JP3534820B2 - Laser processing method and laser processing apparatus for carrying out the method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method for irradiating an object to be processed with laser light to form recesses and the like, and a laser processing apparatus for carrying out the processing method.

[0002]

2. Description of the Related Art FIG. 12 shows, for example, Japanese Patent Laid-Open No. 3-114688.
It is a block diagram of the conventional laser processing apparatus shown by the publication, 1 is a laser beam, 2 is a nozzle, 3 is a reflecting mirror, 4 is a swing head, 5 is a housing, 6 is a stand, 7 is an object to be processed, 8 is a rotary table (processing table means),
Reference numeral 9 is a processing object moving table. The nozzle 2 is attached to the swing head 4, and a reflecting mirror 3 is attached inside the nozzle 2. Further, the nozzle 2 is installed so that its tip is directed toward the processing target 7. The swing head 4 is installed in a housing 5, and the housing 5 is installed in a stand 6. The rotary table 8 is mounted on the workpiece moving table 9, and the workpiece 7 is mounted on the rotary table 8.

Next, the operation will be described. The laser light 1 guided to the inside of the nozzle 2 by the reflecting mirror 3 is applied to the processing target 7 installed on the rotary table 8. At this time, the workpiece 7 is moved by relatively moving the swing head 4, the rotary table 8, and the workpiece moving table 9.
The desired laser light irradiation position can be moved to reciprocate the laser light 1 on the object 7 to form a desired recess in the object 7. Further, the assist gas can be guided together with the laser light through the nozzle 2, and the assist gas is blown to the laser irradiation portion of the processing object 7.

Further, in Japanese Unexamined Patent Publication No. 5-261578, when the object 7 to be processed is processed using the laser beam 1,
The current distance between the reference point and the laser light irradiation surface is obtained, the difference from the set target distance is further obtained, at least one operation amount corresponding to the difference is obtained, and the laser light 1 is determined by the operation amount. A method of controlling is disclosed.

[0005]

Since the conventional laser processing apparatus is constructed as described above, in order to form a recess in the object 7 to be processed, the laser beam 1 is scanned several times within the desired area. It is necessary. However, in such a case, if the scanning speed of the beam spot at the time of scanning the laser light is set inappropriately for the laser light oscillation condition, the workpiece 7 melts inside the recess formed therein. The residual remains, which hinders the irradiation of the laser beam 1 and reduces the processing speed. Furthermore, the melted object 7 adheres to the inner side surface and the bottom surface of the recess to cause the quality of the finished surface. However, there was a problem that

From this point of view, it has been difficult to accurately detect the machining amount and the progress state of machining only by the conventional method of measuring the machining depth by laser light. further,
Since the assist gas is blown from the nozzle 2 to the laser light irradiation portion, if the removal depth of the processing portion becomes deep, the assist gas is not sufficiently supplied to the laser light irradiation portion and incomplete combustion occurs at the laser light irradiation portion of the processing target 7. Cause the soot or the melted work piece 7 to adhere to the work side surface or the work bottom surface to deteriorate the work surface, and the combustion gas generated by the combustion of the work piece 7 diffuses to the surroundings without being collected. Therefore, there is a problem that the working environment is deteriorated.

The invention of claim 1 is made in order to solve the above-mentioned problems, and prevents the melted object to be processed from remaining inside the formed recess, and the complicated 3 An object is to obtain a laser processing method for processing a dimensional shape at high speed and with high accuracy.

It is an object of the present invention to provide a laser processing method which improves the accuracy of finishing a three-dimensional shape formed on a processing object.

According to a third aspect of the invention, the object to be processed is sputtered.
Laser processing for processing a good finished surface without adhesion
Aim to get a way.

According to the fourth aspect of the invention, the object to be processed has a complicated structure.
An object of the present invention is to obtain a laser processing method that removes stains such as spatters when processing a three-dimensional shape and processes a good finished surface.

[0011] The invention of claim 5 is reliably determine the diameter of the laser drilled hole which is formed in the object, and an object thereof is to obtain a laser machining method for determining the optimum laser beam scanning speed.

According to the sixth aspect of the present invention, it is possible to prevent a molten object to be processed from remaining inside the formed recess, and always maintain an optimum and stable processing state to form a complicated three-dimensional shape. An object is to obtain a laser processing method for processing at high speed and with high accuracy.

According to a seventh aspect of the present invention, even if the laser beam is invisible, the optimum and stable processing state is always maintained and complicated 3
An object is to obtain a laser processing method for processing a dimensional shape at high speed and with high accuracy.

It is an object of the invention of claim 8 to obtain a laser processing method for preventing incomplete combustion in a portion irradiated with a laser beam and for finishing a processed surface satisfactorily.

[0015] The invention of claim 9 is intended to obtain a laser processing method which can maintain good working environment.

[0016] The invention of claim 10 is intended to obtain a laser machining method for machining to high speed and high accuracy workpieces such as electrodes of the complex three-dimensional shapes.

The invention according to claim 11 prevents the melted object to be processed from remaining inside the formed recess,
An object of the present invention is to obtain a laser processing apparatus that can process a complicated three-dimensional shape at high speed and with high accuracy.

[0018] The invention of claim 12 is intended to obtain a laser machining apparatus for measuring the diameter of the laser drilled hole which is formed in the object accurately.

According to a thirteenth aspect of the present invention, it is possible to obtain a laser processing apparatus capable of processing a complicated three-dimensional shape at high speed and with high accuracy by always maintaining an optimum and stable processing state even when the laser beam is invisible. To aim.

It is an object of the invention of claim 14 to obtain a laser processing apparatus capable of preventing incomplete combustion in a portion irradiated with a laser beam and finishing a processed surface satisfactorily.

