JP3513438B2 - Flip chip bonding equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonding apparatus for reversing a die (semiconductor chip) and directly bonding it on a substrate.

[0002]

2. Description of the Related Art A flip chip bonding apparatus carries out bonding by the following method. A large number of dies arranged on the wafer sheet with the bumps (electrodes) facing up are picked up and held by suction with a suction nozzle, and then the suction nozzle is rotated vertically by a die reversing device while the die is suctioned. Flip the die. Next, the bonding nozzle receives the die sucked and held by the suction nozzle, and then the bonding nozzle transfers the die onto the substrate and bonds the die onto the substrate. As a flip-chip bonding device of this type,
For example, Japanese Patent No. 2725701 can be cited.

[0003]

When picking up a die from a wafer sheet by a suction nozzle and when transferring a die sucked and held by the suction nozzle to a bonding nozzle, it is necessary to prevent the die from being unnecessarily loaded. There is. Therefore, in general, the suction nozzle is movable up and down and is biased by a spring so as to absorb shocks when the suction nozzle receives and delivers the die.

However, when picking up the die from the wafer sheet, the suction nozzle faces downward, and the weight of the suction nozzle and the like is added to the load of the spring on the die. When transferring the die from the suction nozzle to the bonding nozzle,
The suction nozzle faces upward, and the weight of the spring is subtracted from the load of the spring and added to the die. As described above, the load applied to the die is different between when the die is picked up and when the die is delivered, and the die may be damaged.

An object of the present invention is to provide a flip chip bonding apparatus that applies a substantially constant load to the die both when picking up the die and when delivering the die.

[0006]

A first means of the present invention for solving the above-mentioned problems is to pick up a die arranged on a wafer sheet or tray with bumps directed to the upper surface, and suck and hold the die. In a flip chip bonding apparatus equipped with a die reversing device that rotates 180 degrees to invert the upper surface and the lower surface of the die and move them to a delivery position of the die, the die reversing device includes a suction nozzle for sucking and holding the die, and A nozzle holder that holds a suction nozzle, a pickup load biasing means that biases the nozzle holder toward the suction nozzle, and the suction nozzle and the suction nozzle as well as the suction nozzle when the suction nozzle faces downward and upward. A flip chip bonding device characterized by comprising a balancer for applying an upward load to a moving suction nozzle unit. .

A second means of the present invention for solving the above-mentioned problems is to pick up a die arranged on a wafer sheet or tray with bumps directed to the upper surface, suck and hold the die, and rotate it by 180 degrees. In a flip chip bonding apparatus equipped with a die reversing device for reversing the upper surface and the lower surface of a die to a die transfer position, the die reversing apparatus includes a suction nozzle for sucking and holding the die and a nozzle for holding the suction nozzle. A holder, a frame body in which the suction nozzle is provided so as to be movable up and down, and a frame body that supports the suction nozzle so that the suction nozzle follows and descends when the suction nozzle faces downward, and a driving unit that vertically drives and rotates the frame body. And a pickup load urging means for urging the nozzle holder in the direction of the suction nozzle, and in the case where the suction nozzle faces downward and upward, Characterized in that a balancer exerts an upward force on the suction nozzle unit moves up and down together with the suction nozzle and the adsorption nozzles.

A third means of the present invention for solving the above-mentioned problems is the above-mentioned second means, wherein the nozzle holder is provided with an action shaft on which the weight of the balancer acts, and the suction nozzle is directed downward. The balancer is rotatably provided on the frame so that the weight of the balancer acts upward on the action shaft even in the upward direction.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, on the wafer sheet 2 attached to the wafer ring 1, a large number of dies 3 are attached with the bumps directed toward the upper surface. The wafer ring 1 is fixed on an XY table 4 that is driven in the XY directions, and is positioned and held by a wafer holder 5 that rotates the wafer ring 1 in the θ direction by a rotation driving unit (not shown). A push-up pin 6 that pushes up the die 3 is disposed below the wafer sheet 2.

The substrate 10 to which the die 3 is bonded is
It is fed by a feeder (not shown) along the guide rails 11 arranged opposite to each other and positioned at the bonding position. Above the wafer holder 5, a die reversing device 20 described later is arranged. Above the die reversing device 20, the die 3 from the suction nozzle 21 of the die reversing device 20.
A bonding nozzle 12 is provided for receiving and bonding to the substrate 10.
Is provided with a suction hole 12a. This suction hole 12a
Is connected to a vacuum source via a solenoid valve for a bonding nozzle (not shown). The bonding nozzle 12 is vertically moved by an up / down drive unit (not shown) and is moved in the XY directions by an XY table (not shown).

