JP3520817B2 - Transfer pin and adhesive transfer method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the structure of a transfer pin and a transfer method of an adhesive by which an adhesive can be easily applied in uniform thickness and in uniform shape, without severe control of air supply conditions. SOLUTION: A transfer pin has a partition wall formed by an elastic thin film 14 at a position which is to be the central portion of a hollow portion 21b, with respect to axial direction of a transfer pin 21 so as to divide the depressed hollow portion 21b into two portions of a tip surface side and a back side 21bA, and an air inlet hole 21c through which air can be injected into the back side portion 21bA. A transfer pin has a movable shaft, provided in the back side hollow portion and moving in the axial direction of the transfer pin, to expand the partition wall to the tip surface side hollow portion. A transfer pin has a valve, provided in an air discharging hole, for relieving the air in the hollow portion to the outside when the air pressure in the hollow portion is higher than a prescribed pressure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer pin for transferring an adhesive used for mounting a semiconductor sensor chip such as a semiconductor pressure sensor chip to a mounting position, and a method for transferring an adhesive using the transfer pin.

[0002]

2. Description of the Related Art FIG. 8 is a sectional view showing an example of a semiconductor pressure sensor in which a semiconductor pressure sensor chip is mounted on a die attaching portion (mounting position) of a package in which a pressure introducing hole is formed by using an adhesive. Yes, this semiconductor pressure sensor is used for pressure measurement in a low pressure region. In FIG. 8, a semiconductor pressure sensor chip 1 is fixed to a glass pedestal 2 by a method such as anodic bonding, and the glass pedestal 2 is a package 3 made of a plastic material such as PPS or PBT and a low stress silicone or epoxy resin. Die attaching part 6 with adhesive 4 consisting of
Are glued in. The glass pedestal 2 is omitted and the semiconductor pressure sensor chip 1 is directly packaged in the package 3
There is also a case where it is adhered to the die attaching part 6 by the adhesive 4. The leads 9 are pre-molded in the package 3, and the leads 9 and the aluminum wiring of the semiconductor pressure sensor chip 1 are bonded by a wire 8 of gold or aluminum. A pressure introducing hole 5 for applying a pressure to the semiconductor pressure sensor chip 1 is formed in the glass pedestal 2 and the package 3 as a through hole. In FIG. 8, 7 is a silicon diaphragm, 10 is a lid, and 11 is an overcoat.

FIG. 9 shows an example of the prior art in which the adhesive 4 is applied to the die attaching portion 6 to which the semiconductor pressure sensor chip 1 of the package 3 is attached by using the dispenser nozzle 12. 12 is moved around the pressure introduction hole 5 so as to draw an arc, and the adhesive 4 is applied. On the other hand, FIG. 10 shows another example of the prior art in which the adhesive 4 is applied from the dispenser nozzle 12 to the die attaching portion 6 to which the semiconductor pressure sensor chip 1 of the package 3 is die attached. Pressure introduction hole 5
The adhesive 4 is applied to a large number of points scattered around.

However, with the method shown in FIG. 9, it was difficult to apply the adhesive 4 continuously and with a uniform thickness. That is, the discharge amount of the adhesive 4 from the dispenser nozzle 12 tends to be faint at the start point, while on the other hand, the adhesive 4 tends to be dripped at the end point after the pressure introducing hole 5 has made one round due to the dripping of the adhesive 4. was there. In this way, the adhesive 4
When it is not possible to continuously apply a uniform thickness around the pressure introducing hole 5, the adhesive strength between the pressure sensor chip 1 integrated with the glass pedestal 2 and the package 3 is deteriorated, and the breakdown voltage is reduced. However, there are problems such as a problem of increasing the offset voltage of the pressure sensor chip 1 due to a variation in the coating shape of the adhesive 4.

Further, in the method shown in FIG. 10, the adhesive 4 applied to a large number of points scattered around the pressure introducing hole 5 is used.
Spreads over time and eventually connects, but it is difficult to make the adhesive thickness uniform after spreading due to variations in the amount of adhesive applied and the same problem as the method shown in FIG. was there. Further, since the coating is performed on a large number of points, the coating time is long and the cost is increased.

