JP3414564B2 - Substrate rotary processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, like a spin developer (rotary developing device), supplies a processing liquid such as a developing liquid to the surface of a substrate while holding the substrate in a horizontal posture and rotating it about a vertical axis. The present invention relates to a substrate rotary processing apparatus for performing processing by means of a processing liquid supply unit, and more particularly to a processing liquid supply unit for supplying a processing liquid to the surface of a substrate.

[0002]

2. Description of the Related Art In a substrate rotary processing apparatus used as a semiconductor manufacturing apparatus or the like, for example, a spin developer, in order to supply a developing solution to the entire surface of a rotating substrate as uniformly as possible, various types are used. A developer supply nozzle has been proposed. For example, in the developing solution supply nozzle disclosed in Japanese Patent Publication No. 5-68092, as shown in FIG. 9 , the tip of the cylindrical body 2 is closed, and the developing solution is reversed at the tip within the cylindrical body 2. In this way, the cylindrical body 2 is held in the vertical posture, and the plurality of discharge holes 3 are formed in the side wall near the lower end of the cylindrical body 2.
Is formed in the circumferential direction. At the time of supplying the developing solution, the developing solution supply nozzle 1 is moved above the substrate W held horizontally by the spin chuck 4 by a nozzle moving means (not shown) so that the lower end of the cylindrical body 2 and the surface of the substrate W. Place them so that they approach each other. Then, when the developing solution is fed into the cylindrical body 2 through the developing solution supply pipe 5, the developing solution collides with the inner wall surface of the lower end of the cylindrical body 2 to reduce its flow velocity, and the developing solution is horizontally discharged from the plurality of discharge holes 3 provided in the side wall. Is discharged to the surface of the substrate W, is radially discharged toward the center and the peripheral direction of the substrate W, and is supplied to the surface of the substrate W.
The developer is spread over the entire surface of.

[0003]

In the developing solution supply nozzle 1 as shown in FIG . 9 , the developing solution is spotwise supplied from the plurality of discharge holes 3 onto the substrate W, and the substrate W is rotated to rotate the substrate. Since the developing solution is spread over the entire surface of W, uneven development may occur at the place where the developing solution first hits the surface of the substrate W and at other places. Further, the developer supply pipe 5 has a bent portion and the like. Therefore, the flow velocity of the developer flowing through the pipe before reaching the developer supply nozzle 1 may vary depending on the position of the flow passage in the cross-sectional direction. become. Then, the difference in the flow rate of the developing solution depending on the position of the flow path appears as the difference in the flow rate of the developing solution discharged from the respective discharge holes 3 formed in the circumferential direction of the cylindrical body 2, and the developing solution is supplied. There is a problem that the ejection balance when the developing solution is ejected from the plurality of ejection holes 3 of the nozzle 1 becomes unstable, and uneven processing such as uneven development on the surface of the substrate W is caused. Further, when the developer discharged from the discharge holes 3 of the developer supply nozzle 1 reaches the surface of the substrate W, air is trapped in the developer or nitrogen dissolved in the developer is minute. There is a problem such that a so-called micro bubble is generated in the developing solution by changing into bubbles and the developing solution that covers the surface of the substrate W, for example, a developing solution causes micro-bubbles to cause poor development. is there.

The present invention has been made in view of the above circumstances, and the processing liquid discharged from the discharge port of the processing liquid supply nozzle is evenly supplied to the surface of the substrate to cause uneven processing such as uneven development. Even if the flow velocity of the processing liquid flowing in the developing solution supply pipe before reaching the processing liquid supply nozzle may vary depending on the position in the cross-sectional direction of the flow path, the position of the flow path By reducing the difference in the flow rate of the processing liquid due to the, to improve the uniformity of processing in the substrate surface, further, to prevent the generation of microbubbles in the processing liquid supplied on the substrate and covering the substrate surface, An object of the present invention is to provide a substrate rotary processing apparatus that can eliminate the inconvenience caused by microbubbles.