An object of the 15th aspect of the invention is to obtain a laser processing apparatus capable of maintaining a good working environment.

[0022]

According to a first aspect of the present invention, there is provided a laser processing method in which a laser beam is applied to a processing area portion of an object.
And irradiate the laser beam within the processing area
In the laser processing method for processing an object, the object to be processed
Of the laser processing hole formed when the laser beam is irradiated on
Scanning moving length of beam spot of laser light with respect to diameter d
Desired ratio K of the depth, the diameter d of the laser-machined hole, and
The laser beam repetition number f when the laser-processed hole is formed
And the laser beam scanning speed v is determined from K = 1-v / (d
The value of the laser beam overlap coefficient K given by xf) is 0.2
Laser oscillation conditions or laser beam travel so that it becomes 5 to 0.6
The inspection conditions are set.

The laser processing method according to the invention of claim 2 is
In the case of forming a three-dimensional shape part on the object to be processed, the ratio of the scanning movement length is set to be smaller in the rough processing mode of the object to be processed, and the laser beam scanning speed is determined by this. In the finishing mode of the object to be processed, the ratio of the scanning movement length is set to a larger value, and the side surface part of the three-dimensional shape part machined in the rough machining mode is set to 1 at the laser beam scanning speed determined by this. The laser beam is scanned more than once.

The laser processing method according to the invention of claim 3 is
The laser light is scanned so that the laser light approaches the side surface in order to limit the scattering direction of the spatter generated by the laser light scanning so as not to scatter on the side surface already formed on the target three-dimensional shape portion. To do.

The laser processing method according to the invention of claim 4 is
After forming a three-dimensional shape portion on the object to be processed, laser light is scanned along the contour portion of the three-dimensional shape portion.

The laser processing method according to the invention of claim 5 is
When the laser beam scanning speed is determined, the diameter of the laser processing hole formed when the laser beam is irradiated on the object to be processed is measured.

The laser processing method according to the invention of claim 6 is
Irradiate the laser beam to the processing area of the processing object and
A laser that scans a laser beam in the work area to process the workpiece.
In the processing method, the burning of the object to be processed during laser light irradiation
The shape of the flame generated by baking and the direction of the flame
At least one of them is detected, and the machining pair is detected from this detection result.
Determine the processing amount or processing surface shape of the elephant,
In order to obtain the desired processing state, it is necessary to maintain the prescribed combustion state.
The laser light irradiation state is adjusted.

The laser processing method according to the invention of claim 7 is
When the laser light is invisible, a powdery combustible substance is supplied near the optical path of the invisible laser light near the object to be processed, and the laser light path is visualized by burning the powdery combustible substance with the laser light. By monitoring the visualized laser beam path, the laser beam irradiation state is detected and the laser beam irradiation state is adjusted to maintain a predetermined combustion state.

The laser processing method according to the invention of claim 8 is
The combustion-supporting gas is supplied so that the periphery of the object to be processed when the laser light is irradiated is maintained in a combustion-supporting gas atmosphere having a sufficient concentration.

The laser processing method according to the invention of claim 9 is
Combustion gas generated by combustion of an object to be processed by laser light irradiation is recovered without being released into the atmosphere.

According to a tenth aspect of the present invention, there is provided a laser processing method in which a laser beam is applied to a processed region of a conductive material which is an object to be processed, and the laser beam is scanned within the processed region to process the conductive material. It is intended to manufacture electrodes for electric discharge machines.

In the laser processing apparatus according to the eleventh aspect of the present invention, the desired ratio of the scanning movement length of the beam spot of the laser light to the diameter of the laser processing hole formed when the processing target is irradiated with the laser light. And a laser beam irradiation state adjusting means for determining the laser beam scanning speed from the diameter of the laser beam processing hole and the laser beam repetition number when the laser beam processing hole is formed and instructing the laser beam scanning speed to the control means. It is a thing.

According to the twelfth aspect of the present invention, in the laser processing apparatus, the laser light irradiation state adjusting means measures the diameter of the laser processing hole formed when the processing object is irradiated with the laser light. And image processing means for processing the image information sent from the photographing means to obtain the diameter of the laser processed hole.

According to a thirteenth aspect of the present invention, in the laser processing apparatus, a powdery combustible substance is supplied near the optical path of the invisible laser light near the object to be processed, and the powdery combustible substance is burned by the laser light. The laser light visualization means for visualizing the laser light path is further provided, the laser light irradiation state adjusting means is provided with a monitor means for monitoring the visualized laser light path, and the information output by the monitor means is further provided. The laser light irradiation state is detected based on the above, and the laser light irradiation state is adjusted to maintain a predetermined combustion state.

According to the fourteenth aspect of the present invention, in the laser processing apparatus, the combustion supporting gas is supplied to maintain the surroundings of the object to be processed when the laser light is irradiated in a combustion supporting gas atmosphere having a sufficient concentration. It further comprises a means for supplying a characteristic gas.

The laser processing apparatus according to the fifteenth aspect of the present invention further comprises means for collecting the combustion gas generated by the combustion of the object to be processed by laser light irradiation without releasing it into the atmosphere.

[0037]

According to the laser processing method of the present invention, a desired ratio of the scanning movement length of the beam spot of the laser beam to the diameter of the laser processing hole, the diameter of the laser processing hole, and the laser processing hole when the laser processing hole is formed. The laser light scanning speed is determined from the laser light repetition number and the laser light is scanned. Therefore, it is possible to easily set the optimum laser light scanning speed, which is the optimum feed amount of the beam spot of the laser light according to the oscillation condition of the laser light, and to improve the processing speed in order to always perform the processing with a stable removal amount. Also, the processed surface can be finished well.

