JP3513446B2 - Taping device and taping method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention inserts a chip component into a storage groove in a storage tape wound around a tape reel,
The present invention relates to a taping device and a taping method in which a cover tape closes an opening on the upper surface of a storage groove, and more particularly to stabilization of tape transportation after a chip component is inserted into the storage groove.

[0002]

2. Description of the Related Art A conventional taping device and taping method will be described below.

Conventionally, one chip-shaped electronic component (hereinafter referred to as a "chip-shaped electronic component") is stored in each storage groove in a storage tape wound around a tape reel.
It is called a chip part. ) Is inserted, the operation of conveying the storage tape for one pitch is repeated a plurality of times, and the opening of the storage groove upper surface of the storage tape in which the chip components that have been conveyed to a predetermined position are inserted is covered with a cover tape. The chip component was taped by closing it.

Here, in order to reduce the taping time, the present inventor repeats the work of inserting the chip parts into the plurality of storage grooves a plurality of times, and then collects the storage tapes at a predetermined pitch by the tape feeding mechanism. We have developed a technology for transporting downstream. As a result, the time required for tape feeding can be shortened as compared with the method in which the chip components are inserted into the storage groove one by one as described above and the tape body is conveyed one pitch downstream each time. It has made it possible to shorten the taping time.

[0005]

However, the above-described taping device and taping method have a risk of causing the problems described below.

That is, when the tape is conveyed after the chip component is inserted into the storage groove, there is a concern that the chip component in the storage groove may pop out. In other words, a cover is provided on the upper surface of the storage tape in the transport path for the purpose of guiding the tape during transport and preventing the parts from jumping out. For example, an opening is formed in the cover only at the insertion work position of the parts. Different configurations are widely adopted. Then, as described above, when one chip component is inserted into the storage groove and the tape is conveyed each time, there is no problem in the above configuration, but a plurality of chip components are inserted and conveyed collectively. in case of,
A wide opening corresponding to a storage groove for inserting a plurality of chip components is required in the cover.

Therefore, vibration (braking) at the time of starting and stopping the tape transport causes a problem that the chip component in the storage groove pops out.

[0008]

Therefore, the taping device and taping method of the present invention have been made in view of the above problems. As shown in FIG. 4, a chip nozzle in a component housing portion is provided by a suction nozzle 19 of a component insertion mechanism 15. After sequentially removing 17 and inserting the chip components 17 into the plurality of storage grooves 3B of the tape body 3A a plurality of times based on the recognition result by the recognition camera 26 at the component insertion station as shown in FIG. As shown in FIG. 6, while the shutter 30 closes the openings on the upper surfaces of the plurality of storage grooves 3B at the component insertion station, the tape feeding mechanism conveys the tape body 3A downstream by a predetermined pitch, so that the tape can be stored at the time of conveyance. The protrusion of the chip component 17 from the groove 3B is suppressed.

Further, since the recognition camera 26 previously recognizes the standby positions of the plurality of storage grooves 3B into which the chip parts 17 are to be inserted, the workability of insertion is improved.

Further, since the tape holding mechanism 29 for restricting the position of the tape body 3A during the insertion work is provided outside the recognition area of the plurality of storage grooves 3B by the recognition camera 26, the insertion workability is improved.

Further, since the shutter 30 is interlocked with the Y movement of the component insertion mechanism 15, the workability is good.
Furthermore, the uncertain insertion form due to static electricity, vibration, catching, etc. at the time of insertion can be stabilized by operating the shutter 30 while moving the suction nozzle 19.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a taping device and a taping method of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a taping device to which the present invention is applied. Reference numeral 1 is a taping device main body, and a tape reel 2 is rotatably locked to a pin 2A provided on a side wall of the main body 1. The tip of the tape body (also referred to as a carrier tape) 3A wound around the tape reel 2 has pulleys 4, 5, 6, 7, 8, for applying appropriate tension to the tape body 3A. It is fixed to the take-up reel 12 via 9, 10 and the transport rail 11. Then, the take-up reel 12 by a rotation drive system (not shown)
While the tape main body 3A is sequentially conveyed by a predetermined amount in accordance with the rotation of the tape (wound by the take-up reel 12), a chip component is inserted into the storage groove 3B of the tape main body 3A and further conveyed to a predetermined position. The cover tape 3 is supplied from the cover tape supply reel 13 through the opening on the upper surface of the storage groove 3B.
After being coated with C, it is wound on the winding reel 12. As described above, the tape 3 is formed by the tape main body 3A, the storage groove 3B provided in the tape main body 3B (see FIG. 3 and the like), and the cover tape 3C pressure-bonded to the upper surface thereof.

