JP3390882B2 - Pellicle for exposure reticle, method for attaching the pellicle, and apparatus for attaching the pellicle - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor integrated circuit device manufacturing process in the exposure reticle pellicle and bonding the Ru used for
The present invention relates to a sticking method and a sticking device thereof . Since semiconductor integrated circuit devices have been highly integrated in recent years, the design rule for determining the minimum line width of a circuit pattern is often of the submicron order.

In order to manufacture such a semiconductor integrated circuit device with high quality, it is necessary to constantly control the energy of exposure light when a pattern is transferred onto a wafer in a photo process.

However, in recent photo processes for manufacturing highly integrated semiconductor integrated circuit devices, foreign matters such as dust and particles adhere to the exposure reticle on which a circuit pattern is formed, and the shadow of the dust and the like is generated. On the exposure reticle on which the circuit pattern is formed, about 6.3 mm from the surface of this exposure reticle in order to prevent the non-exposed portion of the circuit pattern from being clearly projected on the wafer from being exposed. An optically stable and transparent polymer thin film such as nitrocellulose is provided at a high position by straddling a frame made of aluminum or the like, and dust and the like that would otherwise fall onto the surface of the exposure reticle and adhere to this transparent high When the particle size of dust etc. received on the molecular thin film is small, the shadow of dust is not projected on the wafer by moving it out of the depth of focus of the reduction projection lens system. And pellicle is used for sea urchin.

[0004]

2. Description of the Related Art A conventional light source that emits exposure light, a condenser lens system that is disposed below the light source to collimate the exposure light, and an exposure reticle that is provided with a pellicle disposed below the condenser lens system are mounted. Exposure having a reticle stage to be placed, a reduction projection lens system for reducing the light transmitted through the exposure pattern of the exposure reticle placed below it, and a wafer stage to place a wafer to print the exposure pattern placed below In the apparatus, a blind (also referred to as an aperture) for shielding the outer periphery of the exposure pattern from the exposure light and preventing undesired light leakage and scattering is provided on the exposure reticle provided with the pellicle. .

FIG. 9 is a schematic diagram showing the structure of a conventional exposure apparatus. In this figure, 81 is a light source, 82 is a condenser lens system, 83 is a blind, 84 is a pellicle, and 84 is a pellicle.
₁ is a frame, 84 ₂ is a polymer thin film, 85 is an exposure reticle, 8
5 ₁ is a transparent reticle substrate, 85 ₂ is an exposure pattern, 86
Is a reticle stage, 87 is a reduction projection lens system, 88 is a wafer, and 89 is a wafer stage.

In this conventional exposure apparatus, exposure light emitted from a light source 81 such as a mercury lamp is converted into parallel rays by a condenser lens system 82 provided below the exposure light.
This parallel light beam was placed on the reticle stage 86,
An exposure reticle 85 made of a transparent reticle substrate 85 ₁ having an exposure pattern 85 ₂ and a pellicle 84 having a polymer thin film 84 ₂ attached to the upper edge of a frame 84 ₁ formed of a metal such as aluminum are attached. The exposure light passing through the transparent portion of the exposure pattern 85 ₂ is reduced to about ⅕ by the reduction projection lens system 87, and the exposure of the wafer 88 mounted on the wafer stage 89 that can be moved in the XY directions. The exposure pattern is printed on the photosensitive resin by projection.

Between the condenser lens system 82 and the polymer thin film 84 ₂ of the pellicle 84, there is formed a blind 83 composed of, for example, four rectangular light-shielding plate-like members combined in a frame shape on the same plane. The size of the aperture is adjusted by sliding the positions of these four light-shielding plate-like bodies, and the parallel rays emitted from the light source 81 and passing through the condenser lens system 82 are formed in the frame of the pellicle 84. 84
On laminated passed the polymer thin film 84 ₂ was on the edge _1, parallel rays of the exposure pattern 85 shields the ₂ other regions, have passed through the condenser lens system 82 of the exposure reticle 85, passes outside the exposure pattern 85 ₂ Then, the wafer 8 reflected on the container wall of the exposure apparatus and placed on the wafer stage 89
It is prevented from entering the photosensitive resin film of No. 8.

In this way, the dust and the like that has fallen and adhered to the surface of the transparent reticle substrate 85 ₁ is received on the polymer thin film 84 ₂ of the pellicle 84, and this dust and the like is depth of focus of the reduction projection lens system. This removes dust shadows from being projected on the photosensitive resin film of the wafer 88.

