JP3406528B2 - Non-sliding gate valve for semiconductor manufacturing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-sliding gate valve for semiconductor manufacturing equipment.

[0002]

2. Description of the Related Art A conventional gate valve is arranged orthogonally in the middle of a fluid flow passage 50 as shown in FIG. 9, and an arm 51 is provided by supplying air pressure to a cylinder or by rotating a handle wheel. The gate pusher 52 and the gate 53 connected to are moved to open and close. That is, as shown in FIG. 9, when the gate 53 is in contact with the roller 54, the cam 55 (or link) changes the direction of the force so that the O-ring 56 fitted in the gate 53 is closed. The valve seat surface 58 provided on the inner wall of the main body 57 is pressed to bring it into a completely closed state. When the gate 53 is fully opened, the pressure-bonded gate 53 is once separated from the valve seat surface 58, and then the arm 5 is opened.
1 is pulled back to move the gate push 52 and the gate 53 as shown in FIG. Therefore, the O-ring 56
Is only crimped to the valve seat surface 58 and is said not to slide at all.

[0003]

By the way, in this gate valve, the movement of closing the gate 53 is shown in FIG.
It is operated by a trapezoidal cam 55 as shown in (b),
The opening operation was due to the tensile force of the spring 59.

Therefore, if the O-ring 56 sticks, the pulling force of the spring 59 will not open the gate 53,
The gate 53 is opened by the pulling force, and the O-ring 56 scrapes the valve seat surface 58. Also,
Even in a reverse pressure state in which pressure is applied from the back surface of the gate 53, the gate 53 cannot be opened only by the pulling force of the spring 59, and eventually the gate 53 is pulled up to open it.
The O-ring 56 will rub the valve seat surface 58.

The rubbing of the O-ring 56 on the valve seat surface 58 in this manner is a problem that must be avoided in a semiconductor manufacturing apparatus because the generation of particles increases. Further, in the structure of the non-sliding gate valve, since the sliding parts such as the cam 55 and the roller 54 are provided inside the valve, dust is easily generated. Further, when the reaction gas is used in a contact area, the gate 53 is heated by a heater so as to prevent the product from adhering. In that case, the O-ring 56 easily adheres to the valve seat surface 58 due to the heat. When the gate 53 is opened, the rubbing phenomenon of the O-ring 53 cannot be avoided. Further, when the gate is heated by the heater, it is inconvenient to clean the gate and replace the O-ring because the heater is built in the gate.

Therefore, the present invention enables the gate to be heated by the gate heater, and the gate can be separated from the gate heater to facilitate cleaning of the gate and replacement of the O-ring. The present invention is intended to provide a non-sliding gate valve for semiconductor manufacturing equipment.

[0007]

In order to solve the above problems, a non-sliding gate valve for a semiconductor manufacturing apparatus according to the present invention is vertically moved between a position where a gate is opposed to a flow path opening and a position where it is separated from the flow path opening, In a non-sliding gate valve for a semiconductor manufacturing apparatus, wherein the gate is moved in a substantially horizontal direction at a position facing the flow passage opening to open and close the flow passage opening, the gate having substantially the same size as the gate. Heater
It consists of a hot plate and a seal plate.
Attach the seal plate to the surface of the
Cartridge heater or heat medium installed on the hot plate
While sealing the flow path, the surface of the seal plate
Stack the gate and bolt from the back side of the hot plate.
Tighten the so that the gate and gate heater can be removed.
It is characterized by the fact that it has been broken .

[0008]

In each of the above constructions, as a gate heater, a hot plate having a groove on the front surface side, a heater mounted in the groove, and the surface of the hot plate are stacked so as to cover the heater, And a seal plate disposed in contact with the back surface of the heater. In this case, it is preferable that the hot plate and the seal plate are welded all around to seal the heater.

Further, as a gate heater, a hot plate having a groove-shaped heat medium flow passage on the surface side is superposed on the surface of this hot plate, and the entire circumference of the hot plate is welded to the hot plate to seal the heat medium flow passage. A seal plate may be provided that is hermetically sealed so that a heat medium can circulate with the outside, and that is placed in contact with the back surface of the gate.