FIG. 2 is a partially enlarged view of FIG. 1, showing various work steps performed by the taping device in order from the right on the paper surface of FIG. That is, from the right, the parts are inserted into the housing groove 3B of the tape body 3A by the parts insertion mechanism 15, the parts are inspected by the parts inspection mechanism 35, and the tape body 3A and the cover tape 3C are crimped by the tape crimping mechanism 50. The chip component 17 which is a target in various working processes is painted black for convenience.

Reference numeral 15 denotes a component insertion mechanism for inserting a chip component into the storage groove 3B of the tape body 3A, which will be described below with reference to plan views (FIG. 3) and side views (FIGS. 4 to 6). While explaining.

(I) is a component suction station, in which the chip components 17 in the component storage unit 16 are sequentially sucked and taken out by the suction nozzles 19 provided on the back surface of the rotary disk 18 of the component insertion mechanism 15, and the suction nozzles concerned. The chip component 17 adsorbed by 19 is conveyed to the next station in accordance with the rotation of the turntable 18. In the component storage unit 16, a wafer having a dicing tape attached to the mounting table 20 is diced and divided into individual chip components 17, and mounted on the mounting table 20. While being pushed up by 21, the suction nozzle 19 sucks and takes out. Reference numeral 22 is an XY table which positions the desired chip component 17 above the push-up pin 21 by moving the mounting table 20 in the XY direction. Also, 23
Is a recognition camera for recognizing the chip component 17 on the wafer.

(II) is a component recognition station, which recognizes the attitude of the chip component 17 by a recognition camera 25 prepared below the chip component 17 in a state of being sucked by the suction nozzle 19. At this time, in the previous component suction station, another suction nozzle 19 that has reached this station.
As a result, the chip components 17 in the wafer are picked up by suction.

(III) is a component insertion station, which is a storage groove 3 of the tape main body 3A on the transport rail 11 on which the chip component 17 sucked by the suction nozzle 19 is waiting below.
Insert in B. The chip component 17 is inserted into the storage groove 3B with its back surface facing upward so that the component inspection mechanism 35 described later can easily inspect it. Further, although not shown, a cover is provided on the upper surface of the tape main body 3A placed on the transport rail 11 for guiding the tape at the time of transport and for preventing the components from jumping out. A predetermined area is provided on the cover only at the inspection work position (in this embodiment, since the six chip parts 17 are considered as one unit, the area where the storage grooves 3B for six pieces are exposed).
Has an opening. Incidentally, the reason why the above-mentioned one unit is six chip parts 17 is based on the recognition camera 2 described later.
Because the number of storage grooves 3B recognized by 6 is 6,
Therefore, in implementing the present invention, the number is not limited to the above six values, and the number can be set as appropriate according to the size of the recognition area (field of view) area of the recognition camera 26. As a result, the time required for the tape feeding by the tape feeding mechanism described later can be set appropriately.

Here, first, the position of the storage groove 3B is recognized by the recognition camera 26, and the recognition result and the recognition result of the component attitude at the previous component recognition station (II) are taken into consideration, and the turntable 18 is considered. Arm 2 with attached
7 constitutes an XY table 28. X tables 28A, Y
The table 28B moves XY. Therefore, the chip component 17 is properly inserted into the storage groove 3B.

Further, 29 is a suction nozzle 19 after the recognition.
Is a vertically movable tape holding mechanism for holding the tape body 3A so that the position of the storage groove 3B does not change due to contact with the tape body 3A during insertion of the tape, mechanical vibration, etc. Of the tape holding plate is arranged, and the tape holding plate comes into contact with the upper surface of the tape body 3A by pressing the tape body 3A by the downward movement of the rod portion of the cylinder.

Further, 30 is a shutter for closing the opening on the upper surface of the storage groove 3B after the chip component 17 is inserted into the storage groove 3B, and is interlocked with the Y movement of the XY table 28 by the Y table 28B. After inserting the chip component 17 into the storage groove 3B,
When the turntable 18 moves to the left side on the paper surface of FIG. 6 due to the Y movement of the Y table 28B, the shutter 30 is also Y moved to close the shutter 30 (FIG. 4 shows the chip component 17 in the storage groove 3B). 5 is a state immediately before the insertion of the chip component 17 into the storage groove 3B, and FIG. 6 is a state after the chip component 17 is inserted into the storage groove 3B.
9 and the chip component 17 are separated from each other, and the opening of the upper surface of the storage groove 3B is closed by the shutter 30. ).