Next, the structure of the die reversing device 20 will be described with reference to FIGS. The suction nozzle 21 is fixed to a nozzle shaft 22, and the nozzle shaft 22 is fixed to a nozzle holder 23. Here, the nozzle shaft 22 is provided with a suction hole (not shown) communicating with the suction nozzle 21, and one end of a tube (not shown) is connected to the suction hole through the nozzle holder 23. The other end of the tube is connected to a vacuum source via a suction valve electromagnetic valve (not shown).

One of the vertical movement bearings 24, which is vertically arranged, is fixed to the nozzle holder 23, and the other vertical movement bearing 24b is fixed to the bearing holder 2.
It is fixed at 5. A support rod 26 also serving as a touch detection is fixed to the bearing holder 25 via an insulating member (not shown). A contact rod 27, which is fixed to the nozzle holder 23 via an insulating member (not shown) and also serves as touch detection, is in contact with the upper surface of the support rod 26.

The bearing holder 25 is a hook-shaped frame body 3.
0 is fixed to the inner side surface of the one portion 30a. A spring hook 31 is fixed to the upper portion of the nozzle holder 23, and a spring hook 32 is fixed to the lower portion of the other portion 30b of the frame 30 corresponding to the spring hook 31. Spring hook 31, 3
2, a pickup load spring 33 is applied,
The nozzle holder 23 includes a pickup load spring 33.
The contact rod 27 is pressed against the support rod 26 by being urged downward.

On the other portion 30b of the frame body 30, the nozzle shaft 2
The rotating shaft 40 is fixed so as to be orthogonal to the axis of the second shaft. The rotary shaft 40 is driven to rotate by a rotary drive unit (not shown) and also vertically driven by a vertical drive unit (not shown). A balancer 41 is rotatably supported on the rotary shaft 40, and a working shaft 42 fixed to the nozzle holder 23 is inserted into a groove 41a formed at the other end of the balancer 41. Further, a stopper 43 that prevents the balancer 41 from rotating more than necessary is fixed to the upper surface of the other portion 30b of the frame body 30.

Next, the operation will be described. In the state shown in FIG. 1, the static load applied to the suction nozzle 21 is as follows. Assuming that the weight of the suction nozzle unit (suction nozzle 21, nozzle shaft 22, nozzle holder 23, contact rod 27, etc.) is W1 and the urging force of the pickup load spring 33 is F, the suction load of the suction nozzle 21 against the die 3 is positive. (Downward load) is “F + W1”.

Assuming that the weight of the balancer 41 acting on the action shaft 42 is W2, the static load acting on the suction nozzle 21 by this weight W2 is as follows. Balancer 41 is rotating shaft 4
The balancer 41 is rotatably supported about 0, and acts as a load weight (upward load) W2 when the suction nozzle 21 is pressed against the die 3 so as to push the working shaft 42 and the nozzle holder 23 upward. . This balancer 4
The static load on the suction nozzle 21 is “F + W1-W2”, that is, “F
+ (W1-W2) ".

As described above, the suction nozzle 21 faces downward,
When the suction nozzle 21 receives the die 3 from the wafer sheet 2, the weight W1 of the suction nozzle unit (suction nozzle 21, nozzle shaft 22, nozzle holder 23, contact rod 27, etc.)
Acts as a positive load for pressing the die 3, but the weight W2 acting on the action shaft 42 of the balancer 41 acts so as to reduce the weight W1 of the suction nozzle unit. Therefore, W2 is set so that W2 = W1, for example. As a result, the suction nozzle 21 is in a state in which the static load of the biasing force F of the pickup load spring 33 is applied. Therefore, the urging force F of the pickup load spring 33 is set to be, for example, about 30 gf.

First, in the state shown in FIG. 1, the XY table 4
The wafer holder 5 is driven in the XY directions to be picked up, and the die 3 is positioned directly below the suction nozzle 21. Next, the rotary shaft 40 is lowered by the vertical drive means (not shown). When the rotating shaft 40 descends, the frame body 30, the bearing holder 25, and the support rod 26 descend together. When the support rod 26 descends, the pickup load spring 3
Due to the urging force F of 3, the contact rod 27 descends following the lowering of the support rod 26.

