jig, and the bolt jig are moved from the first stack side plate toward the stacked body in a state where the pressing of the elastic member guide is released. Thus, the semiconductor stack is provided with a moving unit that allows the stacked body to move in the left-right direction. 2. The semiconductor stack according to claim 1, wherein the moving means in place of the moving means in claim 1 comprises:
A third stack side plate having a cylindrical outer periphery with a hole through which the elastic member guide is slidable and a screw having a cylindrical outer periphery smaller than the cylindrical shape; and a screw on the outer periphery of the third stack side plate. A semiconductor stack comprising: the first stack side plate provided with a hole having a thread that can be fitted. 3. The semiconductor stack according to claim 1, wherein the moving means instead of the moving means in claim 1 is:
The elastic member guide has a slidable hole, the outer circumference is cylindrical, and one end surface thereof has a flange surface larger than the outer diameter of the cylindrical shape, and the hole is provided in the peripheral portion of the flange surface. A third stack side plate, the first stack side plate with a female screw provided at a position where the third stack side plate can penetrate the flange face hole, and the third stack side plate flange face hole and the first stack side plate. A semiconductor stack comprising: a bolt for fastening a female screw in a hole of a stack side plate. 4. The semiconductor stack according to claim 1, wherein the moving means instead of the moving means in claim 1 is:
A third stack side plate having a hole through which the elastic member guide is slidable and having a cylindrical outer periphery, and a protrusion provided on the outer periphery of a cylindrical shape smaller than this cylindrical shape, and a key groove into which the protrusion can be inserted. , The first stack side plate having a groove that can be fitted by rotating the third stack side plate after inserting the protrusion into the key groove.