JP3858911B2 - Transfer method of adhesive using transfer pin - Google Patents

Description

  The present invention relates to a transfer pin for transferring an adhesive used for mounting a semiconductor pressure sensor chip to a mounting position, and an adhesive transfer method using the transfer pin.

  FIG. 10 is a cross-sectional view showing an example of a semiconductor pressure sensor in which a semiconductor pressure sensor chip is mounted using an adhesive on a die attaching portion of a package in which a pressure introduction hole is formed. Used for area pressure measurement. In FIG. 10, the semiconductor pressure sensor chip 1 is fixed to the glass pedestal 2 by anodic bonding or the like, and the glass pedestal 2 is composed of a package 3 made of a plastic material such as PPS or PBT, and low stress silicone or epoxy resin. It is adhered by an adhesive 4 made of Leads 9 are pre-molded on the package 3, and the leads 9 and the aluminum wiring of the semiconductor pressure sensor chip 1 are bonded with gold or aluminum wires 8. In the glass pedestal 2 and the package 3, a pressure introducing hole 5 for applying pressure to the semiconductor pressure sensor chip 1 is formed as a through hole. In FIG. 10, 7 is a silicon diaphragm, 10 is a lid, and 11 is an overcoat. In some cases, the semiconductor pressure sensor chip 1 may be directly bonded to the die attaching portion 6 with the adhesive 4 without using the glass pedestal 2.

  FIG. 11 shows an example of a conventional example in which the adhesive 4 is applied from the dispenser nozzle 12 to the die attaching portion 6 of the package 3. In FIG. 11, the dispenser nozzle 12 is placed around the pressure introducing hole 5. It moves so as to draw an arc, and the adhesive 4 is applied. On the other hand, FIG. 12 shows another conventional example in which the adhesive 4 is applied to the die attaching portion 6 of the package 3 from the dispenser nozzle 12. In FIG. The adhesive 4 is applied to the point.

  However, in the method shown in FIG. 11, it was difficult to apply the adhesive 4 continuously at a uniform thickness. That is, the discharge amount of the adhesive 4 from the dispenser nozzle 12 is slightly blurred at the start point, and tends to be applied much due to dripping of the adhesive 4 at the end point after making a round of the pressure introducing hole 5. It was. As described above, when the adhesive 4 cannot be continuously applied to the periphery of the pressure introducing hole 5 with a uniform thickness, the adhesive strength between the pressure sensor chip 1 integrated with the glass pedestal 2 and the package 3 is poor. As a result, there arises a problem that the breakdown withstand voltage is reduced, and that a variation in offset voltage of the pressure sensor chip 1 due to a variation in the application shape of the adhesive 4 is increased.

  In the method shown in FIG. 12, the adhesive 4 applied to a number of points scattered around the pressure introducing hole 5 spreads over time, and eventually, but due to variations in the application amount of the adhesive 4, etc. It is difficult to apply a uniform thickness, resulting in variations in the shape of the coating, resulting in a decrease in the breakdown voltage of the semiconductor pressure sensor and a large variation in the offset voltage of the pressure sensor chip. It was. Further, since the coating is applied to a large number of points, the time for coating is long and the cost is increased.

Further, a transfer pin 13 as shown in FIG. 13 is known as a transfer pin capable of transferring an adhesive only around a pressure introducing hole formed in a die attaching portion of a package (Japanese Patent Laid-Open No. 9-148349). Technology column). 13A is a side view and FIG. 13B is a plan view. The transfer pin 13 shown in FIG. 13 has a substantially hexagonal recess 13c in plan view formed on the tip surface 13b of the tip portion 13a to which the adhesive is applied, so that the adhesive is applied only to the tip surface 13b around the recess 13c. The adhesive can be attached, and the adhesive is not transferred to the position where the pressure introducing hole is present, and the adhesive can be transferred only around the pressure introducing hole in a short time.
JP 09-148349 A (2nd to 3rd pages, FIG. 13)

  When the transfer pin 13 shown in FIG. 13 is used as a transfer pin for transferring the adhesive to the mounting position, the adhesive can be transferred in a short time without transferring the adhesive to the position where the pressure introduction hole is present. Compared with the method shown in FIGS. 11 and 12, the adhesive can be applied to the periphery of the pressure introducing hole with a uniform thickness and in a uniform shape. . However, when the transfer pin 13 shown in FIG. 13 is used, an adhesive film may be formed across the opening surface of the recess formed on the tip surface. When the adhesive is transferred to the attaching portion, the adhesive is transferred to the position of the pressure introducing hole formed in the die attaching portion, which causes a serious problem of clogging, and improvement thereof is demanded.