In the laser processing method according to the second aspect of the present invention, the optimum scanning speed of the beam spot of the laser light is set according to the oscillation condition of the laser light depending on the rough processing mode or the finishing mode. This makes it possible to improve the accuracy of finishing the three-dimensional shape formed on the object to be processed.

The laser processing method in the third aspect of the present invention, the laser beam scans the laser beam so as to be closer to the side face portions already formed a three-dimensional shape portion as a target.
Therefore, it is possible to process a good finished surface with no spatter attached to the object to be processed.

In the laser processing method according to the fourth aspect of the present invention, after forming the three-dimensional shape portion on the object to be processed, the laser beam is scanned along the contour of the three-dimensional shape portion. Therefore, when processing a complicated three-dimensional shape on the object to be processed, it is possible to remove dirt such as spatter and process a good finished surface.

In the laser processing method according to the fifth aspect of the present invention, the diameter of the laser processing hole during laser irradiation is measured. Therefore, the diameter of the laser-processed hole formed in the object to be processed during laser processing can be reliably obtained, and the optimum laser light scanning speed can be determined.

In the laser processing method according to the sixth aspect of the present invention, the combustion state is grasped by detecting the shape of the flame generated by the combustion of the workpiece, the flame blowing direction, the spatter generation amount, and the spatter scattering direction. , The processing state is determined by obtaining at least the processing amount and the processing surface shape of the processing object from this combustion state, and the laser light irradiation state is adjusted so as to maintain the predetermined combustion state in which the processing state is recognized to be stable. . Therefore, it is possible to prevent the melted material of the processing object from remaining inside the formed recess, always maintain an optimum and stable processing state, and process a complicated three-dimensional shape at high speed and with high accuracy.

In the laser processing method according to the invention of claim 7 , when the laser beam is invisible, the powdery flammable substance is burned by the laser beam to visualize the laser beam path and monitor it. The laser light irradiation state is detected, and the laser light irradiation state is adjusted to maintain a predetermined combustion state. Therefore, even if the laser beam is invisible, the optimum and stable processing state can always be maintained and a complicated three-dimensional shape can be processed at high speed and with high accuracy.

In the laser processing method according to the eighth aspect of the present invention, the periphery of the object to be processed is maintained in a combustion-supporting gas atmosphere having a sufficient concentration. Therefore, it is possible to prevent the incomplete combustion at the laser light irradiation portion and to finish the processed surface satisfactorily.

In the laser processing method according to the ninth aspect of the present invention, the combustion gas generated by the combustion of the object to be processed is recovered without being released into the atmosphere. Therefore, the working environment can be kept good.

The laser processing method according to the tenth aspect of the invention is applied to an object to be processed which is a conductive material. Therefore, the molten conductive material can be prevented from remaining inside the formed recess and a good finished surface can be obtained, so that an electrode having a complicated three-dimensional shape can be processed at high speed and with high precision.

According to the eleventh aspect of the present invention, there is provided a laser processing apparatus, wherein a desired ratio of the scanning movement length of the beam spot of the laser beam to the diameter of the laser processing hole, the diameter of the laser processing hole, and the laser processing hole when the laser processing hole is formed. The laser beam scanning speed is determined from the laser beam repetition number. Therefore, it is possible to prevent the melted object to be processed from remaining inside the formed recess and process a complicated three-dimensional shape at high speed and with high accuracy.

In the laser processing apparatus according to the twelfth aspect of the present invention, the diameter of the laser processing hole is measured by the photographing means, and the image information sent from the photographing means is processed by the image processing means to obtain the diameter of the laser processing hole. Therefore, it is possible to accurately measure the diameter of the laser processing hole formed in the processing target.

According to the thirteenth aspect of the present invention, the laser beam path is visualized by burning the supplied powdery combustible substance with the laser beam, and this is monitored by the monitor means to detect the laser beam irradiation state. To be done. Further, the laser light irradiation state is adjusted to maintain a predetermined combustion state. Therefore, even if the laser beam is invisible, the optimum and stable processing state can always be maintained and a complicated three-dimensional shape can be processed at high speed and with high accuracy.

In the laser processing apparatus according to the fourteenth aspect of the present invention, the periphery of the object to be processed is maintained in a combustion-supporting gas atmosphere having a sufficient concentration. Therefore, it is possible to prevent the incomplete combustion at the laser light irradiation portion and to finish the processed surface satisfactorily.

According to the fifteenth aspect of the present invention, the laser processing apparatus collects the combustion gas generated by the combustion of the object to be processed without releasing it into the atmosphere. Therefore, the working environment can be kept good.

[0052]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. Figure 1
Is a block diagram schematically showing a configuration of a laser processing apparatus according to an embodiment of the invention of claims 1 to 15 , in which 100 is a laser beam irradiation unit, 200 is a laser processing unit,
300 is an assist gas supply unit (flammable gas supply means),
Reference numeral 400 is a combustion gas recovery unit (recovery unit), 500 is an invisible laser light visualization unit (laser light visualization unit), and 600 is a laser light irradiation state adjustment unit (laser light irradiation state adjustment unit). It consists of six components. The laser light irradiation unit 100 is connected to the pulse oscillator laser oscillator (laser light source) 10 for emitting the laser light 1, and is electrically connected to the laser oscillator 10 to control the laser output emitted from the laser oscillator 10. Laser output control device 11, laser oscillator 1
Reflecting mirror (transmitting means) 3 for transmitting the laser beam 1 emitted from 0 to the laser processing section 200, and the processing object provided with the laser beam 1 reflected by the reflecting mirror 3 in the laser processing section 200. It includes a condenser lens (irradiation means) 12 for condensing and irradiating the light.

