JP3518566B2 - Manufacturing method of chip type electrolytic capacitor - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip-type electrolytic capacitor, and more specifically, to a chip-type electrolytic capacitor whose batch aging is performed to enhance the productivity as a whole. The present invention relates to a method for manufacturing an electrolytic capacitor.

[0002]

2. Description of the Related Art A chip-type electrolytic capacitor is a one-lead type (discrete type) aluminum electrolytic capacitor having a seat plate attached thereto, which enables surface mounting on a circuit board like other chip components. The conventional manufacturing process is as follows.

First, the polarity of a discrete type aluminum electrolytic capacitor is determined by the length of its lead terminals, and a predetermined voltage is applied between the lead terminals to perform a short circuit test. Then, for example, 30 pieces are attached to a jig, and aging is performed while applying a predetermined voltage in a constant temperature bath kept at a predetermined temperature. After aging, each lead terminal is pressed to form a flat strip, and after attaching a seat plate made of heat-resistant synthetic resin, each lead terminal is directed outwards along the bottom surface of the seat plate and is opposite to each other. Bend in the direction to make chips.

Next, characteristics such as leakage current, electrostatic capacity and tangent (tan δ) of loss angle are inspected, and product information such as electrostatic capacity, rating and polarity is printed for non-defective products. Since UV ink (ultraviolet curable ink) is usually used for this printing, the ink is dried by radiating ultraviolet rays from an ultraviolet lamp for a predetermined time after printing. Finally, it is wrapped (taping) in embossed tape.

[0005]

However, this has the following problems. First, a seat plate is attached after aging to form a chip, but when the lead terminal is bent, a load is applied to the internal capacitor element via the lead terminal, so that the leakage current characteristics in particular may change.

Although aging is performed by an automatic aging device, the aging of the capacitor is performed by feeding one product, and therefore the aging time normally required for loading and discharging the product is 40 minutes in view of the aging conditions. It takes ~ 1 hour. Therefore, during that time, the aging voltage of the automatic aging device cannot be changed, and therefore, when performing a lot change, there was a waiting time (loss time) of 40 minutes to 1 hour until all the previous products were discharged.

The present invention has been made in order to solve such a conventional problem, and an object of the present invention is to perform chip aging on a chip-type capacitor in a batch manner so that a chip type capacitor having stable characteristics can be obtained. It is an object of the present invention to provide a method for manufacturing a chip-type electrolytic capacitor that enables efficient production of capacitors.

[0008]

In order to achieve the above object, the invention of claim 1 is a chip type capacitor which is capable of surface mounting by attaching a seat plate made of heat resistant synthetic resin to a lead wire same direction type aluminum electrolytic capacitor. A chip forming step, and an aging preparation step of accommodating a plurality of the chip type capacitors in a pallet, covering the same pallet with an electrode plate, and preparing for aging so that each of the chip type capacitors can be energized from the outside. , The pallet is housed in a constant temperature layer kept at a predetermined temperature, and an aging step of applying a predetermined aging voltage to each of the chip-type capacitors via the electrode plate to perform aging; The process of taking out the chip-type capacitors from the above pallet, and then the chip And characterized by performing an inspection step of performing a characteristic test, such as leakage current for the type capacitor sequentially.

According to this, since aging is carried out after chip formation, a chip type electrolytic capacitor having stable leakage current (LC) characteristics can be obtained. Moreover, since a large number of capacitors are stored in the pallet, the production capacity in the aging process is significantly increased.

According to the second aspect of the present invention, the aluminum electrolytic capacitor is inspected for short circuit prior to the chip forming process. According to this, defective short circuits can be eliminated in advance and unnecessary chip formation can be omitted. Further, the third aspect is characterized in that the product information is printed on the chip type capacitor between the chip forming step and the aging preparation step. According to this, the printing ink can be dried by heat during aging.