However, as described above, it is necessary to control the energy of the exposure light when the pattern is transferred onto the wafer 88, but the polymer thin film 8 of the pellicle 84 is required.
4 _2, the transmittance of the irradiated UV like exposure light is gradually colored exposure light has a property to decrease. Therefore, conventionally, the relationship between the irradiation amount of the exposure light and the transmittance of the polymer thin film 84 ₂ of the pellicle 84 attached to the exposure reticle 85 is measured, and the total exposure time of the exposure light is changed to the normal exposure light. Method for estimating the energy down rate from the energy of the pellicle 84, or directly measuring the transmittance of the polymer thin film 84 ₂ of the pellicle 84, and when the energy down rate from the energy of the ordinary exposure light reaches a specified value, the pellicle 84
The energy of the exposure light was controlled by the method of reattaching.

Further, in the above-mentioned prior art, the exposure level is
Transparent reticle substrate 85 ₁Exposure pattern 8
5₂After forming and cleaning, on its upper surface, aluminum
Frame 84 made of metal such as₁Nitrocellulo on the upper edge
Optically stable transparent polymer thin film 84₂Pasted
The pellicle 84₁Applied on the lower edge of
Attached by the adhesive layer that has been formed, inspection using laser light
Transparent reticle substrate 85 depending on the device₁Above (exposure pattern)
The surface of the surface on which
If yes, it is shipped as an acceptable product.

Then, the pellicle 84 is formed on the exposure reticle 85.
If the foreign matter is found to be mixed in the pellicle 84 by the inspection after attaching, the pellicle 84 is peeled off, the exposure reticle 85 is washed again, and then the pellicle 84 is attached. There is.

FIG. 10 is a diagram for explaining the structure of a conventional pellicle, where (A) shows a cross section and (B) shows a plane. In this figure, 84 is a pellicle, 84 ₁ is a frame, 84 ₂ is a polymer thin film, and 84 ₃ is an adhesive layer. As shown in this figure, a conventional pellicle has a frame 8 of a pellicle 84.
4 to ₁ of the upper edge passes adhered to polymer film 84 _2, the adhesive layer 84 ₃ has been applied to flat the entire surface of the lower edge.

[0013]

However, in the conventional exposure apparatus, as described above, the size of the opening of the blind 83 is adjusted so that the parallel light rays emitted from the light source 81 and passed through the condenser lens system 82. Since the region other than the exposure pattern 85 ₂ of the exposure reticle 85 of the polymer thin film 84 ₂ attached to the upper edge of the frame 84 ₁ of the pellicle 84 is shielded from light, the polymer of the pellicle 84 by the irradiation of the exposure light is blocked. Since the decrease in the transmittance of the thin film 84 ₂ is limited to the portion where the exposure pattern 85 ₂ is formed, the transmittance of the polymer thin film 84 ₂ should be measured with the pellicle 84 attached to the exposure reticle 85. Therefore, it is necessary to peel off the pellicle 84 from the exposure reticle 85 and measure the pellicle 84 with a transmittance measuring device, and it is not easy to control the transmittance of the pellicle 84.

Further, as shown in FIG. 10, conventionally, since the adhesive layer is applied in a planar manner on the entire lower edge of the frame 84 ₁ of the pellicle 84, a solvent is used or a pellicle is physically used. When 84 is peeled off from the exposure reticle 85 (see FIG. 9), the adhesive remains on the exposure reticle 85, and the exposure reticle 85 needs to be washed again, resulting in a problem that throughput is deteriorated. Also, if the pellicle 84 is physically peeled off with a strong force, the exposure reticle 85 may be damaged.
There was a problem that the pellicle 84 could not be reused after peeling off.

[0015]

The pellicle of the present invention is a frame 8 of the pellicle 84.
4 ₁ Make the cross section of the adhesive layer at the lower edge convex, and perform a foreign matter inspection on the transparent reticle substrate 85 ₁ with the cross section of the adhesive layer having a convex cross section being temporarily adhered onto the exposure reticle 85. If the standard is satisfied, a larger pressing force is applied to perform the main adhesion at the step of the adhesive layer having a convex cross section, and the product is shipped as an acceptable product. it can be peeled off, that provides means for streamlining the pasting of the pellicle therefor.

[0017]

[0018]

[0019]

In the pellicle for an exposure reticle according to the present invention, it is attached to the frame and the upper edge of the frame.
Polymer thin film and the first contact formed on the entire lower edge of the frame.
The adhesive layer and the first adhesive layer protruding from the surface of the first adhesive layer
And a second adhesive layer having an area smaller than that of the second adhesive layer.
And is the basis.