When the suction nozzle 21 comes into contact with the die 3, the suction nozzle unit (suction nozzle 21, nozzle shaft 22, nozzle holder 23, contact rod 27, etc.) stops descending. Since the support rod 26 is descending, when the contact rod 27 stops descending, the support rod 26 separates from the contact rod 27.
By connecting the support rod 26 and the contact rod 27 to a touch detector (not shown), the moment when the support rod 26 is separated from the contact rod 27, that is, the state where the suction nozzle 21 contacts (touches) the die 3 is detected. It The descent of the rotary shaft 40 is stopped after a certain time from the touch detection. At this time, the suction nozzle 21 comes into contact with the die 3 by the static load of the urging force F of the pickup load spring 33 described above.

At the same time when the suction nozzle 21 approaches the die 3, a suction valve electromagnetic valve (not shown) is opened to start supplying vacuum pressure to the suction nozzle 21. Then, as described above, the push-up pin 6 is lifted by the vertical driving means (not shown) to push up the die 3 after the touch detection of the suction nozzle 21 touching the die 3. As a result, the suction nozzle 21 holds the die 3 by vacuum suction and picks it up from the wafer sheet 2. Subsequently, the rotating shaft 40 is lifted by the vertical drive means (not shown) to return to the original position.

Next, the rotary shaft 40 is rotated 180 degrees by a rotary drive means (not shown). As a result, as shown in FIG. 2, the die 3 vacuum-sucked and held by the suction nozzle 21 is reversed and moved to the delivery position facing the waiting bonding nozzle 12. Next, the bonding nozzle 12
Is driven by an up-and-down driving means (not shown) to descend and move to the die 3
When it comes close to, the solenoid valve for the bonding nozzle (not shown) is opened, and the supply of vacuum to the suction hole 12a of the bonding nozzle 12 is started. Further, the electromagnetic valve for the suction nozzle (not shown) is closed to stop the vacuum supply to the suction hole (not shown) of the suction nozzle 21, the bonding nozzle 12 is pressed against the die 3, and the die 3 is moved from the suction nozzle 21 to the bonding nozzle 1.
Handed over to 2.

As described above, the bonding nozzle 12
The static load when pressing against the die 3 is as follows. Since the urging force F of the pickup load spring 33 acts as a force for pulling up the suction nozzle 21, the load is a positive load on the die 3. Suction nozzle unit (Suction nozzle 2
1, nozzle shaft 22, nozzle holder 23, contact rod 27, etc.)
Since the weight W1 of the above works downward, it becomes a load on the die 3. Weight W2 with which the balancer 41 acts on the action shaft 42
Acts so as to push the working shaft 42 and the nozzle holder 23 upward, so that a positive load is applied to the die 3. That is, the static load on the die 3 is "F-W1 + W2", that is, "F-W1 + W2".
-(W1-W2) ".

In this way, the suction nozzle 21 is reversed (18
When the die 3 sucked and gripped by the suction nozzle 21 is handed over to the bonding nozzle 12 while being rotated upward by 0 degree),
Suction nozzle unit (suction nozzle 21, nozzle shaft 22,
The weight W1 of the nozzle holder 23, the contact rod 27, etc.) acts downward and becomes a load weight, but the weight W2 of the balancer 41 acting on the action shaft 42 acts upward as a positive load, so that the suction nozzle 21 and the suction nozzle unit It acts so as to reduce the load weight W1. As described above, since W2 is set so that W2 = W1, the static load of the biasing force F of the pickup load spring 33, for example, about 30 gf is applied to the suction nozzle 21. .

As described above, the bonding nozzle 12
When the die 3 is handed over to the substrate, the bonding nozzle 12 rises and is subsequently driven by an XY table (not shown) to move above the positioned substrate 10. Next, the bonding nozzle 12 descends and the die 10 is attached to the substrate 10.
To bond. After bonding, the solenoid valve for the bonding nozzle (not shown) is closed and the bonding nozzle 1
The vacuum supply to the second suction hole 12a is stopped, and the bonding nozzle 12 moves in the opposite direction to the state shown in FIG.

In this way, the suction nozzle 21 faces downward,
When the suction nozzle 21 receives the die 3 from the wafer sheet 2, the weight W1 of the suction nozzle unit (suction nozzle 21, nozzle shaft 22, nozzle holder 23, contact rod 27, etc.)
Acts as a positive load for pressing the die 3, but the weight W2 acting on the action shaft 42 by the balancer 41 acts so as to reduce the weight W1 of the suction nozzle unit, and the die 3 receives a static load of, for example, about 30 gf. Join.