  The present invention has been made in view of the above-described problems of the prior art, and has a uniform thickness with respect to the application of the adhesive to the peripheral portion of the pressure introducing hole of the die attaching portion in which the pressure introducing hole is formed. Another object of the present invention is to provide a transfer pin structure and an adhesive transfer method that can be applied in a uniform shape and that can reliably prevent the adhesive from being transferred to the position of the pressure introduction hole.

  And, if the adhesive can be applied to the die attaching portion with a uniform thickness and a uniform shape, the adhesive strength between the pressure sensor chip and the package due to the non-uniform coating thickness will deteriorate. The problem that the breakdown voltage decreases and the problem that the offset voltage of the pressure sensor chip increases due to the variation in the application shape of the adhesive is solved, and the characteristics and stability of the semiconductor pressure sensor can be improved.

  In the adhesive transfer method according to the first aspect of the present invention, a hollow portion having a substantially circular cross section opened at a substantially central portion of the bottom surface of the tip portion to which the adhesive is supplied is formed on the wall surface of the hollow portion. A transfer pin provided with a cylindrical movable portion that slides along the front end surface thereof and is movable from the position of the opening surface of the hollow portion at the height of the bottom surface of the front end portion to a position inside the hollow portion. In the adhesive transfer method of transferring an adhesive to a die attaching part in which a pressure introduction hole for mounting a semiconductor pressure sensor chip provided with a silicon diaphragm is used, the bottom surface of the tip of the transfer pin and The transfer pin is pressed against the adhesive with the tip end surface of the cylindrical movable part provided with the transfer pin inside thereof at substantially the same height, and adhered to the tip bottom surface of the transfer pin and the tip end surface of the movable part. After attaching the agent, glue the transfer pin Then move the cylindrical movable part so that the adhesive adhering to the tip of the movable part comes to the position inside the cavity formed in the transfer pin, and then adhere to the bottom of the tip of the transfer pin The adhesive is transferred to the die attaching portion.

  According to the transfer method of the adhesive using this transfer pin, since the cylindrical movable part is provided, the formation of the adhesive film on the opening surface of the cavity of the transfer pin is prevented, and the tip of the transfer pin The adhesive adhered to the bottom surface of the part can be transferred to the die attaching part.

  An adhesive transfer method according to a second aspect of the present invention includes a transfer pin main body having a substantially cylindrical shape at a tip portion, a movable ring having a flat bottom surface that is attached to the tip portion and movable in the axial direction of the tip portion. The position of the movable ring can be changed from the position where the bottom surface of the distal end portion and the bottom surface of the movable ring are substantially the same height to the position where the bottom surface of the movable ring protrudes outward from the bottom surface of the distal end portion. In the adhesive transfer method of transferring an adhesive to a die attaching portion in which a pressure introduction hole for mounting a semiconductor pressure sensor chip having a silicon diaphragm is mounted using a transfer pin, the bottom surface of the tip portion and the movable portion are transferred. With the bottoms of the rings at approximately the same height, press each bottom against the adhesive and attach the adhesive to each side, then move the transfer pin body and the movable ring away from the adhesive, and then move the ring Move and is characterized in that by projecting the adhesive adhered to the bottom surface of the movable ring, then transferring the adhesive attached to the bottom surface of the movable ring die mounting portion.

  According to the transfer method of the adhesive using this transfer pin, since the movable ring is provided at the tip of the transfer pin body, the position corresponding to the pressure introducing hole formed in the die attaching portion, and The adhesive adhered to the bottom surface of the tip portion of the transfer pin can be prevented from being transferred to the die attaching portion while remaining attached to the bottom surface of the tip portion of the transfer pin in the transfer process. Accordingly, it is possible to reliably prevent the adhesive from being transferred to the position of the pressure introducing hole formed in the die attaching portion, and to transfer only the adhesive adhered to the bottom surface of the movable ring to the die attaching portion. .

  According to the adhesive transfer method of the invention according to claims 1 to 2, the thickness of the adhesive applied to the peripheral portion of the pressure introducing hole of the die attaching part in which the pressure introducing hole is formed is uniform. In addition, it can be applied in a uniform shape, and the adhesive can be reliably prevented from being transferred to the position of the pressure introducing hole.