In the present invention, the component insertion mechanism 15 (the suction nozzle 19 and the shutter 30 can be interlocked (both fixed to the XY table 28 and interlocked with movement in the Y direction)). Therefore, when the chip component 17 is inserted into the storage groove 3B as shown in FIG.
When the table 28B moves in the Y direction, the suction nozzle 19 leaves the chip component 17 in the storage groove 3B, and the opening of the upper surface of the storage groove 3B is closed by the shutter 30. Since it can be controlled only by the Y movement of the Y table 28B, the workability is good. Further, when the chip component 17 is inserted into the storage groove 3B, an uncertain insertion form due to static electricity, vibration, catching or the like can be stably inserted by operating the shutter 30 while moving the suction nozzle 19. It will be possible.

Further, in the present invention, the recognition camera 26 recognizes the positions of a plurality (six in this embodiment) of the storage grooves 3B at once, and the chip parts 17 are sequentially inserted into the storage grooves 3B. I am letting you. By adopting a method in which a plurality of such tapes are inserted and the tape main body 3A is conveyed downstream by 6 pitches by the tape feed mechanism, for example, one chip component 17 is inserted into the storage groove 3B, and the tape feed mechanism is conventionally used. As a result, the working time as a whole can be shortened as compared with the case where the tape main body 3A is conveyed downstream by one pitch and the above operation is repeated again. That is, for example, tape 1
With pitch feed, the time required for the feed is approximately 0.2.
If it is seconds, this will be repeated 6 times, so conventionally it will take about 1.2 seconds in total,
In contrast, in the tape 6 pitch feed of the present invention, the conveyance can be completed in about 0.4 seconds (since the insertion time of the chip component 17 is the same, the difference is only the conveyance time).

[0024] Furthermore, at the start of tape transport,
The vibration (braking) at the time of stop causes a problem such as popping out of the chip component 17 in the storage groove 3B.
In the present invention, one tape feed pitch becomes long, and the number of times of feeding as a whole is reduced. Therefore, the influence of vibration is reduced accordingly, and the feeding operation can be stabilized as compared with the conventional one-pitch feeding.

Reference numeral 35 denotes a component inspection mechanism for inspecting a chip component inserted in the storage groove 3B of the tape body 3A. The component inspection mechanism will be described below in plan view (FIG. 7) and side view (FIG. 8). Through FIG. 10).

In FIGS. 2 and 7, reference numeral 36 denotes a recognition camera prepared above the chip component 17 inserted in the storage groove 3B, and the chip camera 1 in the storage groove 3B.
The posture of No. 7 is recognized (in FIG. 7, only the recognition area is indicated by a chain double-dashed line).

In FIG. 8, 37 is an inspection unit having a probe needle on the lower surface, and the arm 3 to which the inspection unit 37 is fixed.
8 can move up and down along the guide 39, and the up-and-down moving mechanism 40 is mounted on the XY table 41. Therefore,
The inspecting unit 37 moves by XYZ (up and down) to come into contact with the chip component 17 inserted into the storage groove 3B to inspect (FIG. 8 shows the chip inserted into the storage groove 3B. 9 shows a state in which the component 17 has been conveyed to the inspection position (at this point, the upper surface of the chip component 17 before the inspection is blocked by the shutter 47 described later).
10 is moved by Y to expose the chip component 17 in the storage groove 3B, and FIG. 17 shows the state of being in contact with 17 and inspecting. ). In the inspection work, since the inspection unit 37 inspects the six chip components 17 at a time, the storage groove 3B for six pieces is exposed on the cover similarly to the insertion work position described above. An opening is bored.

Reference numeral 42 denotes a component position restricting mechanism for preventing the chip component 17 inserted in the housing groove 3B from being displaced when the component is inspected by the inspecting section 37, which is a component retainer for retaining the six chip components 17. The plate 43 is attached to the vertical movement mechanism 44, and the vertical movement mechanism 44 is placed on the XY table 45.
-Y-Z movable.

A shutter 47 for closing the upper surface of the chip component 17 before the inspection by the inspection unit 37 is provided on the transport rail 11 so as to be movable in the Y direction along the Y movement guide 48.

As described above, according to the present invention, the chip component 17 is inserted into the storage groove 3B of the tape body 3A, and the electrical characteristics of the chip component 17 are inspected while being inserted into the storage groove 3B during the transportation. Therefore, before inserting the component into the storage groove as in the past, once place the chip component on the workbench, inspect it at that location and store it by adsorbing the chip component again with the suction nozzle. It is possible to avoid the occurrence of a defective component due to an impact at the time of suction applied after the inspection, such as a case where a component is inserted into the groove, and it is possible to prevent the problem that a defective product is mixed in the tape. Furthermore, by inserting the chip component 17 into the storage groove 3B with the back surface thereof facing upward, the component inspection mechanism 35 can easily perform the inspection and the workability is improved.

