JP3469423B2 - Electronic cooling evaporator - Google Patents
Electronic cooling evaporatorInfo
- Publication number
- JP3469423B2 JP3469423B2 JP05263097A JP5263097A JP3469423B2 JP 3469423 B2 JP3469423 B2 JP 3469423B2 JP 05263097 A JP05263097 A JP 05263097A JP 5263097 A JP5263097 A JP 5263097A JP 3469423 B2 JP3469423 B2 JP 3469423B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cooling
- section
- absorbing
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Heat Treatment Of Water, Waste Water Or Sewage (AREA)
Description
【0001】[0001]
【発明の属する技術分野】この発明は、各種液体を濃縮
する装置に関し、特に、電流を流すことにより放熱を行
う放熱面と、吸熱を行う吸熱面とを有する素子を利用し
た小型の電子冷却方式蒸発濃縮装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for concentrating various liquids, and more particularly to a small electronic cooling system using an element having a heat radiating surface for radiating heat by passing an electric current and an endothermic surface for absorbing heat. It relates to an evaporative concentration device.
【0002】[0002]
【従来の技術】従来、液を濃縮する装置としては、例え
ば、特開平7−209841号に記載されているよう
に、蒸発槽と結露槽とに左右に区分されると共に、前記
各槽の上部が連通されている濃縮タンクと、ペルチェ素
子によって構成されており、ペルチェ素子の発熱側が蒸
発槽に、吸熱側が結露槽に接していることを特徴とする
現像廃液濃縮装置がある。2. Description of the Related Art Conventionally, as a device for concentrating a liquid, for example, as described in Japanese Patent Application Laid-Open No. 7-209841, an evaporation tank and a condensation tank are divided into left and right parts, and an upper part of each tank. There is a developing waste liquid concentrating device comprising a Peltier element and a concentrating tank communicating with each other, and a heat generating side of the Peltier element is in contact with the evaporation tank and a heat absorbing side of the Peltier element is in contact with the dew condensation tank.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、ペルチ
ェ素子の発熱温度が低いため、例えば特開平7−209
841号に記載されているペルチェ素子を用いた濃縮装
置では、蒸発量が少なく、処理能力が非常に小さく、低
処理量の濃縮も満足に行えないという問題がある。ま
た、従来では、ペルチェ素子の冷却熱量に対して放熱量
が大きいため、放熱部の一部を空冷等で放出し、蒸発濃
縮の加熱と冷却のバランスを取っていたが、ペルチェ素
子の放熱部の一部熱を排熱する構造が必要であり、この
一部放熱の構造は複雑である。However, since the heat generation temperature of the Peltier element is low, for example, Japanese Patent Laid-Open No. 7-209
The concentrator using the Peltier device described in No. 841 has a problem that the amount of evaporation is small, the processing capacity is very small, and the concentration of a low amount of processing cannot be performed satisfactorily. Further, in the past, since the amount of heat radiation is large relative to the amount of cooling heat of the Peltier device, a part of the heat radiation part was discharged by air cooling etc. to balance the heating and cooling of evaporative concentration. A structure for discharging a part of the heat is required, and the structure for this partial heat dissipation is complicated.
【0004】この発明は、かかる点に鑑みてなされたも
ので、別の冷却手段を使用することで蒸発の加熱と冷却
のバランスを取り、小型で低コストであり、消費電力が
小さく、しかも濃縮効率が高く簡単な構造である電子冷
却方式蒸発濃縮装置を提供することを目的とする。The present invention has been made in view of the above point, and balances heating and cooling for evaporation by using another cooling means, which is small in size, low in cost, low in power consumption, and concentrated. An object is to provide an electronic cooling type evaporative concentrator having a high efficiency and a simple structure.
【0005】[0005]
【課題を解決するための手段】前記の目的は、以下に示
す特許請求の範囲の各請求項により達成される。The above objects are achieved by the following claims.
【0006】[請求項1]『電流を流すことにより放熱
を行う放熱部と吸熱を行う吸熱部とを有する放熱吸熱部
と、この放熱吸熱部の放熱部からの放熱により、液を蒸
発させて濃縮を行う蒸発濃縮部と、前記放熱吸熱部の吸
熱部の吸熱により、前記蒸発濃縮部からの気体を冷却し
て凝縮を行う冷却凝縮部とを有している電子冷却方式蒸
発濃縮装置において、前記蒸発濃縮部の発生蒸気を含む
気体を前記冷却凝縮部に送風し、この冷却凝縮部を通過
した気体が前記蒸発濃縮部に戻る循環送風経路を設け、
この循環送風経路および/または前記冷却凝縮部の部分
で前記放熱吸熱部とは別の冷却手段により循環風を冷却
し、 前記別の冷却手段の冷却能力が調節可能であること
を特徴とする電子冷却方式蒸発濃縮装置。』この請求項
1に係る発明により、蒸気の冷却に放熱吸熱部の他に別
々の冷却手段で補助冷却することで蒸発の加熱と冷却の
バランスを取り調整し、これにより放熱部の一部熱を排
熱する構造が不要となり、電子冷却方式蒸発濃縮装置
は、小型で低コストであり、消費電力が小さく、しかも
濃縮効率が高く構造が簡単である。また、別の冷却手段
の冷却能力が調節可能であり、環境温度が変化しても、
安定した処理能力が得られる。 [Claim 1] "A heat-dissipating heat-absorbing portion having a heat-dissipating portion that dissipates heat by passing an electric current and a heat-absorbing portion that absorbs heat, and heat is dissipated from the heat-dissipating portion of the heat-dissipating heat-absorbing portion to evaporate the liquid. In an electronic cooling type evaporative concentrator having an evaporative concentrating section for concentrating, and heat absorption of the heat absorbing section of the heat radiating and absorbing section, a cooling condensing section for cooling and condensing the gas from the evaporative concentrating section, A gas containing the generated vapor of the evaporative concentration section is blown to the cooling condenser section, and a gas is passed through the cooling condenser section to return to the evaporative concentration section.
The circulating air is cooled in the circulating air flow path and / or the cooling / condensing portion by a cooling means different from the heat radiating / absorbing portion.
And, an electronic cooling system evaporative concentration apparatus, wherein the cooling capacity of said further cooling means is adjustable. According to the first aspect of the present invention, in addition to the heat radiation and heat absorption portion for cooling the vapor, auxiliary cooling is performed by separate cooling means to balance and adjust the heating and cooling of evaporation, thereby partially heating the heat radiation portion. The structure for exhausting heat is unnecessary, and the electronic cooling type evaporative concentrator is small in size and low in cost, consumes less power, and has a high concentration efficiency and a simple structure. Also, another cooling means
The cooling capacity of the can be adjusted, even if the environmental temperature changes
Stable processing capacity can be obtained.
【0007】[0007]
【0008】[請求項2]『前記別の冷却手段が下記
A,B,Cのいずれかの方式であることを特徴とする請
求項1記載の電子冷却方式蒸発濃縮装置。[0008] 請 [Claim 2] "the further cooling means characterized in that it is a one of the methods below A, B, C
The electronic cooling type evaporative concentrator according to claim 1 .
【0009】A:前記放熱吸熱部とは別の放熱吸熱部の
吸熱部から発生する冷却熱であり、放熱部は外気により
空冷する方式
B:外気により熱交換器で循環送風経路の空気を直接空
冷する方式
C:ヒートパイプを有する熱交換器で循環送風経路の空
気を間接的に外気により空冷する方式』この請求項2に
係る発明により、簡単な構造で、冷却効率の良い好まし
い冷却の方式が得られ、濃縮効率をより高くすることが
できる。A: Cooling heat generated from a heat absorbing portion of a heat radiating and absorbing portion different from the heat radiating and absorbing portion, and the heat radiating portion is air-cooled by outside air. B: Air in a circulating air blow path is directly passed through a heat exchanger by outside air. Air-cooling method C: method of indirectly cooling the air in the circulation air flow path by the outside air with a heat exchanger having a heat pipe ”According to the invention of claim 2 , a preferable cooling method having a simple structure and good cooling efficiency Can be obtained, and the concentration efficiency can be increased.