In this case, due to the step, the inclined surface or the curved surface, the protrusion having the adhesive layer having a minute area for temporarily adhering to the exposure reticle and the protrusion for retracting and finally adhering to the protrusion are provided. A configuration in which a portion having a wide area of the adhesive layer is formed can be adopted.

Further, in this case, a protrusion having a minute area of the adhesive layer for temporarily adhering onto the exposure reticle, and a wider area for retreating from the protrusion and finally adhering. It is possible to adopt a configuration in which the portion having the agent layer is composed of a plurality of isolated portions.

Further, in this case, a protrusion having a minute area of the adhesive layer for temporarily adhering onto the exposure reticle, and a wider area for retreating from the protrusion and finally adhering. It is possible to employ a configuration in which the portion having the agent layer is a continuous linear portion.

Further, in this case, the adhesive force of the adhesive layer for temporarily adhering onto the exposure reticle above the protruding portion is increased by the adhesive force of the adhesive layer for finally adhering to the portion retracted from the protruding portion. A configuration that is weaker than the force can be adopted.

Further, in the method of sticking the pellicle for an exposure reticle according to the present invention, a protrusion having an adhesive layer with a minute area for temporarily adhering onto the exposure reticle, and a recess from the protrusion. Then, when a pellicle having a portion having an adhesive layer with a wider area for final adhesion is attached to the exposure reticle, first, a protrusion having an adhesive layer with a minute area is formed on the exposure reticle. If the dust adhesion state of the exposure reticle is inspected in that state, and if the dust adhesion state is within the allowable range, it is finally retracted by the portion having the adhesive layer with a wide area Adhesion was performed, and when the adhered state of dust was not within the allowable range, a step was adopted in which the pellicle was peeled off to wash the exposure reticle, and then the pellicle was attached again onto the exposure reticle.

Further, in the pellicle sticking apparatus according to the present invention, the exposure reticle is placed, and the protrusion having the adhesive layer having a minute area for temporarily adhering the exposure reticle thereon is provided. , A base on which a pellicle having a wider area of an adhesive layer for finally adhering is placed, and a peripheral part of the pellicle are pressed by adjusting a pressing force. A pressing member capable of
A structure including a surface condition inspection device capable of inspecting the adhered condition of dust on the surface of the exposure reticle under the pellicle is adopted.

[0026]

[0027]

[Action] As the pellicle of the present invention, a protrusion having an adhesive layer of very small area for provisionally adhered onto the exposed reticle, recessed from the projecting portion, and finally wider for bonding By providing a portion having an adhesive layer of area, a foreign substance inspection is performed on the transparent reticle substrate in a state where it is temporarily adhered on the exposure reticle at the top of the convex adhesive layer, and if the standard is not satisfied, , The pellicle can be easily peeled off, and if the pellicle is passed, the pressing force can be strengthened to make the main adhesion on the exposure reticle at the step of the convex adhesive layer. Can be converted.

[0028]

EXAMPLES Examples for an exposure reticle according to the present invention will be described below.
Explanation of pellicle and exposure equipment used with reference to the drawings
To do.

FIG . 1 is a schematic diagram showing the structure of an exposure apparatus used in the present invention . In the figure, reference numeral 1 denotes a light source, 2 is a condenser lens system, 3 blind, 4 pellicle, 4 ₁ frame,
4 ₂ is a polymer thin film, 5 is an exposure reticle, 5 ₁ is a transparent reticle substrate, 5 ₂ is an exposure pattern, 6 is a reticle stage, 7 is a reduction projection lens system, 8 is a wafer, and 9 is a wafer stage.

[0030] In the exposure apparatus seen in Figure 1, into a parallel beam by <br/> condenser lens system 2 which exposure light provided below emitted from the light source 1 such as a mercury lamp, the collimated light beam is chicle pellicle passed bonding the polymeric thin film 4 ₂ the upper edge of the frame 4 ₁ formed of a metal such as an exposure reticle 5 and aluminum made of a transparent reticle substrate 5 ₁ having the placed eXPOSURE pattern 5 ₂ to the stage 6 4 passes pasted the ones, through the transparent portion of the exposure pattern 5 ₂
The exposed light is reduced to about ⅕ by the reduction projection lens system 7, projected onto the photosensitive resin of the wafer 8 mounted on the wafer stage 9 which can be moved in the XY directions, and the exposure pattern is printed. It is like this.