Therefore, in order to solve these problems, the inventors of the present invention, in Japanese Unexamined Patent Publication No. 9-148349, use a transfer pin shown in FIG. 11 in a die attaching portion of a package in which a pressure introducing hole is formed. A method of transferring the adhesive is proposed. 11A is a perspective view of the transfer pin, and FIG. 11B is a cross-sectional view of the tip of the transfer pin. In the transfer pin 13 shown in FIG. 11, a concave portion 13b is formed in a substantially central portion of the tip end surface 13a thereof, and an air introducing hole 13c communicating with the concave portion 13b is formed.
And, an air discharge hole 13d reaching from the inner side surface of the recess 13b to the outer side surface of the transfer pin 13 is formed.

When the transfer pin shown in FIG. 11 is used, as compared with the method shown in FIGS. 9 and 10, the adhesive is applied to the die attaching portion in a uniform thickness and in a uniform shape. However, if the pressure fluctuation of the air introduced into the recess of the transfer pin is not strictly controlled, the tip of the transfer pin is pressed against the mother liquor of the adhesive on the tray, and the adhesive is attached to the tip. At this time, the adhesive may be blown off due to the pressure fluctuation of the air, and the thickness of the adhesive adhered to the tip surface may become non-uniform, and there is room for improvement in this respect.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and it is possible to apply the adhesive to the die attaching portion in a uniform thickness and in a uniform shape. Further, there is provided a structure of a transfer pin and a method of transferring the adhesive, which can easily apply the adhesive in a uniform thickness and in a uniform shape without requiring severe management of air supply conditions and the like. That is the issue.

[0009]

According to a first aspect of the present invention, there is provided a transfer pin for transferring an adhesive to a die attachment portion having a pressure introduction hole, in which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. An approximately columnar transfer pin to be used, wherein a concave hollow portion is provided at the tip of the transfer pin such that the opening is formed substantially at the center of the tip end surface of the transfer pin. With respect to the axial direction of the transfer pin,
A partition wall is formed by a thin film having elasticity so as to be divided into a front end surface side and a rear side of the transfer pin at a position substantially in the center of the hollow portion with respect to the axial direction of the transfer pin, and the rear side cavity is formed. The transfer pin has an air introduction hole into which air can be press-fitted.

In the transfer pin according to the first aspect of the present invention, the central portion of the tip end surface is hollowed out to form a concave cavity portion, and the adhesive is attached to the tip end surface formed in a substantially annular shape in plan view. It is a thing. When the adhesive is attached to the tip surface of the transfer pin, air is pressed into the hollow portion on the back side to form a partition wall made of an elastic thin film on the cavity side of the tip surface of the transfer pin. Since it can be expanded, the air pressure in the cavity on the tip surface side can be set to a predetermined pressure so that the adhesive can be uniformly attached to the tip surface. Since it is possible to easily control the amount of air introduced into the cavity on the back side by using, for example, an electromagnetic valve, the air supply conditions and the like are different from those of the conventional transfer pin shown in FIG. Adhesive can be evenly attached to the tip surface of the transfer pin without requiring severe management. As a result, it is easy to apply the adhesive to the die attachment part in a uniform thickness and in a uniform shape. become able to.

The term "having elasticity" as used herein means that it has the property of being able to expand and contract with changes in external force, such as rubber.

According to a second aspect of the present invention, there is provided a transfer pin having a substantially columnar shape, which is used when transferring an adhesive agent to a die attaching portion having a pressure introducing hole, in which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. In addition, a concave hollow portion is provided at the tip of the transfer pin so that the opening is formed substantially in the center of the tip surface of the transfer pin, and the hollow portion is further provided in the axial direction of the transfer pin. On the other hand, a partition wall is formed by a thin film having elasticity so as to divide the transfer pin into a front end surface side and a rear side, at a position substantially in the center of the cavity with respect to the axial direction of the transfer pin. Is a transfer pin in which a movable shaft is provided in the hollow portion on the side to move in the axial direction of the transfer pin by electromagnetic drive so as to bulge the partition wall toward the hollow portion on the tip end surface side of the transfer pin.