【0010】[請求項3]『前記蒸発濃縮部、前記冷却
凝縮部および前記循環送風経路の少なくとも1箇所に温
度検出手段を設け、その温度検出結果により前記別の冷
却手段の冷却能力を調節する制御を行なうことを特徴と
する請求項1または請求項2記載の電子冷却方式蒸発濃
縮装置。』この請求項3に係る発明により、温度検出結
果に基づき、別の冷却手段の冷却能力を調節する制御を
行うことで、環境温度が変化しても、より安定した処理
能力が得られる。
[請求項4]『前記別の冷却手段は、前記冷却凝縮部を
通過後の前記蒸発濃縮部に至る循環送風経路に設けたこ
とを特徴とする請求項1乃至請求項3のいずれかに記載
の電子冷却方式蒸発濃縮装置。』この請求項4に係る発
明により、冷却凝縮部を通過後の蒸発濃縮部に至る循環
送風経路で冷却することで濃縮効率をより高くすること
ができる。
[請求項5]『前記放熱吸熱部の放熱部近傍に温度検出
手段を設け、一定温度以上では前記放熱吸熱部への通電
を停止することを特徴とする請求項1乃至請求項4のい
ずれかに記載の電子冷却方式蒸発濃縮装置。』この請求
項5に係る発明により、放熱吸熱部の温度を一定以上に
上昇させないようにして耐久性の向上を図ることができ
る。
[請求項6]『前記放熱吸熱部の電源、操作電源、送風
手段の駆動源からの少なくとも一部の放熱が、前記蒸発
濃縮部の対象とする液および/または前記蒸発濃縮部に
送風される気体を加温する構造としたことを特徴とする
請求項1乃至請求項5のいずれかに記載の電子冷却方式
蒸発濃縮装置。この請求項6に係る発明により、放熱吸
熱部の電源、操作電源、送風手段の駆動源からの少なく
とも一部の放熱を利用することで、濃縮効率をより高く
することができる。
[請求項7]『前記蒸発濃縮部に入る気体と出た後の気
体が熱交換する熱交換構造を設けたことを特徴とする請
求項1乃至請求項6のいずれかに記載の電子冷却方式蒸
発濃縮装置。』この請求項7に係る発明により、蒸発濃
縮部に入る気体と出た後の気体が熱交換することで、高
効率で液を蒸発させることができ、濃縮効率が向上す
る。
[請求項8]『前記放熱吸熱部に直流電流を流すことに
より片面が放熱部となり反対側面が吸熱部となるペルチ
ェ素子を使用し、蒸発濃縮の安定状態では、前記放熱部
と吸熱部の温度差が10〜50℃の範囲となるように構
成したことを特徴とする請求項1乃至請求項7のいずれ
かに記載の電子冷却方式蒸発濃縮装置。』この請求項8
に係る発明により、ペルチェ素子を使用し、温度制御に
より蒸発濃縮の安定状態にすることで消費電力を小さ
く、且つ高い処理能力を得る。
[請求項9]『前記直流電源を入り/切り制御しないで
も、放熱部と吸熱部の温度差が10〜50℃の範囲とな
るような直流電圧に設定することを特徴とする請求項8
記載の電子冷却方式蒸発濃縮装置。』この請求項9に係
る発明により、直流電源を入り/切り制御するための装
置が不要となり、低コスト化が図れる。[0010] [Claim 3] "the evaporation unit, a temperature detecting means provided in at least one position of the cooling and condensing section and the circulating air passage to regulate the cooling capacity of the further cooling means by that temperature detection result The electronic cooling type evaporative concentrator according to claim 1 or 2, which is controlled. According to the invention of claim 3 , by controlling the cooling capacity of another cooling means based on the temperature detection result, more stable processing capacity can be obtained even if the environmental temperature changes. [Claim 4 ] "The another cooling means is provided in a circulating air flow path to the evaporative concentration section after passing through the cooling condensation section," in any one of claims 1 to 3. Electronic cooling evaporative concentrator. According to the fourth aspect of the present invention, the concentration efficiency can be further increased by cooling in the circulation air flow path leading to the evaporative concentration section after passing through the cooling condenser section. [Claim 5] The temperature detecting means is provided "in the heat radiating portion near the heat radiating heat absorption part, either one of claims 1 to 4, characterized in that stopping the energization of the heat radiating heat absorption unit at a constant temperature or more The electronic cooling type evaporative concentrator according to 1. According to the invention of claim 5 , durability can be improved by preventing the temperature of the heat radiating and absorbing part from rising above a certain level. [Claim 6 ] "At least a part of the heat radiation from the power source of the heat radiation / absorption unit, the operation power source, and the drive source of the blower unit is blown to the target liquid of the evaporation concentration unit and / or the evaporation concentration unit. The electronic cooling type evaporative concentrator according to any one of claims 1 to 5 , which has a structure for heating a gas. According to the invention of claim 6 , the concentration efficiency can be further increased by utilizing the heat radiation from at least a part of the power source of the heat radiation / absorption unit, the operation power source, and the drive source of the blowing unit. [Claim 7 ] "The electronic cooling system according to any one of claims 1 to 6 , wherein a heat exchange structure for exchanging heat between the gas entering the evaporative concentration section and the gas after exiting is provided. Evaporative concentrator. According to the invention of claim 7 , heat exchange is performed between the gas entering the evaporating and concentrating portion and the gas after exiting, whereby the liquid can be evaporated with high efficiency, and the concentrating efficiency is improved. [Claim 8 ] "Using a Peltier element in which one side serves as a heat-dissipating portion and the other side serves as a heat-absorbing portion by applying a direct current to the heat-dissipating heat-absorbing portion. The electronic cooling type evaporative concentrator according to any one of claims 1 to 7 , wherein the difference is in the range of 10 to 50 ° C. ] This claim 8
According to the invention of claim 1, a Peltier element is used and a stable state of evaporation and concentration is obtained by temperature control, so that power consumption is reduced and high processing capacity is obtained. [Claim 9] claims and "wherein also without On / Off controlling the DC power source is set to a DC voltage as the temperature difference between the heat radiating portion and the heat absorbing portion is in the range of 10 to 50 ° C. 8
The electronic cooling type evaporative concentrator described. According to the invention of claim 9 , a device for controlling the turning on / off of the DC power supply is not required, and the cost can be reduced.
【0011】[0011]
【発明の実施の形態】以下に、この発明に関する具体例
の一例を実施の形態として示すが、この発明はこれらに
限定されない。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an example of a specific example relating to the present invention will be shown as an embodiment, but the present invention is not limited thereto.
【0012】実施の形態1
図1はこの発明における実施の形態の一例の概略図であ
る。この電子冷却方式蒸発濃縮装置は、ペルチェ素子9
を有する放熱吸熱部10と、液体を蒸発させて濃縮を行
う蒸発濃縮部1と、蒸発した蒸気を冷却することで凝縮
を行う冷却凝縮部2とを有し、さらに蒸発濃縮部1と冷
却凝縮部2とを連通する連通管6、冷却凝縮部2と蒸発
濃縮部1とを連通する連通管11とを有している。連通
管11には蒸発濃縮部1内の液面に送風を行う送風手段
としてのファン3が備えられている。First Embodiment FIG. 1 is a schematic view of an example of an embodiment of the present invention. This electronic cooling type evaporative concentrator uses a Peltier element 9
A heat radiating and absorbing section 10, an evaporating and condensing section 1 for evaporating and condensing a liquid, and a cooling and condensing section 2 for condensing by cooling evaporated vapor. It has a communication pipe 6 that communicates with the section 2, and a communication pipe 11 that communicates the cooling condensation unit 2 and the evaporation concentration unit 1. The communication pipe 11 is provided with a fan 3 as a blowing unit that blows air to the liquid surface in the evaporative concentration unit 1.
【0013】この電子冷却方式蒸発濃縮装置には、連通
管6により蒸発濃縮部1の発生蒸気を含む気体を冷却凝
縮部2に送風し、この冷却凝縮部2を通過した気体が連
通管11により蒸発濃縮部1に戻る循環送風経路Aが設
けられている。In this electronic cooling type evaporative concentration apparatus, a gas containing the vapor generated in the evaporative concentration section 1 is blown to the cooling condensation section 2 by a communication tube 6, and the gas passing through this cooling condensation section 2 is communicated by a communication tube 11. A circulation air flow path A returning to the evaporative concentration section 1 is provided.
【0014】ペルチェ素子9を有する放熱吸熱部10
は、その放熱部7を上にし、吸熱部8を下にして配置
し、放熱吸熱部10を挟んで、蒸発濃縮部1を放熱部7
に接するように放熱吸熱部10の上側に配置し、冷却凝
縮部2を吸熱部8に接するように放熱吸熱部10の下側
に配置している。蒸発濃縮部1は、袋で構成され、連通
管6へ気体を排出する口部1aと、連通管11に配置し
たファン3から空気を吹き込む口部1bとを有してい
る。A heat radiating and absorbing section 10 having a Peltier element 9.
Is arranged so that the heat radiating portion 7 is on the upper side and the heat absorbing portion 8 is on the lower side.
Is arranged on the upper side of the heat radiating and absorbing section 10, and the cooling condenser section 2 is arranged on the lower side of the heat radiating and absorbing section 10 so as to contact the heat absorbing section 8. The evaporative concentration section 1 is composed of a bag, and has a port 1a for discharging gas to the communication pipe 6 and a port 1b for blowing air from the fan 3 arranged in the communication pipe 11.
【0015】蒸発濃縮部1を構成する袋は、折りたたみ
可能の軟質プラスチックを材料とすることが好ましい。
軟質プラスチックとしては、例えばポリエチレンとナイ
ロン、塩化ビリニデン、塩化ビニル、ポリアセタール、
酢酸ビニルの単層や積層シート等が挙げられる。また、
液面Lと、天井面1dとの距離が1〜10cmにするこ
とが蒸発効率を向上させる点、運搬性を良好にする点か
ら好ましい。蒸発濃縮部1の液量はl〜20リットルの
範囲が取扱性と処理能力の面から好ましく、大きさ(底
面積)は0.05〜2m2の範囲が操作性及び処理能力
の面から好ましい。また、十分な送風量を得る点と、液
漏れを防止する点から、2つの口部1a,1bの直径は
30〜100mmであることが好ましく、十分な送風量
を得る点から、2つの口部間の距離はできるだけ離すこ
とが好ましく、好ましい範囲は40〜70cmである。
更に、口部1a,1bは2つとも液貯溜部4の片面に設
けることが好ましいが、それに限定されない。The bag forming the evaporative concentration section 1 is preferably made of foldable soft plastic.