  Since the adhesive can be applied to the die attaching portion in a uniform thickness and in a uniform shape without applying the adhesive to the position of the pressure introducing hole, the invention according to claims 1 to 2 According to the adhesive transfer method, the breakdown pressure is reduced due to the poor adhesive strength between the pressure sensor chip and the package due to the non-uniform coating thickness, and due to variations in the adhesive coating shape. The problem that the variation in the offset voltage of the generated pressure sensor chip becomes large is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

  First, the transfer pin of the first reference example will be described with reference to the drawings.

  1 and 2 are cross-sectional views for explaining a transfer pin of a first reference example. FIG. 1 shows a state immediately after the adhesive is attached to the bottom surface of the tip of the transfer pin, and FIG. 2 shows a state where the movable needle provided in the transfer pin cavity is lowered. As shown in FIG. 1, the transfer pin 14 of the first reference example has a substantially cylindrical shape, and a hollow portion 14c having an opening surface 14d at the center of the bottom surface 14b of the tip portion 14a to which the adhesive is supplied, It is formed inside. The hollow portion 14c in this reference example has a circular cross section and opens to both the upper surface and the bottom surface of the transfer pin, but may be a recess that does not open toward the upper surface. Further, the transfer pin 14 is accommodated in the cavity portion 14c and moves in the axial direction of the transfer pin 14 as shown in FIG. 2 so that the tip of the transfer pin 14 can reach the opening surface 14d of the cavity portion 14c of the transfer pin 14. A movable needle 14e is provided. Although the driving means for the movable needle 14e is not shown, it may be performed by a method using an electromagnetic coil or a method by adjusting air pressure using an electromagnetic valve.

  A method of transferring the adhesive using the transfer pin 14 of the first reference example will be described. As shown in FIG. 1, with the tip of the movable needle 14 e housed in the cavity 14 c inside the transfer pin 14, the tip bottom surface 14 b of the transfer pin 14 is pressed against the adhesive 4 on the tray 17. After the adhesive 4 is attached to the bottom surface 14 b of the tip end of the transfer pin 14, the transfer pin 14 is separated from the adhesive 4. In this case, the adhesive 4 adheres to the perforated circular tip bottom 14b surrounding the opening 14d of the cavity 14c, and together with that, the adhesive film 20 crosses the opening 14d of the cavity 14c. May be formed. Therefore, as shown in FIG. 2, the tip of the movable needle 14e accommodated in the cavity portion 14c inside the transfer pin 14 is made to reach the opening surface 14d of the cavity portion 14c of the transfer pin 14 and formed on the opening surface 14d. After the adhesive film 20 is broken, the movable needle 14e is again accommodated in the cavity portion 14c, and then the adhesive 4 adhered to the bottom surface 14b of the transfer pin 14 is attached to the die in which the pressure introduction hole is formed. This is transferred to the peripheral portion of the pressure introducing hole and applied. Note that the movable needle 14e may be moved only when the adhesive film 20 is formed on the opening surface 14d of the cavity 14c, but the adhesive is applied to the tip regardless of whether or not the adhesive film 20 is formed. It is also possible to move the movable needle 14e each time it adheres to the bottom surface 14b.

  As described above, when the adhesive is transferred using the transfer pin 14 of the first reference example, the adhesive film 20 on the opening surface 14d of the cavity portion 14c is broken by the movable needle 14e, and then the die attaching portion. Since the adhesive can be transferred, the adhesive can be applied to the die attaching portion with a uniform thickness and a uniform shape without filling the pressure introducing hole at the center of the die attaching portion. Therefore, there is a problem that the breakdown voltage is reduced due to the poor adhesive strength between the pressure sensor chip and the package due to the non-uniform coating thickness, and the offset voltage of the pressure sensor chip caused by variations in the adhesive application shape. The problem of large variations is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

  Next, the transfer pin of the first embodiment will be described with reference to the drawings. 3 and 4 are cross-sectional views for explaining a transfer pin according to a first embodiment corresponding to the first aspect of the present invention. FIG. 3 shows a state immediately after the adhesive is attached to the bottom surface of the tip of the transfer pin, and FIG. 4 shows a state where the movable part provided in the transfer pin cavity is raised.