A blind 3 is formed between the exposure reticle 5 and the reduction projection lens system 7 and is formed by combining, for example, four rectangular light-shielding plate-like bodies in a frame shape on the same plane. , The position of the aperture is adjusted by sliding the positions of these four light-shielding plate-like bodies, and the parallel rays emitted from the light source 1 and passing through the condenser lens system 2 are on the frame 4 ₁ of the pellicle 4. a polymer thin film 4 ₂ passed adhered to the edge, to shield regions other than the exposed pattern 5 ₂ of the light passing through the transparent portion of the exposure pattern 5 _second exposure reticle 5, 1/5 by the reduction projection lens system 7 And is projected onto the photosensitive resin of the wafer 8 placed on the wafer stage 9 which can be moved in the XY directions.

In the exposure apparatus shown in FIG . 1, the parallel rays that have passed through the condenser lens system 2 are not exposed to the exposure pattern 5 ₂ of the polymer thin film 4 ₂ attached to the upper edge of the frame 4 ₁ of the pellicle 4. since the irradiated to the region, the transmittance of exposure light illuminated the entire area of the polymer thin film 4 ₂ were decreases.

[0033] Thus, the peeling of the pellicle 4 for measuring the transmittance of a conventional polymer thin film was done in the art 4 _second exposure light is not necessary, the polymer thin film 4 ₂ pellicle 4, exposure reticle 5 Since the transmittance of the exposure light of the polymer thin film 4 ₂ can be measured through the transparent portion of the transparent reticle substrate 5 ₁ adjacent to the exposure pattern 5 ₂ , the energy of the exposure light when the pattern is transferred onto the wafer is measured. Can be easily managed.

FIG . 2 is a schematic diagram showing the construction of another exposure apparatus used in the present invention . In the figure , 11 is a light source, 12 is a condenser lens system, 13 is a blind, 14 is a pellicle, 14 ₁ is a frame, 14 ₂ is a polymer thin film, 15 is an exposure reticle, 15 ₁ is a transparent reticle substrate, and 15 ₂ is an exposure pattern. , 16 is a reticle stage, 17 is a reduction projection lens system, 18 is a wafer, and 19 is a wafer stage.

In the exposure apparatus shown in FIG . 2, exposure light emitted from a light source 11 such as a mercury lamp is provided below.
Was collimated by a condenser lens system 12, the parallel light is formed of a metal such as an exposure reticle 15 and aluminum consisting of a transparent reticle substrate 15 ₁ having the placed EXPOSURE pattern 15 ₂ Les chicle stage 16 frame The pellicle 14 having the polymer thin film 14 ₂ attached to the upper edge of 14 ₁ is transmitted to expose the exposure pattern 15
_The exposure light is reduced by passing through the transparent part of _{2 and} the projection lens system 17
The exposure pattern is projected onto the photosensitive resin of the wafer 18 placed on the wafer stage 19 which can be moved in the XY directions by reducing the exposure pattern by about 1/5.

Then, between the reduction projection lens system 17 and the wafer 18, for example, a blind 13 constituted by combining four rectangular light-shielding plate-like bodies in a frame shape on the same plane.
Is formed, and the size of the opening is adjusted by sliding the positions of these four light-shielding plate-like bodies, and the light source 1
A parallel light beam emitted from the laser beam _{No. 1} and passing through the condenser lens system 12 passes through the polymer thin film 14 ₂ attached to the upper edge of the frame 14 ₁ of the pellicle 14 and the transparent portion of the exposure pattern 15 ₂ of the exposure reticle 15. Then, the area other than the exposure pattern 15 _{2 of the} light reduced by the reduction projection lens system 17 is shielded and projected onto the photosensitive resin of the wafer 18 placed on the wafer stage 19 which can be moved in the XY directions. .

In the exposure apparatus shown in FIG . 2, parallel rays that have passed through the condenser lens system 12 are reflected by the pellicle 14.
Of the polymer thin film 14 ₂ attached to the upper edge of the frame 14 ₁ of
Since the area other than the exposure pattern 15 ₂ is also irradiated, the transmittance of the exposure light in the entire area of the irradiated polymer thin film 14 ₂ is lowered.

[0038] Therefore, peeling of the pellicle 14 to measure the transmittance of exposure light of the polymer which has been made thin film 14 ₂ in the prior art is not necessary, the polymer film 14 ₂ of the pellicle 14, the exposure reticle 15 Since the transmittance of the exposure light of the polymer thin film 14 ₂ can be measured through the transparent portion of the transparent reticle substrate 15 ₁ adjacent to the exposure pattern 15 ₂ , the energy of the exposure light when the pattern is transferred onto the wafer. Can be easily managed.