Examples of soft plastics include polyethylene and nylon, vinylidene chloride, vinyl chloride, polyacetal,
Examples thereof include a single layer of vinyl acetate and a laminated sheet. Also,
It is preferable that the distance between the liquid surface L and the ceiling surface 1d is 1 to 10 cm from the viewpoint of improving evaporation efficiency and good transportability. The amount of liquid in the evaporative concentration section 1 is preferably in the range of 1 to 20 liters from the viewpoint of handleability and processing capacity, and the size (bottom area) is preferably in the range of 0.05 to 2 m 2 from the viewpoint of operability and processing capacity. . In addition, the diameter of the two mouths 1a and 1b is preferably 30 to 100 mm from the viewpoint of obtaining a sufficient air flow rate and the prevention of liquid leakage, and the two mouths from the viewpoint of obtaining a sufficient air flow rate. The distance between the parts is preferably as large as possible, and the preferred range is 40 to 70 cm.
Further, it is preferable that both of the mouth portions 1a and 1b are provided on one surface of the liquid storage portion 4, but the present invention is not limited thereto.
【0016】直流電流をペルチェ素子9に通電すること
により、放熱吸熱部10の放熱部7の温度は上昇し、吸
熱部8の温度は低下する。放熱面7に接する蒸発濃縮部
1内の液は加熱され、さらに、ファン3によって連通管
11から蒸発濃縮部1内の液面への送風が行われること
により、液の蒸発が促進される。蒸発濃縮部1で生じた
蒸気は、連通管6を通り、冷却凝縮部2へと導かれる。By supplying a direct current to the Peltier element 9, the temperature of the heat radiating portion 7 of the heat radiating and heat absorbing portion 10 rises and the temperature of the heat absorbing portion 8 falls. The liquid in the evaporative concentration section 1 in contact with the heat radiating surface 7 is heated, and the fan 3 blows air from the communication pipe 11 to the liquid surface in the evaporative concentration section 1, thereby promoting the evaporation of the liquid. The vapor generated in the evaporative concentration section 1 passes through the communication pipe 6 and is guided to the cooling condensation section 2.
【0017】ペルチェ素子の放熱吸熱能力は100〜5
00Wの範囲であることが好ましく、熱放出部の発熱温
度は30℃〜70℃であることが好ましい。ペルチェ素
子9は1つでも、複数個のペルチェ素子を並べて使用し
てもよい。また、ペルチェ素子9が水分に接触しないよ
う、放熱吸熱部10の周囲に防水手段を設けることが好
ましい。さらに、放熱吸熱部10は、容易にペルチェ素
子9の交換が行える構造であることが好ましい。The heat dissipation and heat absorption capacity of the Peltier device is 100 to 5
It is preferably in the range of 00 W, and the heat generation temperature of the heat emitting portion is preferably 30 ° C to 70 ° C. One Peltier element 9 may be used, or a plurality of Peltier elements may be arranged and used. In addition, it is preferable to provide a waterproof means around the heat radiating and heat absorbing portion 10 so that the Peltier element 9 does not come into contact with moisture. Further, it is preferable that the heat radiation and heat absorption section 10 has a structure that allows the Peltier element 9 to be easily replaced.
【0018】連通管11と連通管6には、蒸発濃縮部1
に入る気体と出た後の気体が熱交換する熱交換構造20
を設け、この熱交換構造20は冷却手段を構成してい
る。蒸発濃縮部1に入る気体は、蒸発濃縮部1から出た
後の気体により予備加熱が行われ、蒸発濃縮部1に入る
気体により蒸発濃縮部1から出た後の気体は、1次冷却
が行われ、蒸発濃縮部1に入る気体と出た後の気体が熱
交換することで、高効率で液を蒸発させることができ、
濃縮効率が向上する。In the communication pipe 11 and the communication pipe 6, the evaporative concentration section 1
Heat exchange structure 20 for exchanging heat between the entering gas and the exiting gas
This heat exchange structure 20 constitutes a cooling means. The gas that enters the evaporative concentration section 1 is preheated by the gas that has left the evaporative concentration section 1, and the gas that has exited the evaporative concentration section 1 by the gas that enters the evaporative concentration section 1 does not undergo primary cooling. The gas entering the evaporative concentrating unit 1 and the gas after it are heat-exchanged with each other, the liquid can be evaporated with high efficiency,
Concentration efficiency is improved.
【0019】連通管6は、冷却手段を構成するファン2
1が設けられ、ファン21の駆動により蒸発濃縮部1か
ら出て1次冷却された気体は、外気による2次冷却が行
われて冷却凝縮部2へ送られる。気体は、ファン空冷方
式により冷却される。冷却凝縮部2は、放熱吸熱部10
の吸熱部8の温度の低下に伴い最終冷却される。冷却凝
縮部2に導かれた蒸気は、そこで冷却され凝縮し液体と
なる。冷却凝縮部2の底部には排出口2aが設けられ、
凝縮により生じた液体を排出口2aから排出し、凝縮し
なかった残りの気体は、連通管11からファン3の駆動
で蒸発濃縮部1へ戻される。冷却凝縮部2の底部を傾斜
させることにより、凝縮により生じた液体を排出口2a
に容易に導くことができる。The communication pipe 6 is a fan 2 which constitutes cooling means.
1 is provided, and the gas that has exited from the evaporative concentration section 1 by driving the fan 21 and is primarily cooled is subjected to secondary cooling by the outside air and sent to the cooling condensing section 2. The gas is cooled by a fan air cooling method. The cooling / condensing unit 2 includes the heat radiating and absorbing unit 10
Final cooling is performed as the temperature of the endothermic part 8 decreases. The vapor introduced to the cooling condenser 2 is cooled and condensed there to become a liquid. An outlet 2a is provided at the bottom of the cooling condensing unit 2,
The liquid generated by the condensation is discharged from the discharge port 2a, and the remaining gas that is not condensed is returned to the evaporative concentration section 1 by driving the fan 3 from the communication pipe 11. By inclining the bottom of the cooling condensing unit 2, the liquid generated by the condensation is discharged through the discharge port 2a.
Can be easily led to.
【0020】熱交換構造20及びファン21は、循環送
風経路Aの部分で放熱吸熱部10とは別の冷却手段Bを
構成し、この別の冷却手段Bにより循環風を冷却し、電
子冷却式廃液装置で放熱を全て液蒸発に使用している。
このように、蒸気の冷却に放熱吸熱部10の他に別々の
冷却手段Bで補助冷却することで蒸発の加熱と冷却のバ
ランスを取り調整し、これにより放熱部の一部熱を排熱
する構造が不要となり、電子冷却方式蒸発濃縮装置は、
小型で低コストであり、消費電力が小さく、しかも濃縮
効率が高く構造が簡単である。The heat exchange structure 20 and the fan 21 constitute a cooling means B separate from the heat radiating and absorbing part 10 in the circulating air flow path A, and the circulating air is cooled by the separate cooling means B, which is an electronic cooling type. All the heat dissipation is used for liquid evaporation in the waste liquid device.
In this way, in addition to the heat radiating and absorbing section 10 for cooling the vapor, auxiliary cooling is separately performed by the separate cooling means B to balance and adjust the heating and cooling of evaporation, and thereby a part of the heat of the heat radiating section is discharged. The structure is unnecessary, and the electronic cooling type evaporative concentrator is
It is small, low cost, low power consumption, high concentration efficiency and simple structure.
【0021】別の冷却手段Bを構成するファン21は、
その回転速度を制御することで冷却能力が調節可能であ
り、冷却能力が調節であることから、環境温度が変化し
ても、安定した処理能力が得られる。The fan 21 constituting another cooling means B is
The cooling capacity can be adjusted by controlling the rotation speed, and since the cooling capacity is adjusted, stable processing capacity can be obtained even if the environmental temperature changes.
【0022】図2はペルチェ素子の原理的構成を示す図
である。ペルチェ素子9は、発熱吸熱部10において中
心的に作用する部分であり、N型半導体35Nと、P型
半導体35Pとが、電気伝導部36を介して、直流電源
38と直列接続された構成になっている。なお、N型半
導体35NやP型半導体35Pは、例えばビスマス・テ
ルル化物の半導体であって、それぞれ、不純物ドーピン
グによる過剰電子と不足電子のエレメントとして構成さ
れる。また、電気伝導部36は、電気絶縁部39を介し
て、熱吸収部37Bと熱放出部37Aとに接続されてお
り、これらは、それぞれ発熱吸熱部10の吸熱部8と放
熱部7に接続されている。なお、熱放出部37Aと熱吸
収部37Bとを熱伝導性セラミックで構成することによ
り、電気絶縁部39を省くことができる。FIG. 2 is a diagram showing the principle structure of the Peltier device. The Peltier element 9 is a part that acts centrally in the heat generating and absorbing section 10, and has a configuration in which the N-type semiconductor 35N and the P-type semiconductor 35P are connected in series with the DC power source 38 via the electric conduction section 36. Has become. The N-type semiconductor 35N and the P-type semiconductor 35P are, for example, bismuth telluride semiconductors, and are configured as elements of excess electrons and deficiency electrons due to impurity doping, respectively. Further, the electric conduction section 36 is connected to the heat absorption section 37B and the heat emission section 37A via the electric insulation section 39, and these are connected to the heat absorption section 8 and the heat radiation section 7 of the heat generation and absorption section 10, respectively. Has been done. Note that the heat insulating portion 37A and the heat absorbing portion 37B are made of a heat conductive ceramic, so that the electrical insulating portion 39 can be omitted.
