JP4460040B2 - Taping device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a taping device in which a chip component is loaded in a storage groove in a storage tape, and an opening on the upper surface of the storage groove is closed with a cover tape.
[0002]
[Prior art]
Chip components are sequentially loaded into the storage grooves in the storage tape by the taping device. However, there are not enough chip components to be loaded in the middle of the loading, or production of the storage tape for the chip components in the middle is not in time. In some cases, the type of the chip part is inevitably changed and another type of chip part is loaded.
[0003]
[Problems to be solved by the invention]
For this reason, a storage tape loaded with a certain amount of chip components may be used, but a storage tape loaded with an odd number of chip components is produced.
[0004]
Therefore, the present invention has an object of taking out a chip part from a storage tape loaded with an odd number of chip parts and transferring it to another storage tape to create a storage tape loaded with a certain amount of chip parts. To do.
[0005]
[Means for Solving the Problems]
For this reason, the first invention is a taping device in which a chip part is loaded in a storage groove in a storage tape, and the opening on the upper surface of the storage groove is closed with a cover tape, and is stored in the storage groove in the storage tape. A chip part is picked up and taken out from above at the lower end of the suction pick-up nozzle, and after picking up, the pick-up nozzle is turned upside down so that the picked-up chip part faces upward, and a rotary table that rotates intermittently by driving the index unit. A plurality of mounting / adsorption nozzles of the mounting head arranged on the peripheral edge of the storage unit receive a chip part from above the suction / extraction nozzle of the extraction device at the absorption station, and a storage groove in the storage tape is wound around the tape reel at the connection / loading station. A component loading device for loading a chip component on the chip, and a chip portion in the storage groove of the storage tape by the component loading device. There characterized in that it consists of a tape feeding device for closing with a cover tape opening of the receiving groove top loaded.
[0006]
According to a second aspect of the present invention, there is provided a component inspection device for inspecting a chip component loaded in the storage groove by the component loading device.
[0007]
Further, the third invention is characterized in that a drive device is provided for rotating the mounting head 180 degrees while the mounting head reaches the loading station from the suction station.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a taping device of the present invention will be described with reference to the drawings. First, the tape feeder will be described based on the front view of the taping device shown in FIG. Reference numeral 1 denotes a taping device main body. A tape reel 2 is rotatably locked to a pin 2 </ b> A erected on a side wall portion of the main body 1, and a tape main body (also called a carrier tape) wound around the tape reel 2. .) The tip of 3A is fixed to the take-up reel 12 via pulleys 4, 5, 6, 7, 8, 9, 10 and a transport rail 11 for applying appropriate tension to the tape body 3A.
[0009]
Then, while the tape main body 3A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up reel 12 by a rotation drive system (not shown) (taken on the take-up reel 12), the storage groove 3B of the tape main body 3A. The chip component is inserted into the inside, and further conveyed to a predetermined position. The opening on the upper surface of the storage groove 3B is covered with the cover tape 3C supplied from the cover tape supply reel 13, and then wound on the take-up reel 12. Go. As described above, the tape 3 is formed by the tape main body 3A, the storage groove 3B provided in the tape main body 3A, and the cover tape (top tape) 3C that is pressure-bonded to the upper surface of the tape main body 3A. It is formed with a tape and a spacer.
[0010]
FIG. 2 is a partially enlarged view of FIG. 1, and shows various work steps performed by the taping device in order from the right on the paper surface of FIG. That is, from the right, a component insertion process into the storage groove 3B of the tape body 3A by the component loading device 15, a component inspection process by the component inspection mechanism 35, and a pressure bonding process between the tape body 3A and the cover tape 3C by the tape crimping mechanism 50 are performed. The chip parts (for example, leadless transistors) 17 to be used in various work processes are blacked out for convenience.
[0011]
Next, the component loading device 15 that is also a component extraction device will be described below with reference to FIGS.
[0012]
(I) is a component suction (removal) station, and the chip component 17 that is suctioned upward by the suction nozzle 41 of the take-out device 40, which will be described later, is turned upside down. A plurality of suction loading nozzles 19 provided on a mounting head 16 disposed on the back surface of the board 18 are sequentially picked up and picked up by the suction loading nozzles 19 through an index unit by a drive motor (not shown). It is conveyed to the next station in accordance with the rotation of the turntable 18. The suction loading nozzle 19 is provided on the mounting head 16 and the driving pulley 21 connected to the θ rotation motor 20 as a result of the mounting head 16 being guided by the guide 14 by a drive motor (not shown) so that it can move up and down. A transmission belt 23 is stretched between the driven pulley 22 and can be rotated around a vertical line.