[0011]

According to the present invention constructed as described above,
Since the gate is heated by the gate heater on the back surface side thereof, it is possible to prevent the product of reaction gas from adhering to the gate. Since the gate heater is constructed separately from the gate and the gate is detachably attached to the gate heater, the gate can be removed for maintenance or the like.

Further, by forming the gate heater in a closed structure, the inside of the gate heater is not affected even when the flow path changes from atmospheric pressure to a vacuum state.

Further, the gate can be easily attached and detached by connecting the gate to the gate heater with a bolt.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment in which the non-sliding gate valve for a semiconductor manufacturing apparatus according to the present invention is used in a portion which is in contact with a reaction gas will be described below. 1 to 6, 1 is a body, 2 is a gate that opens and closes a flow passage port 3 provided on the front side of the body 1, and the surface of the gate 2 is slightly tapered so that the upper portion is thicker and the lower portion is thinner. Is attached,
An O-ring 4 made of fluororubber is provided in the groove formed in the peripheral portion of the front surface, and a gate heater is provided on the back surface side.
The gate heater has a sheathed heater 9 built in between the hot plate 6 and the seal plate 5,
The seal plate 5 is formed to have substantially the same size as the gate 2. The back surface of the gate 2 is overlapped with the seal plate 5, and the gate 2 is detachably attached from the back surface side of the hot plate 6 with a bolt 46. The gate heater is connected to the lower end of the stem 8 via a connector 7 attached to the back surface of the hot plate 6.
An external connection portion 9 a of the sheathed heater 9 and a thermocouple 10 for temperature adjustment are housed in a space inside the lower end portion of the stem 8.

A bonnet 11 is fixedly mounted on the upper surface of the body 1, and a stem 8 is inserted through a central through hole 12 of the bonnet 11. A bellows 14 is provided on the outer periphery of the protruding portion of the stem 8, and the bellows 14 is attached to a flange 13 fixed to the lower peripheral edge of the central through hole 12 and a support member fixed to the outer periphery of the upper end of the stem 8. ing. A sheath heater 16 and a thermocouple 17 are provided on the outer peripheral portion of the bellows 14. A stem holder 15 is attached to the upper end of the stem 8, and a fulcrum roller 18 is rotatably supported on the lower left and right sides of the stem holder 15. The left and right fulcrum rollers 18 are vertically movably fitted in vertical grooves 21 on the outer surface of a housing 20 of a cylinder 19 standing on both left and right sides of the bonnet 11. The left and right ends of the cam plate 23 are joined to the upper end of the piston rod 22 of each cylinder 19. Below the cam plate 23, a pair of left and right roller cams 26 having cam grooves 25 are provided. A pair of left and right cam rollers 24 held by a roller holder 27 connected to the upper end of the stem 8 is engaged with the cam groove 25 of each roller cam 26. Spring hooks 28 are provided at the rear ends of the left and right upper surfaces of the stem holder 15, and spring hooks 2 are provided at the front ends of the left and right lower surfaces of the roller cam 26.
9 is provided, and a spring 30 is stretched between the spring hooks 28 and 29 so as to expand and contract in the front-back direction.

In FIG. 1, 31 is a fluid supply pipe connected to the cylinders 19 on the left and right sides by a one-touch joint 32,
3 is a speed controller for controlling the fluid flow rate to adjust the operating speed of the cylinder 19, 34 is a side plate,
35 is an upper plate, 36 is a cover plate, 3
Terminal plates 7 and 38 are gate heaters and bellows heaters, and 39 is a heater cord, which is held by a holder 40.

Stroke A of cylinder 19 shown in FIG.
3 is the stroke B of the gate 2 shown in FIG. 2 plus the operating stroke C of the roller cam 26 shown in FIG. 3, and the operating stroke C is converted into the horizontal movement D shown in FIG.

