JP3462392B2 - Manufacturing method of sealing cap for electronic component protection package - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a cap for sealing a package made of ceramics or the like for protecting electronic parts such as circuit elements.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 20, a seal cap having a thickness of 0.2 mm and a width of 2.85 has been manufactured.
mm, length 2.85 mm FeNi 42% alloy and FeN
iCo alloy, for example Kovar (FeNi29% Co17
%) On a surface of a base material 11 made of Ni) or further plated with Au, on which a brazing ring material 12 made of an Au-based brazing material such as AuSn20% having a thickness of 30 μm is superposed and heat-fused. To form the sealing cap 13.

By the way, the manufacturing method of the above sealing cap cannot be expected to be produced in large numbers because it is a manual work.
Further, in order to cope with the smaller and thinner parts, the Au-based brazing material also needs to be small and thin. However, since this brazing material is brittle and difficult to process, the ring material 12 is pressed from the plate to remove the ring material 12. With this method, there is a limit in terms of the thinness of the ring width, etc., and it was impossible in particular in terms of brittleness.

Therefore, the surface of the Kovar plate material is plated with Ni, and the Au-plated surface of the brazing material is solid-phase diffusion-bonded to the surface, which is rolled and then pressed. , Mass production of sealing caps has been attempted. However, in solid-phase diffusion bonding, the Au-based brazing material and Au are diffused, and a brittle AuSn layer is formed at the interface, and the bonding strength is weak. There was a problem that it would come off as soon as it entered. Further, even if Au plating was omitted and only Ni plating was performed, solid-phase diffusion of the Ni plating and the Au-based brazing material did not easily occur, and the bonding strength could not be obtained.

[0005]

SUMMARY OF THE INVENTION Therefore, the present invention provides a method for manufacturing a sealing cap for an electronic component protection package, which has sufficient bonding strength and does not separate the Au-based brazing material from the base material even when bent. Is what you are trying to do.

[0006]

A method for manufacturing a sealing cap for an electronic component protection package according to the present invention for solving the above-mentioned problems includes a brazing tape made of an Au-based brazing material,
A base material tape made of FeNi-based material and Ni-plated or Ni-plated and Au-plated are overlaid,
It is placed on a lower die having a pin hole, the positioning pin of an upper die having a positioning pin is fitted into the pin hole to overlap the upper die and the lower die, and the upper die and the lower die are pressed. After fixing the upper mold and the lower mold together into an electric furnace, the upper mold and the lower mold are heated to melt the brazing filler metal tape to form a clad material, Immediately after heating the clad material or after rolling after heating, the clad material is pressed out to obtain a sealing cap.

According to the present invention, a tape material made of an Au-based brazing material is heat-fused to a base tape such as Kovar to form a clad material. According to the present invention, only the Au-based brazing material can be satisfactorily thinned without rolling the Au-based brazing material having poor workability.

Further, in the present invention, by setting the balance between the Kovar width before heat fusion and the width of the Au-based brazing material, the finished Au-based brazing material of the clad material is finished to a predetermined thickness. You can also For example, by combining wide Kovar and narrow Au brazing filler metal, Au
The thickness of the brazing filler metal layer can be further reduced.
At this time, since the upper and lower molds have poor wettability, the brazing filler metal does not melt and spread beyond the width of Kovar. Further, even if the Kovar and the Au-based brazing filler metal having the same width are used, it is possible to appropriately process the Kovar and the Au-based brazing filler metal uniformly by rolling while maintaining the thickness ratio of the Kovar and the Au-based brazing filler metal. Also,
The brazing material is not limited to AuSn 20%, but Au-based material or the like may be used, and the base material is not limited to Kovar and is FeNi.
A system material or the like is appropriately used.

In the present invention, the lower mold is further provided with a concave groove, the brazing tape and the base tape are fitted into the concave groove so that a part of the brazing tape and the base tape are projected from the concave groove, and then the upper mold is lowered. It is preferable to perform heat treatment after stacking with the mold.

When the Au-based brazing material tape and the base tape are long, two pairs of pin holes are provided in the lower die, two pairs of positioning pins are provided in the upper die, and the lower die is connected. After arranging, place the brazing material tape and the base tape on the lower mold, so that the upper mold is displaced from the lower mold by half a sheet in the connecting direction of the lower mold,
It is preferable that the upper die is stacked and the positioning pin is fitted into the pin hole of the lower die, and the upper die is sequentially and continuously fixed to perform the heat treatment.

Here, an embodiment of a method of manufacturing the sealing cap of the electronic component protection package of the present invention will be described with reference to the drawings. As shown in FIG. 1, the AuSn 20% single-scale tape 1 is laid on the Ni-plated or further Au-plated Kovar (FeNiCo alloy) single-scale tape 2 to form a carbon lower mold 3 shown in FIG. As shown in FIG. 3, the AuSn 20% single-length tape 1 is placed on top.