The component inspection by the component inspection mechanism 35 is performed after the chip component 17 is inserted into the storage groove 3B.
Since it suffices to perform it at one place on the transport path until the tape main body 3A and the cover tape 3C are pressure-bonded by the tape pressure-bonding mechanism 50, which will be described later, it is relatively easy to secure the installation place in the device.

Finally, 50 is a vertically movable tape crimping mechanism which inserts the chip component 17 into the storage groove 3B and crimps the tape main body 3A and the cover tape 3C, which have been inspected for the chip component 17. , Taping is completed.

Then, the tape 3 for which taping has been completed is successively wound on the take-up reel 12.

[0034]

According to the present invention, sequentially taken out chip components in component housing by the suction nozzle of the component insertion mechanism, parts
After repeating the insertion work of the chip component into the plurality of storage grooves at the product insertion station a plurality of times, the shutter is closed at the component insertion station by the shutter mechanism to close the openings of the storage grooves. Since it is possible to prevent the chip component from jumping out of the groove, and the shutter mechanism is interlocked with the movement of the component insertion mechanism in the predetermined direction,
Good workability. Further, since the standby positions of the plurality of storage grooves into which the chip components are to be inserted are recognized in advance by the recognition mechanism, the workability of insertion is improved. Further, since the tape position regulation mechanism for regulating the storage tape during the insertion work of the chip component is provided outside the recognition area of the plurality of storage grooves by the recognition mechanism, the insertion workability is further improved.

[Brief description of drawings]

FIG. 1 is a front view showing a taping device according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of FIG.

FIG. 3 is a plan view for explaining a component insertion mechanism.

FIG. 4 is a side view for explaining the component insertion mechanism.

FIG. 5 is a side view for explaining the component insertion mechanism.

FIG. 6 is a side view for explaining the component insertion mechanism.

FIG. 7 is a plan view for explaining the component inspection mechanism.

FIG. 8 is a side view for explaining the component inspection mechanism.

FIG. 9 is a side view for explaining the component inspection mechanism.

FIG. 10 is a side view for explaining the component inspection mechanism.

[Explanation of symbols]

1 Taping device body 2 tape reel 3 tapes 12 take-up reel 15 Parts insertion mechanism 17 Chip parts 19 Suction nozzle 26 recognition camera 30 shutters 35 Parts inspection mechanism 50 tape crimping mechanism

─────────────────────────────────────────────────── ───Continued from the front page (56) References JP-A-5-16909 (JP, A) JP-A-10-107482 (JP, A) Actual development Sho-62-127909 (JP, U) (58) Field (Int.Cl. ⁷ , DB name) B65B 35/38 B65B 35/30

Claims (6)

(57) [Claims] 1. A taping device in which a chip component is inserted into a storage groove inside a storage tape wound around a tape reel, and an opening on the upper surface of the storage groove is closed by a cover tape. Components are sequentially taken out and inserted into the storage groove in the storage tape at the component insertion station, and the operation of inserting the chip component into the storage groove by the component insertion mechanism is repeated a plurality of times for a plurality of storage grooves. A shutter mechanism that closes the openings on the upper surface of the plurality of storage grooves at the component insertion station after being opened, and conveys the storage tape by a predetermined amount while closing the openings on the upper surface of the plurality of storage grooves by the shutter mechanism. A taping device comprising a tape feeding mechanism. 2. The taping device according to claim 1, further comprising a recognition mechanism that recognizes standby positions of a plurality of storage grooves into which chip components are inserted by the component insertion mechanism. 3. The taping according to claim 2, further comprising a tape position restricting mechanism that restricts the accommodating tape during the inserting operation, outside the recognition area of the plurality of accommodating grooves by the recognizing mechanism. apparatus. 4. The taping device according to claim 1, wherein the shutter mechanism is configured to interlock with movement of the component insertion mechanism in a predetermined direction. 5. A taping method in which a chip component is inserted into a storage groove in a storage tape wound around a tape reel and a cover tape closes an opening on the upper surface of the storage groove.
The step of sequentially picking out the chip components in the component storage unit by the component insertion mechanism and inserting the chip components in the storage groove in the storage tape at the component insertion station , and the operation of inserting the chip components in the plurality of storage grooves were repeated a plurality of times. Later, the component insertion stay
And a tape feeding mechanism conveys a predetermined amount of the storage tape while the openings of the upper surfaces of the plurality of storage grooves are closed by a shutter mechanism. 6. The taping method according to claim 5, wherein the standby position of the plurality of storage grooves is recognized by the recognition mechanism before the chip component is inserted by the component insertion mechanism.