【0023】直流電源38からの電流は、N型半導体3
5N→P型半導体35P→N型半導体35N・・・→P
型半導体35Pのように流れ、図2の上側では熱吸収さ
れ、下側では熱放出されることになり、この吸熱と放熱
によって熱吸収部37Bと熱放出部37Aには、所定の
温度差が形成されることになる。The current from the DC power source 38 is applied to the N-type semiconductor 3
5N → P type semiconductor 35P → N type semiconductor 35N ... → P
2 flows like a type semiconductor 35P, heat is absorbed at the upper side of FIG. 2, and heat is discharged at the lower side. Due to this heat absorption and heat radiation, a predetermined temperature difference is generated between the heat absorbing portion 37B and the heat emitting portion 37A. Will be formed.
【0024】このように、放熱吸熱部10に直流電流を
流すことにより片面が放熱部7となり反対側面が吸熱部
8となるペルチェ素子9を使用し、ペルチェ素子9は蒸
発濃縮の安定状態では、放熱部7と吸熱部8の温度差が
10〜50℃の範囲、好ましくは10〜40℃の範囲と
なるような構造で、制御に構成している。ペルチェ素子
9を使用し、制御により蒸発濃縮の安定状態することで
消費電力を小さく、且つ高い処理能力を得る。As described above, by using the Peltier element 9 in which one side serves as the heat radiating section 7 and the other side serves as the heat absorbing section 8 by causing a direct current to flow through the heat radiating and absorbing section 10, the Peltier element 9 is used in a stable state of evaporation and concentration. The structure is such that the temperature difference between the heat radiating portion 7 and the heat absorbing portion 8 is in the range of 10 to 50 ° C., preferably 10 to 40 ° C., and is configured for control. By using the Peltier element 9 and controlling the evaporation and concentration to a stable state, the power consumption is reduced and a high processing capacity is obtained.
【0025】また、他の実施の形態として直流電源38
を入り/切り制御しないでも、放熱部7と吸熱部8の温
度差が10〜50℃の範囲、好ましくは10〜40℃の
範囲となるような直流電圧に設定することができ、直流
電源38を入り/切り制御するための装置が不要とな
り、低コスト化を図ることができる。As another embodiment, a DC power source 38
It is possible to set the DC voltage such that the temperature difference between the heat radiating part 7 and the heat absorbing part 8 is in the range of 10 to 50 ° C., preferably 10 to 40 ° C. A device for controlling the turning on / off of the switch is unnecessary, and the cost can be reduced.
【0026】実施の形態2
図3はこの発明における実施の形態の一例の概略図であ
る。この電子冷却方式蒸発濃縮装置は、図1の実施の形
態と同じ符号を付したものは同様に構成されるから説明
を省略する。この実施の形態では、循環送風経路Aを構
成する連通管6には、別の冷却手段Bを構成する熱交換
器22が備えられるだけであり、この熱交換器22は外
気と循環風が互いに直交流または斜交流の形式で、隔板
で仕切られた各層を流れ、各層が積層され、隔板で熱交
換するタイプで、ファン23が設けられている。外気に
より熱交換器22で循環送風経路Aの空気を直接空冷す
る方式が設けられ、熱交換器22の駆動により蒸発濃縮
部1から出た気体が、外気による熱交換で冷却が行われ
て冷却凝縮部2へ送られる。また、連通管11には、フ
ァン3が設けられるだけであり、凝縮しなかった残りの
気体は、連通管11からファン3の駆動で蒸発濃縮部1
へ戻される。Embodiment 2 FIG. 3 is a schematic view of an example of an embodiment of the present invention. This electronic cooling type evaporative concentrator is denoted by the same reference numeral as that of the embodiment of FIG. In this embodiment, the communication pipe 6 that constitutes the circulating air flow path A is only provided with the heat exchanger 22 that constitutes another cooling means B, and the heat exchanger 22 is such that the outside air and the circulating air flow mutually. A fan 23 is provided, which is a type in which each layer is partitioned by a partition plate in the form of a cross flow or oblique alternating current, each layer is laminated, and heat is exchanged by the partition plate. A method is provided in which the air in the circulating air passage A is directly air-cooled by the heat exchanger 22 by the outside air, and the gas discharged from the evaporative concentration section 1 by driving the heat exchanger 22 is cooled by heat exchange by the outside air. It is sent to the condenser 2. Further, only the fan 3 is provided in the communication pipe 11, and the remaining gas that has not condensed is driven by the fan 3 from the communication pipe 11 to evaporate and condense part 1.
Returned to.
【0027】熱交換器22の一実施例を図4及び図5に
示す。図4の熱交換器22は隔板261が各層をなし、
隣接する隔板261の間には波板262が入って通路2
64,265が形成されている。また、外周は固定部材
263で隔板26lを固定している。隔板261の厚さ
は例えば0.lmmで、好ましくは0.01から1mm
であり、ポリプロピレン材を使用している。0.0lm
mより薄いと、熱交換率は高まるものの、隔壁の強度が
低下し、また、製作上も難しくなる。1mm以上では構
造上の強度は高くなるものの、熱交換率が低下する。材
料はポリエチレン、ポリプロピレン、ポリ塩化ビニル、
ポリ塩化ビニリデン、ポリエチレンテレフタレート、ナ
イロンの少なくとも1つを使用したもので熱交換効果が
高く製作性も高い。隣接する隔板261の聞隔は例えば
lmmで、波板262は波のピッチが例えば4mmで整
流及び強度部材としての効果がある。An embodiment of the heat exchanger 22 is shown in FIGS. In the heat exchanger 22 shown in FIG. 4, the partition plate 261 has layers.
A corrugated plate 262 is inserted between the adjacent partition plates 261 so that the passage 2
64 and 265 are formed. In addition, the partition plate 261 is fixed to the outer periphery by a fixing member 263. The thickness of the partition plate 261 is, for example, 0. 1 mm, preferably 0.01 to 1 mm
And uses polypropylene material. 0.0lm
When the thickness is less than m, the heat exchange rate is increased, but the strength of the partition wall is reduced and it is difficult to manufacture. When the thickness is 1 mm or more, the structural strength increases, but the heat exchange rate decreases. Materials are polyethylene, polypropylene, polyvinyl chloride,
It uses at least one of polyvinylidene chloride, polyethylene terephthalate, and nylon, and has a high heat exchange effect and high manufacturability. The spacing between adjacent partition plates 261 is, for example, 1 mm, and the corrugated plate 262 has a wave pitch of, for example, 4 mm, which is effective as a rectifying and strength member.
【0028】図5の熱交換器22は、図4と機構的、機
能的に同じ部材は同一符号と同―名称を付け説明を省略
する。図5(a)は他の熱交換器22で通路264には
隔板261と隔板261との間にスペーサ631がある
構造となっており、波板262はない。また、図5
(b)は他の熱交換器22で通路264、通路265共
に、隔板26lと隔板261との間にスべーサ631が
あり、波板262がない構造となっている。なお、熱交
換器22はこれに限定されるものではなく、例えば交流
方向が斜交流形等でも良い。In the heat exchanger 22 shown in FIG. 5, members that are mechanically and functionally the same as those shown in FIG. 4 are designated by the same reference numerals, and the description thereof will be omitted. In FIG. 5A, another heat exchanger 22 has a structure in which a spacer 631 is provided in the passage 264 between the partition plates 261 and 261 and there is no corrugated plate 262. Also, FIG.
In (b), another heat exchanger 22 has a structure in which both the passage 264 and the passage 265 have a spacer 631 between the partition plate 26l and the partition plate 261 and no corrugated plate 262. The heat exchanger 22 is not limited to this, and for example, the AC direction may be an oblique AC type.
【0029】実施の形態3
図6はこの発明における実施の形態の一例の概略図であ
る。この電子冷却方式蒸発濃縮装置は、図1の実施の形
態と同じ符号を付したものは同様に構成されるから説明
を省略する。この実施の形態では、冷却凝縮部2の一部
2bを蒸発濃縮部1の上方まで延出し、循環送風経路A
を構成する連通管6を冷却凝縮部2の一部2bに接続し
ている。この冷却凝縮部2の一部2bは、SUS板で形
成され、SUS板による自然外気熱交換を行い、冷却凝
縮部2の部分で放熱吸熱部10とは別の冷却手段Bによ
り循環風を冷却するように構成され、蒸発濃縮部1から
出た気体が、外気による冷却が行われて冷却凝縮部2へ
送られる。また、連通管11には、ファン3が設けられ
るだけであり、凝縮しなかった残りの気体は、連通管1
1からファン3の駆動で蒸発濃縮部1へ戻される。Embodiment 3 FIG. 6 is a schematic view of an example of an embodiment of the present invention. This electronic cooling type evaporative concentrator is denoted by the same reference numeral as that of the embodiment of FIG. In this embodiment, a part 2b of the cooling / condensing section 2 is extended to above the evaporative concentrating section 1, and the circulating air blowing path A
The communication pipe 6 constituting the above is connected to a part 2b of the cooling condenser unit 2. A part 2b of the cooling / condensing unit 2 is formed of a SUS plate, performs natural outside air heat exchange by the SUS plate, and cools the circulating air in the cooling / condensing unit 2 by a cooling means B different from the heat radiating / absorbing unit 10. The gas emitted from the evaporative concentration section 1 is cooled by the outside air and sent to the cooling condensing section 2. Further, the communication pipe 11 is only provided with the fan 3, and the remaining gas that has not condensed is the communication pipe 1
It is returned from 1 to the evaporative concentration section 1 by driving the fan 3.