Next, in the pin holes 5 on both sides of the lower die 3 shown in FIG. 2, the positioning pins 7 on both sides of the upper die 6 shown in FIG. As shown in FIG. 5, the single tapes 1 and 2 which are fitted and stacked by the upper mold 6 are fixed by pressing or using a clamp or the like.

Then, both the upper die 6 and the lower die 3 are charged into an electric furnace (not shown), and the single-sized tapes 1 and 2 are heat-fused to form a clad material 8 as shown in FIG. This clad material 8
Is then pressed, or if necessary, rolled and then pressed to obtain the sealing cap 9 shown in FIG.

Next, another embodiment of the method for manufacturing the sealing cap of the electronic component protection package of the present invention will be described. As shown in FIG. 8, a single tape 1'of AuSn 20%
10 and the Ni-plated or Au-plated Kovar (FeNiCo alloy) single-sized tape 2 ′ are overlapped with each other, and the carbon lower mold 3 ′ shown in FIG. As shown in FIG. 5, the outer surface of the Kovar single tape 2'is projected so as to protrude above the groove 4 '.

Then, in the pin holes 5'on both sides of the lower mold 3'shown in FIG. 9, the positioning pins 7'on both sides of the upper mold 6'shown in FIG. After inversion, it is fitted as shown in FIG. 12, and the single tapes 1'and 2'which are stacked by the upper mold 6'are fixed by pressing or using a clamp or the like.

Next, the upper mold 6'and the lower mold 3'are charged into an electric furnace (not shown), and the single tape 1 '. 2'is heat-fused to form a clad material 8'as shown in FIG. 13, and this clad material 8'is then punched out, or if necessary, rolled and then press-extruded to show in FIG. Obtain the sealing cap 9 '.

The exemplification of this embodiment is that the single tape 1,
This is the case where the clad materials 8 and 8'are made by heating and fusing 1 ', 2 and 2'. As shown in FIG.
When the 0% long tape 1 ″ is heat-fused to the Kovar long tape 2 ″, the following method may be mentioned.

First, as shown in FIG. 16, the lower mold 3'is successively connected, and the long tapes 1 "and 2" which are overlapped with the concave grooves 4'of the lower mold 3'are fitted into the long mold 3 '. The outer surface of the 2 "is projected above the groove 4 '.

Next, as shown in FIG. 17, the upper die 6'is shifted in the connecting direction of the lower die (longitudinal direction of the tape) by half, and the positioning pins 7'are placed in the pin holes 5'of the lower die 3 '. The long tapes 1 ″ and 2 ″ that have been fitted and made continuous and are stacked by the upper mold 6 ′ are fixed by pressing or using a clamp or the like.

Next, the continuous upper mold 6'and lower mold 3'are charged into a long electric furnace (or conveyor furnace) not shown, and the long tapes 1 "and 2" are continuously fed. By heat fusion, a long clad material 8 ″ as shown in FIG. 18 can be obtained.

Then, the long clad material 8 ″ thus obtained is punched as it is, or if necessary, rolled, and then punched, and then, as in the above embodiment, as shown in FIGS. Obtain the sealing caps 9 and 9'shown in FIG.
Also, for example, a fixed length such as a length of 3 m is appropriately performed.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Specific examples and conventional examples of the method for manufacturing the sealing cap of the electronic component protection package of the present invention will be described.

[0023]

Example 1 As shown in FIG. 1, thickness 30 μm, width 14 m
m, length 1000 mm AuSn 20% single tape 1
And thickness 0.2mm, width 28.0mm, length 1000mm
2 of the Kovar (FeNiCo alloy) is overlaid, and as shown in FIG. 2, the lower mold 3 made of carbon having a thickness of 10 mm, a width of 120 mm, and a length of 1000 mm has AuSn of 20% as shown in FIG. I put it so that

Next, in the two pin holes 5 each having an inner diameter of 10.1 mm in the longitudinal direction on both sides of the lower mold 3 shown in FIG. 2, a carbon-made product having a thickness of 10 mm, a width of 120 mm and a length of 1000 mm shown in FIG. As shown in FIG.
Then, the single-sized tapes 1 and 2 which were fitted by the upper mold 6 were fixed by pressing or using a clamp or the like.

Next, both the upper mold 6 and the lower mold 3 were loaded into an electric furnace (not shown), and the single-sized tapes 1 and 2 were heat-fused at 350 ° C. to have a width of 28.0 mm and a thickness as shown in FIG. 0.215
mm (AuSn 20% thickness 15 μm, Kovar thickness 0.2 mm), and then clad material 8 was press-pressed to have a width of 2.0 mm and a length of 2.
A 5 mm sealing cap 9 was obtained.

