JP3494541B2 - Electronic component container and crystal oscillator using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field of use of a container for electronic parts and a crystal oscillator using the same, and in particular, a crystal oscillator is integrally formed by using a sheet-shaped resin substrate (sheet-shaped substrate). After that, the present invention relates to a crystal oscillator container that is individually divided and manufactured.

[0002]

BACKGROUND OF THE INVENTION Crystal oscillators are widely used as frequency and time sources in various electronic devices because of their stable oscillation frequencies. In recent years, as the demand has increased, a manufacturing method having excellent productivity has been demanded. One of such manufacturing methods is, for example, a method in which a plurality of crystal oscillators are integrally formed by a sheet-shaped substrate and then individually divided.

(Example of Prior Art) FIG. 4 is a diagram for explaining an example of this type of prior art, showing a method of manufacturing a crystal oscillator using a sheet substrate. The crystal oscillator is integrally formed by using the sheet-like substrate 2 on which the dividing grooves 1 are formed, which are discontinuous in the vertical and horizontal directions. Each rectangular resin substrate 3 is surrounded by the vertical and horizontal dividing grooves 1, has a circuit pattern (not shown) on the main surface, and a circuit element such as a crystal oscillator and an IC (not shown) is arranged. Then, after fitting the projections 6 of the resin cover 5 (see FIG. 5) into the small holes 4 at the four corners of the resin substrate 3 and covering them,
It was divided into individual crystal oscillators.

[0004]

[Problems to be Solved by the Invention]

(Problem) However, in the above configuration, since the container 7 is formed from the resin substrate 3 and the resin cover 5, E
There was an adverse effect due to MI (electromagnetic interference). From this, it was considered to form the ground electrode 8 on the back surface of the resin substrate 3 and use the metal cover 9 as the resin cover 5.

For example, as shown in FIGS. 6 and 7,
The ground electrode 8 is formed on the back surface of the resin substrate 3, and the side surface electrode 11 connected to the ground electrode 8 is formed by providing the concave portion 10 on the side surface. The metal cover 9 is provided with a protrusion 12 that comes into contact with the outer peripheral surface of the resin substrate 3, and the legs 13 are extended. Then, it was considered that the metal cover 9 was placed on each resin substrate 3 and the leg portion 13 was soldered to the side surface electrode 11. Reference numeral 14 in the drawing is an electrode for surface mounting extending from the electrode pattern on the main surface. When the metal cover 9 is covered on the outer peripheral side surface of the resin substrate 3, the opening tip of the metal cover 9 may come into contact with a conductive path or the like of a circuit board (not shown).

However, in such a case, the sheet-like substrates 2 are covered with the metal covers 9, respectively, for example, when they are individually soldered, or when cream solder is applied and they are melted and joined by a high-heat furnace or a laser. When doing so, there was a problem in that the metal cover 9 was joined in a state in which the metal cover 9 was not positioned sufficiently with respect to the resin substrate 3 when it was rattled. For example, when the metal cover 9 is positioned so as to be inclined, a cutting blade hits the metal cover 9 when the resin cover 3 is divided into individual pieces, which causes damage or deformation of the metal cover 9, which makes the height dimension non-standard. A good product will be produced. Further, since the side surface electrode 11 and the leg portion 13 are basically solder-bonded to each other on their exposed surfaces, there is a problem that mechanical strength is also impaired.

(Object) The present invention has a structure for electrically connecting a metal cover and a ground electrode of a resin substrate, and further, the positional accuracy of the metal cover with respect to the resin substrate is improved, and thus the dimensional accuracy is improved, and It is an object of the present invention to provide a crystal oscillator using this.

[0008]

According to the present invention, an opening end face of a metal cover is made smaller than a plate surface of a resin substrate to provide a bulge portion on a pair of opposing leg portions, and a space A between the concave portions of the resin substrate The relation between the leg portions B of the cover and the bulging portion C of the leg portions is A≈B ≧ C
Alternatively, setting A ≧ B ≧ C is a basic solution.