The laser processing section 200 is the laser processing chamber 1
3, two rotary tables (processing table means) 8a and 8b, two object moving tables (processing table means) 9a and 9b, and a table movement control device (control means) 14 are included. The rotary table 8 rotates about a central axis in the z-axis direction shown in the figure.
b is configured to rotate about a central axis in the x-axis direction.

The object moving tables 9a and 9b and the rotary tables 8a and 8b are electrically connected to the table movement control device 14, and the movement direction and rotation direction thereof are controlled by the table movement control device 14. Also,
A laser processing chamber 13 is installed on the rotary table 8a,
The processing target 7 is installed inside thereof. The entrance window (not shown) through which the laser light 1 enters the laser processing chamber 13 is made of a substance such as quartz glass or Pyrex glass through which the laser light 1 is transmitted. The laser light 1 emitted from the laser light irradiation unit 100, further transmitted, and condensed is guided into the laser processing chamber 13 through the entrance window of the laser processing chamber 13 and reaches the processing target 7.

In this embodiment, the reflecting mirror 3 is used as a transmission means of the laser light 1 emitted from the laser oscillator 10,
Although the workpiece moving tables 9a and 9b and the rotary tables 8a and 8b are used as means for moving the workpiece 7, the laser beam 1 is scanned, but the present invention is not limited to this. . As another laser beam scanning method, for example, the oscillated laser beam 1 is guided to a laser focusing head provided at the end of an arm of a horizontal articulated robot by using an optical fiber to freely move the robot arm. By moving, the beam spot may be moved on the object 7 to be scanned with the laser light.

The assist gas supply unit 300 includes an assist gas supply port 15 attached to the laser processing chamber 13 and an assist gas supply device 17 connected to the assist gas supply port 15. The assist gas supply device 17 stores oxygen gas, for example. The combustion gas recovery unit 400 includes a combustion gas exhaust port 16 attached to the laser processing chamber 13.
And a combustion gas recovery device 18 connected to the combustion gas discharge port 16. The invisible laser optical path visualization unit 500 includes a combustible powder supply device 19 in which a combustible powder (powdered combustible substance) 24 is stored. The combustible powder supply device 19 includes an opening / closing valve 20 and an assist gas supply port. It is connected to the laser processing chamber 13 via 15.

The laser light irradiation state adjusting unit 600 includes a fiberscope 21 installed around the laser processing chamber 13,
A laser processing hole diameter measuring camera (imaging means) 39 installed above the reflecting mirror 3, a measurement monitor 22 electrically connected to the fiberscope 21 and the laser processing hole diameter measuring camera 39, and An image processing device (image processing means) 23 electrically connected to the monitor 22 is provided. The image processing device 23 is electrically connected to the table movement control device 14. The monitor means includes a fiberscope 21 and a measurement monitor 22.

Next, the operation will be described. In the laser light irradiation unit 100, the laser light 1 whose output has been adjusted by the laser output control device 11 and the laser oscillator 10 is guided to the condenser lens 12 by the reflecting mirror 3 and is further processed in the laser processing chamber 13. The object 7 is focused and irradiated.
The laser processing unit 200 moves the laser processing chamber 13 by the rotary tables 8a and 8b, the processing object movements 9a and 9b, and the table movement control device 14, and the laser light 1 on the processing object 7 installed therein. A complicated three-dimensional shape is processed by controlling the irradiation position of.

In the assist gas supply section 300, an assist gas such as high-purity oxygen gas is supplied into the laser processing chamber 13 from the upper side surface of the laser processing chamber 13 through the assist gas supply port 15. Supplied from 17. As a result, the inside of the laser processing chamber 13 is filled with oxygen gas, so that when the processing target 7 is irradiated with the laser beam 1, the processing target 7 is completely burned and desired molding is performed. Therefore, incomplete combustion of the workpiece 7 is suppressed by the supplied oxygen gas, which prevents soot from adhering to the glass for the laser light incident window of the laser processing chamber 13 due to sputtering or combustion.

In the combustion gas recovery unit 400, the combustion gas generated by laser processing is discharged from the combustion gas discharge port 16 to the combustion gas recovery device 18. The combustion gas recovery device 18 includes a water tank filled with water for dissolving carbon dioxide gas, and the combustion gas discharged from the laser processing chamber 13 is allowed to pass through the water in the water tank. This makes it possible to prevent the carbon dioxide gas in the combustion gas from being released into the atmosphere because the carbon dioxide gas is dissolved in water. Further, if the carbon dioxide concentration of the carbon dioxide gas-dissolved water approaches the saturated concentration, this water is exchanged. The dissolved state of carbon dioxide can be easily understood from the discolored state of the aqueous solution according to the dissolved amount of carbon dioxide gas by mixing BTB solution or lime water into the carbon dioxide dissolved water of the combustion gas recovery device 18, for example. It is possible to know when to replace the carbon dioxide gas-dissolved water.

In the invisible laser optical path visualization unit 500, the combustible powder supply device 19 stores the combustible powder 24 such as graphite powder, and the opening / closing valve 20.
Is opened, the combustible powder 24 is sucked from the combustible powder supply device 19 by the flow of the assist gas supplied from the assist gas supply device 17 to the laser processing chamber 13, and is conveyed to the laser processing chamber 13 together with the assist gas. It is sprayed in the processing chamber 13. In this way, the combustible powder 24 existing in the laser optical path in the laser processing chamber 13 is burned by the irradiated laser light 1, whereby the invisible laser optical path is visualized.

In the laser light irradiation state adjusting unit 600, the diameter of the processed hole formed by irradiating the object to be processed 7 with at least one pulse of the laser light 1 before the laser light scanning is started is determined by the laser processing hole diameter measuring camera 39. Taken by. This image is sent to the measurement monitor 22 and the image processing device 23, the diameter of the laser processing hole is measured, and is used for setting the laser beam scanning speed.

