JP3436837B2 - Substrate rotary processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, like a spin developer (rotary developing device), supplies a processing liquid such as a developing liquid to the surface of a substrate while holding the substrate in a horizontal posture and rotating it about a vertical axis. The present invention relates to a substrate rotary processing apparatus for performing processing by means of a processing liquid supply unit, and more particularly to a processing liquid supply unit for supplying a processing liquid to the surface of a substrate.

[0002]

2. Description of the Related Art In a substrate rotary processing apparatus used as a semiconductor manufacturing apparatus or the like, for example, a spin developer, in order to supply a developing solution to the entire surface of a rotating substrate as uniformly as possible, various types are used. A developer supply nozzle has been proposed. For example, in the developing solution supply nozzle disclosed in Japanese Patent Publication No. 5-68092, as shown in FIG. 10, the tip of the cylindrical body 2 is closed, and the developing solution is reversed at the tip within the cylindrical body 2. In this way, the cylindrical body 2 is held in the vertical posture, and the plurality of discharge holes 3 are formed in the side wall near the lower end of the cylindrical body 2.
Is formed in the circumferential direction. At the time of supplying the developing solution, the developing solution supply nozzle 1 is moved above the substrate W held horizontally by the spin chuck 4 by a nozzle moving means (not shown) so that the lower end of the cylindrical body 2 and the surface of the substrate W. Place them so that they approach each other. Then, when the developing solution is fed into the cylindrical body 2 through the developing solution supply pipe 5, the developing solution collides with the inner wall surface of the lower end of the cylindrical body 2 to reduce its flow velocity, and the developing solution is horizontally discharged from the plurality of discharge holes 3 provided in the side wall. Is discharged to the surface of the substrate W, is radially discharged toward the center and the peripheral direction of the substrate W, and is supplied to the surface of the substrate W.
The developer is spread over the entire surface of.

[0003]

In the developing solution supply nozzle 1 as shown in FIG. 10, the developing solution is spotwise supplied from the plurality of ejection holes 3 onto the substrate W, and the substrate W is rotated to rotate the substrate. Since the developing solution is spread over the entire surface of W, uneven development may occur at the place where the developing solution first hits the surface of the substrate W and at other places. Further, the developer supply pipe 5 has a bent portion and the like. Therefore, the flow velocity of the developer flowing through the pipe before reaching the developer supply nozzle 1 may vary depending on the position of the flow passage in the cross-sectional direction. become. Then, the difference in the flow rate of the developing solution depending on the position of the flow path appears as the difference in the flow rate of the developing solution discharged from the respective discharge holes 3 formed in the circumferential direction of the cylindrical body 2, and the developing solution is supplied. There is a problem that the ejection balance when the developing solution is ejected from the plurality of ejection holes 3 of the nozzle 1 becomes unstable, and uneven processing such as uneven development on the surface of the substrate W is caused. Further, when the developer discharged from the discharge holes 3 of the developer supply nozzle 1 reaches the surface of the substrate W, air is trapped in the developer or nitrogen dissolved in the developer is minute. and changes towards the bubble to generate a so-called micro-bubbles in the developing solution, the developing solution covering the surface of the substrate W
There is a disadvantage such as, development defect occurs by the microbubbles occurs.

The present invention has been made in view of the above circumstances, and the processing liquid discharged from the discharge port of the processing liquid supply nozzle is evenly supplied to the surface of the substrate to cause uneven processing such as uneven development. Even if the flow velocity of the processing liquid flowing in the processing liquid supply pipe before reaching the processing liquid supply nozzle may vary depending on the position in the cross-sectional direction of the flow path, the position of the flow path By reducing the difference in the flow rate of the processing liquid due to the, to improve the uniformity of processing in the substrate surface, further, to prevent the generation of microbubbles in the processing liquid supplied on the substrate and covering the substrate surface, An object of the present invention is to provide a substrate rotary processing apparatus that can eliminate the inconvenience caused by microbubbles.