【0030】実施の形態4
図7はこの発明における実施の形態の一例の概略図であ
る。この電子冷却方式蒸発濃縮装置は、図1の実施の形
態と同じ符号を付したものは同様に構成されるから説明
を省略する。この実施の形態では、循環送風経路Aを構
成する連通管6に、別の冷却手段Bとして、放熱吸熱部
10とは別の放熱吸熱部40の吸熱部41から発生する
冷却熱であり、放熱部42は外気により空冷する方式が
用いられている。Fourth Embodiment FIG. 7 is a schematic view of an example of the embodiment of the present invention. This electronic cooling type evaporative concentrator is denoted by the same reference numeral as that of the embodiment of FIG. In the present embodiment, the cooling heat generated from the heat absorbing portion 41 of the heat radiating heat absorbing portion 40 different from the heat radiating heat absorbing portion 10 as the different cooling means B in the communication pipe 6 forming the circulation air flow path A is radiated. The part 42 uses a method of air cooling with outside air.
【0031】即ち、連通管6には、ハウジング43が備
えられている。このハウジング43内には、ペルチェ素
子44を有する放熱吸熱部40により凝縮室45と外気
室46の2室が形成され、この凝縮室45には連通管6
が連通され、外気室46にはファン47と外気連通口4
3aが開口している。放熱吸熱部40は、その放熱部4
2を外気室側にし、吸熱部41を凝縮室側にして配置
し、放熱部42に放熱フィン48が設けられ、吸熱部4
1に凝縮フィン49が設けられている。ペルチェ素子4
4を有する放熱吸熱部40は、図2に示す放熱吸熱部1
0と同様に構成されるから、詳細な説明は省略する。That is, the communication pipe 6 is provided with the housing 43. Inside the housing 43, two chambers, a condensing chamber 45 and an outside air chamber 46, are formed by the heat radiating and absorbing portion 40 having the Peltier element 44, and the condensing chamber 45 has a communicating pipe 6
To the outside air chamber 46, and the fan 47 and the outside air communication port 4 are connected to the outside air chamber 46.
3a is open. The heat radiating / absorbing part 40 is the heat radiating part 4
2 on the outside air chamber side and the heat absorbing portion 41 on the condensing chamber side. The heat radiating portion 42 is provided with heat radiating fins 48.
1, a condensing fin 49 is provided. Peltier element 4
The heat radiating and absorbing section 40 having the heat radiating and absorbing section 1 has the heat radiating and absorbing section 1 shown in FIG.
Since the configuration is the same as that of 0, detailed description will be omitted.
【0032】実施の形態5
図8はこの発明における実施の形態の一例の概略図であ
る。この電子冷却方式蒸発濃縮装置は、図1の実施の形
態と同じ符号を付したものは同様に構成されるから説明
を省略する。この実施の形態では、循環送風経路Aを構
成する連通管6に、別の冷却手段Bとして、ヒートパイ
プ50を有する熱交換器51で循環送風経路Aの空気を
間接的に外気により空冷する方式が用いられている。Embodiment 5 FIG. 8 is a schematic view of an example of an embodiment of the present invention. This electronic cooling type evaporative concentrator is denoted by the same reference numeral as that of the embodiment of FIG. In this embodiment, a method of indirectly cooling the air in the circulating air blowing path A by the outside air with a heat exchanger 51 having a heat pipe 50 as another cooling means B for the communication pipe 6 constituting the circulating air blowing path A. Is used.
【0033】即ち、連通管6には、ハウジング52が備
えられている。このハウジング52内には、断熱板で形
成される隔壁53により凝縮室45と外気室46の2室
が形成され、この凝縮室45には連通管6が連通され、
外気室46にはファン47と外気連通口52aが開口し
ている。隔壁53には、複数本のヒートパイプ50が凝
縮室45と外気室46とに渡して設けられている。ヒー
トパイプ50は、例えばアルミニウム、ステンレス鋼、
銅等のパイプの内側にガラス繊維や網状の細い銅線等で
つくったウイック材を張り、内部を減圧し、フレオン、
アンモニア、水等の熱媒体の蒸気の移動と蒸発潜熱の授
受によって熱移動を行う装置であり、ヒートパイプ50
により凝縮室45の温度が低下する。That is, the communication pipe 6 is provided with the housing 52. In the housing 52, two chambers, a condensing chamber 45 and an outside air chamber 46, are formed by a partition wall 53 formed of a heat insulating plate, and the communicating pipe 6 communicates with the condensing chamber 45.
A fan 47 and an outside air communication port 52a are opened in the outside air chamber 46. In the partition wall 53, a plurality of heat pipes 50 are provided across the condensing chamber 45 and the outside air chamber 46. The heat pipe 50 is made of, for example, aluminum, stainless steel,
Wick material made of glass fiber or net-like thin copper wire is placed inside the pipe of copper, etc., the pressure inside is reduced, and Freon,
The heat pipe 50 is a device that performs heat transfer by transferring vapor of a heat medium such as ammonia and water and transferring latent heat of vaporization.
As a result, the temperature of the condensation chamber 45 decreases.
【0034】実施の形態6
図9はこの発明における実施の形態の一例の概略図であ
る。この電子冷却方式蒸発濃縮装置は、図1の実施の形
態と同じ符号を付したものは同様に構成されるから説明
を省略する。この実施の形態の別の冷却手段Bは、冷却
能力が調節可能な構造であり、温度検出手段は、5か所
に設置されている。第1の温度検出手段C1は、蒸発濃
縮部lの温度を検出するための液温検出手段であり、蒸
発濃縮部1において連通管3側の口部1aを通じて設け
られ、蒸発濃縮部1内の液温を検出する。第2の温度検
出手段C2は、循環送風経路Aの温度を検出するための
気体温度検出手段であり、連通管6内に設けられ、連通
管6を通る蒸気の温度を測定する。第3の温度検出手段
C3は、放熱部7の温度を検出するための放熱部温度検
出手段であり、放熱部近傍に設けられ、放熱部7の温度
を検出する。第4の温度検出手段C4、吸熱部8の温度
を検出するための吸熱部温度検出手段であり、吸熱部8
に設けられ、吸熱部8の温度を検出する。第5の温度検
出手段C5は、冷却凝縮部2の温度を検出するための冷
却凝縮部温度検出手段であり、冷却凝縮部2内に設けら
れ、冷却凝縮部2内の温度を検出する。Sixth Embodiment FIG. 9 is a schematic view of an example of the embodiment of the present invention. This electronic cooling type evaporative concentrator is denoted by the same reference numeral as that of the embodiment of FIG. Another cooling means B of this embodiment has a structure in which the cooling capacity can be adjusted, and the temperature detecting means is installed at five locations. The first temperature detecting means C1 is a liquid temperature detecting means for detecting the temperature of the evaporative concentration section 1, is provided in the evaporative concentration section 1 through the opening 1a on the communication pipe 3 side, and is provided in the evaporative concentration section 1. Detect the liquid temperature. The second temperature detecting means C2 is a gas temperature detecting means for detecting the temperature of the circulation air passage A, is provided in the communication pipe 6, and measures the temperature of the steam passing through the communication pipe 6. The third temperature detecting means C3 is a heat radiating section temperature detecting means for detecting the temperature of the heat radiating section 7, is provided near the heat radiating section, and detects the temperature of the heat radiating section 7. The fourth temperature detecting means C4 is an endothermic temperature detecting means for detecting the temperature of the endothermic portion 8,
And detects the temperature of the heat absorbing portion 8. The fifth temperature detecting means C5 is a cooling / condensing section temperature detecting means for detecting the temperature of the cooling / condensing section 2, is provided in the cooling / condensing section 2, and detects the temperature in the cooling / condensing section 2.
【0035】これらの温度検出手段の温度検出結果を制
御部Dに送り、制御部Dでは温度検出結果に基づき別の
冷却手段Bの冷却能力を調節する制御を行なっており、
環境温度が変化しても、より安定した処理能力が得られ
る。The temperature detection results of these temperature detection means are sent to the control section D, and the control section D controls the cooling capacity of another cooling means B based on the temperature detection results.
Even if the environmental temperature changes, more stable processing capacity can be obtained.