[0026]

Example 2 As shown in FIG. 8, a thickness of 30 μm and a width of 14.
5 mm, 1000 mm long AuSn 20% single-length tape 1 ', thickness 0.4 mm, width 14.5 mm, length 100
A 0 mm thick Kovar (FeNiCo alloy) single tape 2'was overlaid, and as shown in FIG.
As shown in FIG. 10, the Kovar single tape 2'is fitted into the groove 4'having a width of 15 mm in the central longitudinal direction and a depth of 0.39 mm of the lower mold 3'having a width of 0 mm, a width of 120 mm, and a length of 1000 mm. The outer surface is projected 40 μm above the groove 4.

Next, the lower die 3'shown in FIG. 9 has two pin holes 5'having an inner diameter of 10.1 mm in the longitudinal direction on both sides.
10mm thick and 120m wide made of carbon shown in 1
m, a length of 1000 mm, two locating pins 7 ′ each having an outer diameter of 10 mm in the longitudinal direction on both sides of the upper die 6 ′ are inverted as shown in FIG. The single tapes 1'and 2'overlapped in the concave groove 4'by 'were fixed by pressing or using a clamp or the like.

Next, the upper mold 6'and the lower mold 3'are charged into an electric furnace (not shown), and the single-sized tapes 1'and 2'are heated and fused at 350 ° C. to form a clad material as shown in FIG. No. 8 ', then clad material 8'is rolled by 50% and width is 15m
m, thickness 0.215 mm (AuSn 20% thickness 15 μ
m, the thickness of Kovar is 0.2 mm), and then the rolled clad material 8'is punched out to obtain a sealing cap 9'having a width of 2.0 mm and a length of 2.5 mm shown in FIG. .

[0029]

PRIOR ART The same single tapes 1, 1 ', 2, as in Example 2
2'was piled up to form a clad material by diffusion bonding, and this clad material was rolled by 50%, but could not be processed due to peeling.

Regarding the sealing cap of the example thus obtained, the bonding state of AuSn 20% and Kovar was 18
When a 0-degree bending test was performed and inspected, the sealing caps of the examples did not peel off at all, and the bonding state was good. This is done by melting 20% AuSn
It is nothing other than the fact that the Ni plating underneath the plating causes diffusion and is bonded.

[0031]

Example 3 Thickness 30 μm and width 14.5 m shown in FIG.
m, 100 m long AuSn 20% long tape 1 ″
And a long tape 2 ″ of Kovar (FeNiCo alloy) having a thickness of 0.4 mm, a width of 14.5 mm, and a length of 100 m are overlapped with each other, and the recesses of the lower mold 3 ′ are successively formed as shown in FIG. Fit into the groove 4'and attach the outer surface of the long tape 2 "to each lower mold 3 '.
It was made to project upward from the concave groove 4 '.

Next, as shown in FIG. 17, the upper mold 6'is sequentially shifted by half, and the positioning pins 7'are fitted into the pin holes 5'of the lower mold 3'to be continuous, and a large number of upper molds 6'are provided. The long tapes 1 ″ and 2 ″ overlapped with each other were fixed by pressing or using a clamp or the like.

Next, the upper mold 6'and the lower mold 3 ', which were made continuous, were loaded into a conveyor furnace (not shown), and the long tape 1 ",
2 ″ is continuously heated and fused at 350 ° C. to form a long clad material 8 ″ as shown in FIG. 18, and then the long clad material 8 ″ is rolled by 50% and a width of 15 mm, Thickness 0.215
mm (AuSn 20% thickness 15 μm, Kovar thickness 0.2 mm), and then the rolled long clad material 8 ″ was press-pressed to obtain the same shapes as in Examples 1 and 2.
The sealing caps 9 and 9'having a width of 2.0 mm and a length of 2.5 mm shown in FIG.

When the yield of the sealing cap of Example 3 thus obtained from the long clad material was examined, the long tapes 1 ″ and 2 ″ were completely melt-bonded from the leading edge to the last end. Since it is a long clad material, the production yield of sealing caps obtained by press punching is 10
It was very good, close to 0%.

The upper molds 6 and 6'and the lower molds 3 and 3'used in Examples 1, 2 and 3 are made of carbon, but the invention is not limited to this, and the tape is heated and melted. Other materials may be used as long as they do not get wet. For example, a heat resistant material such as stainless steel or ceramics is preferable in terms of heat conduction such as temperature rise and heating. Further, the lower mold 3'may have a plurality of concave grooves 4 ', and especially in the case of two rows as shown in FIG. 19, the balance is good, and the pressing of the tapes superposed in the concave grooves 4'by the upper mold 6'is good. It is stable without deviation.