[0005]

According to the first and second aspects of the present invention, there are provided substrate holding / rotating means for holding a substrate in a horizontal posture and rotating it about a vertical axis, and an ejection port for ejecting a processing liquid. And a processing liquid supply nozzle for supplying a processing liquid to the surface of the substrate held by the substrate holding / rotating means, wherein the processing liquid supply nozzle
The discharge port of the substrate held by the substrate holding / rotating means is
It is formed downward so as to face the surface, faces the ejection port of the treatment liquid supply nozzle, and is interposed between the surface of the substrate held by the substrate holding / rotating means and the ejection port of the treatment liquid supply nozzle. Then, a liquid contact member having a circular planar shape is provided , and the liquid contact member blocks the processing liquid discharged from the discharge port from directly flowing down onto the substrate, and the liquid discharge member from the discharge port to the upper surface of the liquid contact member. The discharged processing liquid is caused to flow along the upper surface thereof so that the processing liquid flows down from the entire peripheral edge of the liquid contact member onto the substrate. Further, in the invention according to claim 1, the processing liquid supply nozzle discharge ports, a plurality of circular holes constructed by consecutively provided, the diameter of each circular hole, larger than equal to or a distance between the circular hole and circular hole adjacent thereto, according to the second aspect of the present invention Then, slide the discharge port of the processing liquid supply nozzle Characterized by being constituted by preparative shaped hole.

According to a third aspect of the present invention, in the substrate rotary processing apparatus according to the second aspect, the slit-shaped hole is divided into a plurality of partitions by a plurality of partition walls.

According to a fourth aspect of the present invention, in the substrate rotary processing apparatus according to any one of the first to third aspects, the processing liquid supply nozzle has a discharge port connected to the processing liquid supply nozzle. The liquid supply pipe is characterized in that it is arranged outside the projected position of the inner peripheral edge of the tip.

In the substrate rotary processing apparatus according to each of the first and second aspects of the invention, the substrate holding / rotating means holds the substrate.
Formed downwards to face the surface of the held substrate
The processing liquid discharged from the discharge port of the processing liquid supply nozzle is
Without falling onto the substrate as it flows down on the liquid abutting member,
After flowing along the upper surface , it flows down from the entire peripheral edge of the liquid contact member onto the substrate. In this case, by the processing device of the invention according to claim 1, the discharge port of the processing solution supply nozzle is configured by consecutively provided a plurality of circular holes, the diameter of each circular hole is circular adjacent to the circular hole since that is the same or more as compared to the distance between the holes, the liquid contact part material flows out from the respective round holes
While the treatment liquids that have flowed down in a rod shape flow along the upper surface of the liquid contact member, adjacent treatment liquids are connected to each other to form a film-like flow. Further, by the processing device of the invention according to claim 2, the processing liquid for the discharge port of the supply nozzle is formed by a slit-type holes, the processing liquid flowing down the liquid against member on flows out from the slit-shaped hole, It becomes a film and flows along the upper surface of the liquid contact member. Therefore, the processing liquid flows in a curtain shape from the entire peripheral edge of the liquid application member and is evenly supplied to the surface of the substrate. Further, in the treatment apparatus of the invention according to claim 1, even if the flow velocity of the treatment liquid flowing in the treatment liquid supply pipe is uneven in the cross-sectional direction of the flow path, it flows into the treatment liquid supply nozzle from the treatment liquid supply pipe. treatment liquid so flows down each solution against member on the respective circular holes after being diverted into a plurality of circular holes, the treatment liquid from the discharge port of the processing solution supply nozzle flows down on the liquid contact part material point Thus, the deviation of the flow rate of the processing liquid due to the position of the flow path is alleviated. The processing liquid is small because through the circular hole flows down from the circular hole on the liquid abutting member, when the treatment liquid is discharged from the discharge port of the processing solution supply nozzle, air is mixed in the processing solution Hateful.

Further, even if the flow velocity of the treatment liquid flowing through the treatment liquid supply pipe before reaching the treatment liquid supply nozzle may vary depending on the position of the flow passage in the cross-sectional direction, the treatment liquid supply nozzle may be discharged from the discharge port. Since the discharged processing liquid is supplied onto the substrate after passing through the upper surface of the liquid contact member, the difference in the flow velocity of the processing liquid depending on the position of the flow path is alleviated. Further, when the process liquid discharged from the discharge port of the processing solution supply nozzle is Chakueki the upper surface of the liquid contact member, microbubbles occurred during processing solution, the microbubbles, the treatment liquid is liquid against member While flowing over , it diffuses into the air and disappears. Therefore, micro bubbles do not coexist in the processing liquid that has flowed down from the liquid contact member to the surface of the substrate and covered the surface of the substrate.