The image processing device 23 is the laser output control device 1.
1 is electrically connected to the laser output control device 11
The number of repetitions (or repetition oscillation frequency) of the laser light of the laser oscillator 10 can be known from the information. Further, a fiberscope 21 and a measurement monitor 22 installed around the laser processing chamber 13 cause a flame generation state when the object 7 to be laser processed inside the laser processing chamber 13 is burned,
Alternatively, the progress state of processing is grasped by monitoring the scattered state of spatters, and a visualized image of the invisible laser optical path visualized by the invisible laser optical path visualization unit 500 is captured, and the captured image is imaged by the image processing device 23. The measurement is performed to correct the focusing device and the laser beam irradiation angle, and the laser beam irradiation state is adjusted so as to maintain the optimum processing state.

Next, the laser processing method according to the invention of claim 1 and the laser beam irradiation state adjusting means according to the invention of claim 11 which are implemented by the laser processing apparatus shown in FIG. 1 will be described in detail. FIG. 2 shows the behavior of the beam spot moving on the processing target 7. The focused laser beam 1 is focused on, for example, the laser irradiation surface 25 whose focal position has already been processed and exposed.
Scanning is performed along the laser beam scanning path 27 as shown in FIG. Incidentally, reference numeral 26 indicates a surface not irradiated with laser light.

Using the laser processing hole diameter d, the laser light repetition number f, and the laser light scanning speed v on the object 7 measured by the above-described method, two continuous pulses for the laser processing hole diameter d are used. The overlapping ratio of the beam spots of the laser light 1 (the ratio of the scanning movement length), that is, the laser light overlapping coefficient K is expressed by the following equation K = 1-v / (d × f).

According to the experiment by the inventor, the laser beam scanning speed v is set so that the laser beam overlapping coefficient K takes a value near 0.5.
There was a tendency that the processing speed became maximum when was set. For example, when the diameter of the processed hole formed by irradiating the graphite 7 as the object to be processed 7 with the laser power of 50 W and the focus position of the laser light 1 on the graphite surface and irradiating the laser light is K = 0.5, the above laser is set as K = 0.5 When performing laser light scanning at the laser light scanning speed (or beam spot feed speed) obtained from the formula of the light overlap coefficient, the focus position was fixed at the processing start position regardless of the change in the position of the laser light irradiation surface accompanying the processing progress. Processing speed is about 30mg / m by repeating laser light scanning 8 times per surface
In, it is possible to realize processing with a processed side surface roughness of about 30 μm Rmax and a processed bottom surface roughness of about 40 μm Rmax.

FIG. 3 is a graph in which the relationship between the laser beam overlap coefficient K and the removal amount (arbitrary unit) is classified according to the number of laser beam scans with graphite as the processing target (the removal amount corresponds to the removal speed). . The horizontal axis represents the laser light overlap coefficient, and the vertical axis represents the removal amount. From this figure, the laser beam scanning conditions and the laser beam scanning speed are set so that the laser beam overlapping coefficient K becomes a value in the range of 0.25 to 0.6, and the laser beam scanning is performed to melt the object to be processed. Thing 7
It can be seen that is efficiently discharged to the outside of the processing area, the residue of the melt in the processing area is prevented, and the optimum processing speed is obtained. Also,
Such a method of determining the laser beam scanning speed or the laser beam oscillation condition can also be applied to other workpieces 7 such as iron, steel, and silicon nitride.

In the above embodiment, the laser light overlapping coefficient K
Is the image processing device 23 of the laser light irradiation state adjusting unit 600.
Is configured in advance. That is, the laser beam overlap coefficient K can be set according to the processing conditions of the object to be processed, the laser oscillation conditions, and the finishing conditions of the processed surface as described later. This setting is preferably configured so that it can be programmed according to the machining process or input by an operator. It is obvious to those skilled in the art that the image processing device 23 does not necessarily have such a function, and a computer device and an appropriate input device may be provided for this purpose.

FIGS. 4a to 4c show changes in the shape of the combustion flame 38 of the object 7 to be processed, which changes depending on the progress of laser processing. As shown in FIG. 4a, the laser irradiation surface 25
When is at the focal position 30 of the laser light 1, in general,
There is a tendency that the short combustion flame 38 is blown up at a relatively shallow angle α ₁ and the spatter 32 is scattered over a wide angle range. As the laser irradiation surface deviates from the focal position 30 as the processing progresses, the combustion flame 38 blows up longer as shown in FIG. 4B, and the spatter 32 is limited to the direction of the combustion flame 38. When the processing further progresses and the laser irradiation surface largely deviates from the focal position 30, the combustion flame 38 blows up vertically for a long time, and the spatter 32 hardly occurs. In the example shown in FIGS. 4a to 4c, generally, the angle α of the combustion flame 38 with respect to the irradiation surface is α ₃ >.
The relationship of α ₁ and α ₂ holds, and the length L of the combustion flame 38 has the relationship of L ₁ <L ₂ <L ₃ .

By monitoring this state change with the fiberscope 21 and the measurement monitor 22 as shown in FIG. 1, it becomes possible to grasp the progress of processing, and it is a standard for the correction of the focus position on the processing surface and the correction of the laser beam irradiation angle. Becomes For example, when the rising angle α of the combustion flame 38 is 80 ° or more with respect to the laser irradiation surface 25, the focus position correction amount is sent to the table movement control device 14 to correct the focus position 30, or the laser beam scanning is continued. However, the laser processing can be automated such that the processing is stopped if the shape of the combustion flame 38 continues to be in a certain state.