FIG . 3 is a structural explanatory view showing a pellicle ,
(A) shows a cross section and (B) shows a plane. In the figure , 24 is a pellicle, 24 ₁ is a frame, 24 ₂ is a polymer thin film, 24 ₃ is a first adhesive layer, and 24 ₄ is a second adhesive layer.

In the pellicle of this embodiment, as shown in the figure, the polymer thin film 24 ₂ is attached to the upper edge of the frame 24 ₁ of the pellicle 24, and the first adhesive is applied to the entire lower edge thereof. A layer 24 ₃ is formed and a thickness of several 10 μm is formed on the center of the layer 24 _3.
A second adhesive layer 24 ₄ having a width of about m to 100 μm narrower than that of the first adhesive layer 24 ₃ is formed. As this adhesive, a material formed of urethane rubber, foamed polyethylene or the like and an acrylic adhesive can be used.

Then, the first adhesive layer 24₃And the second
Adhesive layer 24_FourIs frame 24₁Formed continuously on the lower edge of
Has been. In addition, the first adhesive layer 24₃And the second connection
Adhesive layer 24_FourCan be formed with the same adhesive
The second adhesive layer 2 can be formed by changing these adhesives.
Four _FourThe adhesive strength of the first adhesive layer 24₃Make it weaker
You can

Using the pellicle 24 of this embodiment,
0.1 kg / cm²Pellicle 24 with some pressure
The convex second adhesive layer 24_FourBy the exposure reticle
Temporarily adhere to the top with a weak adhesive force, and in that state a transparent reticle substrate
When foreign matter on the board is inspected and the standard is not met
Peel off the pellicle 24, and if it passes, 5kg / c
m ²The first adhesive that increases the pressing force to a degree to form a convex step
Agent layer 24₃Finally glue on the exposure reticle by
Streamlines pellicle attachment work
can do.

FIG . 4 is an explanatory diagram showing the structure of the pellicle .
(A) shows a cross section and (B) shows a plane. In the figure , 34 is a pellicle, 34 ₁ is a frame, 34 ₂ is a polymer thin film, 34 ₃ is a first adhesive layer, and 34 ₄ is a second adhesive layer.

In the pellicle of this embodiment, as shown in the figure, the polymer thin film 34 ₂ is attached to the upper edge of the frame 34 ₁ of the pellicle 34, and the lower edge thereof has a high center. A first adhesive layer 34 ₃ having an inclined surface is formed, and a second adhesive layer 34 ₄ having a narrow width is formed on the center of the first adhesive layer 34 ₃ .

Then, the first adhesive layer 34₃And the second
Adhesive layer 34_FourIs the frame 34₁Formed continuously on the lower edge of
Has been. In addition, the first adhesive layer 34₃And the second connection
Adhesive layer 34_FourCan be formed with the same adhesive
The second adhesive layer 3 can be formed by changing these adhesives.
Four _FourThe adhesive strength of the first adhesive layer 34₃Make it weaker
You can

[0046] With the pellicle 34 of this embodiment, the pellicle 34 performs foreign matter inspection on a transparent reticle substrate by temporarily bonded state on the exposure reticle by a second adhesive layer 34 _4, meet the standards If not, the pellicle 34 can be easily peeled off, and if the pellicle 34 is passed, the pressing force can be increased to finally bond the pellicle 34 onto the exposure reticle by the first adhesive layer 34 ₃ . The pasting work can be streamlined. The inclined surface in this embodiment can be replaced by a curved surface.

FIG . 5 is a structural explanatory view showing a pellicle ,
(A) shows a cross section and (B) shows a plane. Figure smell <br/> Te, 44 pellicle, 44 ₁ frame, 44 ₂ polymer film, 44 ₃ first adhesive layer, 44 ₄ denotes a second adhesive layer.

The pellicle of this embodiment is shown in the figure.
Frame 44 of pellicle 44 as shown₁High on the upper edge
Molecular thin film 44₂The first contact on the entire lower edge.
Adhesive layer 44₃The first width along the inner circumference above
Adhesive layer 44₃Narrower second adhesive layer 44_FourForming
is doing. Then, the first adhesive layer 44₃And the second
Adhesive layer 44_FourIs the frame 44₁Continuously formed on the lower edge of
ing. In addition, the first adhesive layer 44₃And the second glue
Agent layer 44_FourCan also be formed with the same adhesive.
The second adhesive layer 44 by changing these adhesives.
_FourThe adhesive strength of the first adhesive layer 44₃To be weaker
You can