In the substrate rotary processing apparatus according to the third aspect of the present invention, the slit-shaped holes are divided into a plurality of partitions by a plurality of partition walls. Therefore, even if the flow velocity of the treatment liquid flowing in the treatment liquid supply pipe is uneven in the cross-sectional direction of the flow path, the treatment liquid flowing from the treatment liquid supply pipe into the treatment liquid supply nozzle is divided into a plurality of compartments. liquid contact portion material after it has been
Since flows down above the treatment liquid from the discharge port of the processing solution supply nozzle when flowing down on the liquid abutting member, the flow rate of the treatment liquid by the position of the flow path with respect to that there is no partition wall in the slit-shaped hole Bias will be alleviated. The processing liquid, so flows down onto the liquid against member through the compartment partitioned small, when the treatment liquid is discharged from the discharge port of the processing solution supply nozzle, air is unlikely to be mixed in the processing solution .

In the substrate rotary processing apparatus of the invention according to claim 4, since the discharge port of the processing liquid supply nozzle is arranged outside the projection position of the inner peripheral edge of the tip of the processing liquid supply pipe, the processing liquid supply pipe processing liquid that has flowed into the process liquid supply nozzle, after changed to by like abuts the bottom wall inner surface once the outward direction of the flow of the process liquid supply nozzle, on the discharge port liquid against <br/> member Run down. Thus, treatment liquid from the discharge port of the processing solution supply nozzle when flowing down on the liquid abutting member, so that the deviation of the flow velocity distribution of the process liquid by the position of the flow path is reduced.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described below with reference to the drawings.

1 and 2 show an example of an embodiment of the present invention. FIG. 1 is a perspective view showing a part of the structure of a spin developer, and FIG. 2 is a front view thereof. The spin developer, as shown, is a developer supply nozzle 1
0, a spin chuck 12 for holding the substrate W in a horizontal posture,
Further, although not shown, the spin motor includes a rotating shaft 14 that supports the spin chuck 12, and rotates the rotating shaft 14 to rotate the substrate W held by the spin chuck 12 around a vertical axis. The spin chuck 12 holds a cup, which is provided so as to surround the side and the lower side of the substrate W held by the spin chuck 12 and collects the developing solution scattered from above the substrate W, and the developing solution supply nozzle 10. In addition, a nozzle moving mechanism for moving between a standby position outside the outer peripheral edge of the substrate W and a developing solution supply position directly above the substrate W is provided. The components not shown are the same as those of the conventional spin developer, and the description thereof will be omitted. In the following, a developer supply that supplies a developer to the surface of the substrate W held in the horizontal position by the spin chuck 12 will be described. The parts will be mainly described.

The cylindrical body 16 of the developing solution supply nozzle 10 is connected to a developing solution supply pipe (not shown) by a flow path, and a developing solution flow-down element 18 is integrally fixed to the tip of the cylindrical body 16. . The developer flow-down element 18 is the cylindrical body 1.
6 is attached so as to close the front end opening of the tubular body 16. As shown in a longitudinal sectional view of FIG. 3 and a plan view from above in FIG.
Plug part 20 that is fitted to the tip of the plug to close the opening surface of the plug
And a connecting portion 22 extending downward from the central portion thereof, and a liquid contacting member 24 that is connected to the central portion and has a circular planar shape, and these are made of, for example, a fluororesin. It is integrally formed. The stopper 20 has
A plurality of circular holes 26, ten circular holes in the illustrated example, are formed on the circumference, and the circular holes 26 are arranged so that adjacent ones are in contact with each other. The lower ends of the ten circular holes 26 serve as the discharge ports 28. This outlet 2
8 and the liquid contact member 2 so as to be interposed between the surface of the substrate W held by the spin chuck 12 and each ejection port 28.
4 are arranged. The entire bottom surface of the liquid contact member 24 is formed as a concave surface 30. The developer flow-down element 18 is provided with a distance such that the bottom surface of the liquid application member 24 does not come into contact with the developer on the substrate W, for example, a distance of about 4 mm is provided between the bottom surface of the liquid application member 24 and the surface of the substrate W. And is arranged above the substrate W.