[0013]
(II) is a component recognition station that recognizes the posture of the chip component 17 by a first recognition camera (not shown) prepared below the chip component 17 in a state of being sucked by the suction loading nozzle 19.
[0014]
(III) is a component insertion station that inserts and loads the chip component 17 sucked by the suction loading nozzle 19 into the storage groove 3B of the tape main body 3A on the transport rail 11 waiting below. The chip component 17 is inserted into the storage groove 3B with its back surface facing upward so that it can be easily inspected by a component inspection mechanism 35 to be described later. The surface will be facing up. Further, although not shown, a cover is provided on the upper surface of the tape main body 3A placed on the transport rail 11 for the purpose of guiding during transport and preventing the parts from popping out. Therefore, an opening having a predetermined width is formed in the cover (in this embodiment, since six chip components 17 are considered as one unit, an opening in which six storage grooves 3B are exposed). The one unit described above is made up of six chip parts 17 because the number of the storage grooves 3B recognized by the second recognition camera (not shown) is six, and therefore the recognition area of the second recognition camera. The number can be set as appropriate according to the size of the (view) region.
[0015]
Here, the position of the storage groove 3B is first recognized by the second recognition camera, the recognition result and the recognition result of the component posture at the previous component recognition station (II) are taken into account, and the turntable 18 is attached. The arm 24 thus moved is moved XY by the X table 26 and the Y table 27 constituting the XY table 25.
[0016]
That is, when the screw shaft 27B is rotated by driving the Y-axis motor 27A, the slider 27C moves along the guide 27D fixed to the apparatus main body 1, and the Y table 27 moves in the Y direction. When the screw shaft 26B rotates by driving, the slider 26C moves along the guide 26D fixed to the Y table 27A, and the X table 26 moves in the Y direction, and is fixed to the arm 24 fixed to the X table 26. The rotated disk 18 is moved XY. Accordingly, the chip component 17 is inserted and loaded in an appropriate shape into the storage groove 3B.
[0017]
Reference numeral 29 denotes a tape press capable of moving up and down to hold the tape body 3A so that the position of the storage groove 3B does not fluctuate due to contact with the tape body 3A or mechanical vibration when the suction loading nozzle 19 is inserted after the recognition. In the mechanism, a pair of tape pressing plates are arranged outside the recognition area of the second recognition camera. For example, the tape pressing plate abuts against the upper surface of the tape main body 3A by the downward movement of the rod portion of the cylinder. Press 3A.
[0018]
Further, 30 is a shutter for closing the opening on the upper surface of the storage groove 3B after the chip component 17 is inserted into the storage groove 3B, and is interlocked with the Y movement by the Y table 27 of the XY table 25. After the chip part 17 is inserted into the storage groove 3B, the shutter 30 is also moved in the Y direction when the rotary table 18 moves up and down in FIG. 30 is closed.
[0019]
In the present invention, the suction loading nozzle 19 and the shutter 30 are configured to be interlocked (both are fixed to the XY table 25 and can be interlocked with respect to movement in the Y direction). When the Y table 27 moves Y while the chip component 17 is inserted into the housing, the suction loading nozzle 19 leaves the chip component 17 in the storage groove 3B and the opening on the upper surface of the storage groove 3B is opened by the shutter 30. Since these two operations can be controlled only by the Y movement of the Y table 27, the workability is good. Further, the uncertain insertion mode due to static electricity, vibration, catching, etc. when the chip component 17 is inserted into the storage groove 3B can be stably inserted by operating the shutter 30 while moving the suction loading nozzle 19. Is possible.
[0020]
Further, a plurality (six in this embodiment) of the storage grooves 3B are recognized at a time by the second recognition camera, and the chip components 17 are sequentially inserted into the storage grooves 3B. By adopting such a system in which a plurality of such tapes are inserted and the tape body 3A is conveyed downstream by 6 pitches by the tape feeding mechanism, for example, the chip parts 17 are inserted into the storage grooves 3B one by one, and the tape feeding mechanism The work time as a whole can be shortened as compared with the case where the main body 3A is transported downstream by one pitch and the above operation is repeated again (since the insertion time of the chip component 17 is the same, only the transport time is reduced). It will be a difference.)
[0021]
Reference numeral 35 denotes a component inspection mechanism for performing component inspection (for example, electrical characteristic inspection) on the chip component inserted into the storage groove 3B of the tape body 3A.