[0005]

The invention according to claim 1 is
It has a substrate holding / rotating means for holding the substrate in a horizontal posture and rotating it about a vertical axis, and a discharge port for discharging the processing liquid, and supplies the processing liquid to the surface of the substrate held by the substrate holding / rotating means. And a plurality of processing liquid supply nozzles on the lower end surface of the processing liquid supply nozzle.
The discharge ports of the
The shape is symmetrical, and the center part is the processing liquid supply nozzle.
Through the connecting part that extends downward from the center of the lower end surface,
The liquid contact member connected to the center of the lower end surface of the nozzle is opposed to the discharge port of the processing liquid supply nozzle and between the surface of the substrate held by the substrate holding / rotating means and the discharge port of the processing liquid supply nozzle. interposed therebetween and arranged by the liquid contact member, the
The processing liquid discharged from the discharge port is blocked from flowing down onto the substrate as it is, and the processing liquid discharged from the discharge port to the surface of the liquid applying member is caused to flow along the surface, and the edge of the liquid applying member is applied to the substrate. It is characterized in that the treatment liquid is made to flow downward.

[0006]

According to a second aspect of the invention, the substrate is placed in a horizontal posture.
Substrate holding / rotating means for holding and rotating around a vertical axis
And a discharge port for discharging the processing liquid.
Processing for supplying the processing liquid to the surface of the substrate held by the transfer means
In a substrate rotary processing apparatus having a liquid supply nozzle,
A liquid contact member with a concave bottom surface is used to supply the processing liquid.
Face the discharge port of the supply nozzle and hold and rotate the substrate.
The surface of the substrate held by the transfer means and the discharge of the processing liquid supply nozzle
It is placed so as to be interposed between the outlet and the liquid contact member.
The processing liquid discharged from the discharge port directly flows onto the substrate.
Block the falling liquid and flow the treatment liquid along the surface of the liquid application member.
It is characterized in that it is made to flow down from the edge onto the substrate .

In the substrate rotary processing apparatus according to the first aspect of the present invention, the processing liquid discharged from the discharge port of the processing liquid supply nozzle does not flow directly onto the substrate but is processed.
A plurality of liquid supply nozzles that are equidistantly formed on the circumference of the lower end of the liquid supply nozzle
From the individual discharge ports to the surface of the liquid contact member,
The treatment liquid is evenly discharged and flows over the surface of the liquid contact member.
After the treatment liquid has flowed along the surface of the liquid applying member , the processing liquid is applied from the entire peripheral edge of the liquid applying member having a symmetrical planar shape.
The treatment liquid evenly flows down on the surface of the substrate in the entire circumferential direction . Therefore, the processing liquid is evenly supplied to the surface of the substrate in a curtain shape from the entire edge of the liquid application member. Further, even if the flow velocity of the processing liquid flowing in the developing liquid supply pipe before reaching the processing liquid supply nozzle may vary depending on the position in the cross-sectional direction of the flow path, it is discharged from the discharge port of the processing liquid supply nozzle. Since the treatment liquid is supplied onto the substrate after passing through the surface of the liquid contact member, the difference in the flow velocity of the treatment liquid depending on the position of the flow path is alleviated. Furthermore, when the treatment liquid ejected from the ejection port of the treatment liquid supply nozzle reaches the surface of the liquid contact member, microbubbles are generated in the treatment liquid. While flowing over the surface, it diffuses into the air and disappears. Therefore, micro bubbles do not coexist in the processing liquid that has flowed down from the liquid contact member to the surface of the substrate and covered the surface of the substrate.

[0009]