  As shown in FIG. 3, the transfer pin 15 of the first embodiment has a substantially cylindrical shape, and a hollow portion 15c having an opening surface 15d at the center of the bottom surface 15b of the tip portion 15a to which an adhesive is supplied. It is formed inside. The hollow portion 15c in this embodiment has a circular cross section and opens to both the top and bottom surfaces of the transfer pin, but may be a recess that does not open to the top surface. The transfer pin 15 is housed in the cavity 15c and includes a columnar movable part 15e that slides along the wall surface of the cavity 15c. The distal end surface 15f of the movable portion 15e is positioned at the inner side of the cavity portion 15c (as shown in FIG. 4) from the same height as the opening surface 15d of the cavity portion 15c at the center position of the bottom surface 15b of the distal end portion of the transfer pin 15. A cylindrical movable portion 15e that is movable at a position accommodated in a hollow portion. Although the driving means for the movable portion 15e is not shown, it may be performed by a method using an electromagnetic coil, a method by adjusting air pressure using an electromagnetic valve, or the like. Moreover, the front end surface 15f of the movable part 15e is a flat surface.

  A method for transferring the adhesive using the transfer pin 15 of the first embodiment will be described. As shown in FIG. 3, in a state where the position of the movable portion 15e is adjusted so that the front end surface 15f of the movable portion 15e inside the transfer pin 15 is at the same height as the opening surface 15d of the cavity portion 15c. 15 is pressed against the adhesive 4 accumulated on the tray 17, and the adhesive 4 is adhered to the front end bottom 15b of the transfer pin 15 and the front end surface 15f of the movable portion 15e. Set it apart from 4. In this state, the front end surface 15f of the movable portion 15e to which the adhesive 4 is attached exists at the position of the opening surface 15d of the cavity portion 15c.

  Next, as shown in FIG. 4, the movable portion 15 e is raised to move the distal end surface 15 f of the movable portion 15 e to which the adhesive 4 is adhered to a position inside the cavity portion 15 c, and the bottom surface of the distal end portion of the transfer pin 15. The adhesive adhering to 15b is protruded. Then, as shown in FIG. 4, the adhesive is transferred to the die attaching portion in a state where the adhesive 4 attached to the bottom surface 15b of the tip of the transfer pin 15 protrudes, and the die attaching portion in which the pressure introducing hole is formed. The adhesive 4 is transferred and applied to the peripheral portion of the pressure introducing hole.

  As described above, when the adhesive is transferred using the transfer pin 15 of the first embodiment, the adhesive 4 adhered to the tip surface 15f of the movable portion 15e is transferred in the state of being accommodated in the cavity 15c. Therefore, the adhering agent is not transferred to a position where there is a pressure introducing hole formed in the die attaching portion. Therefore, the adhesive can be applied to the die attaching portion with a uniform thickness and a uniform shape without filling the pressure introducing hole at the center of the die attaching portion with the adhesive. Therefore, there is a problem that the breakdown voltage is reduced due to the poor adhesive strength between the pressure sensor chip and the package due to the non-uniform coating thickness, and the offset voltage of the pressure sensor chip caused by variations in the adhesive application shape. The problem of large variations is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

  Next, the transfer pin of the second embodiment will be described with reference to the drawings. 5 and 6 are cross-sectional views for explaining a transfer pin according to a second embodiment corresponding to the second aspect of the present invention. FIG. 5 shows a state immediately after the adhesive is attached to the bottom surface of the transfer pin main body and the bottom surface of the movable ring provided in the transfer pin, and FIG. 6 shows the adhesive on the die attaching portion of the package by lowering the movable ring. The state just before transferring is shown.

  As shown in FIG. 5, the transfer pin of the second embodiment has a transfer pin body 16 having a substantially cylindrical end portion 16a and an outer peripheral surface of the end portion 16a. Is provided with a movable ring 16e having a flat bottom surface 16f. In the transfer pin according to the second embodiment, the movable ring bottom surface 16f is moved from the position where the tip bottom surface 16b of the transfer pin main body 16 and the movable ring bottom surface 16f are substantially at the same height. The movable ring 16e can be moved to a position protruding outward. The movable ring 16e is made of a magnetic material such as iron, nickel, cobalt, or an alloy thereof, and has a structure that can be moved in the axial direction of the transfer pin body by an electromagnetic coil 22 provided above the movable rig 16e. Further, a stopper 24 is provided at the tip 16a of the transfer pin main body 16 so that the movable ring 16e does not fall away from the transfer pin main body 16. Further, the bottom surface 16b of the front end portion of the transfer pin main body 16 is a flat surface.