In the substrate rotary processing apparatus having the above-described structure, as shown in FIG. 2, the developing solution from the discharge port 28 of the developing solution supply nozzle 10 is, for example, 0.5 l / min-1.
When discharged at a flow rate of 5 l / min, the developer does not flow down onto the substrate W as it is, but flows down onto the liquid contact member 24 and flows along its surface, and then flows down onto the substrate W from its peripheral edge. Will be done. Further, the circular holes 26 of the developing solution supply nozzle 10 are arranged so that adjacent ones are in contact with each other and are evenly arranged on the circumference, and the planar shape of the liquid contact member 24 is circular. Therefore, the developing solution is uniformly discharged from the discharge port 28 of the developing solution supply nozzle 10 in the circumferential direction, and the ten rod-shaped flows are connected to each other while flowing along the surface of the liquid contact member to form a film. , And flows down from the entire peripheral edge of the liquid contact member 24 to the surface of the substrate W evenly. For this reason, the developing solution is evenly supplied to the surface of the substrate W in a curtain shape from the entire peripheral edge of the liquid application member 24. Incidentally, when the developer discharged from the discharge port 28 of the developer supply nozzle 10 reaches the surface of the liquid contact member 24, micro bubbles are generated in the developer. Micro bubbles are mixed in the developer that has diffused and disappeared into the air while flowing on the surface of the patch member 24 and flowed down from the liquid patch member 24 to the surface of the substrate W to cover the surface of the substrate W. There is no.

The plurality of circular holes formed in the plug portion of the developing solution flow-down element need not necessarily be arranged so that adjacent ones are in contact with each other as shown in FIG. As shown in the partially enlarged plan view of FIG. 5, the circular hole 32 and the circular hole 32 adjacent to the circular hole 32 may be arranged with a space. In this case, the diameter D of the circular holes 32 is equal to the distance d between the adjacent circular holes 32, or the diameter D of the circular holes 32 is larger than the distance d (D ≧ d).
To be

The circular holes 26 formed in the plug portion 20 of the developer flow-down element 18 shown in FIG. 4 are all formed to have the same diameter, but the developer shown in the plan view of FIG. Like the flow-down element 34, a large-diameter circular hole 38 and a small-diameter circular hole 40 may be formed in the plugging portion 36 in a mixed manner. Furthermore, the plurality of circular holes formed in the plug portion of the developer flow-down element do not necessarily have to be evenly arranged on the circumference, and it is also necessary to continuously connect the plurality of circular holes on the circumference. Not necessarily.

Next, the developer flow-down element 42, whose plan view is shown in FIG. 7, has an annular slit-shaped hole 46 in the plug portion 44.
It is an example of the structure which formed. Reference numeral 48 in the figure denotes a connecting portion for holding the liquid contact member in the plug portion 44. In the developing solution supply nozzle to which the developing solution flow-down element 42 is attached, the developing solution is uniformly discharged in the circumferential direction from the annular discharge port at the lower end of the slit-shaped hole 46, and the film is formed along the surface of the liquid contact member. It flows in a uniform manner and is evenly supplied in a curtain shape from the entire peripheral edge of the liquid contact member to the surface of the substrate.

Further, in the developer flow-down element 50 shown in a plan view in FIG. 8, an annular slit-shaped hole 54 is formed in the plug portion 52.
And the slit-shaped hole 54 is formed into a plurality of partition walls 56.
This is an example of a configuration in which a plurality of sections 58 are partitioned by. The developing solution supply nozzle to which the developing solution flow-down element 50 is attached has the developing solution supply nozzle shown in FIG. 7 when the flow rate of the developing solution flowing in the developing solution supply pipe is uneven in the cross-sectional direction of the flow path. This is advantageous over the downflow element 42. That is, in the developing solution supply nozzle to which the developing solution flow-down element 50 is attached, the processing solution flowing in from the developing solution supply pipe is divided into a plurality of compartments 58 and then flows down onto the surface of the liquid applying member. Therefore, the deviation of the flow rate of the developing solution depending on the position of the flow path is alleviated. Further, in the developing solution supply nozzle to which the developing solution flow-down element 50 is attached, the developing solution flows down onto the surface of the solution applying member through the partition 58 that is divided into small parts, so that air is unlikely to be mixed into the developing solution.

The slit-shaped holes 46 and 54 formed in the plug portions 44 and 52 of the developer flow-down elements 42 and 50 shown in FIGS. 7 and 8 are formed in an annular shape, but the developer flow-down is performed. The slit-shaped hole formed in the plugging portion of the element does not necessarily have to be annular. Further, the partition walls for partitioning the slit-like holes formed in the plug portion of the developer flow-down element may be arranged irregularly, and the partitions partitioned by the partition walls are shown in FIG. Various other shapes may be used.