According to the invention of claim 4, in the aging preparation step, the pallet is formed with a matrix of fitting holes into which the respective chip type capacitors are fitted with the polarities thereof aligned, and the fitting holes are formed by a vibration exciter. Each chip type capacitor is fitted in the fitting hole by applying vibration to the pallet. The vibrator may be a vibrator normally used in a ball feeder or the like, which allows the chip-type capacitors to be automatically loaded into the fitting holes without human intervention.

Further, according to the invention of claim 5, in the aging preparation step, the electrode plate is provided with a common electrode terminal for a predetermined number of the chip-type capacitors. Then, in the sixth aspect, the electrode terminal is made of conductive rubber. For example, if chip capacitors are arranged in a matrix of m rows × n columns on a pallet, the electrode terminals are arranged along the m rows or n columns, and preferably along the smaller number. .

The invention of claim 7 is characterized in that, in the step of taking out the capacitors, the chip type capacitors are successively taken out from the pallet in a line.
For that purpose, therefore, a U-shaped holder for holding the pallet having an open upper surface so as to cover the upper surface is prepared in the capacitor taking-out step.
After being inverted by 0 °, the pallet is pushed out of the holder at a predetermined pitch so that the chip capacitors are sequentially taken out in a single row from the pallet.

According to a ninth aspect of the present invention, the chip-type electrolytic capacitor is housed in the embossed tape after the above-described inspection process. By performing such a series of manufacturing processes, the productivity can be improved. Highly rational manufacturing process is established.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the manufacturing method of the present invention will be described in more detail with reference to the drawings. First, FIG. 1A shows a discrete type aluminum electrolytic capacitor 1 supplied from a work supply means (not shown).

This aluminum electrolytic capacitor 1 is provided with an aluminum outer case 2 in which a capacitor element is housed, and two lead terminals 3 are provided from the sealing portion.
a and 3b are pulled out. The lead terminals 3a and 3b have different lengths depending on their polarities. In this case, the longer lead terminal 3a is the anode and the shorter lead terminal 3b.
Is used as a cathode, and the polarity is determined based on this length.

After the polarity determination, a short circuit inspection is performed. That is, as shown in FIG. 1 (b), this short-circuit test is performed with a predetermined voltage E between the lead terminals 3a and 3b.
Is applied and the current flowing between them is read by the ammeter A.

Although not shown, the lead terminals 3a and 3b are pressed into a flat strip shape after the short-circuit inspection, and then the seat plate 4 is attached as shown in FIG. 1 (c). By doing so, the discrete type aluminum electrolytic capacitor 1 becomes the chip type capacitor 5.

The seat plate 4 is made of a molded product of heat-resistant synthetic resin, and a pair of lead insertion holes (not shown) are formed in the seat plate 4, and each of the bottom surfaces thereof communicates with the lead insertion holes. The lead guide grooves are formed so as to extend in the opposite directions from there. Further, a polarity discriminating unit 6 is provided at two adjacent corners of the seat plate 4 by obliquely cutting off the same corner,
For example, the one having the polarity discriminating portion 6 is the anode.

The seat plate 4 is attached to the sealing portion side of the outer case 2 of the discrete type aluminum electrolytic capacitor 1 by inserting the lead terminals 3a and 3b into the lead insertion holes, and then the lead terminals 3a and 3b are attached. The seat plates 4 are bent in the opposite directions toward the outside along the lead guide grooves formed on the bottom surface of the seat plate 4. As a result, the seat plate 4 is held with respect to the outer case,
It is a surface mountable chip component. In some cases, an adhesive material or a double-sided adhesive tape may be interposed between the outer case 2 and the seat plate 4.

Next, the chip type capacitor 5 is shown in FIG.
As shown in (d), product information 7 unique to the capacitor 5 is printed. The product information 7 includes, for example, the electrostatic capacity, the rating, and the polarity direction, and the printing is performed with, for example, UV ink (ultraviolet curable ink), and after the printing, the ink is dried by ultraviolet irradiation.