【0036】また、温度検出手段としては、例えばサー
モスタットやサーミスタ等で構成される。また、各温度
検出手段は、前記5か所のうち1か所のみに設けてもよ
い。The temperature detecting means is composed of, for example, a thermostat or thermistor. Further, each temperature detecting means may be provided only in one of the above five places.
【0037】また、別の冷却手段Bは、図9に二点鎖線
で示すように冷却凝縮部2を通過後の蒸発濃縮部1に至
る循環送風経路Aに設けることができ、冷却凝縮部2を
通過後の蒸発濃縮部1に至る循環送風経路Aで冷却する
ことで濃縮効率をより高くすることができる。この冷却
凝縮部2を通過後の蒸発濃縮部1に至る循環送風経路A
に設けた別の冷却手段Bも、同様に冷却能力が調節可能
な構造であり、制御部Dにより温度検出結果に基づき制
御を行なうことができ、環境温度が変化しても、より安
定した処理能力が得られる。Further, another cooling means B can be provided in the circulating air flow path A reaching the evaporative concentration section 1 after passing through the cooling condensation section 2 as shown by the two-dot chain line in FIG. The concentration efficiency can be further increased by cooling in the circulation air flow path A reaching the evaporative concentration section 1 after passing through. Circulation air flow path A reaching the evaporative concentration section 1 after passing through the cooling condensation section 2
Similarly, another cooling means B provided in the above-mentioned structure has a structure in which the cooling capacity can be adjusted, and control can be performed based on the temperature detection result by the control unit D, and a more stable process can be performed even if the environmental temperature changes. Ability is obtained.
【0038】さらに、制御部Dでは、放熱吸熱部10の
放熱部近傍に設けた温度検出手段C3からの温度検出結
果に基づき、一定温度以上では電源回路Fを制御し、放
熱吸熱部10への通電を停止する。このように、放熱吸
熱部10の温度を一定以上に上昇させないようにして耐
久性の向上を図ることができる。Further, the control section D controls the power supply circuit F at a certain temperature or higher based on the temperature detection result from the temperature detecting means C3 provided in the vicinity of the heat radiation section of the heat radiation and heat absorption section 10. Stop energizing. In this way, it is possible to improve the durability by preventing the temperature of the heat radiation / absorption part 10 from rising above a certain level.
【0039】実施の形態7
図10はこの発明における実施の形態の一例の概略図で
あり、図10(a)は正面図、図10(b)は平面図、
図10(c)は側面図である。この電子冷却方式蒸発濃
縮装置の装置本体60内には、ペルチェ素子9を有する
放熱吸熱部10と、液体を蒸発させて濃縮を行う蒸発濃
縮部1と、蒸発した蒸気を冷却することで凝縮を行う冷
却凝縮部2と、さらに蒸発濃縮部1と冷却凝縮部2とを
連通する連通管6、冷却凝縮部2と蒸発濃縮部1とを連
通する連通管11とが配置されている。連通管11に
は、蒸発濃縮部1内の液面に送風を行う送風手段として
のファン3が備えられている。Embodiment 7 FIG. 10 is a schematic view of an example of an embodiment of the present invention. FIG. 10 (a) is a front view, FIG. 10 (b) is a plan view,
FIG.10 (c) is a side view. In the apparatus body 60 of this electronic cooling type evaporative concentrator, a heat radiating and absorbing part 10 having a Peltier element 9, an evaporative concentrating part 1 for evaporating and concentrating a liquid, and an evaporating vapor for condensing by cooling. A cooling / condensing unit 2 to be performed, a communication pipe 6 that connects the evaporative concentration unit 1 and the cooling condensation unit 2 to each other, and a communication pipe 11 that connects the cooling condensation unit 2 and the evaporation concentration unit 1 are arranged. The communication pipe 11 is provided with a fan 3 as a blowing unit that blows air to the liquid surface in the evaporative concentration unit 1.
【0040】また、装置本体60内には、連通管6によ
り蒸発濃縮部1の発生蒸気を含む気体を冷却凝縮部2に
送風し、この冷却凝縮部2を通過した気体が連通管11
により蒸発濃縮部1に戻る循環送風経路Aが設けられて
いる。In the apparatus main body 60, the gas containing the vapor generated in the evaporative concentration section 1 is sent to the cooling / condensing section 2 through the communication tube 6, and the gas passing through the cooling / condensing section 2 is connected to the communication tube 11.
Thus, a circulation air flow path A returning to the evaporative concentration section 1 is provided.
【0041】放熱吸熱部10は、その放熱部7を上に
し、吸熱部8を下にして配置し、放熱吸熱部10を挟ん
で、蒸発濃縮部1を放熱部7に接するように放熱吸熱部
10の上側に配置し、冷却凝縮部2を吸熱部8に接する
ように放熱吸熱部10の下側に配置している。The heat radiating and absorbing portion 10 is arranged with the heat radiating portion 7 on the upper side and the heat absorbing portion 8 on the lower side. The heat radiating and absorbing portion 10 is sandwiched so that the evaporative concentrating portion 1 is in contact with the heat radiating portion 7. It is arranged on the upper side of 10, and the cooling condenser section 2 is arranged on the lower side of the heat radiating and absorbing section 10 so as to be in contact with the heat absorbing section 8.
【0042】冷却凝縮部2は、高温ガス槽200と、冷
却して気体をファン3に戻す層201を有し、高温ガス
槽200は装置本体60の上部まで延び、蒸気を送る層
202へ連通し、この蒸気を送る層202に連通管6か
らの高温の蒸気が導入される。冷却して気体をファン3
に戻す層201は、蒸発濃縮部1に戻すために気体をフ
ァン3に入れる層203に連通し、気体をファン3に入
れる層203は装置本体60の上部に位置している。The cooling / condensing unit 2 has a high temperature gas tank 200 and a layer 201 for cooling and returning the gas to the fan 3. The high temperature gas tank 200 extends to the upper part of the apparatus body 60 and communicates with a layer 202 for sending vapor. Then, the high temperature steam from the communication pipe 6 is introduced into the layer 202 that sends the steam. Cool and blow gas 3
The layer 201 for returning gas to the evaporative concentration section 1 communicates with the layer 203 for putting gas in the fan 3, and the layer 203 for putting gas in the fan 3 is located above the apparatus main body 60.
【0043】蒸発濃縮部1は、袋で構成され、連通管6
へ気体を排出する口部1aと、連通管11に配置したフ
ァン3から空気を吹き込む口部1bとを有し、中央部が
支持板300により支持されている。蒸発濃縮部1を構
成する袋は、折りたたみ可能の軟質プラスチックで形成
され、口部1a及び口部1bのスクリューキャップ1a
1,1b1を外すことで装置本体60に設けられた扉6
1を開き、取り出し口62から取り出し可能になってい
る。The evaporative concentration section 1 is composed of a bag and has a communication pipe 6
It has a mouth portion 1a for discharging gas to and a mouth portion 1b for blowing air from the fan 3 arranged in the communication pipe 11, and the central portion is supported by the support plate 300. The bag forming the evaporative concentration unit 1 is made of foldable soft plastic, and has a screw cap 1a of the mouth portion 1a and the mouth portion 1b.
The door 6 provided on the apparatus main body 60 by removing 1, 1b1
1 can be opened and taken out from the take-out port 62.
【0044】装置本体60の下部には、ファン70が設
けられ、空気を外気導入槽71へ送る。外気導入槽71
は、高温ガス槽200に接して配置されている。高温ガ
ス槽200は、熱交換板72により形成され、空気を装
置本体60の下側から上側に送り、高温ガス槽200を
流れる蒸気を冷却するように構成されている。熱交換板
72は熱伝導性のよい金属の薄板、例えばアルミニウム
やステンレス等の薄板が用いられる。装置本体60内部
の奥部に形成されたスペース63には、電装部75及び
ポンプ76等が配置され、上部のスペース64には電装
部77が配置される。装置本体60に上部のスペース6
4に配置された電装部77は、例えば放熱吸熱部1の電
源、操作電源、送風手段であるファン3の駆動源等であ
り、これらからの一部の放熱が、蒸発濃縮部1に送風さ
れる気体を加温する構造となっており、放熱吸熱部1の
電源、操作電源、送風手段の駆動源からの少なくとも一
部の放熱を利用することで、濃縮効率をより高くするこ
とができる。A fan 70 is provided at the bottom of the apparatus main body 60 and sends air to the outside air introduction tank 71. Outside air introduction tank 71
Are arranged in contact with the high temperature gas tank 200. The high temperature gas tank 200 is formed by the heat exchange plate 72, and is configured to send air from the lower side to the upper side of the apparatus main body 60 to cool the steam flowing through the high temperature gas tank 200. As the heat exchange plate 72, a metal thin plate having good heat conductivity, for example, a thin plate of aluminum, stainless steel or the like is used. An electric equipment part 75, a pump 76, and the like are arranged in a space 63 formed inside the apparatus body 60, and an electric equipment part 77 is arranged in an upper space 64. Space 6 on top of the device body 60
The electric component section 77 arranged in 4 is, for example, a power source of the heat radiating and heat absorbing section 1, an operating power source, a drive source of the fan 3 which is a blowing unit, and a part of the heat radiated from these is blown to the evaporative concentration section 1. The gas has a structure for heating the gas, and by utilizing at least a part of heat radiation from the power source of the heat radiation / absorption unit 1, the operation power source, and the drive source of the blowing unit, the concentration efficiency can be further increased.