The thus-configured non-slide gate valve for a semiconductor manufacturing apparatus of this embodiment is used, for example, for partitioning a reaction furnace of a CVD apparatus and a load lock chamber. By supplying air to the upper chambers of the left and right cylinders 19, as shown in FIGS. 4 and 5, the cam plate 23 connected to the upper end of the piston rod 22 and the roller cam 26 integral with the cam plate 23 are formed. To descend. Along with this, the roller holder 27 via the cam roller 24 held in the cam groove 25 of the roller cam 26, the stem 8 coupled to the roller holder 27, the stem holder 15 integrated with the stem 8, the gate 2 and the like close the bellows 14. Compress and descend. When the gate 2 is lowered to a level facing the flow passage port 3 of the body 1, the fulcrum rollers 18 pivotally supported on the lower left and right sides of the stem holder 15 stop at the lower end of the vertical groove 21, and the stem 8 integrated with the stem holder 15 is provided. As a result, the gate 2 stops moving at stroke B. When the cam plate 23 is further lowered by the operation of the cylinder 19 and the roller cam 26 integral therewith is lowered by the stroke C shown in FIG. 3, the cam roller 24 moves from the engaging portion 25b to the bending portion 25a in the cam groove 25. The stem holder 15, which is connected to the roller holder 27 for holding the cam roller 24, the stem 8 and the gate 2 are fulcrum rollers at the lower left and right sides of the stem holder 15 as a result of being overcome by the reverse inclined surface 25c and horizontally moving backward by D. As shown in FIG. 6, the gate 2 having the fulcrum as the fulcrum 18 is tilted, and the surface of the gate 2 having a tapered surface becomes vertical to close the flow path port 3. At this time, the O-ring 4 on the peripheral portion of the front surface of the gate 2 comes into close contact with the peripheral portion of the flow path opening 3 and reliably seals.

Next, the case of opening the non-sliding gate valve will be explained. Air is supplied to the lower chambers of the cylinders 19 on the left and right sides, and the cam plate 23 connected to the upper end of the piston rod 22 is shown in FIGS. As shown, when the roller cam 26 integrated with the cam plate 23 is lifted by the stroke C shown in FIG. 3, the cam roller 24 in the cam groove 25 moves from the reverse inclined surface 25c to the bending portion 25a to the engaging portion 25b. The roller holder 27, the stem holder 15, the stem 8 and the gate 2 that can hold the cam roller 24 as a result of being moved over to the side and horizontally moving forward by D
Rotate around the fulcrum roller 18 as a fulcrum and stand upright, and the gate 2 separates from the peripheral edge of the flow path port 3. When the cam plate 23 is further raised by the operation of the cylinders 19 on both the left and right sides, and the roller cam 26 integral with the cam plate 23 is raised, the cam roller 2 held in the cam groove 25 is moved.
4 through roller holder 27, stem holder 1
5, the stem 8, the gate 2 and the like extend the bellows 14 and ascend. When the stroke B is raised to the level at which the gate 2 opens the flow passage port 3 of the body 1, the cylinder 19
Stroke reaches the limit of rise of A = B + C, and the rise of the gate 2 is stopped.

In such a non-slide gate valve, since the gate 2 is heated via the seal plate 5 by the sheath heater 9 housed in the hot plate 6 of the gate heater on the back surface side, the gate 2 and the O ring 4 are CVD-heated. It is possible to prevent the reaction product generated in the reaction furnace of the apparatus from adhering. Further, since the bellows 14 inserted through the stem 8 so as to move up and down is heated by the sheath heater 16 from the outer peripheral side, it is possible to prevent reaction products from adhering to the bellows 14. Further, even if the gate 2 is heated and the O-ring 4 becomes sticky to the periphery of the flow path port 3, the cam groove 25 of the roller cam 26 and the cam roller 2 can be used.
4, the cam mechanism is forcibly operated by the thrust of the cylinder 19 to horizontally move the gate 2 along the axial direction of the flow passage port 3 to open it. The generation of particles can be suppressed without rubbing the peripheral edge of the. Further, even in a reverse pressure state in which pressure is applied from the back surface of the gate 2, the thrust of the cylinder 19 forcibly operates the cam mechanism to move the gate 2 horizontally and open it, so that the O-ring 4 touches the peripheral edge of the flow path port 3. Without doing
The generation of particles can be suppressed.