Next, FIG. 9 shows another example of the embodiment of the present invention. FIG. 9 is a vertical cross-sectional view showing the configuration of the processing liquid supply unit of the spin developer. This developer supply nozzle 60
Is a developer discharge section 64 in which a plurality of circular holes 66 (or an annular slit-like hole) forming a discharge port are formed in communication with the tip of the developer supply pipe 62, and the developer discharge section 64. The connecting portion 68 extending downward from the central portion of the lower surface of the portion 64
And the liquid contact member 70 in which the connecting portion 68 is connected to the central portion.
It consists of and. The developing solution discharge part 64 is formed such that the diameter of the lower half part is larger than the diameter of the upper half part, and a plurality of circular holes 66 are respectively formed from the projection position 72 of the inner peripheral edge of the tip of the developing solution supply pipe 62. It is located outside.

In the developing solution supply nozzle 60 shown in FIG. 9, the developing solution flowing from the developing solution supply pipe 62 into the developing solution discharge section 64 collides with the inner surface of the bottom wall of the developing solution discharge section 64 and flows in the direction of flow. To the outside, and then flows down from the discharge port onto the surface of the liquid contact member 70 through the plurality of circular holes 66. Therefore, when the developing solution flows down from the outlet of the developing solution ejecting section 64 onto the surface of the liquid contact member 70, the deviation of the flow rate distribution of the developing solution due to the position of the flow path in the developing solution supply pipe 62 is alleviated. It will be.

The external shape and structure of the liquid contact member are shown in FIG.
It is not limited to the ones shown in FIGS. 4 and 9 and various ones can be used.

[0023]

When the substrate rotary processing apparatus according to each of the first and second aspects of the present invention is used, the processing liquid discharged from the discharge port of the processing liquid supply nozzle is curtained from the entire edge of the liquid applying member. Since it is evenly supplied to the surface of the substrate,
It is possible to prevent uneven processing such as uneven development due to uneven supply of the processing liquid to the substrate surface. Further, even if the flow velocity of the treatment liquid flowing in the developer supply pipe before reaching the treatment liquid supply nozzle may vary depending on the position in the cross-sectional direction of the flow passage, the flow velocity of the treatment liquid depends on the position of the flow passage. Since the difference is alleviated, the uniformity of processing in the substrate plane is improved as compared with the conventional apparatus. Furthermore, since it is possible to prevent microbubbles from being mixed in the processing liquid that has flowed down from the liquid application member to the surface of the substrate and covered the surface of the substrate, it is possible to eliminate inconveniences such as defective development due to the microbubbles.

Further, in the processing apparatus of the first aspect of the present invention, even if the flow velocity of the processing liquid flowing in the processing liquid supply pipe is uneven in the cross-sectional direction of the flow path, the processing liquid is discharged from the discharge port of the processing liquid supply nozzle. liquid is at the time when flowing down on the liquid abutting member, since the deviation of the flow rate of the treatment liquid by the position of the channel is to be relaxed, can be supplied uniformly processing solution to the surface of the substrate. Moreover, since the processing liquid flows down into smaller through the circular hole liquid against <br/> member on, when the treatment liquid is discharged from the discharge port of the processing solution supply nozzle, air is mixed in the processing solution Hateful.

In the substrate rotary processing apparatus according to the third aspect of the present invention, even if the flow velocity of the processing liquid flowing in the processing liquid supply pipe is uneven in the cross-sectional direction of the flow path, the processing liquid is supplied from the discharge port of the processing liquid supply nozzle. when the treatment liquid flows down on the liquid abutting member,
Since the deviation of the flow rate of the processing liquid due to the position of the flow path is reduced with respect to the slit-shaped hole having no partition wall, the processing liquid can be evenly supplied to the surface of the substrate. Further, in order to flow down to the processing solution through the compartment is partitioned small liquid abutting member on, when the treatment liquid is discharged from the discharge port of the processing solution supply nozzle, air is unlikely to be mixed in the processing solution.

In the substrate rotary processing apparatus according to the fourth aspect of the present invention, the processing liquid is applied from the discharge port of the processing liquid supply nozzle to the liquid contact portion.
At the time of flowing down onto the material, it is possible to mitigate the deviation in the flow velocity distribution of the processing liquid due to the position of the flow path in the processing liquid supply pipe.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of an embodiment of the invention according to claim 1 and showing a partial configuration of a spin developer.