In this way, the chip type capacitor 5 is aged after the product information is made into chips and printed. In the present invention, the preparation step is prepared prior to the aging. In this preparation step, a pallet 10 as shown in FIG. 2 (a) is used. This pallet 10 has a frame body 10a on the periphery and is a box body having an open top surface, and a large number of fitting holes 11 into which the chip capacitors 5 are fitted are provided in the bottom portion.

In this example, 35 fitting holes 11 are provided in the vertical direction (row direction) and 25 fitting holes 11 in the horizontal direction (column direction), for a total of 875 fitting holes 11, as shown in FIGS. Shows a plan view and a sectional view of a part thereof, respectively. According to this, each fitting hole 11 has a hole main body 11a and a hole main body 11a which are fitted so that the chip type capacitor 5 is reversed (the outer case 2 is on the lower side and the seat plate 4 is on the upper side).
And a seat plate fitting portion 11b matching the shape of the seat plate 4 formed in a stepped shape on the upper edge side.

Returning to FIG. 2A, the pallet 10 is placed on the vibrator 20. In this case, as the vibrator 20, a vibrator applied to a normal ball feeder is used, and a large number of chip type capacitors 5 are provided in the pallet 10.
Then, the vibrator 20 is operated to operate the pallet 10
By applying a vibration to, the chip type capacitor 5 is fitted into each fitting hole 11 such that the polarity discriminating portion 6 of the seat plate 4 and the seat plate fitting portion 11b are aligned with each other.
The 75 chip capacitors 5 are arranged in the fitting holes 11 in the pallet 10 in an orderly manner with their polarities aligned.

If the fitting hole 11 cannot be completely filled in, the operator removes the fitting hole 11. If the fitting hole 11 has a vacancy, a chip type capacitor 5 is additionally inserted to fill the vacancy. You can do it like this. Further, in this example, the frame body 10a is separated from the pallet 10, and is arranged around the pallet 10 when the chip type capacitors 5 are charged and aligned, and then removed. However, it may be integrated with the pallet 10 as long as it has a height that does not hinder the attachment of the electrode plate 30 described later.

In this way, after the chip type capacitors 5 are arranged in the pallet 10 in an orderly manner with their polarities aligned,
The electrode plate 30 is covered on the open upper surface of the pallet 10. As shown in FIG. 4A and its side view (b), the chip type capacitors 5 are provided on the inner surface side (the surface facing the inside of the pallet 10) of the electrode plate 30.
Is provided with a plurality of electrode terminals 31 for supplying an aging voltage.

In this case, each electrode terminal 31 is the anode side terminal 3
1a and cathode side terminals 31b are arranged in parallel with the matrix arrangement of the pallet 10 for each row in the vertical direction. That is, when the pallet 10 is covered with the electrode plate 30, the anode-side terminals 31a are arranged along the corresponding rows of the chip capacitors 5.
Is commonly connected to the anode side lead terminal 3a of each of the chip type capacitors 5 and
Are commonly connected to the cathode side lead terminal 3b.

In this example, the anode side lead terminal 3a and the cathode side lead terminal 3b of each chip type capacitor 5 are oriented along the column direction (lateral direction) as shown in FIG. 4 (a). Therefore, the electrode terminals 31 are arranged in the row direction (vertical direction) orthogonal to the electrode terminals 31, but unlike this, the anode side lead terminals 3 of the chip capacitors 5 are different.
When a and the cathode side lead terminal 3b are oriented in the row direction (longitudinal direction), the electrode terminals 31 are arranged in the column direction (horizontal direction) orthogonal thereto.

Each anode side terminal 31a and cathode side terminal 31b
Are preferably made of strip-shaped conductive rubber. Then, each anode side terminal 31a is connected to the + side electrode of the DC aging power supply VE via the current limiting resistor 32,
On the other hand, each cathode side terminal 31b is connected to the-side electrode of the same aging power source VE. Also, the electrode plate 30
When the pallet 10 is covered with the pallet 10, the end portions of the anode side terminal 31a and the cathode side terminal 31b (for example, refer to the portion above the solid line 33 in FIG. 4A) are located outside the pallet 10, and the aging power source Acts as a contact terminal for VE.