[0009]

With such a solution, elasticity is generated between the legs of the metal cover, which has a basic function of mechanically connecting the metal cover and the resin substrate. Hereinafter, examples of the present invention will be described in detail along with their functions.

[0010]

First Embodiment FIG. 1 is a diagram of a crystal oscillator for explaining an embodiment of the present invention. The same parts as those in the previous conventional example are designated by the same reference numerals and the description thereof will be omitted. In the crystal oscillator, similarly to the above, a crystal oscillator and a circuit element (not shown) such as an IC are arranged on the sheet-like substrate 2 on which the dividing grooves 1 are formed vertically and horizontally intermittently (see the previous figure). , Metal cover 9
And then integrally formed, and then individually divided.

In this embodiment, as described above, the resin substrate 4 having the ground electrode 8 (not shown) on the back surface is used.
The side surface is provided with the concave portion 10 extending from the front surface to the back surface, and the side surface electrode 11 connected to the ground electrode 8 is formed. Metal cover 9
Has a protrusion 12 that abuts the outer peripheral surface of the resin substrate 3 in the central portion of the side surface of each cover, and further has a leg portion 13 extending from the tip of the center. Further, all the leg portions 13 are provided with the bulging portions 15 protruding toward the concave portion of the resin substrate 3.

However, as shown in the exploded side view of FIG. 2, the opening end surface of the metal cover 9 is set larger than the plate surface of the resin substrate 4. That is, the resin substrate 3 and the metal cover 9
When the center lines XX ′ of the two are aligned, a gap (referred to as an outer shape gap) G1 is generated on both end sides. Further, the width of the recess 10 is made larger than that of the leg portion 13, and a gap (a recess gap) G2 ≧ G1 is formed on both sides of the center line.
Have. Further, the length A between the concave portions of the resin substrate 3 and the distance B between the legs of the metal cover 9 are substantially equal to each other, and the distance C between the bulging portions is made shorter than these (that is, A≈B ≧ C).

In such a structure, the leg portions 13 of the metal cover 9 are pushed and inserted into the recesses of the resin substrates 3 in the state of the sheet substrate 2. Then, at least one of the four side surfaces of the side surface electrode 11 and the leg portion is joined by solder (not shown) to electrically connect to the ground electrode 8 on the back surface. Then, the sheet-shaped substrate 2 is individually divided to obtain a plurality of crystal oscillators.

With such a structure, when the leg portion 13 of the metal cover 9 is pushed into the concave portion of the resin substrate 3, the leg portion 13 is guided into the concave portion and the protruding portion 12 stops at the outer peripheral surface. Then, as shown in the cross-sectional view of FIG. 3, the leg portion 13 including the protruding portion 12 has an “eight” shape in the two sets of opposing directions, and the bulging portion 15 causes the resin substrate 3 and Connect elastically (mechanically).

Further, since the recess gap G2 is smaller than the outer shape gap G1, even if there is a lateral displacement when the metal cover 9 and the resin substrate 3 are fitted together, the leg portions 13 are not dislocated in the recess. The movement is restricted, and the metal cover 9 does not drop off from the resin substrate 3. Therefore,
The two sets are elastically positioned in opposite directions, the movement of the legs 13 is limited, and the centers of the resin substrate 3 and the metal cover 9 are aligned and joined.

Further, solder (not shown) penetrates into the gap between the leg portion 13 and the side surface electrode 11 generated by the bulging portion 15, so that they are surface-bonded to each other. Therefore, the bonding strength between them can be increased.

As a result, the metal cover 9 is accurately positioned on each resin substrate 3 and fixed with high precision without rattling. Therefore, when the sheet substrate 2 is divided, the cutting blade does not hit the metal cover 9 and a smooth operation can be performed.

[0018]

[Other Matters] In the above embodiment, two resin substrates 3 facing each other are provided.
The recesses are provided on the side surfaces (that is, all the side surfaces) of the set, and the leg portions 13 of the metal cover 9 are fitted together so as to have an elastic action in the opposing directions. Good. It should be noted that these figures are omitted.