[0036]

As described above, according to the method of manufacturing the sealing cap of the electronic component protection package of the present invention, the sealing of the electronic component protection package has sufficient bonding strength and is not peeled off even when bent. Caps can be manufactured efficiently and stably.

[Brief description of drawings]

FIG. 1 is an AuS used in an embodiment of a method for manufacturing a sealing cap of an electronic component protection package according to the present invention.
It is a perspective view of the state where the single-scale tape of n20% and the single-scale tape of Kovar were piled up.

FIG. 2 is a perspective view of a lower mold used in the method for manufacturing the sealing cap of the present invention.

3 is a side view showing a state in which the stacked single-scale tapes of FIG. 1 are placed on the lower mold of FIG.

FIG. 4 is a perspective view of an upper mold used in the method for manufacturing the sealing cap of the present invention.

5 is a vertical cross-sectional view showing a state in which the single-size tape laminated on the lower mold shown in FIG. 3 is pressed and fixed by the upper mold of FIG.

6 is a perspective view showing a clad material obtained by heat-sealing the single-scale tape shown in FIG.

7 is a perspective view showing a sealing cap obtained by pressing out the clad material of FIG.

FIG. 8 is an Au used in another embodiment of the method for manufacturing the sealing cap of the electronic component protection package of the present invention.
It is a perspective view of the state where the single-scale tape of Sn20% and the single-scale tape of Kovar were piled up.

FIG. 9 is a perspective view of a lower mold used in the method for manufacturing the sealing cap of the present invention.

10 is a side view showing a state in which the stacked single-scale tapes of FIG. 8 are fitted in the lower groove of FIG.

FIG. 11 is a perspective view of an upper mold used in the method for manufacturing the sealing cap of the present invention.

FIG. 12 is a vertical cross-sectional view showing a state in which the single-scale tape stacked on the lower mold shown in FIG. 10 is pressed and fixed by the upper mold of FIG.

13 is a perspective view showing a clad material obtained by heat-sealing the stacked single-scale tapes shown in FIG.

FIG. 14 is a perspective view showing a sealing cap obtained by pressing out the clad material of FIG.

FIG. 15 is an Au used in another embodiment of the present invention.
It is a perspective view in the state where the long tape of Sn20% and the long tape of Kovar were piled up.

FIG. 16 is a side view showing a state in which lower dies are successively connected and the long tapes of FIG. 15 are fitted into the concave grooves.

FIG. 17 is a vertical cross-sectional view showing a state in which the long tapes stacked in the concave groove of the continuous lower mold shown in FIG.

18 is a perspective view showing a long clad material obtained by heating and fusing the stacked long tapes shown in FIG.

FIG. 19 is a perspective view showing another example of the lower mold.

FIG. 20 is a schematic perspective view showing a conventional method for manufacturing a sealing cap.

[Explanation of symbols]

1,1 'AuSn 20% single tape 1 ”AuSn 20% long tape 2,2 'Kovar single tape 2 ”Kovar long tape 3,3 'lower mold 4,4 'concave groove 5,5 'pin hole 6,6 'upper mold 7,7 'locating pin 8,8 'clad material 8 "long clad material 9,9 'Sealing cap

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/02

Claims (3)

(57) [Claims] 1. A brazing tape made of Au-based brazing material,
A base material tape made of FeNi-based material and Ni-plated or Ni-plated and Au-plated are overlaid,
It is placed on a lower mold having a pin hole, and the positioning pin of an upper mold having a positioning pin is fitted into the pin hole so that the upper mold and the lower mold are superposed, and the upper mold and the lower mold are pressed. After fixing the upper mold and the fixed lower mold into an electric furnace together, the upper mold and the lower mold are heated to melt the brazing filler metal tape to form a clad material, A method of manufacturing a sealing cap for an electronic component protection package, which comprises pressing a clad material immediately after heating or after rolling after heating to remove a press to obtain a sealing cap. 2. The lower die further comprises a concave groove, and the brazing tape and the base tape are fitted into the concave groove so that a part of the brazing tape and the base tape are projected from the concave groove, and then the upper die is overlapped with the lower die. 2. The method for manufacturing a sealing cap for an electronic component protection package according to 1. 3. The lower die is provided with two pairs of pin holes, the upper die is provided with two pairs of positioning pins, and after the lower die is connected and arranged, the brazing tape and the base tape are overlapped to form the lower die. Place the upper mold on top of the lower mold so that the upper mold is offset from the lower mold by half a sheet in the connecting direction of the lower mold, and insert the positioning pins into the pin holes of the lower mold. The method for producing a sealing cap for an electronic component protection package according to claim 1 or 2, wherein the sealing caps of the electronic component protection package are sequentially and continuously stacked and fixed.