As described above, the chip capacitors 5 are arranged in a matrix in the pallet 10 and the pallet 10 is formed.
After covering the electrode plate 30 with the electrode plate 30, as shown in FIG. 2 (c), the electrode plate 30 is fixed to the pallet 10 with the fasteners 40, and in this state, the pallet 10 is kept at a predetermined temperature. It is placed in a tank (aging tank) 50 (Fig. 2
(See (d)).

The aging tank 50 has an internal volume capable of accommodating the pallets 10 in multiple stages, and support rails 51a and 51b for supporting the pallets 10 are provided on both side surfaces of the inner wall thereof. For convenience of drawing, only a pair of support rails 51a and 51b is shown in FIG. 2D, but actually, the necessary number of steps is provided.

As shown in FIG. 5, a power supply terminal 52 is provided on one of the support rails 51a so as to be in contact with each anode side terminal 31a of the electrode plate 30. This power supply terminal 52 is preferably made of conductive rubber, and each anode side terminal 31
A convex contact 52a is formed in a portion corresponding to a, and a recess 52b between the contact 52a corresponds to each cathode side terminal 31b.

Therefore, the power supply terminal 52 contacts each anode side terminal 31a of the electrode plate 30 through each contactor 52a and does not contact the cathode side terminal 31b. The power supply terminal 52 is connected to the aging power source V via the current limiting resistor 32.
It is connected to the + side electrode of E.

Although not shown, the other support rail 5
A power supply terminal 52 similar to the above is also provided on 1b. However, on the support rail 51b side, the convex contact 52a is in contact with the cathode side terminal 31b, and the concave portion 52b between them corresponds to the anode side terminal 31a, so that the pitch is offset from the support rail 51a side. Has been done.

Therefore, the power supply terminal 52 on the side of the support rail 51b is connected to the electrode plate 30 via the respective contacts 52a.
Of each of the cathode side terminals 31b and not of the anode side terminals 31a. The power supply terminal 52 on the side of the support rail 51b is connected to the-side electrode of the aging power supply VE.

As can be seen from the above description, the pallet 1
0 is actually supported by the support rails 51a and 51b through the contact terminal portions on both sides of the electrode plate 30, and
The aging voltage is supplied via the power supply terminals 52, 52.

FIG. 6 shows an equivalent circuit at the time of aging. As compared with FIG. 5, the positions of the convex contact 52a, the anode side terminal 31a, and the cathode side terminal 31b are interchanged, but this is for the convenience of drawing and there is no substantial change. As shown in this equivalent circuit, a discharge circuit including a switch 53 is provided between the power supply terminal 52 on the support rail 51a side and the power supply terminal 52 on the support rail 51b side so as to bypass the aging power supply VE. It is connected.

The switch 53 is turned off during aging and turned on after the aging is completed. As a result, the electric charge accumulated in each chip type capacitor during aging is discharged, and the safety in the subsequent steps is ensured.

When the aging is completed in this way, the electrode plate 30 is removed from the pallet 10 and the chip type capacitor 5 is taken out from the pallet 10. As shown in FIG. 7, a holding tool 60 for the pallet 10 and a long belt conveyor 70 are prepared for this capacitor removal step.

In this example, the holder 60 is the pallet 1
It consists of a U-shaped frame that receives the pallet 10 so as to cover the upper surface of
It is reciprocally rotatable by 80 degrees. That is, the bottom surface side of the U-shape is horizontally supported by the rotating shaft 61 such as a motor, and in FIG. 7, the initial position where the opening end faces the left side, and the opening end faces the right side of the belt conveyor 70 side. It is reciprocally rotated 180 degrees with respect to the take-out position.