In the substrate rotary processing apparatus according to the second aspect of the present invention, the processing liquid discharged from the discharge port of the processing liquid supply nozzle is used.
On the surface of the liquid contact member without directly flowing down onto the substrate.
After flowing down to the surface and flowing along its surface,
Run down from the edge onto the substrate. Therefore, the treatment liquid
Curtain-like from the entire edge of the member to the surface of the substrate
Will be supplied. Also reaches the processing liquid supply nozzle
The flow rate of the processing liquid flowing in the developer supply pipe
It may vary depending on the position in the cross-sectional direction of the road.
Even the processing liquid discharged from the discharge port of the processing liquid supply nozzle
Is supplied onto the substrate after passing through the surface of the liquid contact member.
Therefore, the difference in the flow rate of the processing liquid due to the position of the flow path is reduced.
Will be done. In addition, whether the discharge port of the processing liquid supply nozzle
When the processing liquid ejected from the liquid reaches the surface of the liquid contact member
In addition, micro bubbles are generated in the treatment liquid.
Bubbles are emptied while the processing liquid flows on the surface of the liquid application member.
Disperses into the air and disappears. Therefore, from the liquid contact member to the substrate
In the processing liquid that has flowed down to the surface of the substrate and covered the substrate surface,
Black bubbles will not be mixed. Further, since the entire bottom surface of the liquid contacting member is concave, liquid drainage at the edge of the liquid contacting member becomes good.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described below with reference to the drawings.

1 and 2 show an example of an embodiment of the present invention. FIG. 1 is a perspective view showing a part of the structure of a spin developer, and FIG. 2 is a front view thereof. The spin developer, as shown, is a developer supply nozzle 1
0, a spin chuck 12 for holding the substrate W in a horizontal posture,
Further, although not shown, the spin motor includes a rotating shaft 14 that supports the spin chuck 12, and rotates the rotating shaft 14 to rotate the substrate W held by the spin chuck 12 around a vertical axis. The spin chuck 12 holds a cup, which is provided so as to surround the side and the lower side of the substrate W held by the spin chuck 12 and collects the developing solution scattered from above the substrate W, and the developing solution supply nozzle 10. In addition, a nozzle moving mechanism for moving between a standby position outside the outer peripheral edge of the substrate W and a developing solution supply position directly above the substrate W is provided. The components not shown are the same as those of the conventional spin developer, and the description thereof will be omitted. In the following, a developer supply that supplies a developer to the surface of the substrate W held in the horizontal position by the spin chuck 12 will be described. The parts will be mainly described.

The tubular body 16 of the developing solution supply nozzle 10 is connected to a developing solution supply pipe (not shown), and a developing solution flow-down element 18 is integrally fixed to the tip of the tubular body 16. . The developer flow-down element 18 is the cylindrical body 1.
6 is attached so as to close the front end opening of the tubular body 16. As shown in a longitudinal sectional view of FIG. 3 and a plan view from above in FIG.
Plug part 20 that is fitted to the tip of the plug to close the opening surface of the plug
And a connecting portion 22 extending downward from the central portion thereof, and a liquid contacting member 24 that is connected to the central portion and has a circular planar shape, and these are made of, for example, a fluororesin. It is integrally formed. The stopper 20 has
A plurality of ejection holes 26 are formed on the circumference at equal intervals, and face the ejection openings 28 at the lower end of the ejection holes 26 and the surface of the substrate W held by the spin chuck 12 and each ejection opening 28. The liquid contact member 24 is arranged so as to be interposed between the liquid contact member 24 and the liquid contact member 24.
The entire bottom surface of the liquid contact member 24 is formed as a concave surface 30. The developer flow-down element 18 includes the liquid contact member 2
A distance such that the bottom surface of 4 does not come into contact with the developer on the substrate W,
For example, between the bottom surface of the liquid contact member 24 and the surface of the substrate W, 4
It is arranged above the substrate W with a distance of about mm.

In the substrate rotary processing apparatus having the above-described structure, as shown in FIG. 2, the developing solution is discharged from the plurality of ejection openings 28 of the developing solution supply nozzle 10 at 0.5 l / mi, for example.
When discharged at a flow rate of n to 1.5 l / min, the developing solution does not flow down onto the substrate W as it is, but flows down onto the liquid contact member 24 and flows along the surface thereof, and then from the peripheral edge thereof. It will flow down onto the substrate W. The plurality of discharge ports 28 of the developing solution supply nozzle 10 are evenly arranged on the circumference, and the plan view of the liquid contact member 24 is circular, so that the developing solution is supplied to the developing solution supply nozzle. The liquid is evenly ejected from the plurality of ejection ports 28 in the circumferential direction and evenly flows down from the entire peripheral edge of the liquid contact member 24 onto the surface of the substrate W. For this reason, the developing solution is evenly supplied to the surface of the substrate W in a curtain shape from the entire peripheral edge of the liquid application member 24. Incidentally, when the developer discharged from the discharge port 28 of the developer supply nozzle 10 reaches the surface of the liquid contact member 24, micro bubbles are generated in the developer. Micro bubbles are mixed in the developer that has diffused and disappeared into the air while flowing on the surface of the patch member 24 and flowed down from the liquid patch member 24 to the surface of the substrate W to cover the surface of the substrate W. There is no.