In the transfer pin according to the second aspect of the present invention, the central portion of the tip end surface is hollowed out to form a concave hollow portion, and the adhesive is attached to the tip end surface formed in a substantially annular shape in plan view. It is a thing. When the adhesive is attached to the tip surface of the transfer pin, the movable shaft in the cavity on the back side is moved to form a partition wall made of a thin film having elasticity on the cavity side on the tip side of the transfer pin. Since it can be swollen, the air pressure in the cavity on the tip end surface side can be set to a predetermined pressure so that the adhesive can be evenly attached to the tip end surface. Then, the movable shaft is driven by electromagnetic drive, and it is not necessary to introduce air into the cavity on the back side. Therefore, in the case of this transfer pin,
Compared to the case of the conventional transfer pin shown in FIG. 11, it is possible to uniformly adhere the adhesive to the tip end surface of the transfer pin without requiring severe management of the air supply conditions, etc. It becomes easy to apply the adhesive to the part in a uniform thickness and in a uniform shape.

[0014]

[0015]

[0016]

According to a third aspect of the present invention, there is provided a transfer method of using the transfer pin according to the first aspect of the present invention to transfer an adhesive agent to a die attaching portion having a pressure introducing hole in which a semiconductor pressure sensor chip is mounted. When supplying the adhesive to the tip surface of the transfer pin, the entire tip surface of the transfer pin is brought into contact with the mother liquor of the adhesive, and then air is supplied to the cavity on the back side via the air introduction hole. The adhesive is supplied to the tip surface of the transfer pin by press-fitting to expand the partition wall toward the cavity portion on the tip surface side of the transfer pin and then separating the tip surface of the transfer pin from the mother liquor of the adhesive agent. This is an adhesive transfer method.

In the transfer method according to the third aspect, since the transfer pin according to the first aspect is used, compared with the conventional transfer pin shown in FIG. 11, it is not necessary to strictly manage the air supply conditions. Thus, the adhesive can be evenly attached to the tip surface of the transfer pin.

A transfer method according to a fourth aspect is a method of transferring the adhesive agent to the die-attached portion in which the semiconductor pressure sensor chip is mounted and in which the pressure introducing hole is formed, using the transfer pin according to the second aspect. When the adhesive is supplied to the tip end surface of the transfer pin, the entire tip end surface of the transfer pin is brought into contact with the mother liquor of the adhesive agent, and then the movable shaft is moved to become the substantially central portion of the cavity. Adhesive that supplies adhesive to the tip surface of the transfer pin by bulging the partition provided at the position to the cavity side of the tip surface of the transfer pin and then separating the tip surface of the transfer pin from the mother liquor of the adhesive. It is a transfer method of the agent.

In the transfer method according to the fourth aspect, since the transfer pin according to the second aspect is used, compared to the conventional transfer pin shown in FIG. 11, it is not necessary to perform severe management on the air supply conditions and the like. Thus, the adhesive can be evenly attached to the tip surface of the transfer pin.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a transfer pin according to a first embodiment will be described with reference to the drawings.

1 and 2 are sectional views for explaining a first embodiment corresponding to the transfer pin according to claim 1,
1 shows a state before the tip surface of the transfer pin is brought into contact with the adhesive, and FIG. 2 shows a state where the tip surface of the transfer pin is brought into contact with the adhesive.

As shown in FIG. 1, the transfer pin 21 in the first embodiment has a substantially cylindrical shape, and the transfer pin 21 is
A concave cavity 21b is provided at the tip of the transfer pin 21 such that its opening 21e is formed substantially at the center of the tip surface 21a of the transfer pin 21, and the cavity 21b is formed in the axial direction of the transfer pin 21. A partition wall is formed by a thin film 14 (silicone rubber film in this embodiment) having elasticity at a position substantially in the center of the cavity 21b so that the cavity 21b is located at the back cavity 21bA with respect to the axial direction of the transfer pin 21. And the tip side cavity 21
In addition to being divided into bB, an air introduction hole 21c to which the air pipe 16 is connected is provided in the inner cavity 21bA. The thin film having elasticity may be any thin film having a property of expanding by air pressure and returning to the original state by releasing pressure, and a plastic film or the like can be used in addition to rubber. Air is pressed into the inner cavity 21bA by opening / closing an electromagnetic valve connected to the air pipe 16 (not shown) so that a predetermined amount of air can be pressed.