Further, as shown in FIG. 8, in relation to the holder 60, when the holder 60 is in the product take-out position, the pallet 10 held by the holder 60 is belted at a predetermined pitch. A pusher rod 62 that pushes out toward the conveyor 70 and a lift rod 63 that vertically moves the holder 60 itself are provided. As shown in FIG. 7, a hole 64 is formed on the bottom surface of the holder 60 so that the pusher rod 62 can be inserted into the holder 60.

When the holder 60 is in the initial position shown by the solid line in FIG. 7, the electrode plate 30 is removed and the pallet 10 is removed.
Is inserted into the holder 60 from its open end. next,
The holder 60 is rotated clockwise by 180 degrees and is set at the product take-out position on the belt conveyor 70 side as shown by the imaginary line in the figure. At this product unloading position, the pallet 10 is upside down.

Along with this, the pusher rod 62 arrives at the bottom surface side of the holder 60 from a retracted position (not shown), and the pallet 10 is pushed out from the holder 60 by one row onto the belt conveyor 70, for example. Next, the holder 60 is lifted by the lift rod 63 to a predetermined height (more than the axial length of the chip type capacitor).

As a result, the chip capacitors 5 for one row are discharged from the pallet 10 onto the belt conveyor 70. It should be noted that the other columns are not discharged from the pallet 10 because they are left in the holder 60. When one row of chip type capacitors 5 is carried by the belt conveyor 70 and is lost below the pallet 10, the lift rod 6
3, the holder 60 is lowered until the pallet 10 contacts the belt conveyor 70.

Then, the pallet 10 is again extruded by the pusher rod 62 so that the next row will be positioned on the belt conveyor 70. And the lift rod 6
The holder 60 is again lifted to a predetermined height by 3, and the next column of chip capacitors 5 is discharged onto the belt conveyor 70.

Thereafter, the lift rod 63 descends, the pusher rod 62 pushes out, the lift rod 63 rises,
When the lift rod 63 is repeatedly lowered to the last row of the pallet 10 and the discharge of all the chip type capacitors 5 is completed, the pallet 10 passes over the belt conveyor 70 and reaches the pallet receiver 65 arranged on the opposite side. Extruded.

Then, after the pusher rod 62 has moved to the retracted position (not shown), the holder 60 is returned to the initial position on the opposite side by 180 degrees, and is set in a waiting state for receiving the next pallet 10, and at the same time, receives the pallet. 65 is lowered by one stage of the pallet by the lift rod 66.

In this way, the chip capacitors 5 are discharged from the pallet 10 to the belt conveyor 70 in a state where they are arranged in a line, and are conveyed to the next inspection step by the conveyor 70 in the same manner. As shown in FIG. 9, in the inspection process, the chip-type capacitors 5 are transferred to the turntable 80 one by one and transferred to the product take-out position.

Meanwhile, the tangent (tan) of capacitance, leakage current characteristic and loss angle is measured by a measuring means (not shown).
δ) etc. are measured. Then, when it reaches the product take-out position, it is delivered to the selection table 81, and the ones judged to be defective are discharged to the defective product discharge portion 82, and the good products are stored one by one in the concave portion of the embossing tape 83, Finally taped.

Although a series of manufacturing steps from the supply of the discrete type aluminum electrolytic capacitor (work) to the final emboss taping have been described above, the present invention is not limited to the above example, and the gist of the present invention is not limited thereto. Modifications within the range are naturally included.

[0051]

As described above, according to the present invention,
The following effects are achieved. That is, by aging after chip formation, a product with stable leakage current characteristics can be obtained.

Further, by using the pallet capable of accommodating a large number of chip type capacitors and performing the batch aging, the production capacity can be increased about three times or more as compared with the conventional one. Furthermore, a lot change can be quickly dealt with only by changing the pallet (changing the pallet having different fitting holes), and it is not necessary to wait until all the products in the previous lot are aged.

[Brief description of drawings]

FIG. 1 is a schematic diagram for explaining each process from a work supply to a printing process.

