JP3400933B2 - Method of manufacturing flexible circuit board - Google Patents
Method of manufacturing flexible circuit boardInfo
- Publication number
- JP3400933B2 JP3400933B2 JP26787697A JP26787697A JP3400933B2 JP 3400933 B2 JP3400933 B2 JP 3400933B2 JP 26787697 A JP26787697 A JP 26787697A JP 26787697 A JP26787697 A JP 26787697A JP 3400933 B2 JP3400933 B2 JP 3400933B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- metal
- flexible circuit
- pattern
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気メッキ法によ
り回路パタ−ンを形成する為の可撓性回路基板の製造法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible circuit board for forming a circuit pattern by electroplating.
【０００２】[0002]
【従来の技術】従来、可撓性回路基板を製造する場合、
銅箔を基材としてこれに絶縁フィルムを接着した可撓性
銅張積層板を使用していた。銅箔は絶縁フィルムとの接
着面に予め密着性を向上する為に表面処理を施すことも
できる。また、銅箔は圧延法や電解法等で製造され、そ
の銅箔をエッチング手段で所要の回路パタ−ンを形成し
ていた。2. Description of the Related Art Conventionally, when manufacturing a flexible circuit board,
A flexible copper clad laminate having a copper foil as a base material and an insulating film bonded thereto has been used. The copper foil may be subjected to a surface treatment in advance on the adhesive surface with the insulating film in order to improve the adhesion. Further, the copper foil is manufactured by a rolling method or an electrolysis method, and the required circuit pattern is formed by etching the copper foil.
【０００３】[0003]
【発明が解決しようとする課題】前記の如く回路パタ−
ンを形成する為のエッチング法は、銅箔を化学的に溶解
する手段であり、その製法上オ−バ−エッチングする可
能性があった。その為、回路パタ−ンの細り、欠け又は
断線といった不良を発生する要因になっていた。また、
多量のエッチング廃液が発生し、その処理にも問題があ
った。As described above, the circuit pattern
The etching method for forming the copper foil is a means for chemically dissolving the copper foil, and there is a possibility of over-etching due to the manufacturing method. Therefore, it has been a factor of causing defects such as thinning of the circuit pattern, chipping or disconnection. Also,
A large amount of etching waste liquid was generated, and there was a problem in its treatment.
【０００４】一方、製品によっては回路パタ−ン形成後
にメッキ処理を施す場合もあるが、いずれのメッキ処理
に於いても、メッキ層の密着性の向上の目的で回路パタ
−ンの表面をソフトエッチングして表面の異常層を除去
していた。この場合、銅箔の製造メ−カ−により、圧延
や電解などの製法或いはその防錆処理などの表面仕上げ
も異なり、また、防錆処理により形成される防錆膜の厚
み性状も一定していなかった。その為に、ソフトエッチ
ング液に対する銅箔の溶解性が異なり、エッチング量が
安定しないという現象があった。このようなエッチング
量不足の場合はメッキ層の密着性が不十分となり、ま
た、エッチング量過多の場合はメッキ表面の仕上がりが
粗くなったりしていた。このいずれの場合でも製品の歩
留まりを低下させるという問題があった。On the other hand, some products may be plated after the circuit pattern is formed. In any plating process, the surface of the circuit pattern is softened to improve the adhesion of the plated layer. The abnormal layer on the surface was removed by etching. In this case, depending on the manufacturer of the copper foil, the manufacturing method such as rolling or electrolysis or its surface finish such as anticorrosion treatment is different, and the thickness property of the anticorrosion film formed by anticorrosion treatment is also constant. There wasn't. Therefore, there is a phenomenon that the solubility of the copper foil in the soft etching solution is different and the etching amount is not stable. When the etching amount is insufficient, the adhesion of the plating layer is insufficient, and when the etching amount is excessive, the finish of the plating surface is rough. In any of these cases, there is a problem that the yield of products is reduced.