  A method for transferring the adhesive using the transfer pin of the second embodiment will be described. As shown in FIG. 5, the electromagnetic coil 22 is actuated to raise the movable ring 16e so that the bottom surface 16b of the front end portion of the transfer pin main body 16 and the bottom surface 16f of the movable ring are at the same height. The bottom surface 16b of the transfer pin body 16 and the bottom surface 16f of the movable ring 16f are pressed against the adhesive 4 on the tray 17, and the adhesive 4 is attached to each surface, and then the transfer pin body 16 and the movable ring 16e are joined together. Then, it is separated from the adhesive 4.

  Next, as shown in FIG. 6, the electromagnetic ring 22 is operated to lower the movable ring 16e, and the adhesive 4 attached to the bottom surface 16f of the movable ring is protruded. In this state, the adhesive 4 is transferred to the die attaching portion 6, and the adhesive 4 is transferred and applied to the peripheral portion of the pressure introducing hole 5 of the die attaching portion 6 in which the pressure introducing hole 5 is formed.

  As described above, when the adhesive is transferred using the transfer pin of the second embodiment, the position surrounded by the movable ring bottom surface 16f, which corresponds to the pressure introducing hole formed in the die attaching portion. The adhesive is not transferred to the die attaching portion 6 while remaining on the bottom surface 16b of the tip end portion of the transfer pin main body 16. Therefore, the adhesive is surely prevented from being transferred to the position of the pressure introducing hole 5 in the center of the dangling part 6 and the adhesive is uniformly applied to the die attaching part 6 in a uniform shape. it can. Therefore, there is a problem that the breakdown voltage is reduced due to the poor adhesive strength between the pressure sensor chip and the package due to the non-uniform coating thickness, and the offset voltage of the pressure sensor chip caused by variations in the adhesive application shape. The problem of large variations is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

  Next, the transfer pin of the second reference example will be described with reference to the drawings. 7 and 8 are cross-sectional views for explaining the transfer pin of the second reference example. FIG. 7 shows a state immediately after the adhesive is attached to the bottom surface of the tip of the transfer pin, and FIG. 8 accommodates the adhesive attached on the thin film at the position where the opening surface of the transfer pin cavity is located in the cavity. Shows the state.

  As shown in FIG. 7, the transfer pin 18 of the second reference example has a substantially cylindrical shape, and forms a hollow portion 18c that is open at a substantially central portion of the bottom surface 18b of the tip end portion 18a. In this reference example, the hollow portion 18c is formed in a concave shape, but it may be formed in a cylindrical shape that is open on both the top surface and the bottom surface of the transfer pin. A thin film 18e made of silicone rubber is provided on the bottom end surface 18b of the transfer pin 18 so as to cover the transfer pin front end portion bottom surface 18b including the opening surface 18d of the cavity 18c and form a flat surface. Although the thin film 18e is made of silicone rubber in this reference example, it may be made of a material having a property that can expand and contract in accordance with fluctuations in external force. The thin film 18e is attached to the outer peripheral portion of the bottom surface 18b of the tip end portion of the transfer pin 18 so as not to be peeled off. The wire 26 is connected to the central portion of the thin film 18e on the cavity 18c side, and the thin film 18e at the position of the opening surface 18d of the cavity 18c is accommodated in the cavity 18c by winding the wire 26. It has a structure. In this reference example, the wire 26 is connected to the shaft of the motor 27 provided above the hollow portion 18c, and the motor 27 is driven and rotated to rotate the wire 26. When the motor 27 is driven to wind up the wire 26, the thin film 18e is pulled upward and extended, and the thin film 18e at the position of the opening surface 18d of the cavity 18c is accommodated in the cavity 18c. When the motor 27 is rotated in the reverse direction, the wire 26 returns to its original state, and the thin film 18e again covers the transfer pin tip portion bottom surface 18b to form a flat surface.