A method of transferring an adhesive using the transfer pin 21 of the first embodiment (an embodiment corresponding to the invention of claim 4) will be described. As shown in FIG. 1, the tip end surface 21 a of the transfer pin 21 is positioned above the adhesive 4 (adhesive mother liquor) that is placed on the tray 17. At this time, the air pressures of the front surface side cavity portion 21bB and the back side cavity portion 21bA are set to the same pressure, and the thin film 14 is not pressurized. Next, the transfer pin 21 is lowered to move the transfer pin 2
Adhesive 4 with the entire front end surface 21a of No. 1 on tray 17
(Adhesive mother liquor). Then, as shown in FIG. 2, the hollow portion 21bA on the back side is passed through the air pipe 16.
Then, air 15 is press-fitted by opening and closing an electromagnetic valve (not shown) to insert the thin film 14 forming the partition wall into the cavity 2 on the tip surface side.
Swell to the 1bB side. Next, the front end surface 21 of the transfer pin 21
By separating a from the adhesive 4 (adhesive mother liquor) laid on the tray 17, the adhesive is supplied to the tip end surface 21 a of the transfer pin 21.

When the adhesive is supplied in this manner, the adhesive does not crawl into the cavity 21b of the transfer pin 21 and an adhesive film is formed in the opening 21e of the cavity 21b. Without this, the adhesive can be uniformly attached to the front end surface 21a formed in a substantially annular shape in plan view. Further, the control of the amount of air introduced into the hollow portion 21bA on the back side can be easily achieved by a simple operation of, for example, opening the electromagnetic valve for a certain period of time. Therefore, in the case of this transfer pin 21, compared with the case of the conventional transfer pin shown in FIG. 11 described above, it is not necessary to perform severe management of the air supply conditions and the like, and an adhesive agent is applied to the tip surface 21a of the transfer pin. The adhesive can be evenly adhered, so that the adhesive can be easily applied to the die-attached portion in a uniform thickness and in a uniform shape.

Next, the transfer pin of the second embodiment will be described with reference to the drawings. 3 and 4 are cross-sectional views for explaining a second embodiment corresponding to the transfer pin according to claim 2, and FIG. 3 is a state before the tip surface of the transfer pin is brought into contact with the adhesive, and FIG. Indicates a state in which the tip surface of the transfer pin is in contact with the adhesive.

As shown in FIG. 3, the transfer pin 22 in the second embodiment has a substantially cylindrical shape, and the transfer pin 22 is
A concave cavity 22b is provided at the tip of the transfer pin 22 such that its opening 22e is formed substantially at the center of the tip surface 22a of the transfer pin 22, and the cavity 22b is formed in the axial direction of the transfer pin 22. A partition wall is formed by a thin film 14 (silicone rubber film in this embodiment) having elasticity at a position substantially in the center thereof, and the cavity 22b is defined as a cavity 22bA on the inner side with respect to the axial direction of the transfer pin. Tip side cavity 22bB
It is divided into and. With respect to the thin film 14 having elasticity, by applying an external force, the front surface side cavity portion 22bB
Any thin film may be used as long as it has a property of bulging to the side and returning to the original state by releasing the applied force, and a plastic film or the like can be used in addition to rubber. And the back cavity 2
2bA is transferred to the transfer pin 2 by electromagnetically driving the coil 18.
There is provided a movable shaft 19 which is movable in the two axial directions, and by this movable shaft 19, the thin film 14 forming the partition wall can be inflated to the transfer pin tip end surface side cavity portion 22bB side. .

A method of transferring an adhesive using the transfer pin 22 of the second embodiment (an embodiment corresponding to the invention of claim 5) will be described. As shown in FIG. 3, the tip end surface 22 a of the transfer pin 22 is positioned above the adhesive 4 (adhesive mother liquor) that is placed on the tray 17. At this time, the air pressures of the front surface side cavity portion 22bB and the back side cavity portion 22bA are the same, and the thin film 14 is kept in a state where no force is exerted by the movable shaft 19. Next, the transfer pin 22
Is moved down to bring the entire front end surface 22a of the transfer pin 22 into contact with the adhesive 4 (adhesive mother liquor) placed on the tray 17.
Next, as shown in FIG. 4, the movable shaft 19 is moved by the electromagnetic drive of the coil 18 to push down the thin film 14 forming the partition wall and bulge toward the tip surface side cavity portion 22bB side. The air pressure in the cavity 22bB is set to a desired pressure. Next, the front end surface 22a of the transfer pin 22 is attached to the tray 1
The adhesive is supplied to the tip end surface 22 a of the transfer pin 22 by separating it from the adhesive 4 (adhesive mother liquor) that has been filled in 7.