Next, a second embodiment of the present invention will be described with reference to FIGS. The non-sliding gate valve for a semiconductor manufacturing apparatus according to the present embodiment is different from the non-sliding gate valve for a semiconductor manufacturing apparatus according to the first embodiment in the structure of the gate heater. Will be described, and description of other configurations will be omitted. 7 (a), (b), (c),
As shown in (d), the lower end of the stem 8'provided with the through hole 41 at the center of the shaft penetrates the center of the upper plate of the hot plate 6'and is joined to the center of the upper end of the hot plate 6 '. The peripheral edge of the through portion and the stem 8'are seal-welded. A groove 42 is formed in the peripheral edge of the surface of the hot plate 6'on the side of the gate 2 and a cartridge heater 43 is housed in this groove 42. An electric wire 44 of the cartridge heater 43 is formed in a through hole 41 at the axial center of the stem 8 '. Threaded through Figure 1
The upper side plate 34 of the housing 20 shown in FIG.
Is connected to the terminal plate 37 attached to the. The seal plate 5'is applied to the surface of the hot plate 6 ', and seal welding 45 is applied to the entire circumference thereof to seal the cartridge heater 43. Then, the gate 2 of the same size is overlaid on the surface of the seal plate 5'of the gate heater, and the gate 2 is tightened from the back surface of the hot plate 6'with the bolt 46 so that the gate 2 is detachably attached to the gate heater. ing.

Next, a third embodiment of the present invention will be described with reference to FIGS. The non-sliding gate valve for semiconductor manufacturing equipment according to the present embodiment is the first
Since the structure of the gate heater is different from that of the non-sliding gate valve for a semiconductor manufacturing apparatus according to the embodiment, the structure of this gate heater will be described, and the description of the other structures will be omitted. 8 (a), (b), (c),
As shown in (d), a groove-shaped heat medium passage 42 is formed in the peripheral portion of the surface of the hot plate 6'on the gate 2 side.
The heat medium supply pipe 4 is inserted into the through hole 41 provided at the axial center of the stem 8 '.
8 is inserted, one end of the heat medium supply pipe 48 is connected to the heat medium supply port 47a of the heat medium supply / discharge block 47 fixed to the upper end of the stem 8 ′ by a screw, and the other end of the heat medium supply pipe 48 is L-shaped. It is connected to the heat medium flow path 42 via the joint pipe 49. The heat medium discharge passage 48 ′ on the outer periphery of the heat medium supply pipe 48 is connected to the heat medium discharge passage 48 ″ having the heat medium discharge port 47 b of the heat medium supply and discharge block 47 in the horizontal direction.
The seal plate 5 ′ is applied to the surface of the above, and seal welding 45 is applied to the entire circumference thereof to seal the heat medium passage 42. And the seal plate 5'of the gate heater
A gate 2 of the same size is stacked on the surface of the gate 2, and the gate 2 is tightened from the back surface of the hot plate 6'with a bolt 46 so that the gate 2 is detachably attached to the gate heater.

In the gate heater of the gate valve according to the second and third embodiments, the cartridge heater 43
And hot plate 6'that contains a heater for circulating heat medium
Is completely sealed by the seal plate 5 ', the temperature does not become non-uniform even if the pressure changes from atmospheric pressure to vacuum, and the entire gate 2 can be heated uniformly. Further, since the gate 2 is detachably fastened to the gate heater with the bolt 46, the gate 2 can be easily washed and the O-ring 4 can be easily replaced.

[0025]

In summary, according to the non-sliding gate valve for a semiconductor manufacturing apparatus of the present invention, the gate is heated by the gate heater on the back surface side thereof, so that the portion contacted with the reaction gas, for example, the reaction furnace of a CVD apparatus or the like. When used as a partition, it is possible to prevent the reaction product from adhering to the gate or the O-ring for sealing. Since the gate heater is configured separately from the gate and the gate and the gate heater are detachably attached, the gate can be separated from the gate heater, and the gate can be easily washed and the O-ring can be replaced easily. You can

Further, since the gate heater has a closed structure, the inside of the gate heater is not affected even when the pressure of the flow path changes from atmospheric pressure to vacuum, so that the temperature of the gate heater becomes non-uniform. Instead, the gate can be heated uniformly.

By attaching the gate to the gate heater with bolts, the gate heater can be easily attached and detached.

[Brief description of drawings]

FIG. 1 is a vertical sectional front view of a non-slide gate valve for a semiconductor manufacturing apparatus according to a first embodiment of the present invention in an open state.