The outer shape and the structure of the liquid contact member are not limited to those shown in FIGS. 1 to 4, and various kinds can be used .

Further, the liquid contacting member 24 described above is formed so that the entire bottom surface thereof is formed into the concave surface 30 so that the liquid is easily drained at the peripheral edge . However, the liquid contacting member 38 shown in FIG.
As described above, it is possible to form the entire bottom surface into the convex surface 40 so as to improve drainage at the bottom surface portion. Reference numeral 42 in the drawing is a connecting portion extending from the center of the lower end surface of the developing solution supply nozzle (not shown).

The liquid application member 44 shown in FIG . 6 is an example in which the entire shape is a quadrangular pyramid. Reference numeral 46 in the drawing denotes a connecting portion extending from the center of the lower end surface of the developing solution supply nozzle (not shown). In addition to this, the outer shape of the liquid contact member may be a polygonal pyramid such as a triangular pyramid or a hexagonal pyramid .
It may be hemispherical, spherical, or elliptical.

The liquid contact member 48 shown in FIG . 7 has a structure in which a plurality of grooves 50 are equally arranged in the circumferential direction on the surface thereof and are radially formed. In the liquid contact member 48, the developer discharged from the discharge port of the developer supply nozzle (not shown) and flowing down is uniformly guided in the radial direction by being guided by the plurality of grooves 50, and from the entire periphery of the liquid contact member 48. It is evenly supplied to the surface of the substrate. Further, the liquid contact member 54 shown in FIG. 8 has a configuration in which notches 56 are formed at equal positions in the circumferential direction at a plurality of positions on the peripheral edge portion thereof. As described above, the notches 56 are equally formed at a plurality of positions on the peripheral edge portion of the liquid contact member 54, so that the developer discharged from the discharge port of the developer supply nozzle (not shown) flows down. It is possible to prevent the liquid from flowing in one direction, and the liquid contact member 54
It is possible to uniformly supply the developing solution to the surface of the substrate from the entire periphery of the substrate. Reference numerals 52 and 58 in the figure respectively denote connecting portions extending from the central portion of the lower end surface of the developing solution supply nozzle.

[0019]

[0020]

The developer supply nozzle and the liquid contact member are
It may be stopped when the developing solution is supplied to the substrate, or the developing solution may be supplied to the surface of the substrate while moving along the surface of the substrate.

[0022]

When the substrate rotary processing apparatus according to each of the first and second aspects of the present invention is used, the processing liquid discharged from the discharge port of the processing liquid supply nozzle is curtained from the entire edge of the liquid applying member. Since it is evenly supplied to the surface of the substrate,
It is possible to prevent uneven processing such as uneven development due to uneven supply of the processing liquid to the substrate surface. Further, even if the flow velocity of the treatment liquid flowing in the developer supply pipe before reaching the treatment liquid supply nozzle may vary depending on the position in the cross-sectional direction of the flow passage, the flow velocity of the treatment liquid depends on the position of the flow passage. Since the difference is alleviated, the uniformity of processing in the substrate plane is improved as compared with the conventional apparatus. Furthermore, since it is possible to prevent microbubbles from being mixed in the processing liquid that has flowed down from the liquid application member to the surface of the substrate and covered the surface of the substrate, it is possible to eliminate inconveniences such as defective development due to the microbubbles.