When the pellicle 44 of this embodiment is used,
The crepe 44 has a convex second adhesive layer 44._FourExposed by
On the transparent reticle substrate with the reticle temporarily bonded
Inspected for foreign matter, and if it does not meet the standard, it is easy
The pellicle 44 can be peeled off.
The first adhesive layer 44 that increases the pressure to form a convex step₃To
So you can finally glue it on the exposure reticle
Therefore, the work of attaching the pellicle can be streamlined.
Wear. In this case, the frame 44 of the pellicle 44₁Outer circumference of lower edge
Second adhesive layer 44 along _FourCan also form
It

FIG . 6 is a structural explanatory view showing a pellicle ,
(A) shows a cross section and (B) shows a plane. In the figure , 54 is a pellicle, 54 ₁ is a frame, 54 ₂ is a polymer thin film, 54 ₃ is a first adhesive layer, and 54 ₄ is a second adhesive layer.

In the pellicle of this embodiment, as shown in the figure, the polymer thin film 54 ₂ is attached to the upper edge of the frame 54 ₁ of the pellicle 54, the lower edge of which is attached to the inner periphery of the lower edge. The first adhesive layer 54 ₃ that slopes upward
And a second adhesive layer 54 ₄ is formed. Then, the first adhesive layer 54 ₃ and the second adhesive layer 54 ₄ are separated by the frame 5
4 ₁ are continuously formed in a lower edge. Also, this first
The adhesive layer 54 ₃ and the second adhesive layer 54 ₄ may be formed of the same adhesive, and these adhesives may be different to increase the adhesive strength of the second adhesive layer 54 _4. It can be weaker than the first adhesive layer 54 ₃ .

When the pellicle 54 of this embodiment is used, the pellicle 54 is temporarily adhered to the exposure pattern reticle by the second adhesive layer 54 ₄ and foreign matter inspection is performed on the transparent reticle substrate to satisfy the standard. If not, the pellicle 54 can be easily peeled off.
Since the pressing force can be strengthened and the first adhesive layer 54 ₃ can be used for the main adhesion onto the exposure reticle, the operation of attaching the pellicle can be streamlined. The inclined surface in this embodiment can be replaced by a curved surface.

FIG . 7 is a structural explanatory view showing a pellicle ,
(A) shows a cross section and (B) shows a plane. In the figure , 64 is a pellicle, 64 ₁ is a frame, 64 ₂ is a polymer thin film, 64 ₃ is a first adhesive layer, and 64 ₄ is a second adhesive layer.

In the pellicle of this embodiment, as shown in the figure, the polymer thin film 64 ₂ is attached to the upper edge of the frame 64 ₁ of the pellicle 64, and the first adhesive is applied to the entire lower edge thereof. Layer 64 ₃ is formed and a plurality of isolated second adhesive layers 64 ₄ are formed thereon.

The first adhesive layer 64 ₃ and the second adhesive layer 64 ₄ can also be formed by the same adhesive, and these adhesives can be made different and the second adhesive layer 64 ₄ can be formed.
The adhesive strength of ₄ can be made weaker than that of the first adhesive layer 64 ₃ . This example corresponds to the pellicle of the third example in which the second adhesive layer is isolated, but the second adhesion of the pellicle of the fourth, fifth, and sixth examples is performed. The agent layer can be isolated as in this example.

When the pellicle 64 of this embodiment is used, foreign matter is inspected on the transparent reticle substrate while the pellicle 64 is temporarily adhered to the exposure reticle by the isolated convex second adhesive layer 64 ₄ . If the standard is not satisfied, the pellicle 64 can be easily peeled off, and if the pellicle 64 is acceptable, the pressing force is increased to finally bond the pellicle 64 onto the exposure reticle by the first adhesive layer 64 ₃ . Because you can
The pellicle attachment work can be streamlined.

FIG . 8 is a schematic structural explanatory view showing a pellicle sticking device. In the figure , 71 is a base, 72 is an exposure reticle, 72 ₁ is a transparent reticle substrate, 72 ₂ is an exposure pattern, 73 is a pellicle, 73 ₁ is a frame, 73 ₂ is a polymer thin film, and 73 ₃ is a first adhesive. Layer, 73 ₄ is a second adhesive layer, 74 is a pressing member, 75 ₁ and 75 ₂ are cam devices, 7
6 is a laser device, and 77 is a detection device.