FIG. 2 is a partial front view of the spin developer shown in FIG.

3 is a vertical cross-sectional view of a developer flow-down element that constitutes a developer supply unit of the spin developer shown in FIG.

FIG. 4 is a plan view of the developer flow-down element shown in FIG. 3 viewed from above.

FIG. 5 is a partially enlarged plan view of the developer flow-down element as seen from above, showing another embodiment of the invention according to claim 1;

FIG. 6 is a plan view of a developer flow-down element showing still another embodiment of the invention according to claim 1;

FIG. 7 is a plan view of a developer flow-down element showing an example of an embodiment of the invention according to claim 2;

FIG. 8 is a plan view of a developer flow-down element showing another embodiment of the invention according to claim 2;

FIG. 9 is a vertical cross-sectional view showing a configuration example of a processing liquid supply section of a spin developer of the invention according to claim 4;

FIG. 10 is a perspective view of a main part showing an example of a configuration of a developer supply nozzle in a conventional spin developer.

[Explanation of symbols]

10, 60 Developer supply nozzle 12 Spin chuck 14 rotation axis 18, 34, 42, 50 Developer downflow element 22, 68 connection part 24, 70 Liquid contact member 26, 32, 38, 40, 66 circular holes 28 Discharge port 46, 54 Slit holes 56 partition walls 58 divisions 62 Developer supply pipe 64 developer discharge part 72 Projection position of inner peripheral edge of tip of developer supply pipe W board

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Yoshii, 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Rakusai Plant (56) Reference JP-A-7-326554 (JP, A) Special Kaihei 5-234879 (JP, A) (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/027 G03F 7 / 00,7 / 06,7 / 07, G03F 7/12-7 / 14 G03F 7/26-7/42 B05C 5/00-5/04 B05C 7/00-21/00

Claims (4)

(57) [Claims] 1. A surface of a substrate held by the substrate holding / rotating means, which has a substrate holding / rotating means for holding the substrate in a horizontal posture and rotating it about a vertical axis, and a discharge port for discharging a processing liquid. In a substrate rotation type processing apparatus having a processing liquid supply nozzle for supplying a processing liquid to a substrate, the ejection port of the processing liquid supply nozzle is connected to the substrate holding / rotating unit.
Face downwards to face the surface of the substrate held by the means
Formed, and a plurality of circular holes constructed by consecutively provided, the diameter of each circular hole, so as to be larger equal to or than the distance between the circular hole and circular hole adjacent thereto, the process liquid supply Face the nozzle's outlet and its outlet
A liquid contacting member having a circular planar shape is disposed immediately below the substrate and is interposed between the surface of the substrate held by the substrate holding / rotating means and the discharge port of the processing liquid supply nozzle.
By the liquid contact member, the processing liquid discharged from the discharge port of the processing liquid supply nozzle is blocked from flowing down on the substrate as it is, and the processing liquid is caused to flow along the upper surface to flow down from the entire peripheral edge onto the substrate . A substrate rotation type processing apparatus characterized by the above. 2. A surface of a substrate held by the substrate holding / rotating means, which has a substrate holding / rotating means for holding the substrate in a horizontal posture and rotating it about a vertical axis, and a discharge port for discharging a processing liquid. In a substrate rotation type processing apparatus having a processing liquid supply nozzle for supplying a processing liquid to a substrate,
Face downwards to face the surface of the substrate held by the means
Formed, and, in <br/> both to constitute the slit-type holes, is opposed to the treatment liquid outlet port of the supply nozzle and the surface treatment liquid supply of the substrate held by the substrate holding and rotating means The plane shape is circular because it is interposed between the nozzle and the discharge port.
The liquid applying member that forms the
It is characterized in that the processing liquid discharged from the discharge port of the physical liquid supply nozzle is blocked from flowing down on the substrate as it is, and the processing liquid is caused to flow along the upper surface so as to flow down from the entire peripheral edge onto the substrate. Substrate rotary processing equipment. 3. The substrate rotary processing apparatus according to claim 2, wherein the slit-shaped holes are partitioned into a plurality of partitions by a plurality of partition walls. 4. The process liquid supply nozzle according to claim 1, wherein the discharge port of the process liquid supply nozzle is arranged outside the projected position of the inner peripheral edge of the tip of the process liquid supply pipe connected to the process liquid supply nozzle. The substrate rotary processing apparatus described.