Further, in the substrate rotary processing apparatus according to the first aspect of the present invention, the processing liquid is evenly discharged in the circumferential direction from the plurality of discharge ports of the processing liquid supply nozzle to the surface of the liquid contact member, and the flat surface is obtained. Since the processing liquid flows down evenly in the entire circumferential direction from the entire peripheral edge of the liquid contact member having a symmetrical shape to the surface of the substrate, uneven processing may occur due to uneven supply of the processing liquid to the substrate surface. It can be prevented more reliably.

Further , in the substrate rotary processing apparatus according to the second aspect of the present invention, since the liquid is well drained at the edge of the liquid contact member, unnecessary dripping of the processing liquid on the surface of the substrate is eliminated, It is possible to prevent uneven processing.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of an embodiment of the present invention and showing a partial configuration of a spin developer.

FIG. 2 is a partial front view of the spin developer shown in FIG.

3 is a vertical cross-sectional view of a developer flow-down element that constitutes a developer supply unit of the spin developer shown in FIG.

FIG. 4 is a plan view of the developer flow-down element shown in FIG. 3 viewed from above.

5 is a front view of a liquid application member showing a configuration example different from that of the liquid application members shown in FIGS. 1 to 4. FIG .

FIG. 6 is a perspective view of a liquid contact member showing another configuration example.

FIG. 7 is a perspective view of a liquid contacting member similarly showing another configuration example.

FIG. 8 is a perspective view of a liquid contacting member similarly showing another configuration example.

FIG. 9 is a developer supply nozzle in a conventional spin developer.
It is a principal part perspective view which shows an example of a structure of a cheat .

[Explanation of symbols]

1 0 developer supply nozzle 12 spin chuck 14 rotation axis 18 developer flows down element 22,42,46,52,58 articulation 24, 3 8,44,48,5 4 liquid contact member 26 discharge holes 28 discharge opening 30 concave surface

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Yoshii, 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Rakusai Plant (56) Reference JP-A-6-338449 (JP, A) Special Kaihei 8-330211 (JP, A) JP 7-326554 (JP, A) JP 62-92441 (JP, A) JP 5-55133 (JP, A) (58) Fields investigated ( Int.Cl. ⁷ , DB name) H01L 21/027 G03F 7/30 502

Claims (2)

(57) [Claims] 1. A surface of a substrate held by the substrate holding / rotating means, which has a substrate holding / rotating means for holding the substrate in a horizontal posture and rotating it about a vertical axis, and a discharge port for discharging a processing liquid. In a substrate rotary processing apparatus having a processing liquid supply nozzle for supplying a processing liquid to a substrate , a plurality of discharge ports are circumferentially formed on a lower end surface of the processing liquid supply nozzle.
They are evenly distributed on the top and have a symmetrical planar shape, and the central part is the processing liquid supply nozzle.
Through the connecting part that extends downward from the center of the lower surface of the
The liquid contact member connected to the center of the lower end surface of the nozzle,
The liquid contact portion is arranged so as to face the discharge port of the processing liquid supply nozzle and to be interposed between the surface of the substrate held by the substrate holding / rotating means and the discharge port of the processing liquid supply nozzle.
Wood by, characterized in that the process liquid discharged from the discharge ports so as to flow down from the allowed edge flows along the surface of the processing liquid the liquid contact member intercept to flow down onto the substrate as it is on a substrate Substrate rotary processing equipment. 2. A substrate is held in a horizontal posture and is rotated about a vertical axis.
The substrate holding / rotating means has a substrate holding / rotating means for rotating and a discharge port for discharging the processing liquid.
Supplying the processing liquid to the surface of the substrate held on the step
In a substrate rotary processing apparatus having a supply nozzle, a liquid application member having a concave bottom surface is used to supply the processing liquid.
Face the discharge port of the supply nozzle and hold and rotate the substrate.
The surface of the substrate held by the transfer means and the discharge of the processing liquid supply nozzle
It is placed so as to be interposed between the outlet and the liquid contact member.
The processing liquid discharged from the discharge port directly flows onto the substrate.
Block the falling liquid and flow the treatment liquid along the surface of the liquid application member.
The feature is that it is made to flow down from the edge onto the substrate.
Substrate rotating apparatus for treating.