In the pellicle sticking apparatus of this embodiment, an exposure reticle 72 having an exposure pattern 72 ₂ formed on a transparent reticle substrate 72 ₁ on a base 71,
The polymer thin film 73 ₂ is attached to the upper edge of the frame 73 ₁ formed of aluminum or the like, and the first adhesive layer 73 is attached to the lower edge thereof.
_3, the second adhesive layer 73 ₄ convex by laminating a pellicle 73 formed are so placed, thereon, corresponding to the exposure pattern 72 ₂ of the transparent reticle substrate 72 ₁ A pressing member 74 having an opening is arranged, and the pressing member 74 is pressed by adjusting the pressure by the cam devices 75 ₁ and 75 ₂ .

Then, the laser device 76 provided above
As the laser light emitted is through the opening and the polymer thin film 73 ₂ of the pressing member 74, which is swept transparent reticle substrate 72 ₁ in the upper surface, it is detected by the detecting device 77 the reflected light from the transparent reticle substrate 72 ₁ from Has been

When the exposure reticle 72 and the pellicle 73 are attached using the pellicle attaching apparatus of this embodiment, the exposure reticle 72 and the pellicle 73 are laminated on the base 71 as shown in this figure. The laminated structure is rotated by the cam devices 75 ₁ and 75 ₂ by a predetermined angle and is pressed by the pressing member 74 at a pressure of 0.1 kg / cm ² to form a convex second adhesive layer. temporarily bonded by 73 _4, in this state, a laser beam emitted from a laser device 76 which is provided above, through the opening and the polymer thin film 73 ₂ of the pressing member 74, sweeps the transparent reticle substrate 72 ₁ of the upper surface by detecting by detector 77 the reflected light from the transparent reticle substrate 72 _1, checks for debris transparent reticle substrate 72 on _1, if the state of adhesion of foreign matter such as dust is in the acceptable range Further cam device 75 _1, 7
5 ₂ is rotated by a predetermined angle to press the pressing member 74.
Then, it is pressed with a pressure of 5 kg / cm ² and finally bonded by the first adhesive layer 73 ₃ .

When the adhered state of foreign matter such as dust is not within the allowable range, the cam devices 75 ₁ and 75 ₂ are returned to take out the exposure reticle 72 and the pellicle 73, and the pellicle 73 is separated from the exposure reticle 72 and stored as it is. After cleaning the exposure reticle 72 to remove foreign matters and drying, the temporary adhesion of the pellicle 73, the inspection of the adhesion state of dust,
Main adhesion, peeling, and washing are repeated.

Although the above-mentioned inspection of the adhered state of foreign matter such as dust is performed on the upper surface of the exposure reticle, the inspection is performed on both sides of the polymer film of the pellicle by adjusting the focus of the inspection device. However, if foreign matter such as dust that interferes with exposure adheres, the polymer film of the pellicle can be reattached. The above cam devices 75 ₁ , 75 ₂
Can be replaced by an appropriate pressing device.

[0063]

According to the present invention, when the transmittance of a pellicle is measured, the transmittance can be measured in a state of being attached to the exposure reticle without peeling off the pellicle from the exposure reticle . Questions that need improvement in the field
Problem, i.e., if the blind is installed above the reticle stage, dust generated by the friction when adjusting the size of the blind opening to slide the shielding plate constituting the blind drop onto the exposure reticle There is no accident of sticking due to adhesion, and the pellicle was temporarily bonded
After inspecting foreign matter such as dust on the exposure reticle, perform regular adhesion.
Easy to attach pellicle because it can be done
Has the effect on work efficiency, and the pellicle
Can be reused, which can contribute to cost reduction.

[0064]

[Brief description of drawings]

1 is a schematic illustration of EXPOSURE APPARATUS.

Figure 2 is a schematic illustration of EXPOSURE APPARATUS.

[Figure 3] is a diagram illustrating the configuration of a pellicle, the (A) is cross-section and (B) shows a plane.

[Figure 4] is a diagram illustrating the configuration of a pellicle, the (A) is cross-section and (B) shows a plane.

[Figure 5] is a configuration diagram of a pellicle, the (A) is cross-section and (B) shows a plane.

[Figure 6] is a diagram illustrating the configuration of a pellicle, the (A) is cross-section and (B) shows a plane.

[Figure 7] is a diagram illustrating the configuration of a pellicle, the (A) is cross-section and (B) shows a plane.

8 is a schematic illustration of a sticking apparatus pellicle.

FIG. 9 is a schematic configuration explanatory diagram of a conventional exposure apparatus.

FIG. 10 is an explanatory diagram of a configuration of a conventional pellicle, (A)
Shows a cross section and (B) shows a plane.