That is, the recesses 10 are provided on the pair of side surfaces of the resin substrate 3 facing each other, and the pair of leg portions of the metal cover 9 corresponding thereto are elastically fitted to each other to be fitted. Then, the side electrode 11 and the leg portion 13 may be soldered on either one or both sides. Even in such a case, since the concave portion gap G2 is smaller than the outer shape gap G1 as described above, the movement of the leg portion 13 in the concave portion is restricted, and the metal cover 9 does not drop off from the resin substrate 3. , Correctly positioned.

Further, in view of the relationship with the electrode pattern (not shown) of the resin substrate 3, the resin substrate 3 is positioned and fixed between one set of legs, and one of the side electrodes 11 provided in the other set and the metal cover. The leg portion 13 of 9 may be joined to obtain an electrical connection with the ground electrode on the back surface. Leg 1 in this case
Since 3 is merely an electrical connection, the bulging portion 15 may be omitted.

Further, although one recess is provided on each of the pair of opposing side surfaces of the resin substrate and the corresponding leg portion 13 is fitted therein, for example, two recesses are provided on the side surface and the corresponding legs are provided. The parts 13 may be fitted together.

Further, the relationship among the length A between the concave portions of the resin substrate 3, the distance B between the legs of the metal cover 9 and the distance C between the bulging portions is A≈B ≧ C.
However, the point is that the elastic action should be obtained when the legs are pushed into the recesses of the resin substrate, so that A ≧ B ≧ C
May have a relationship of.

[0023]

According to the present invention, the opening end face of the metal cover is made smaller than the plate surface of the resin substrate, and a bulge portion is provided on a pair of opposing leg portions. The relationship between the distance B and the distance C between the bulging portions of the legs is A≈B ≧ C or A ≧ B
Since ≧ C, the position accuracy of the metal cover with respect to the resin substrate can be improved, and the dimensional accuracy can be improved, and a crystal oscillator using the same can be provided.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a crystal oscillator (container) for explaining an embodiment of the present invention.

FIG. 2 is an exploded side view of a container for explaining an embodiment of the present invention.

FIG. 3 is a sectional view of a container for explaining the operation of the embodiment of the present invention.

FIG. 4 is a diagram showing a method of manufacturing a crystal oscillator using a sheet-like substrate for explaining a conventional example.

FIG. 5 is a diagram of a resin cover for explaining a conventional example.

6A and 6B are views of a container as a proposal for a conventional example, FIG. 6A is an exploded view, and FIG. 6B is a rear view of a resin substrate.

FIG. 7 is a side view of a container as a proposal for a conventional example.

[Explanation of symbols]

1 division groove, 2 sheet-like substrate, 3 resin substrate, 4 small holes, 5 resin cover, 6 protrusions, 7 container, 8 shield electrode, 9 metal cover, 10 concave portion, 11 side surface electrode,
12 protrusions, 13 legs, 14 mounting electrodes, 15
Bulging part.

Claims (2)

(57) [Claims] 1. A rectangular resin substrate having a ground electrode on the back surface and at least a pair of opposed side surfaces having recesses extending from the front surface to the back surface, and protrusions contacting outer peripheral surfaces of the four sides of the resin substrate. A container for an electronic component, which has a portion, a leg portion extending from the protruding portion and inserted into a concave portion of the resin substrate, and a metal cover having an opening end surface smaller than a plate surface of the resin substrate. A bulging portion protruding toward the concave portion of the resin substrate is provided on the leg portion of the metal cover, and the bulging portion A of the resin substrate, the leg portion B of the metal cover, and the bulging portion C of the leg portion are provided. the relationship and a = B ≧ C or a ≧ B ≧ C, the elasticity between the legs of the metal cover for electronic components container, characterized in that fitted between the resin substrate and the metal cover. 2. A crystal oscillator, characterized in that a circuit element is housed in the electronic component container according to claim 1.