FIG. 2 is a vertical side view taken along the line II of FIG. 1, showing the non-sliding gate valve for the same semiconductor manufacturing apparatus.

FIG. 3 is a vertical cross-sectional view showing a cam mechanism in the non-sliding gate valve for the semiconductor manufacturing apparatus.

FIG. 4 is a vertical cross-sectional view showing the non-sliding gate valve for the same semiconductor manufacturing apparatus, showing a state in which the gate is vertically lowered to close it.

FIG. 5 is a longitudinal side view of the same non-sliding gate valve for semiconductor manufacturing equipment taken along the line II-II of FIG. 4.

FIG. 6 is a vertical cross-sectional side view showing the non-sliding gate valve for the same semiconductor manufacturing apparatus, showing a state in which a flow passage port is closed by a gate.

7 (a) to 7 (d) show a gate heater in a non-sliding gate valve for a semiconductor manufacturing apparatus according to a second embodiment of the present invention, and FIG. A front view, (b) is a vertical sectional side view taken along line III-III of (a),
(C) is a side view of (a) and (d) is a sectional view taken along line IV-IV of (a) with a gate attached.

FIGS. 8A to 8D show a gate heater in a non-sliding gate valve for a semiconductor manufacturing apparatus according to a third embodiment of the present invention, and FIG. Front view, (b) is a vertical sectional side view taken along the line V-V of (a), (c)
6A is a side view of FIG. 7A, and FIG. 6D is a sectional view taken along line VI-VI of FIG.

FIG. 9 is a vertical cross-sectional side view showing a conventional non-slide gate valve for a semiconductor manufacturing apparatus in a closed state.

FIG. 10 is a vertical sectional side view showing the gate valve in an open state.

11A and 11B are views showing a cam for closing the gate in the same gate valve, FIG. 11A is a view when the gate is open, and FIG. 11B is a view showing a state when the gate is closed. .

[Explanation of symbols]

1 body 2 gates 3 channel openings 4 O-ring 5,5 'seal plate 6,6 'hot plate 7 connector 8,8 'stem 9 Sheath heater 14 Bellows 15 Stem holder 16 sheathed heater 18 fulcrum roller 19 cylinders 21 vertical groove 22 Piston rod 23 Cam plate 24 Cam roller 25 cam groove 26 Roller cam 27 Roller holder 30 spring 41 through hole 42 Groove-shaped heat medium flow path 43 Cartridge heater 45 Seal welding 46 volts 47 Heat medium supply / discharge block 47a Heat medium supply port 47b Heat medium outlet 48 Heat medium supply pipe 48 'heat medium discharge path 48 "heat medium discharge path

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) F16K 39/00-51/02 F16K 3/00-3/36

Claims (3)

(57) [Claims] 1. A gate is vertically moved to a position facing a flow path opening and a position where it is separated, and the gate is moved substantially horizontally at a position facing the flow path opening to open and close the flow path opening. In a non-slide gate valve for semiconductor manufacturing equipment configured as described above , the size is almost the same as the gate.
Install the gate heater of the hot plate and the seal plate.
Consists of a seal plate on the surface of this hot plate
Cartridge mounted on the hot plate by attaching by welding
Seals the heater or heat medium flow path and seals
Put the gate on the surface of the plate and
Tighten the bolts from the back side to
A semiconductor manufacturing apparatus characterized by being detachably provided
Non-sliding gate valve for. 2. The surface circumference of the hot plate on the gate side
A groove is formed at the edge, and the cartridge heater is placed in this groove.
A seal plate on the surface of this hot plate.
Syringe, cartridge with seal welding all around them
A non-slider for semiconductor manufacturing equipment according to claim 1, wherein the heater is sealed.
Dynamic gate valve. 3. A groove-shaped heat is formed on the surface side of the hot plate.
Form a medium flow path and seal the surface of this hot plate.
Rates are stacked and this hot plate and seal play
Is welded to the entire circumference to seal the heat medium flow path to the outside.
The half according to claim 1, wherein the heat medium is hermetically sealed so that the heat medium can circulate between the half.
Non-sliding gate valve for conductor manufacturing equipment.