JP3404456B2 - Solid material dicing method - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for treating a solid material using a dicing sheet in a dicing process technique.

[0002]

2. Description of the Related Art FIGS. 1 (a) to 1 (g) are views showing a conventional dicing process, and FIGS. 1 (h) (i) (j).
1 (k) is a diagram showing a state of adhesion of dust, generated compound and the like on the surface of the solid chip in FIGS. 1 (d) (e) (f) (g).

As shown in FIG. 1 (a), the dicing sheet is composed of two layers of an adhesive layer 2 and a base material 3, and a solid material 1 to be diced is placed on the adhesive layer 2 as shown in FIG. 1 (b). to paste together. Next, as shown in FIG. 1C, the solid material 1 is fully cut by a dicing blade 5 using a dicing device as shown in FIG. 1D to form a solid chip 6. Next, as shown in FIG. 1E, the produced compound 8 (FIG. 1H) on the surface of the solid chip 6 is washed away with the washing water 7. Then, as shown in FIGS. 1 (f) and (i), appearance inspection is performed to detect dust on the surface of the solid chip 6, adhesion of the generated compound 8 or chip chip, and defective product due to crack 10.
Bad marks 9 are applied to the defective product as shown in FIGS. Solid chips 6 are formed by using such a dicing process.

[0004]

According to the method using the conventional dicing process, when the solid material 1 is fully cut to form the solid material 6, the adhesive layer 2 and the base material 3 are diced by cutting the dicing sheet. The generated compound 8 which is dust is generated.

Since this compound 8 has an adhesive property, it tends to bind to the dicing blade 5, which lowers the cutting ability of the dicing blade 5, leading to chipping of the solid chip 6 and generation of cracks 10. Also, a problem occurs that the life of the dicing blade 5 is shortened.

Further, since the produced compound 8 is very likely to adhere to the surface of the solid chip 6, washing with the washing water 7 is often insufficient, and as a result, a defective product is produced by the visual inspection and the yield is lowered. There is also the problem of inviting.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method in which a produced compound is less likely to adhere to the conventional method.

[0008]

According to the present invention (Claim 1)
According to the solid material dicing method, a solid material is diced.
The process of attaching to a sheet and the process of attaching to the sheet
The step of applying a surfactant to the surface of the solid material
Process of dicing solid material and washing solid chips
And a cleaning step.
By removing the surfactant,
Achieve the stated purpose.

Solid material die according to the present invention (claim 2)
The sing method is to apply a surfactant to one main surface of the solid material.
And the other surface of the solid material coated with the surfactant.
The step of sticking to a dicing sheet, and the solid material
Process of dicing the material and washing solid chips
And having at least
Achieving the above objectives by removing the surfactant
To achieve.

As a method for applying the surface active agent to the solid material, it is preferable to drop the surface material with a dropper, a nozzle or the like.

Even when the surfactant is mixed in the cutting water, the solid material may be coated with the surfactant in advance.

The solid material according to the present invention (claim 3)
Of glass materials, semiconductor materials, dielectric materials, and metal materials
Due to any one or more types of laminated structure
Thus, the above object is achieved.

Here, the surfactant is preferably one that can be easily removed by city water used for washing, and it is more preferable to use a general household neutral detergent.

The operation of the present invention will be described below. As in the present invention, by attaching a surfactant to the surface of the solid material with which the dicing blade contacts, not only the solid material but also a film of the surfactant is formed on the surface of the dicing blade, and the sticky product compound is bound. Hard to do. Therefore, it is possible to reduce chipping and cracking of solid chips, cutting accuracy of dicing, cutting life,
It is possible to improve the cutting speed. Also,
Product compound deposition on the solid chip surface is also reduced.

By removing the surfactant from the solid chip in the subsequent washing step, the surfactant does not affect the performance of the solid chip at all.

[0016]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

2 (a) to 2 (g) are diagrams showing the dicing process of the present invention, and FIGS. 2 (h) (i) (j).
FIG. 2 (k) is a diagram showing a state of adhesion of dusts, generated compounds and the like on the surface of the solid chip in FIGS. 2 (d) (e) (f) (g).

As shown in FIG. 2 (a), the dicing sheet is composed of two layers of an adhesive layer 2 and a base material 3, and the solid material 1 to be diced on the adhesive layer 2 is as shown in FIG. 2 (b). After the bonding, the surfactant 4 is applied on the adhesive layer 2. Next, as shown in FIG. 2C, the solid material 1 is removed by the dicing blade 5 using a dicing device.
Full cutting is performed as in (d) to form the solid chip 6.
Next, as shown in FIG. 2 (e), the surfactant 4 and the produced compound 8 (FIG.
Wash away (h)). Then, as shown in FIGS. 2F and 2I, appearance inspection is performed to detect dust on the surface of the solid chip 6 and defective products due to adhesion of the generated compound 8, and FIGS.
Bad mark 9 is applied to the defective product as described above. Solid chips 6 are formed by using such a dicing process.

Here, as the surface active agent, a commercially available neutral detergent for household use was used.

In the present embodiment, the surfactant was applied to the solid material adhered to the dicing sheet, but the present invention is not limited to this, and the surfactant is applied to the solid material in advance before adhering to the dicing sheet. May be applied.

As the solid material, it is possible to use one of a glass material, a semiconductor material, a dielectric material, and a metal material, or a laminated material of a plurality of kinds.

[0022]

As in the present invention, by protecting the surface of the solid material during dicing with the use of a surfactant, chipping and cracks of the solid chip are reduced, the life of the dicing blade and the cutting speed are improved, and cutting is performed. Accuracy and cutting ability are improved. Also, the adhesion of the produced compound on the surface of the solid chip is reduced. Therefore, cost reduction and man-hour reduction can be achieved by improving the yield of the dicing process.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a conventional example.

FIG. 2 is a diagram for explaining one embodiment of the present invention.

[Explanation of symbols]

1 Solid material 2 Adhesive layer 3 base materials 4 Surfactant 5 dicing blade 6 solid chips 7 wash water 8 Product compound 9 Bad Mark 10 cracks and chips

Claims (3)

(57) [Claims] 1. A step of attaching a solid material to a dicing sheet, a step of applying a surfactant to the surface of the solid material attached to the sheet, a step of dicing the solid material, and a dicing solid material. And a step of washing at least, by the washing step,
A solid material dicing method characterized in that the surfactant is removed. 2. A step of applying a surfactant to one main surface of the solid material, a step of attaching the other surface of the solid material coated with the surfactant to a dicing sheet, and a step of dicing the solid material. And a step of washing the solid chip, wherein the surfactant is removed by the washing step. Wherein the solid material, a glass material, a semiconductor material, dielectric material, to claim 1 or 2, characterized in that either one kind or plural kinds of the laminated structure of a metal material
The solid material dicing method described .