【0045】実施の形態8
図11はこの発明における実施の形態の一例の概略図で
あり、図11(a)は正面図、図11(b)は平面図、
図11(c)は側面図である。この電子冷却方式蒸発濃
縮装置は、図10と同様に構成されるものは、同じ符号
を付して説明を省略する。この電子冷却方式蒸発濃縮装
置の装置本体60内には、放熱吸熱部10が、その放熱
部7を上にし、吸熱部8を下にして配置され、放熱吸熱
部10を挟んで、蒸発濃縮部1を放熱部7に接するよう
に放熱吸熱部10の上側に配置し、冷却凝縮部2を吸熱
部8に接するように放熱吸熱部10の下側に配置してい
る。Embodiment 8 FIG. 11 is a schematic view of an example of an embodiment of the present invention. FIG. 11 (a) is a front view, FIG. 11 (b) is a plan view,
FIG. 11C is a side view. The electronic cooling type evaporative concentrator having the same structure as that of FIG. 10 is denoted by the same reference numeral and its description is omitted. In the apparatus body 60 of this electronic cooling type evaporative concentration apparatus, the heat radiation and heat absorption section 10 is arranged with the heat radiation section 7 facing upward and the heat absorption section 8 facing downward. 1 is arranged on the upper side of the heat radiating and absorbing section 10 so as to contact the heat radiating section 7, and the cooling condenser section 2 is arranged on the lower side of the heat radiating and absorbing section 10 so as to contact the heat absorbing section 8.
【0046】冷却凝縮部2は、高温ガス槽200と、冷
却して気体をファン3に戻す層201を有し、高温ガス
槽200は装置本体60の下部に位置し、蒸発濃縮部1
から連通管6を介して高温の蒸発濃縮部1が導入され
る。冷却して気体をファン3に戻す層201は、高温ガ
ス槽200から装置本体60の上部にまで延びている。The cooling / condensing section 2 has a high temperature gas tank 200 and a layer 201 for returning the gas to the fan 3 by cooling, and the high temperature gas tank 200 is located in the lower part of the apparatus main body 60, and the evaporative concentration section 1 is provided.
The high temperature evaporative concentration section 1 is introduced from the through the communication pipe 6. The layer 201 that cools and returns the gas to the fan 3 extends from the high temperature gas tank 200 to the upper portion of the apparatus body 60.
【0047】装置本体60の下部には、ファン80を備
える空冷ユニット81が冷却凝縮部2の高温ガス槽20
0を冷却するように設けられている。装置本体60内部
の蒸発濃縮部1と冷却して気体をファン3に戻す層20
1の間のスペース83には、電装部85及びポンプ86
等が配置されている。電装部85は、例えば放熱吸熱部
1の電源、操作電源、送風手段であるファン3の駆動源
からの一部の放熱が、蒸発濃縮部1の対象とする液およ
び蒸発濃縮部1に送風される気体を加温する構造となっ
ており、放熱吸熱部1の電源、操作電源、送風手段の駆
動源からの少なくとも一部の放熱を利用することで、濃
縮効率をより高くすることができる。An air cooling unit 81 equipped with a fan 80 is provided under the apparatus main body 60, and the high temperature gas tank 20 of the cooling condenser section 2 is provided.
It is provided to cool 0. Layer 20 that cools the evaporative concentration section 1 inside the apparatus body 60 and returns the gas to the fan 3
In the space 83 between the two, the electrical component 85 and the pump 86
Etc. are arranged. In the electric component part 85, for example, a part of the heat radiation from the power source of the heat radiation / absorption part 1, the operation power source, and the drive source of the fan 3 which is a blowing means is blown to the target liquid of the evaporation concentration part 1 and the evaporation concentration part 1. The gas has a structure for heating the gas, and by utilizing at least a part of heat radiation from the power source of the heat radiation / absorption unit 1, the operation power source, and the drive source of the blowing unit, the concentration efficiency can be further increased.
【0048】[0048]
【発明の効果】以上説明したように、請求項1記載の発
明では、蒸気の冷却に放熱吸熱部の他に別々の冷却手段
で補助冷却するから蒸発の加熱と冷却のバランスを取り
調整し、これにより放熱部の一部熱を排熱する構造が不
要となり、電子冷却方式蒸発濃縮装置は、小型で低コス
トであり、消費電力が小さく、しかも濃縮効率が高く構
造が簡単である。また、別の冷却手段の冷却能力が調節
であり、環境温度が変化しても、安定した処理能力を得
ることができる。 As described above, according to the first aspect of the invention, the vapor is cooled by auxiliary cooling by means of separate cooling means in addition to the heat radiating and absorbing portion, so that the evaporation heating and cooling are balanced and adjusted. This eliminates the need for a structure for discharging a part of heat from the heat radiating portion, and the electronic cooling type evaporative concentrator is small in size, low in cost, consumes less power, and has a high concentration efficiency and a simple structure. Also, the cooling capacity of another cooling means can be adjusted.
Therefore, stable processing capacity can be obtained even when the environmental temperature changes.
You can
【0049】[0049]
【0050】請求項2記載の発明では、別の冷却手段が
簡単な構造で、冷却効率の良い好ましい冷却の方式であ
り、濃縮効率をより高くすることができる。According to the second aspect of the present invention, another cooling means has a simple structure, is a preferable cooling method with good cooling efficiency, and can enhance the concentration efficiency.
【0051】請求項3記載の発明では、温度検出結果に
基づき、別の冷却手段の冷却能力を調節する制御を行う
から、環境温度が変化しても、より安定した処理能力を
得ることができる。According to the third aspect of the present invention, since the control for adjusting the cooling capacity of another cooling means is performed based on the temperature detection result, more stable processing capacity can be obtained even if the environmental temperature changes. .
【0052】請求項4記載の発明では、冷却凝縮部を通
過後の蒸発濃縮部に至る循環送風経路で冷却するから、
濃縮効率をより高くすることができる。According to the fourth aspect of the invention, since the cooling air is cooled in the circulating air flow path to the evaporative concentration section after passing through the cooling condensation section,
The concentration efficiency can be increased.
【0053】請求項5記載の発明では、放熱吸熱部の温
度を一定以上に上昇させないようにしたから、放熱吸熱
部の耐久性の向上を図ることができる。According to the fifth aspect of the present invention, since the temperature of the heat radiating and absorbing portion is not raised above a certain level, the durability of the heat radiating and absorbing portion can be improved.
【0054】請求項6記載の発明では、放熱吸熱部の電
源、操作電源、送風手段の駆動源からの少なくとも一部
の放熱を利用することで、濃縮効率をより高くすること
ができる。According to the sixth aspect of the present invention, the concentration efficiency can be further increased by utilizing the heat radiation from at least a part of the power source of the heat radiating and absorbing portion, the operating power source, and the driving source of the blowing means.
【0055】請求項7記載の発明では、蒸発濃縮部に入
る気体と出た後の気体が熱交換するから、高効率で液を
蒸発させることができ、濃縮効率が向上する。According to the seventh aspect of the invention, since the gas entering the evaporative concentration section and the gas after it undergoes heat exchange, the liquid can be evaporated with high efficiency and the concentration efficiency is improved.
【0056】請求項8記載の発明では、ペルチェ素子を
使用し、温度制御により蒸発濃縮の安定状態にすること
で消費電力を小さく、且つ高い処理能力を得ることがで
きる。According to the eighth aspect of the present invention, a Peltier element is used and a stable state of evaporative concentration is obtained by controlling the temperature, so that the power consumption can be reduced and a high processing capacity can be obtained.
【0057】請求項9記載の発明では、放熱部と吸熱部
の温度差が10〜50℃の範囲となるような直流電圧に
設定したから、直流電源を入り/切り制御するための装
置が不要となり、低コスト化を図ることができる。In the invention according to claim 9 , since the DC voltage is set so that the temperature difference between the heat radiating part and the heat absorbing part is in the range of 10 to 50 ° C., a device for controlling ON / OFF of the DC power supply is unnecessary. Therefore, cost reduction can be achieved.
【図1】この発明の電子冷却方式蒸発濃縮装置の実施の
形態の一例を示す概略図である。FIG. 1 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
【図2】ペルチェ素子の構成を示す図である。FIG. 2 is a diagram showing a configuration of a Peltier device.
【図3】この発明の電子冷却方式蒸発濃縮装置の実施の
形態の一例を示す概略図である。FIG. 3 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
【図4】熱交換器の概略構成図である。FIG. 4 is a schematic configuration diagram of a heat exchanger.
【図5】他の実施の形態の熱交換器の概略構成図であ
る。FIG. 5 is a schematic configuration diagram of a heat exchanger according to another embodiment.
【図6】この発明の電子冷却方式蒸発濃縮装置の実施の
形態の一例を示す概略図である。FIG. 6 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentration apparatus of the present invention.