  A method for transferring the adhesive using the transfer pin 18 of the second reference example will be described. As shown in FIG. 7, the adhesive 4 on the tray 17 has the transfer pin 18 in a state where the thin film 18 e covers the transfer pin tip end bottom surface 18 b including the opening surface 18 d of the cavity 18 c to form a flat surface. The adhesive 4 is adhered to the entire surface of the thin film 18e covering the bottom surface 18b of the tip. Next, as shown in FIG. 8, the motor 27 is driven to wind up the wire 26, and the central portion of the thin film 18e is pulled upward, and the thin film 18e at the position of the opening surface 18d of the cavity 18c is attached thereto. It is accommodated in the cavity 18C together with the adhesive 4 that is present. In this manner, with the adhesive 4 adhering to the thin film 18e on the bottom surface 18b of the front end protruding from the outer surface of the transfer pin 18, the adhesive is transferred to the die attaching portion to form a pressure introduction hole. The adhesive is transferred and applied to the peripheral portion of the pressure introduction hole of the die attaching portion.

  As described above, when the adhesive is transferred using the transfer pin 18 of the second reference example, the position of the opening surface 18d of the cavity 18c, which is a position corresponding to the pressure introduction hole formed in the die attaching portion. The adhesive 4 adhered to the thin film 18e at the position is accommodated in the hollow portion 18C and is not transferred to the die attaching portion. Therefore, it is possible to reliably prevent the adhesive from being transferred to the position of the pressure introducing hole at the center of the die attaching portion, and to apply the adhesive to the die attaching portion in a uniform shape with a uniform thickness. Therefore, there is a problem that the breakdown voltage is reduced due to the poor adhesive strength between the pressure sensor chip and the package due to the non-uniform coating thickness, and the offset voltage of the pressure sensor chip caused by variations in the adhesive application shape. The problem of large variations is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

  Next, the transfer pin of the third reference example will be described with reference to the drawings. FIG. 9 is a cross-sectional view for explaining the transfer pin of the third reference example, and shows a state after applying an ultrasonic vibration to the tip after attaching an adhesive to the bottom of the tip of the transfer pin. Show.

  As shown in FIG. 9, the transfer pin of the third reference example is an ultrasonic oscillator that can apply ultrasonic vibration to a transfer pin main body 19 having a substantially cylindrical shape and a tip 19 a of the transfer pin main body 19. 28. The transfer pin main body 19 is formed with a hollow portion 19c having an opening surface 19d at the center of the bottom surface 19b of the tip portion to which the adhesive 4 is supplied. The hollow portion 19c in this reference example has a circular cross section and opens to both the top and bottom surfaces of the transfer pin main body 19, but may be a recess that does not open toward the top surface. The ultrasonic oscillator 28 that can apply ultrasonic vibration to the tip 19a of the transfer pin main body 19 is made of a piezoelectric element or the like.

  A method for transferring the adhesive using the transfer pin of the third reference example will be described. The tip bottom surface 19b of the transfer pin main body 19 is pressed against the adhesive 4 accumulated on the tray 17 to adhere the adhesive 4 to the tip bottom surface 19b, and then the transfer pin main body 19 is separated from the adhesive 4. In this case, the adhesive 4 is attached to the bottom surface 19b of the circular hole surrounding the opening 19d of the hollow portion 19c, and at the same time, the adhesive 4 crosses the opening 19d of the hollow 19c. A film may be formed. Therefore, as shown in FIG. 9, ultrasonic vibration is applied to the tip 19a of the transfer pin main body 19 by the ultrasonic oscillator 28, and the adhesive that has crawled up into the cavity 19c or across the opening surface 19d. Shake off the formed adhesive film. Thereafter, the adhesive 4 adhered to the bottom end surface 19b of the transfer pin main body 19 is transferred to the die attaching portion, and the adhesive 4 is applied to the peripheral portion of the pressure introducing hole of the die attaching portion in which the pressure introducing hole is formed. To do.

  As described above, when the adhesive is transferred using the transfer pin 19 of the third reference example, the adhesive film on the opening surface 19d of the cavity 19c is shaken off by applying ultrasonic vibration, and then the die is transferred. Since the adhesive can be transferred to the attaching portion, the adhesive can be applied to the die attaching portion with a uniform thickness and a uniform shape without filling the pressure introducing hole at the center of the die attaching portion. Therefore, there is a problem that the breakdown voltage is reduced due to the poor adhesive strength between the pressure sensor chip and the package due to the uneven coating thickness, and the offset voltage of the pressure sensor chip caused by the variation in the adhesive application shape. The problem of large variations is solved, and the characteristics of the semiconductor pressure sensor can be improved and the characteristics can be stabilized.