【０００５】本発明は斯かる諸問題を解消する為の可撓
性回路基板の製造法を提供するものである。The present invention provides a method for manufacturing a flexible circuit board to solve these problems.
【０００６】[0006]
【課題を解決するための手段】その為に、本発明の可撓
性回路基板の製造法では、ポリイミドフィルムまたはポ
リエステルフィルム等の絶縁フィルム上にプライマ−成
分を含有する金属とバインダ−成分との混合液を塗布し
乾燥することにより前記絶縁フィルム表面に前記金属を
被着する工程と、前記金属の表面に感光性ドライフィル
ムを貼着して露光・現像処理により所要の回路パタ−ン
に必要なパタ−ンを形成する工程と、該パタ−ン形成部
に電気メッキを施して所要の回路パタ−ンを形成する工
程と、前記感光性ドライフィルムを剥離して前記回路パ
タ−ン以外の不要な前記金属部分を剥離する工程とを有
するものである。Therefore, in the method for producing a flexible circuit board of the present invention, a metal containing a primer component and a binder component are formed on an insulating film such as a polyimide film or a polyester film. The step of applying the metal to the surface of the insulating film by applying a mixed solution and drying, and the step of exposing and developing the photosensitive dry film on the surface of the metal to obtain the required circuit pattern. Different pattern forming step, a step of electroplating the pattern forming portion to form a desired circuit pattern, and a step of peeling the photosensitive dry film to remove a pattern other than the circuit pattern. And a step of peeling off the unnecessary metal portion.
【０００７】ここで、前記金属の被着工程に続いて該金
属表面にＮｉ又はＣｕを無電解メッキすることもでき、
また、絶縁フィルムと金属の密着性を更に強固にする為
に、前記絶縁フィルムの表面をサンドブラスト又は凸版
圧着法などの手段で粗面化することも好適である。Here, it is also possible to perform electroless plating of Ni or Cu on the surface of the metal following the step of depositing the metal,
In order to further strengthen the adhesion between the insulating film and the metal, it is also preferable to roughen the surface of the insulating film by means such as sandblasting or letterpress bonding.
【０００８】また、前記プライマ−成分にはアセトン、
キシレン、トルエンなどのケトン類又はベンゼンの誘導
体を使用でき、前記バインダ−成分としてはセルロ−ス
等の有機物を採用でき、そして、前記プライマ−成分を
含有する前記金属にはＰｄ又はＮｉ及びその合金である
活性金属が使用され、前記パタ−ンの形成後に電気メッ
キする金属にはＮｉやＣｕ或いはＮｉ及びＣｕの複層の
ものを使用できる。Further, the primer component is acetone,
Ketones such as xylene and toluene or derivatives of benzene can be used, organic materials such as cellulose can be adopted as the binder component, and Pd or Ni and its alloys can be used as the metal containing the primer component. The active metal is used, and the metal to be electroplated after forming the pattern may be Ni or Cu or a multi-layer of Ni and Cu.
【０００９】[0009]
【発明の実施の形態】以下、実施例を挙げて本発明を更
に説明する。一実施例として、絶縁フィルムには厚さ２
５μｍの市販のポリイミドフィルム又はポリエステルフ
ィルムを用い、プライマ−成分としてトルエンを、ま
た、バインダ−成分としてセルロ−スを用い、金属Ｐｄ
との重量比が１：１．５：７．５の混合液を絶縁フィル
ムに５ｇ／ｍ2塗布した。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be further described below with reference to Examples. As an example, the insulating film has a thickness of 2
A commercially available polyimide film or polyester film having a thickness of 5 μm was used, toluene was used as a primer component, and cellulose was used as a binder component.
5 g / m 2 of a mixed liquid having a weight ratio of 1: 1.5: 7.5 was applied to the insulating film.