FIG. 2 is a schematic diagram for explaining each process from palletizing to aging.

FIG. 3 is a partially enlarged plan view of a pallet and a side view thereof.

FIG. 4 is an enlarged plan view of a main part of an electrode plate and a side view thereof.

FIG. 5 is a perspective view of an essential part showing a correspondence relationship between a power supply terminal of an aging tank and an electrode terminal on an electrode plate side.

FIG. 6 is an equivalent circuit of an aging circuit.

FIG. 7 is a perspective view schematically showing a holder used for taking out products from a pallet.

FIG. 8 is a schematic perspective view for explaining a method for taking out products from a pallet.

FIG. 9 is a schematic diagram for explaining an inspection process and an embossed taping process.

[Explanation of symbols]

1 Aluminum electrolytic capacitor 2 exterior case 3a, 3b lead terminals 4 seat plate 5 chip capacitors 10 pallets 11 Fitting hole 20 shaker 30 electrode plate 31a Anode side terminal 31b Cathode side terminal 50 aging tank 51a, 51b Support rail 52 Power supply terminal 60 holder 70 Belt conveyor

Continuation of front page (56) Reference JP-A-7-226336 (JP, A) JP-A-5-335192 (JP, A) Actual development Sho-58-72836 (JP, U) (58) Fields investigated (Int .Cl. ⁷ , DB name) H01G 9/004 H01G 9/04 307 H01G 13/00 361 H01G 13/00 371

Claims (9)

(57) [Claims] 1. A chip forming step of mounting a seat plate made of heat-resistant synthetic resin on a lead wire same direction type aluminum electrolytic capacitor to obtain a surface mountable chip type capacitor,
An aging preparation step of accommodating a plurality of the above chip capacitors in a pallet, covering the pallet with an electrode plate, and preparing for aging so that each of the chip capacitors can be energized from the outside; An aging step in which the chip type capacitors are housed in a constant temperature layer kept at, and a predetermined aging voltage is applied to each of the chip capacitors via the electrode plate to perform aging;
Manufacture of a chip-type electrolytic capacitor characterized by sequentially carrying out a step of taking out each of the chip-type capacitors from the pallet after aging and an inspection step of subsequently inspecting the chip-type capacitors for characteristics such as leakage current. Method. 2. The method for producing a chip-type electrolytic capacitor according to claim 1, wherein a short-circuit inspection of the aluminum electrolytic capacitor is performed prior to the chip forming step. 3. The method for manufacturing a chip type electrolytic capacitor according to claim 1, wherein product information is printed on the chip type capacitor between the chip forming step and the aging preparation step. . 4. In the aging preparation step, fitting holes into which the respective chip capacitors are fitted with their polarities aligned are formed in a matrix in the pallet, and the pallet is attached to the pallet by a vibrator. The method of manufacturing a chip-type electrolytic capacitor according to claim 1, wherein each of the chip-type capacitors is fitted into the fitting hole by applying vibration. 5. The chip type electrolytic capacitor according to claim 1, wherein in the aging preparation step, the electrode plate is provided with a common electrode terminal for a predetermined number of the chip type capacitors. Manufacturing method. 6. The method for manufacturing a chip type electrolytic capacitor according to claim 5, wherein the electrode terminals are made of conductive rubber. 7. The method for manufacturing a chip type electrolytic capacitor according to claim 1, wherein, in the capacitor taking out step, the chip type capacitors are sequentially taken out in a line from the pallet. 8. A U-shaped holder for holding the pallet having an open upper surface so as to cover the upper surface is prepared in the step of taking out the capacitor.
The chip type capacitor according to claim 7, wherein the chip type capacitors are sequentially taken out in a line from the pallet by pushing out the pallet from the holder at a predetermined pitch after being inverted by 80 degrees. Method of manufacturing electrolytic capacitor. 9. The method of manufacturing a chip-type electrolytic capacitor according to claim 1, wherein the chip-type electrolytic capacitor is housed in an embossed tape after the inspection step.