It is sectional drawing for demonstrating the 1st reference example, and has shown in a model the state which made the adhesive agent adhere to the front-end | tip part bottom face of a transfer pin. It is sectional drawing for demonstrating a 1st reference example, and has shown in a model the state which lowered | hung the movable needle. It is sectional drawing for demonstrating 1st Embodiment, and has shown the state in which the adhesive agent was made to adhere to the front-end | tip part bottom face of a transfer pin. It is sectional drawing for demonstrating 1st Embodiment, and has shown in a model the state which raised the movable part. It is sectional drawing for demonstrating 2nd Embodiment, and has shown the state which made the adhesive agent adhere to the bottom face of a transfer pin main body, and the bottom face of a movable ring. It is sectional drawing for demonstrating 2nd Embodiment, and shows the state before lowering a movable ring and transferring an adhesive agent to the die attaching part of a package. It is sectional drawing for demonstrating the 2nd reference example, and has shown the state in which the adhesive agent was made to adhere to the front-end | tip part bottom face of a transfer pin. It is sectional drawing for demonstrating a 2nd reference example, and has shown in a model the state which accommodated the adhesive agent adhering on the thin film of a position with the opening surface of a cavity part in a cavity part. It is sectional drawing for demonstrating the 3rd reference example, and shows the state after applying an ultrasonic vibration to the front-end | tip part, after attaching an adhesive agent to the front-end | tip part bottom face of a transfer pin. It is sectional drawing for demonstrating the structure of a semiconductor pressure sensor. It is a figure which shows an example of the conventional adhesive agent application method. It is a figure which shows another example of the conventional adhesive agent coating method different from FIG. It is a figure which shows an example of the conventional transfer pin, (a) is a side view, (b) is a top view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pressure sensor chip 4 Adhesive 5 Pressure introduction hole 6 Die attaching part 7 Diaphragm 15 Transfer pin 15a Tip part 15b Tip part bottom face 15c Cavity part 15d Opening surface 15e Movable part 15f Movable part tip surface 16 Transfer pin main body 16a Tip part 16b Tip Bottom surface 16e Movable ring 16f Movable ring bottom

Claims (2)

A hollow portion having a substantially circular cross section is formed at a substantially central portion of the bottom surface of the tip portion to which the adhesive is supplied, and the tip surface is slid along the wall surface of the cavity and the tip surface is the bottom surface of the tip portion. A semiconductor pressure sensor chip provided with a silicon diaphragm, using a transfer pin provided with a columnar movable part movable from the position of the opening surface of the cavity part to a position inside the cavity part at a height of In the adhesive transfer method of transferring the adhesive to the die attaching part in which the pressure introducing hole for mounting is formed,
In a state where the tip bottom surface of the transfer pin and the tip surface of the cylindrical movable part provided with the transfer pin inside thereof are substantially at the same height, the transfer pin is pressed against the adhesive, and the tip bottom surface of the transfer pin, After the adhesive is attached to the front end surface of the movable part, the transfer pin is separated from the adhesive, and then the adhesive attached to the front end surface of the movable part comes to a position inside the cavity formed in the transfer pin. The transfer method of the adhesive is characterized in that the cylindrical movable part is moved as described above, and then the adhesive adhered to the bottom surface of the tip of the transfer pin is transferred to the die attaching part. A transfer pin main body having a substantially cylindrical tip, and a movable ring mounted around the tip and movable in the axial direction of the tip, and having a flat bottom surface. A semiconductor pressure sensor provided with a silicon diaphragm, using a transfer pin that allows the position of the movable ring to be changed from a position at substantially the same height to a position where the bottom surface of the movable ring protrudes outward from the bottom surface of the tip. In the adhesive transfer method of transferring the adhesive to the die attaching portion in which the pressure introduction hole for mounting the chip is formed,
With the bottom surface of the tip and the bottom surface of the movable ring at substantially the same height, the bottom surface is pressed against the adhesive and the adhesive is attached to the respective surfaces, and then the transfer pin body and the movable ring are bonded to the adhesive. And then moving the movable ring to cause the adhesive adhered to the bottom surface of the movable ring to protrude, and then transferring the adhesive adhered to the bottom surface of the movable ring to the die attaching portion. .

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