Next, the invisible laser optical path visualization method will be described in detail. Laser processing chamber 13 during laser light irradiation
For example, as described above, when a powder of a combustible substance such as graphite is mixed with oxygen gas and sent from the assist gas supply port 15, the combustible powder 19 scattered in the laser processing chamber 13 is emitted from the laser optical path. Since only the entered material burns, the laser light path is visualized by the flame generated during burning as shown in FIG. The invisible laser light is processed by photographing the visualized laser light path shown by hatching in FIG. 5 by, for example, the fiberscope 21 and the measurement monitor 22, and sending the photographed image to the image processing device 23 to measure the image. Information such as the incident angle with respect to the surface of the object 7, the focal position, and the beam spot diameter can be obtained safely and accurately. Further, by changing the installation position of the fiberscope 21 and capturing a visualized image, the laser light irradiation angle and the like can be known in more detail. Further, since the visualized laser light 1 can be photographed by an instant camera, the irradiation state of the laser light 1 can be obtained in a short time at low cost. With this method, the irradiation state of the laser beam 1 can be grasped safely and accurately, and the adjustment of the laser beam irradiation state can be performed reliably, so that the processing accuracy can be improved. The combustible powder 19 that has not burned is sent from the combustion gas discharge port 16 to the combustion gas recovery device 18 and is recovered together with the combustion gas.

The laser processing apparatus configured as described above facilitates the setting of the optimum scanning speed of the laser beam 1 according to the oscillation conditions of the laser beam 1, and allows the processing with a stable removal amount to always proceed. The processing speed can be improved and the processed surface can be finished well. Furthermore, according to such a laser processing apparatus, the laser beam irradiation means and the laser beam irradiation state adjusting means can accurately and easily adjust the laser beam irradiation state on the processing target 7 and improve the processing accuracy. That is, since the laser light irradiation means and the laser light irradiation state adjusting means can constantly monitor the laser light irradiation state and the processing state, it is possible to quickly deal with any abnormalities in processing, and the finishing state of the processed surface. Therefore, it is possible to correct the number of times of laser irradiation, the irradiation direction, and the focus position as necessary. Further, the incomplete combustion of the object 7 to be processed is improved by the supply of the combustion-supporting gas, and the melted material and soot of the object 7 are not attached to the surface to be processed, so that a good surface can be obtained. Further, the gas generated by the combustion of the object to be processed is recovered by the recovery means, and the working environment is kept good without being diffused to the outside.

Example 2. Next, a laser processing method according to an embodiment of the present invention will be described. The laser processing method according to this embodiment can be implemented using the laser processing apparatus according to the first embodiment shown in FIG. Therefore, the description of the laser processing apparatus is omitted. When the laser light scanning is performed under the processing conditions of the above-described first embodiment, the processed surface roughness becomes the value shown in the first embodiment, but the processed surface roughness is increased by increasing the value of the laser light overlapping coefficient K and performing the laser light scanning. Can be further improved.

FIG. 6 is a graph showing the measured value of the processed side surface roughness formed by scanning laser light when graphite is selected as the processing target 7 as an example. The horizontal axis represents the laser light overlapping coefficient, and the vertical axis represents the processed surface roughness μmRmax. This figure shows 8 laser light scans per surface.
The measurement result of the processed side surface roughness when the laser light 1 is scanned by increasing the value of the laser light overlap coefficient K at the last one laser scanning is shown. From this, the laser light overlap coefficient K is brought close to 1. It can be seen that the processed side surface roughness improves to 10 μmRmax. For example, K = 0.25 to 0.
After rough machining at about 6, the surface finish can be greatly improved without lowering the overall machining speed by scanning the finished surface with laser light several times with K = 0.75 to 0.98. . The laser beam scanning method for improving the processed surface roughness can also be applied to other processed objects 7 such as iron, steel, and silicon nitride.

Reference Example 1. 7A to 7C are explanatory views showing the laser processing method according to Reference Example 1, and show the laser light irradiation method for vertically processing the side surfaces of the three-dimensional shape to be formed.
The laser processing method according to this embodiment can be implemented using the laser processing apparatus according to the first embodiment shown in FIG. Therefore, the description of the laser processing apparatus is omitted.

Since the side surface to be machined cannot be formed vertically only by irradiating the surface of the object 7 with the laser beam 1 vertically, the laser beam 1 is incident on the surface of the object 7 as shown in FIG. 7a. The angle θ _{1 is set} to, for example, about 30 ° and laser light scanning is performed to form an inversely tapered side surface.
When the tip of the reverse taper portion reaches the vicinity of the side surface of the processing target shape 29, the incident angle θ ₂ of the laser beam 1 is corrected by about 5 ° as shown in FIG. Optical scanning is performed so as to scrape off the upper part of the side surface. Next, FIG.
As shown in FIG. 3C, the laser beam 1 is irradiated so that the outer periphery of the laser beam 1 at a position deviated from the focus position 30 comes into contact with the processing side surface as the finishing process, and the focus position 30 is moved above the surface of the processing target 7. The laser beam 1 is scanned with the power density distribution of the laser beam 1 lowered so that the upper part of the side surface is not processed to a size larger than the predetermined size. At this time, the output control of the laser light 1 is executed via the laser output control device 11.

Example 3. 8a and 8b are explanatory views showing a laser processing method according to an embodiment of the invention of claim 3 , and the object to be processed 7
It is shown that the direction in which is melted and scattered as the sputter 32 is controlled by the laser beam scanning direction, and the spatter 32 is prevented from reattaching to the processed side surface. The laser processing method according to this embodiment can be implemented using the laser processing apparatus according to the first embodiment shown in FIG. Therefore, the description of the laser processing apparatus is omitted.