When the adhesive is supplied in this manner, the adhesive does not crawl into the cavity 22b of the transfer pin 22 and an adhesive film is formed in the opening 22e of the cavity 22b. Without this, the adhesive can be uniformly attached to the front end surface 22a formed in a substantially annular shape in plan view. Furthermore, since the operation of the movable shaft 19 in the inner cavity 22bA is performed by the coil 18 by an electromagnetic drive method, it is easy to control so that the thin film 14 forming the partition wall is pushed down by a certain distance. it can. As described above, in the case of the transfer pin 22, the tip surface side hollow portion 21b can be easily formed.
Since the air-pressure in B can be set to a desired pressure,
Compared with the case of the conventional transfer pin shown in FIG. 11 described above, the adhesive can be uniformly attached to the tip end surface 22a of the transfer pin without requiring severe management of the air supply conditions and the like. Make the thickness uniform on the attachment part,
Further, it becomes possible to easily apply the adhesive in a uniform shape.

Next, the transfer pins of the first reference example and the second reference example will be described with reference to the drawings.

[0031] Figures 5 and 6 are cross-sectional views for illustrating a reference example of the transfer pins, FIG. 5 shows a state in contact with the distal end surface of the transfer pins of the first reference example in adhesive , Fig. 6
Shows the state where the tip end surface of the transfer pin of the second reference example is in contact with the adhesive.

As shown in FIG. 5, the transfer pin 23 in the first reference example has a substantially rectangular column shape.
A concave cavity portion 23b is provided at the tip end of the transfer pin 23 such that its opening 23e is formed substantially at the center of the tip end surface 23a of the transfer pin 23. The cavity 23b has a circular cross section, and has an air introduction hole 23c communicating from the outside of the transfer pin 23 to the cavity 23b and an air discharge hole 23d reaching the outside of the transfer pin from the inner surface of the cavity 23b. Is formed. The air pipe 16 is provided in the air introduction hole 23c.
Is connected so that the air 15 can be supplied. Further, the air discharge hole 23d is provided on the side surface 23f of the transfer pin 23, and the air discharge hole 23d is provided in the hollow portion 23b when the air pressure in the hollow portion 23b becomes higher than a predetermined pressure. Valve 24 for letting air escape to the outside
Is provided. When the air pressure inside the cavity 23b becomes higher than a predetermined pressure, the valve 24 is opened to the outside of the transfer pin 23 to open the air discharge hole 23d so that the air pressure inside the cavity 23b is kept constant. It works to maintain a predetermined pressure. Then, when the air pressure in the hollow portion 23b becomes equal to or lower than a predetermined pressure, the valve 24 automatically returns to the original position and closes the air discharge hole 23d to keep the air pressure in the hollow portion 23b. It is designed to maintain a predetermined pressure.

A method of transferring the adhesive using the transfer pin 23 of the first reference example will be described. The transfer pin 23 with the valve 24 closed and the air discharge hole 23d closed is placed on the tray 17 with the adhesive 4 (adhesive mother liquor).
Position above. At this time, a constant pressure (for example, 5 gf / cm) is applied to the hollow portion 23b via the air pipe 16.
^{2 to} 50 gf / cm ² of air 15 is supplied. Then, while supplying this air, the transfer pin 2
3 is moved down to bring the entire front end surface 23a of the transfer pin 23 into contact with the adhesive 4 (adhesive mother liquor) placed on the tray 17. At this time, the hollow portion 23b is in a closed state and the internal pressure increases, but when the air pressure becomes higher than a predetermined pressure, the valve 24
Open to the outside of the transfer pin 23 to open the air discharge hole 23d, and the air pressure inside the cavity 23b is maintained at a predetermined pressure. When the air pressure in the hollow portion 23b becomes equal to or lower than a predetermined pressure, the valve 14 automatically returns to the closed position to close the air discharge hole 23d, and the hollow portion 23b is closed.
The inside air pressure is kept at a predetermined pressure.

As described above, in the transfer pin 23 of this reference example , even if the pressure of the air 15 supplied into the hollow portion 23b via the air pipe 16 fluctuates, the valve 24 works,
The air pressure inside the cavity 23b can be maintained at a predetermined pressure.