【図7】この発明の電子冷却方式蒸発濃縮装置の実施の
形態の一例を示す概略図である。FIG. 7 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
【図8】この発明の電子冷却方式蒸発濃縮装置の実施の
形態の一例を示す概略図である。FIG. 8 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
【図9】この発明の電子冷却方式蒸発濃縮装置の実施の
形態の一例を示す概略図である。FIG. 9 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
【図10】この発明の電子冷却方式蒸発濃縮装置の実施
の形態の一例を示す概略図である。FIG. 10 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
【図11】この発明の電子冷却方式蒸発濃縮装置の実施
の形態の一例を示す概略図である。FIG. 11 is a schematic view showing an example of an embodiment of an electronic cooling type evaporative concentrator of the present invention.
1 蒸発濃縮部 2 冷却凝縮部 7 放熱部 8 吸熱部 10 放熱吸熱部 A循環送風経路 B 放熱吸熱部10とは別の冷却手段 1 Evaporative concentration section 2 Cooling condensing section 7 Heat sink 8 Heat absorption part 10 Heat dissipation and heat absorption section A circulating air flow path B Cooling means other than the heat radiation and heat absorption section 10
フロントページの続き (72)発明者 中島 圭一 神奈川県川崎市川崎区田辺新田1番1号 富士電機 株式会社内 (72)発明者 山口 香 神奈川県川崎市川崎区田辺新田1番1号 富士電機 株式会社内 (72)発明者 大澤 正弘 神奈川県川崎市川崎区田辺新田1番1号 富士電機 株式会社内 (56)参考文献 特開 平7−209841(JP,A) 特開 平8−267050(JP,A) 特開 平8−57202(JP,A) 特開 平9−314126(JP,A) (58)調査した分野(Int.Cl.7,DB名) C02F 1/04 F25B 21/02 Continued Front Page (72) Inventor Keiichi Nakajima 1-1 Tanabeshinden, Kawasaki-ku, Kawasaki-shi, Kanagawa Fuji Electric Co., Ltd. Electric Machinery Co., Ltd. (72) Inventor Masahiro Osawa 1-1 Tanabe Nitta, Kawasaki-ku, Kawasaki-shi, Kanagawa Fuji Electric Co., Ltd. (56) Reference JP-A-7-209841 (JP, A) JP-A-8- 267050 (JP, A) JP-A-8-57202 (JP, A) JP-A-9-314126 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C02F 1/04 F25B 21 / 02
Claims (9)
吸熱を行う吸熱部とを有する放熱吸熱部と、この放熱吸
熱部の放熱部からの放熱により、液を蒸発させて濃縮を
行う蒸発濃縮部と、前記放熱吸熱部の吸熱部の吸熱によ
り、前記蒸発濃縮部からの気体を冷却して凝縮を行う冷
却凝縮部とを有している電子冷却方式蒸発濃縮装置にお
いて、 前記蒸発濃縮部の発生蒸気を含む気体を前記冷却凝縮部
に送風し、この冷却凝縮部を通過した気体が前記蒸発濃
縮部に戻る循環送風経路を設け、 この循環送風経路および/または前記冷却凝縮部の部分
で前記放熱吸熱部とは別の冷却手段により循環風を冷却
し、 前記別の冷却手段の冷却能力が調節可能である ことを特
徴とする電子冷却方式蒸発濃縮装置。Claim: What is claimed is: 1. An evaporation method for evaporating and concentrating a liquid by radiating heat from a heat radiating and absorbing section having a heat radiating section for radiating heat by passing an electric current and a heat absorbing section for absorbing heat, and radiating heat from the heat radiating section of the heat radiating and absorbing section. In an electronic cooling type evaporative concentrator having a concentrating part and a cooling condensing part that cools and condenses the gas from the evaporative condensing part by absorbing the heat of the heat radiating and absorbing part. A gas containing the generated vapor of is blown to the cooling / condensing unit, and a gas that has passed through the cooling / condensing unit is returned to the evaporation / concentrating unit. Cooling the circulating air by cooling means other than the heat radiation and heat absorption section
And, an electronic cooling system evaporative concentration apparatus, wherein the cooling capacity of said further cooling means is adjustable.
れかの方式であることを特徴とする請求項1記載の電子
冷却方式蒸発濃縮装置。 A:前記放熱吸熱部とは別の放熱吸熱部の吸熱部から発
生する冷却熱であり、放熱部は外気により空冷する方式 B:外気により熱交換器で循環送風経路の空気を直接空
冷する方式 C:ヒートパイプを有する熱交換器で循環送風経路の空
気を間接的に外気により空冷する方式2. The electronic cooling type evaporative concentrator according to claim 1, wherein the other cooling means is one of the following A, B, and C types. A: Cooling heat generated from a heat absorbing part of a heat radiating and absorbing part different from the heat radiating and absorbing part, and the heat radiating part is air-cooled by outside air B: A method of directly cooling the air in the circulation blower path by a heat exchanger by outside air C: A method of indirectly cooling the air in the circulation air flow path by the outside air with a heat exchanger having a heat pipe
記循環送風経路の少なくとも1箇所に温度検出手段を設
け、その温度検出結果により前記別の冷却手段の冷却能
力を調節する制御を行なうことを特徴とする請求項1ま
たは請求項2記載の電子冷却方式蒸発濃縮装置。Wherein the evaporation unit, the temperature sensing means in at least one place of the cooling and condensing section and the circulating air passage provided, to perform a control for adjusting the cooling capacity of the further cooling means by that temperature detection result An electronic cooling type evaporative concentrator according to claim 1 or 2 .
過後の前記蒸発濃縮部に至る循環送風経路に設けたこと
を特徴とする請求項1乃至請求項3のいずれかに記載の
電子冷却方式蒸発濃縮装置。Wherein said further cooling means according to any one of claims 1 to 3, characterized in that provided in the circulating air passage extending the cooling condensing unit to the evaporation portion after passing Electronic cooling evaporative concentrator.
段を設け、一定温度以上では前記放熱吸熱部への通電を
停止することを特徴とする請求項1乃至請求項4のいず
れかに記載の電子冷却方式蒸発濃縮装置。5. providing the temperature detecting means to the heat radiating portion near the heat radiating heat absorption part, to any one of claims 1 to 4, characterized in that stopping the energization of the heat radiating heat absorption unit at a constant temperature or more The electronic cooling type evaporative concentrator described.
段の駆動源からの少なくとも一部の放熱が、前記蒸発濃
縮部の対象とする液および/または前記蒸発濃縮部に送
風される気体を加温する構造としたことを特徴とする請
求項1乃至請求項5のいずれかに記載の電子冷却方式蒸
発濃縮装置。6. The liquid targeted for the evaporative concentration section and / or the gas blown to the evaporative concentration section, at least part of the heat radiation from the power source of the heat radiating and absorbing section, the operation power source, and the driving source of the blowing unit. The electronic cooling type evaporative concentrator according to any one of claims 1 to 5 , characterized in that it has a structure for heating.
が熱交換する熱交換構造を設けたことを特徴とする請求
項1乃至請求項6のいずれかに記載の電子冷却方式蒸発
濃縮装置。7. The electronic cooling system evaporator according to any one of claims 1 to 6, characterized in that the gas after it leaves the gas entering the evaporative concentration portion is provided heat exchange structure for heat exchange Concentrator.
り片面が放熱部となり反対側面が吸熱部となるペルチェ
素子を使用し、蒸発濃縮の安定状態では、前記放熱部と
吸熱部の温度差が10〜50℃の範囲となるように構成
したことを特徴とする請求項1乃至請求項7のいずれか
に記載の電子冷却方式蒸発濃縮装置。8. A Peltier element having a heat radiating portion on one side and a heat absorbing portion on the opposite side by applying a direct current to the heat radiating and heat absorbing portion is used. electronic cooling type evaporative concentration apparatus according to any one of claims 1 to 7 but is characterized by being configured to be in the range of 10 to 50 ° C..
も、放熱部と吸熱部の温度差が10〜50℃の範囲とな
るような直流電圧に設定することを特徴とする請求項8
記載の電子冷却方式蒸発濃縮装置。9. The method of claim 8, wherein the well without DC power supply On / Off control, set to a DC voltage as the temperature difference between the heat radiating portion and the heat absorbing portion is in the range of 10 to 50 ° C.
The electronic cooling type evaporative concentrator described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05263097A JP3469423B2 (en) | 1997-03-07 | 1997-03-07 | Electronic cooling evaporator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05263097A JP3469423B2 (en) | 1997-03-07 | 1997-03-07 | Electronic cooling evaporator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10244251A JPH10244251A (en) | 1998-09-14 |
| JP3469423B2 true JP3469423B2 (en) | 2003-11-25 |
Family
ID=12920151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05263097A Expired - Fee Related JP3469423B2 (en) | 1997-03-07 | 1997-03-07 | Electronic cooling evaporator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3469423B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4821304B2 (en) * | 2005-12-19 | 2011-11-24 | パナソニック電工株式会社 | Electrostatic atomizer |
| JP5321716B2 (en) * | 2012-06-18 | 2013-10-23 | 富士通株式会社 | Loop heat pipe and electronic equipment |
| JP5667722B1 (en) * | 2014-07-31 | 2015-02-12 | 鈴木 洋一 | Drinking water plant |
| CN111867981B (en) * | 2018-03-13 | 2024-03-12 | 格尼弗有限责任公司 | Methods and equipment for water purification |
-
1997
- 1997-03-07 JP JP05263097A patent/JP3469423B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10244251A (en) | 1998-09-14 |
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