[Explanation of symbols]

1, 11 Light source 2, 12 Condenser lens system 3, 13 Blind 4, 14 Pellicle 4 ₁ , 14 ₁ Frame 4 ₂ , 14 ₂ Polymer thin film 5, 15 Exposure reticle 5 ₁ , 15 ₁ Transparent reticle substrate 5 ₂ , 15 ₂ Exposure pattern 6,16 Reticle stage 7,17 Reduction projection lens system 8,18 Wafer 9,19 Wafer stage 24,34,44,54,64 Pellicle 24 ₁ , 34 ₁ , 44 ₁ , 54 ₁ , 64 ₁ Frame 24 ₂ , 34 ₂ , 44 ₂ , 54 ₂ , 64 ₂ Polymer thin film 24 ₃ , 34 ₃ , 44 ₃ , 54 ₃ , 64 ₃ 1st adhesive layer 24 ₄ , 34 ₄ , 44 ₄ , 54 ₄ , 64 ₄ 2 adhesive layer 71 base 72 exposure reticle 72 ₁ transparent reticle substrate 72 ₂ exposure pattern 73 pellicle 73 ₁ frame 73 ₂ polymer thin film 73 ₃ first adhesive layer 73 ₄ second adhesive layer 74 pressing member 75 _1, 75 ₂ cam Location 76 laser device 77 detection device

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Takayoshi Matsuyama 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Within Fujitsu Limited (72) Inventor Ryoichi Miura 5950 Soeda, Irima-cho, Satsuma-gun, Kagoshima Incorporated company Kyushu Fujitsu In Electronics (56) Reference JP 62-92959 (JP, A) JP H2-218113 (JP, A) JP 6-5508 (JP, A) JP S63-298245 (JP, A) ) JP-A-6-19124 (JP, A) JP-A-63-104058 (JP, A) JP-A-4-133061 (JP, A) Actually open flat 6-36054 (JP, U) (58) Field (Int.Cl. ⁷ , DB name) G03F 1/14 G03F 7/20 H01L 21/027

Claims (8)

(57) [Claims] 1. A frame, a polymer thin film attached to the upper edge of the frame, a first adhesive layer formed on the entire lower edge of the frame, and a surface of the first adhesive layer . The first adhesive layer protruding
A pellicle for an exposure reticle, comprising a second adhesive layer having a smaller area . 2. A central portion or an inner peripheral portion of the first adhesive layer
The pellicle for an exposure reticle according to claim 1, wherein the second adhesive layer is formed . 3. A slope having a high central portion or inner peripheral portion
The first adhesive layer having a surface and the middle of the first adhesive layer
The pellicle for an exposure reticle according to claim 1 , wherein the second adhesive layer is formed on the central portion or the inner peripheral portion . 4. The pellicle for an exposure reticle according to claim 1, wherein the second adhesive layer is composed of a plurality of isolated portions. 5. The first adhesive layer according to claim 1, wherein the second adhesive layer comprises a continuous linear portion.
The pellicle for an exposure reticle described. 6. The adhesive force of the second adhesive layer is set to the first adhesive layer.
6. The pellicle for an exposure reticle according to claim 1, wherein the pellicle is weaker than the adhesive force of the agent layer . 7. A frame, a polymer thin film attached to the upper edge of the frame, a first adhesive layer formed on the entire lower edge of the frame, and a surface of the first adhesive layer . The first adhesive layer protruding
When the pellicle is affixed with a second adhesive layer narrower area on the exposure reticle, first, tentatively adhered by the second adhesive layer on the exposure reticle, the dust exposure reticle in that state The adhesion state is inspected, and if the adhesion state of dust is within the allowable range, the first adhesion
An exposure characterized by finally adhering with the agent layer , and when the dust adhesion state is not within the allowable range, the pellicle is peeled off to wash the exposure reticle, and then the pellicle is attached again onto the exposure reticle. How to attach pellicle for reticle. 8. An exposure reticle is placed on which a frame and a frame are mounted.
The thin polymer film attached to the upper edge of the frame and the entire lower edge of the frame
Formed first adhesive layer and surface of the first adhesive layer
A second contact having a smaller area than the first adhesive layer protruding from
A base on which a pellicle having a binder layer is placed, a pressing member that can press the peripheral portion of the pellicle by adjusting a pressing force, and a surface of an exposure reticle below the pressing member through the pellicle. An apparatus for sticking a pellicle for an exposure reticle, comprising: a surface state inspection device capable of inspecting a dust attachment state.