[0022]
In FIG. 2, reference numeral 36 denotes a third recognition camera prepared above the chip component 17 inserted in the storage groove 3B, and recognizes the posture of the chip component 17 in the storage groove 3B.
[0023]
Reference numeral 37 denotes an inspection unit having a probe needle on the lower surface, and moves by XYZ (up and down) to contact the chip component 17 inserted into the storage groove 3B for inspection. In the inspection work, since the six chip components 17 are inspected at a time by the inspection unit 37, the cover has a width that exposes the six storage grooves 3B in the same manner as the insertion work position described above. An opening is formed.
[0024]
Further, the component inspection by the component inspection mechanism 35 is in the course of the conveyance path from the time when the chip component 17 is inserted into the storage groove 3B until the tape main body 3A and the cover tape 3C are crimped by the tape crimping mechanism 50 described later. Since it suffices to perform it in one place, it is relatively easy to secure an installation place in the apparatus.
[0025]
50 is a tape crimping mechanism that can move up and down, and the chip component 17 is inserted into the storage groove 3B, and the tape body 3A and the cover tape 3C that have been inspected for the chip component 17 are crimped to complete the taping. It is. Then, the tape 3 for which taping has been completed is sequentially wound around the take-up reel 12.
[0026]
Next, the take-out device 40 will be described. The take-out device 40 picks up and takes out the chip component 17 housed in the storage groove 3B in the storage tape 3 from above at the lower end of the suction take-out nozzle 41, and after taking out, the suction take-out nozzle 41 is turned upside down to remove the suction component. The chip component 17 thus formed is directed upward.
[0027]
The premise will be described in detail below. First, chip components 17 are sequentially loaded into the storage grooves 3B in the tape main body 3A by the component loading device 15, but the chip components 17 to be loaded in the middle of the loading are insufficient. In other cases, the production of the storage tape 3 for other chip parts may not be in time, and the type of chip parts must be changed halfway and other types of chip parts may be loaded. The storage tape 3 loaded with a quantity of chip parts is produced. Therefore, in order to create a storage tape loaded with a certain amount of chip parts by taking out the chip parts from the storage tape loaded with a half quantity of chip parts and transferring it to another storage tape, A take-out device 40 for taking out the chip component 17 from the storage tape 3 loaded with the chip component is required.
[0028]
Contrary to the tape feeder, 42 is a tape supply device for sequentially peeling the cover tape 3C with a peeling device (not shown) from the storage groove 3B in which a half quantity of chip components 17 is loaded. The component loading device 15 The Y-axis motor 27A is fixed to a support member 43 for fixing the Y-axis motor 27A so as to be parallel to the tape feeder.
[0029]
Then, the screw shaft 46 rotated by the vertical drive motor 45 is driven, the nut body 47 moves along the guide 44 fixed to the support member 43, and the take-out device 40 moves up and down. Further, a reversing motor 48 is fixed to the nut body 47, and a transmission belt 52 is stretched between a driving pulley 49 fixed to the driving shaft and a driven pulley 51 provided on the support body 50, and a suction take-out nozzle. The reversing arm 53 having 41 is reversed 180 degrees with the reversing shaft 54 as a support shaft. Therefore, the chip component 17 stored in the storage groove 3B in the storage tape 3 loaded with a half quantity of chip components 17 is adsorbed from above by the lower end of the adsorption / extraction nozzle 41 lowered by the drive of the vertical drive motor 45. After the removal, the reversing motor 48 is driven to reverse the reversing arm 53 so that the chip component 17 adsorbed by the adsorption / extraction nozzle 41 can be directed upward.
[0030]
The operation will be described below with the above configuration. First, the tape supply device 42 removes the tape main body (upper tape in FIG. 3) one pitch at a time while removing the cover tape 3C sequentially from the storage groove 3B loaded with the chip component 17 of an odd quantity by the peeling device in FIG. Transport from right to left.
[0031]
Then, the chip component 17 is sucked and taken out from above by the lower end of the suction take-out nozzle 41 driven by the vertical drive motor 45, and after this take-off, the reversing motor 48 is driven to turn the reversing arm 53 around the reversing shaft 54 as a supporting shaft. The chip component 17 that is reversed and sucked by the suction and extraction nozzle 41 is directed upward, and the back surface side is facing upward.
[0032]
Then, the X-axis motor 26A and the Y-axis motor 27A are driven to move the XY table 25, the suction loading nozzle 19 is positioned above the component extraction position in the tape supply device 42, and the mounting head 16 is moved by a drive motor (not shown). The nozzle 19 is lowered by being lowered along the guide 14 and inherited from the suction take-out nozzle 41. The rotary disk 18 is intermittently rotated by the index unit, and the posture of the chip component 17 in the state of being sucked by the suction loading nozzle 19 is recognized by the first recognition camera at the component recognition station (II).