【００１０】これを２３０℃で２分間乾燥し、これに通
常法で感光性ドライフィルムを貼着し、露光・現像処理
して回路パタ−ンの為のパタ−ンを形成した。このパタ
−ンに硫酸銅を主成分とする銅メッキ浴を用いて銅メッ
キ厚みで３５μｍの電解メッキ処理を行って回路パタ−
ンを形成した。そこで、感光性ドライフィルムを剥離
後、キシレンを用いて不要な金属Ｐｄ領域を除去して可
撓性回路基板を得た。This was dried at 230 ° C. for 2 minutes, a photosensitive dry film was adhered to it by an ordinary method, and exposed and developed to form a pattern for a circuit pattern. This pattern is subjected to electrolytic plating treatment with a copper plating thickness of 35 μm using a copper plating bath containing copper sulfate as a main component to form a circuit pattern.
Formed. Therefore, after peeling the photosensitive dry film, unnecessary metal Pd regions were removed using xylene to obtain a flexible circuit board.
【００１１】ここで、絶縁フィルムと金属の密着性を更
に強固にする為に、絶縁フィルムの表面をサンドブラス
ト又は凸版圧着法などの手段で粗面化することもでき
る。Here, in order to further strengthen the adhesiveness between the insulating film and the metal, the surface of the insulating film may be roughened by means such as sandblasting or letterpress bonding.
【００１２】また、プライマ−成分には上記の他、アセ
トン、キシレンなどのケトン類又はベンゼンの誘導体を
使用でき、プライマ−成分を含有する金属にはＰｄの他
Ｎｉ及びその合金である活性金属も使用でき、そして、
パタ−ンの形成後に電気メッキする金属にはＮｉやＮｉ
及びＣｕの複層のものを使用できる。In addition to the above, ketones such as acetone and xylene, or a derivative of benzene can be used as the primer component, and as the metal containing the primer component, not only Pd but also active metals such as Ni and its alloys can be used. Can be used and
Ni or Ni is used for the metal to be electroplated after the pattern is formed.
And a multilayer of Cu can be used.
【００１３】上記手法により製造した可撓性回路基板
は、回路パタ−ンの精度が良好であって、例えば回路パ
タ−ン幅３０μｍの細線部でも欠けや断線等はなかっ
た。The flexible circuit board manufactured by the above method has a good circuit pattern accuracy, and for example, there is no chipping or disconnection even in a fine line portion having a circuit pattern width of 30 μm.
【００１４】次に、他の実施例として、絶縁フィルムに
は上記実施例と同様なものを用いたが、金属Ｐｄを被着
後、無電解銅メッキ浴を使用して金属Ｐｄ表面上に銅を
厚さ２μｍ無電解メッキ処理した可撓性回路基板も製造
した。Next, as another embodiment, the same insulating film as that used in the above embodiment was used, but after depositing the metal Pd, an electroless copper plating bath was used to deposit copper on the surface of the metal Pd. A flexible circuit board having a thickness of 2 μm and subjected to electroless plating was also manufactured.
【００１５】絶縁フィルムと回路パタ−ンとの密着性を
従来法で製造した可撓性回路基板と比較したところ、密
着強度はｇ／ｃｍ2表示で、本発明の無電解メッキ処理
無しの場合に７００、無電解メッキ処理有りの場合に７
２０、そして従来法の場合では６００〜６５０であっ
た。この結果から分かるように、本発明による製造法で
は絶縁フィルムと回路パタ−ンとの密着性の良好な可撓
性回路基板を製造することができた。When the adhesion between the insulating film and the circuit pattern is compared with that of a flexible circuit board manufactured by a conventional method, the adhesion strength is in g / cm 2 and the case without the electroless plating treatment of the present invention. 700, 7 with electroless plating
20 and 600 to 650 in the case of the conventional method. As can be seen from these results, it was possible to manufacture a flexible circuit board having good adhesion between the insulating film and the circuit pattern by the manufacturing method according to the present invention.