When a three-dimensional shape is formed by laser light scanning, as shown in FIG. 8a, the processing bottom surface has a different processing depth due to a difference in the number of scans of the laser light 1, and therefore the vicinity of the irradiated beam spot. In this case, the minute step 31 is generated, and the scattering direction of the sputter 32 is limited by the minute step 31, and when the laser beam 1 is scanned in the direction away from the already formed side surface, the sputter 32 scatters in the side surface direction. Therefore, as shown in FIG. 8B, the laser beam 1 is scanned so that the laser beam 1 is always brought close to the formed side surface, and the minute step 31 is processed into the processing target shape 29, whereby the spatter 32 is scattered toward the processing side surface. It is possible to obtain a good finished surface that does not adhere to the spatter 32.

Example 4. Next, a description will be given of a laser processing method of an embodiment of the invention of claim 4. The laser processing method according to this embodiment can be implemented using the laser processing apparatus according to the first embodiment shown in FIG. Therefore, the description of the laser processing apparatus will be omitted below. When the processing area is narrow or complicated, for example, when the method of Reference Example 1 is applied, the finish processing of Example 2 is performed because the spatter 32 adheres to the facing processing side surface. By performing laser light scanning on the contour portion of the processing area at a scanning speed of the beam spot of the laser light such that the laser light overlapping coefficient K becomes, the dirt such as the spatter 32 adhering to the side surface can be removed. A good finished surface can be obtained.

Example 5. FIG. 9 is a view showing a fine-shaped electrode manufactured by applying a laser processing method for electrode processing for a die-sinking electric discharge machine according to an embodiment of the invention of claim 10 . In addition, in this embodiment, the laser processing apparatus according to the first embodiment described above may be applied, and further, the laser processing methods according to the second to fourth embodiments described above may be applied. Therefore, the description of the laser processing apparatus is omitted.

As shown in FIG. 9, for example, when the electrode material is graphite, a linear thin film having a laser power of 50 W and a beam spot diameter of 150 μm and a thickness of 100 μm or less under the laser beam scanning conditions shown in the first embodiment. Several ribs could be processed at intervals of about 200 μm.
Electrodes of this shape are difficult to machine by machining, and
According to the laser machining method of this embodiment, the machining time can be greatly shortened when the number of ribs is large or when irregularly arranged ribs are machined, as compared with wire electric discharge machining.

Example 6. Figure 10a and 10b are diagrams showing an electrode having another embodiment complicated shapes fabricated by applying the laser processing method of the invention of claim 10. Also in this embodiment, the laser processing apparatus according to the first embodiment can be applied as in the fifth embodiment, and the laser processing methods according to the second to fourth embodiments can be applied. Therefore, the description of the laser processing apparatus is omitted. For machining a rib electrode having a complicated shape such as a curved shape, by combining with an NC device, as shown in FIG.
It is possible to easily process curved slit machining electrodes such as those shown in Fig. 10 and machining electrodes such as those shown in Fig. 10b, and also for irregularly arranged rib electrodes, chemical fiber nozzle machining electrodes, gas or fuel spray nozzle machining electrodes, etc. It can be applied, and not only the shape that is difficult to machine by conventional wire electric discharge machining, but also the machining process can be greatly shortened compared to electrode machining by wire electric discharge machine.

Example 7. Figure 11a and 11b are views illustrating an electrode fabricated by applying a laser processing method for further another embodiment, electrode processing for die sinking electric discharge machine of the invention of claim 10.
Also in this embodiment, as in the case of the fifth and sixth embodiments, the laser processing apparatus according to the first embodiment can be applied, and further, the laser processing methods of the second to fourth embodiments can be applied. Therefore, the description of the laser processing apparatus is omitted.

As shown in FIG. 11a, by irradiating the workpiece 7 with the laser light 1 from the outside or inside of the bottom of the concave portion of the concave electrode 33, or from both sides thereof,
Through holes having a diameter of several hundred μm and a length of about 10 mm can be processed at high speed. This can be applied to the processing of the gas vent hole 34 for preventing the gas generated at the time of electric discharge machining from staying in the concave portion of the concave electrode 33. For example, in the case of processing a die having a convex portion, the concave portion is conventionally formed. The projections were formed by using the divided electrodes in order so that they cannot be formed. However, this gas venting hole processing method allows processing with the concave electrode 33, and shortens the processing time without requiring complicated setup. .

[0085]

As described above, according to the first aspect of the invention, the laser beam is applied to the processing area of the object to be processed,
The object to be processed is processed by scanning the laser beam within the processing area.
In the laser processing method, a laser beam is applied onto the object to be processed.
The diameter d of the laser processed hole formed when
The desired length of the scanning movement length of the beam spot of the laser light
K, the diameter d of the laser processing hole, and the laser processing
Laser from the laser beam repetition number f when the hole is formed
Determine the optical scanning speed v and give it as K = 1-v / (d × f)
The value of the laser light overlapping coefficient K is 0.25 to 0.6
Laser oscillation conditions or laser light scanning conditions
Since it is configured so that it is possible to easily set the optimum moving length that is the optimum feed amount of the beam spot of the laser light according to the oscillation conditions of the laser light, and to always perform processing with a stable removal amount. There is an effect that the speed can be improved and the processed surface can be finished well.

According to the invention of claim 2, the object to be machined is
When forming a three-dimensionally shaped portion, the ratio of the scanning movement length is set to a smaller value in the rough machining mode of the workpiece, and the laser beam is scanned at the laser beam scanning speed determined by this to finish the workpiece. In the mode, the ratio of the scanning movement length is set to be larger so that the side surface portion of the three-dimensional shape portion processed in the rough processing mode is scanned with the laser light one or more times at the laser light scanning speed determined by the ratio. Since it is configured, there is an effect of improving the accuracy of finishing the three-dimensional shape formed on the object to be processed.