[0033]
The tape main body 3A (on the lower side in FIG. 3) on the conveyance rail 11 waiting for the chip component 17 adsorbed by the adsorption loading nozzle 19 at the component insertion station (III) due to the intermittent rotation of the rotating disk 18 further. The tape is inserted into the storage groove 3B, but is inserted into the storage groove 3B with the back surface facing upward so that the inspection by the component inspection mechanism 35 is easy. At this time, when the chip component 17 inherited in the component suction (takeout) station (I) reaches the component insertion station (III) as it is, the left and right sides are reversed with respect to the longitudinal direction of the storage tape 3. Since the transport direction of the tape to be taken out is the same as the transport direction of the tape into which the chip component is inserted and loaded, the tape is inserted at the component insertion station (III) while being sucked at the component suction (removal) station (I). Then, it is wound around the take-up reel 12.
[0034]
When the direction of transporting the tape from which the chip component is taken out is opposite to the direction of transporting the tape into which the chip component has been inserted and loaded, the tape is rotated by the θ rotation motor 20 around a vertical line of 180 degrees. It is also possible to reach the component insertion station (III) in the same state as the position at the station (I) and insert it into the take-up reel 12.
[0035]
In either case, the direction of the chip component when wound on the take-up reel can be made the same direction.
[0036]
The position of the storage groove 3B is recognized by the second recognition camera at the component insertion station (III), and the recognition result and the recognition result of the component posture at the previous component recognition station (II) are added. The arm 24 to which the turntable 18 is attached is moved XY by the X table 26 and the Y table 27 constituting the XY table 25, and the chip component 17 is inserted and loaded into the storage groove 3B in an appropriate form.
[0037]
Then, the component inspection mechanism 35 performs component inspection (for example, electrical property inspection) on the chip component inserted in the storage groove 3B of the tape body 3A, and the tape crimping mechanism 50 inspects the chip component 17. The tape main body 3A and the cover tape 3C that have been finished are pressed together to complete the taping. Then, the tape 3 on which taping has been completed is sequentially wound around the take-up reel 12 with the surface thereof facing up.
[0038]
【The invention's effect】
According to the present invention, it is possible to take out a chip component from a storage tape loaded with an odd number of chip components and transfer it to another storage tape to create a storage tape loaded with a certain amount of chip components. . According to the second aspect of the present invention, since the take-out device reverses the chip component, it is easy to inspect by the component inspection device for the chip component with the back surface facing upward. Further, according to the third aspect of the present invention, even when the transport direction of the tape from which the chip component is taken out is opposite to the transport direction of the tape into which the chip component is inserted and loaded, the chip component when wound on the take-up reel Can be made the same direction.
[Brief description of the drawings]
FIG. 1 is a front view showing a taping device.
FIG. 2 is a partially enlarged view of FIG.
FIG. 3 is a plan view showing a taping device.
FIG. 4 is a right side view showing the taping device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 3 Storage tape 3A Tape main body 3B Storage groove 3C Cover tape 15 Component loading apparatus 16 Mounting head 17 Chip component 18 Rotary disk 19 Adsorption loading nozzle 25 XY table 40 Extraction apparatus 41 Adsorption extraction nozzle 42 Tape supply apparatus 53 Reverse arm

Claims (3)

In a taping device in which chip parts are loaded in a storage groove in a storage tape and the opening on the upper surface of the storage groove is closed with a cover tape, the chip part stored in the storage groove in the storage tape is A plurality of devices are disposed around the periphery of the rotary table that rotates by intermittently driving the index unit and the picking device that picks up from the upper side and then reverses the suction and picking nozzle after picking up so that the picked-up chip component faces upward. The component loading in which the suction loading nozzle of the mounting head loads the chip component from the suction ejection nozzle of the take-out device at the suction station from the upper side and loads the chip component into the storage groove in the storage tape wound around the tape reel at the loading station. Device and the storage groove in which the chip component is loaded into the storage groove of the storage tape by the component loading device Taping apparatus characterized by comprising a tape feeding device for closing with a cover tape opening surface. 2. The taping device according to claim 1, further comprising a component inspection device for inspecting a chip component loaded in the storage groove by the component loading device. The taping device according to claim 1, further comprising a driving device that rotates the mounting head 180 degrees while the mounting head reaches the loading station.

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