【００１６】[0016]
【発明の効果】本発明によれば、絶縁フィルムと回路パ
タ−ンとの密着性の良好な可撓性回路基板を製造するこ
とができ、また、回路パタ−ンの形成手段としてエッチ
ング法を使用しないので、エッチング廃液を発生させる
こともない。According to the present invention, it is possible to manufacture a flexible circuit board having good adhesion between an insulating film and a circuit pattern, and an etching method is used as a means for forming the circuit pattern. Since it is not used, no etching waste liquid is generated.
【００１７】本発明法を採用する場合には、片面型可撓
性回路基板のみならず、密着性に優れたスル−ホ−ル導
通部を有する両面型可撓性回路基板も好適に製造でき
る。When the method of the present invention is adopted, not only a single-sided flexible circuit board but also a double-sided flexible circuit board having a through-hole conducting portion having excellent adhesion can be preferably manufactured. .
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/18 H05K 3/24 H05K 3/38 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) H05K 3/18 H05K 3/24 H05K 3/38
Claims (6)
るＰｄ又はＮｉ及びその合金からなる金属とバインダ−
成分との混合液を塗布し乾燥することにより前記絶縁フ
ィルム表面に前記金属を被着する工程と、前記金属の表
面に感光性ドライフィルムを貼着して露光・現像処理に
より所要の回路パタ−ンに必要なパタ−ンを形成する工
程と、該パタ−ン形成部に電気メッキを施して所要の回
路パタ−ンを形成する工程と、前記感光性ドライフィル
ムを剥離して前記回路パタ−ン以外の不要な前記金属部
分を剥離する工程とを含む可撓性回路基板の製造法。1. A metal and a binder made of Pd or Ni and an alloy thereof containing a primer component on an insulating film.
A step of applying the metal on the surface of the insulating film by applying a mixed solution of the components and drying, and a circuit pattern required by exposing and developing by adhering a photosensitive dry film on the surface of the metal. Forming a pattern necessary for the pattern, a step of electroplating the pattern forming portion to form a desired circuit pattern, and a step of peeling the photosensitive dry film to form the circuit pattern. A method of manufacturing a flexible circuit board, which comprises the step of peeling off unnecessary metal portions other than those described above.
Ｎｉ又はＣｕを無電解メッキする工程を含む請求項１の
可撓性回路基板の製造法。2. The method for manufacturing a flexible circuit board according to claim 1, further comprising a step of electrolessly plating Ni or Cu on the surface of the metal subsequent to the step of depositing the metal.
又は凸版圧着法などの手段で粗面化する請求項１又は請
求項２の可撓性回路基板の製造法。3. The method for manufacturing a flexible circuit board according to claim 1, wherein the surface of the insulating film is roughened by means such as sandblasting or letterpress bonding.
ン、トルエンなどのケトン類又はベンゼンの誘導体であ
る請求項１〜３のいずれかの可撓性回路基板の製造法。4. The method for producing a flexible circuit board according to claim 1, wherein the primer component is a ketone such as acetone, xylene or toluene, or a derivative of benzene.
物である請求項１〜４のいずれかの可撓性回路基板の製
造法。5. The method of manufacturing a flexible circuit board according to claim 1, wherein the binder component is an organic substance such as cellulose.
属がＮｉ及び／又はＣｕである請求項１〜５のいずれか
の可撓性回路基板の製造法。6. The method for manufacturing a flexible circuit board according to claim 1, wherein the metal to be electroplated after forming the pattern is Ni and / or Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26787697A JP3400933B2 (en) | 1997-09-12 | 1997-09-12 | Method of manufacturing flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26787697A JP3400933B2 (en) | 1997-09-12 | 1997-09-12 | Method of manufacturing flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1187887A JPH1187887A (en) | 1999-03-30 |
| JP3400933B2 true JP3400933B2 (en) | 2003-04-28 |
Family
ID=17450863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26787697A Expired - Fee Related JP3400933B2 (en) | 1997-09-12 | 1997-09-12 | Method of manufacturing flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3400933B2 (en) |
-
1997
- 1997-09-12 JP JP26787697A patent/JP3400933B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1187887A (en) | 1999-03-30 |
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