Then, the tip end surface 23a of the transfer pin 23 is separated from the adhesive 4 (adhesive mother liquor) laid on the tray 17 while the air pressure inside the cavity 23b is kept at a predetermined pressure. An adhesive is supplied to the tip surface 23a of the. In this way, when the adhesive is supplied, the adhesive does not crawl into the cavity 23b of the transfer pin 23,
Further, an adhesive film is not formed in the opening 23e of the cavity 23b, and the adhesive can be evenly attached to the tip surface 23a.

FIG. 7 shows a state in which the adhesive 4 is transferred to the die-attached portion of the package 3 by using the transfer pin 23 of the first reference example , and the pressure introducing hole 5 is formed around the pressure introducing hole 5. The adhesive 4 is applied without blocking.

Thus, in the case of this transfer pin 23,
Since the air pressure in the hollow portion 23b can be easily maintained at a predetermined pressure, compared to the case of the conventional transfer pin shown in FIG. 11 described above, strict control of the air supply conditions etc. is not required, and the transfer can be performed. The adhesive can be evenly attached to the tip end surface 23a of the pin, so that the adhesive can be easily applied to the die attachment portion in a uniform thickness and in a uniform shape.

Next, the transfer pin of the second reference example is shown in FIG.
Will be described with reference to. Second reference , as shown in FIG.
The transfer pin 23 in the example is the first reference shown in FIG.
It has the same configuration except that the installation positions of the air discharge hole 23d and the valve 24 are different from the example. That is, the transfer pin 23 is in the shape of a substantially quadrangular prism, and a hollow portion 23b having a concave shape is formed at the tip of the transfer pin 23, and an opening 23e thereof is formed substantially at the center of the tip surface 23a of the transfer pin 23. The hollow portion 23b has a circular cross section, and has an air introduction hole 23c communicating with the hollow portion 23b from the outside of the transfer pin 23 and an inner side surface of the hollow portion 23b from the outside of the transfer pin. The reaching air discharge hole 23d is formed. The air pipe 16 is connected to the air introduction hole 23c.

In the transfer pin 23 of the second reference example , the air discharge hole 23d is provided in the upper surface 23g of the transfer pin 23, and the air pressure in the cavity 23b becomes higher than a predetermined pressure in the air discharge hole 23d. A valve 24 is provided to allow the air in the hollow portion 23b to escape to the outside when it is opened. This valve 2
When the air pressure in the hollow portion 23b becomes higher than a predetermined pressure, the reference numeral 4 opens the outside of the transfer pin 23 to open the air discharge hole 23d so that the air pressure in the hollow portion 23b becomes a predetermined pressure. Function to keep Then, after that, the hollow portion 23b
When the internal air pressure becomes lower than a predetermined pressure, the valve 24 automatically returns to the original position and closes the air discharge hole 23d so that the air pressure inside the cavity 23b is maintained at the predetermined pressure. I have to.

The second reference example in this way, the installation position of the first reference example and an air discharge hole 23d and the valve 24 is in different forms, in which the same effects as the first embodiment.

[0041]

According to the transfer pins of the inventions of claims 1 and 2 and the method of transferring the adhesives of claims 3 and 4 , the adhesive is applied to the die attaching portion in a uniform thickness and in a uniform shape. It is possible to achieve this, and there is a useful effect that the adhesive can be easily applied in a uniform thickness and in a uniform shape without requiring severe management of air supply conditions and the like.

Since it becomes easy to apply the adhesive to the die-attached portion in a uniform thickness and in a uniform shape, the transfer pin according to the first and second aspects of the invention and the third and fourth aspects of the invention. According to the adhesive transfer method of the invention according to the invention, there is a problem that the breakdown withstand voltage is lowered due to the poor adhesive strength between the pressure sensor chip and the package due to the uneven coating thickness, and the adhesive coating. The problem that the offset voltage variation of the pressure sensor chip becomes large due to the variation in shape is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a first embodiment,
It shows a state before the tip end surface of the transfer pin is brought into contact with the adhesive.

FIG. 2 is a sectional view for explaining the first embodiment,
The state where the tip end surface of the transfer pin is in contact with the adhesive is shown.

FIG. 3 is a cross-sectional view for explaining the second embodiment,
It shows a state before the tip end surface of the transfer pin is brought into contact with the adhesive.

FIG. 4 is a sectional view for explaining the second embodiment,
The state where the tip end surface of the transfer pin is in contact with the adhesive is shown.