When the suction nozzle 21 is turned upside down (rotated by 180 degrees) and the die 3 held by the suction nozzle 21 is handed over to the bonding nozzle 12, the suction nozzle unit (suction nozzle 21, nozzle shaft 22). , The weight W1 of the nozzle holder 23, the contact rod 27, etc.) acts downward and becomes a load weight, but the weight W2 acting on the action shaft 42 by the balancer 41 acts upward as a positive load, and the suction nozzle 21 and the suction nozzle unit. When the die 3 is transferred to the bonding nozzle 12, a static load of, for example, about 30 gf is applied to the die 3 when the die 3 is transferred to the bonding nozzle 12.

That is, even when the suction nozzle 21 receives the die 3 and when the die 3 is turned over by 180 degrees, a constant load is always applied to the die 3 and the die 3 is not damaged.

In each of the above-described embodiments, the case where the die 3 arranged on the wafer sheet 2 with the bumps facing the upper surface is picked up by the suction nozzle 21 and suction-held is described. However, the die 3 is arranged on the tray. It goes without saying that the present invention can also be applied to the case where the die 3 thus picked up is picked up by the suction nozzle 21 and held by suction.

In addition, in each of the above-described embodiments, the support rod 26 and the contact rod 27 are also used for touch detection, but touch detection may be performed by another non-contact type means. For example, the sensor is attached to one of the nozzle holder 23 or the frame 30 so as to face the other. That is, since the suction nozzle 21 comes into contact with the die 3 and the lowering of the suction nozzle 21 is stopped, and the frame 30 lowers with respect to the nozzle holder 23, the sensor and the surface facing the sensor are changed. The change may be detected by a sensor.

[0030]

According to the die reversing device of the present invention, a suction nozzle for sucking and holding a die, a nozzle holder for holding the suction nozzle, and a pickup load biasing means for biasing the nozzle holder toward the suction nozzle. And a balancer that applies an upward load to the suction nozzle and the suction nozzle unit that moves up and down together with the suction nozzle even when the suction nozzle faces downward and upward. A nearly constant load is applied to the die when it is delivered.

[Brief description of drawings]

FIG. 1 is a front view of a flip-chip bonding apparatus according to an embodiment of the present invention before receiving a die.

FIG. 2 is a front view showing a state in which a suction nozzle that has received a die has rotated 180 degrees.

FIG. 3 is a perspective view of a die reversing device.

FIG. 4 is a front view of a die reversing device.

FIG. 5 is a plan view of FIG.

6 is a cross-sectional view taken along the line AA of FIG.

[Explanation of symbols]

2 wafer sheet 3 dies 10 substrates 12 Bonding nozzle 20 Die reversing device 21 Suction nozzle 23 Nozzle holder 24 Vertical motion bearing 26 Support rod 27 contact rod 30 frame 33 Spring for pickup load 40 rotation axis 41 Balancer 42 Working axis

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 311

Claims (3)

(57) [Claims] 1. A die arranged on a wafer sheet or tray with bumps directed to the upper surface is picked up and held by suction, and is rotated 180 degrees to turn the upper surface and the lower surface of the die to a transfer position of the die. In a flip chip bonding apparatus equipped with a die reversing device for moving, the die reversing device attaches a suction nozzle for sucking and holding a die, a nozzle holder for holding the suction nozzle, and the nozzle holder in the direction of the suction nozzle. And a balancer for applying an upward load to the suction nozzle and the suction nozzle unit that moves up and down together with the suction nozzle even when the suction nozzle is directed downward and upward. Flip chip bonding equipment. 2. A die arranged on a wafer sheet or tray with bumps directed to the upper surface is picked up and held by suction, and is rotated 180 degrees so that the upper surface and the lower surface of the die are inverted to the transfer position of the die. In a flip chip bonding apparatus having a moving die reversing device, the die reversing device, a suction nozzle for sucking and holding a die, a nozzle holder for holding the suction nozzle, and the suction nozzle is provided so as to be vertically movable, A frame body that supports the suction nozzle so that the suction nozzle follows and descends when the suction nozzle faces downward; and a drive unit that drives the frame body up and down and rotates.
A pickup load urging means for urging the nozzle holder toward the suction nozzle, and an upward load on the suction nozzle and a suction nozzle unit that moves up and down together with the suction nozzle even when the suction nozzle faces downward and upward. And a balancer for adding a flip chip bonding device. 3. The nozzle holder is provided with an action shaft on which the weight of the balancer acts, so that the weight of the balancer acts on the action shaft upward even when the suction nozzle faces downward and upward. The flip-chip bonding apparatus according to claim 2, wherein the balancer is rotatably provided on the frame body.