FIG. 5 is a cross-sectional view for explaining the first reference example , showing a state where the tip end surface of the transfer pin is in contact with the adhesive.

FIG. 6 is a cross-sectional view for explaining a second reference example , showing a state where the tip end surface of the transfer pin is in contact with the adhesive.

FIG. 7 is a partial plan view showing a state in which an adhesive is transferred to a die attaching portion using the transfer pin of the first reference example .

FIG. 8 is a cross-sectional view for explaining the structure of a semiconductor pressure sensor.

FIG. 9 is a diagram showing an example of a conventional adhesive application method.

FIG. 10 is a diagram showing an example of a conventional adhesive application method different from that of FIG.

FIG. 11 is a view showing an example of a conventional transfer pin,
(A) is a perspective view and (b) is a partial cross-sectional view.

[Explanation of symbols]

1 Pressure sensor chip 2 glass pedestal 3 packages 4 adhesive 5 Pressure introduction hole 6 Die attaching part 7 diaphragm 13 Conventional transfer pin 13a Tip surface 13b recess 13c Air introduction hole 13d air discharge hole 14 thin film 15 air 16 air pipes 17 trays 18 coils 19 Movable axis 21 Transfer pin 21a Tip surface 21b cavity 21bA Back cavity 21bB Tip surface side cavity 21c Air introduction hole 21e opening 22 Transfer pin 22a Tip surface 22b cavity 22bA Back cavity 22bB Tip surface side cavity 22e opening 23 Transfer pin 23a Tip surface 23b cavity 23c Air introduction hole 23d air discharge hole 23e opening 23f side 23g upper surface 24 valves

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomohiro Inoue 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Takamasa Sakai, 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works, Ltd. (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/52

Claims (4)

(57) [Claims] 1. A transfer pin having a substantially columnar shape, which is used when transferring an adhesive to a die attaching portion having a pressure introducing hole, on which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A concave hollow portion is provided at the tip of the transfer pin so that its opening is formed substantially at the center of the tip surface of the transfer pin. Further, the hollow portion is formed in the axial direction of the transfer pin. A partition wall is formed by a thin film having elasticity so as to be divided into two parts, the inner side and the inner side, at a position substantially in the center of the cavity with respect to the axial direction of the transfer pin, and air is supplied to the inner cavity. Transfer pin that has an air introduction hole that can be pressed. 2. A transfer pin having a substantially columnar shape, which is used when transferring an adhesive to a die attaching portion having a pressure introducing hole, in which a semiconductor pressure sensor chip having a silicon diaphragm is mounted. A concave hollow portion is provided at the tip of the transfer pin so that its opening is formed substantially at the center of the tip surface of the transfer pin. Further, the hollow portion is formed in the axial direction of the transfer pin. A partition wall is formed by a thin film having elasticity so as to be divided into two parts, the inner side and the inner side, at a position substantially in the center of the hollow portion with respect to the axial direction of the transfer pin, and an electromagnetic wave is formed in the inner hollow portion. A transfer pin provided with a movable shaft that is movable in the axial direction of the transfer pin by driving and can bulge the partition wall toward the hollow portion of the transfer pin tip surface. 3. A method for transferring an adhesive to a die-attached portion, in which a semiconductor pressure sensor chip is mounted, in which a pressure introduction hole is formed, using the transfer pin according to claim 1, When supplying the adhesive to the tip surface, contact the entire tip surface of the transfer pin with the mother liquor of the adhesive, and then press the air into the cavity on the back side through the air introduction hole to form the partition wall. Adhesive is supplied to the tip surface of the transfer pin by swelling the thin film on the cavity side of the tip surface of the transfer pin and then separating the tip surface of the transfer pin from the mother liquor of the adhesive. Transfer method. 4. A method for transferring an adhesive to a die-attached portion, in which a semiconductor pressure sensor chip is mounted, in which a pressure introducing hole is formed, using the transfer pin according to claim 2, wherein When supplying the adhesive to the tip surface, the entire surface of the tip surface of the transfer pin is brought into contact with the mother liquor of the adhesive, and then the movable shaft is moved so that the partition wall provided at the position substantially in the center of the cavity is transferred to the transfer pin A method for transferring an adhesive in which the adhesive is supplied to the tip surface of the transfer pin by expanding the tip surface of the transfer pin from the mother liquor of the adhesive and then bulging it toward the cavity on the tip surface side.