According to the third aspect of the present invention, the side surface portion is formed so as to limit the scattering direction of the spatter so that the spatter generated by the laser beam scanning does not scatter on the side surface portion of the target three-dimensionally formed portion which is already formed. On the other hand, since the laser beam is configured to scan so that the laser beam approaches, there is an effect that a good finished surface without spatter adhered to the object to be processed can be processed.

According to the invention of claim 4 , the object to be machined is 3
Since the laser beam is scanned along the contour portion of the three-dimensional shape portion after forming the three-dimensional shape portion, stains such as spatter are removed when processing a complicated three-dimensional shape on the object to be processed. It has the effect that a good finished surface can be processed.

According to the invention of claim 5 , when the laser beam scanning speed is determined, the diameter of the laser processed hole formed when the laser beam is irradiated onto the object to be processed is measured. Therefore, there is an effect that the diameter of the laser processing hole formed in the processing object can be surely measured and the optimum laser light scanning speed can be determined.

According to the invention of claim 6 , the laser beam is processed.
It irradiates the processing area of the object, and the laser is irradiated within the processing area.
The laser processing method that scans the light and processes the processing object
Occurs due to combustion of the workpiece during laser irradiation.
At least one of the flame shape and the direction of the flame
One is detected, and based on this detection result
Rui or machined surface shape is determined and the desired processing state
Laser irradiation to maintain a predetermined combustion state in order to obtain
Since it is configured to adjust the state, it is possible to prevent the melted object from remaining inside the recess where it was formed, and to always maintain an optimal and stable processing state and to create complex three-dimensional shapes. There is an effect that processing can be performed at high speed and with high accuracy.

According to the seventh aspect of the present invention, when the laser light is invisible, the powdery combustible substance is supplied to the vicinity of the optical path of the invisible laser light near the object to be processed, and the powdery combustible substance is converted into the laser beam. The laser light path is visualized by burning with light, and the laser light irradiation state is detected by monitoring the visualized laser light path, and the laser light irradiation state is adjusted to maintain a predetermined combustion state. Therefore, even if the laser beam is invisible, there is an effect that an optimal and stable processing state is always maintained and a complicated three-dimensional shape can be processed at high speed and with high accuracy.

According to the eighth aspect of the invention, since the combustion-supporting gas is supplied so as to maintain the surroundings of the object to be processed in the atmosphere of the combustion-supporting gas having a sufficient concentration, the laser beam irradiation portion It has the effect of preventing incomplete combustion and finishing the machined surface satisfactorily.

According to the ninth aspect of the present invention, the combustion gas generated by the combustion of the object to be processed by the laser light irradiation is collected without being released into the atmosphere, so that the working environment can be kept good. is there.

According to the tenth aspect of the present invention, since the object to be processed is a conductive material, it is possible to prevent a molten material of the conductive material from remaining inside the formed recess and to form a complicated three-dimensional shape. There is an effect that the electrode of can be processed at high speed and with high accuracy.

According to the eleventh aspect of the present invention, the desired ratio of the scanning movement length of the beam spot of the laser light to the diameter of the laser processing hole formed when the laser light is irradiated onto the object to be processed and the laser processing. The laser beam scanning speed is determined from the diameter of the hole and the laser beam repetition number when the laser processing hole is formed, and the laser beam irradiation state adjusting means for instructing the laser beam scanning speed to the control means is provided. So
It is possible to prevent the melted object to be processed from remaining inside the formed recess and to process a complicated three-dimensional shape at high speed and with high accuracy.

According to the twelfth aspect of the present invention, the laser light irradiation state adjusting means measures the diameter of the laser processing hole formed when the processing object is irradiated with the laser light, and the imaging means. Since the image processing means for processing the image information sent from the means to obtain the diameter of the laser-machined hole is provided, it is possible to accurately measure the diameter of the laser-machined hole formed in the object to be machined. is there.

According to the thirteenth aspect of the present invention, a powdery combustible substance is supplied near the optical path of the invisible laser light in the vicinity of the object to be processed, and the powdery combustible substance is burned by the laser light to produce a laser beam. The laser light visualization means for visualizing the optical path is further provided, the laser light irradiation state adjusting means is provided with monitor means for monitoring the visualized laser optical path, and further, the laser light is based on the information output from the monitor means. The irradiation state is detected and the laser beam irradiation state is adjusted to maintain a predetermined combustion state. Therefore, even if the laser beam is invisible, an optimal and stable processing state is always maintained and complicated three-dimensional There is an effect that the shape can be processed at high speed and with high accuracy.

According to the fourteenth aspect of the present invention, there is provided a combustion-supporting gas supply means for supplying the combustion-supporting gas so as to maintain the periphery of the object to be processed in a combustion-supporting gas atmosphere having a sufficient concentration. Therefore, there is an effect of preventing incomplete combustion at the laser light irradiation portion and finishing the processed surface satisfactorily.

According to the fifteenth aspect of the present invention, since the means for collecting the combustion gas generated by the combustion of the object to be processed is not released into the atmosphere, it is possible to maintain a good working environment. .

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a laser processing apparatus according to an embodiment of the invention according to claims 1 to 15 .

FIG. 2 is an explanatory diagram showing a behavior of a beam spot when scanning a laser beam on a processing object.

FIG. 3 is a graph of experimental results showing the relationship between the laser light overlap coefficient and the removal amount.

FIG. 4 is a diagram showing a state of a combustion flame during laser processing.

FIG. 5 is a configuration diagram for explaining invisible laser optical path visualization according to an embodiment of the invention of claim 7 ;

FIG. 6 is a graph of an experimental result showing a relationship between a laser light overlapping coefficient and a processed surface roughness.

FIG. 7 is an explanatory diagram of laser light scanning by a laser processing method for forming a vertical side surface, which is Reference Example 1 .

FIG. 8 is an explanatory diagram of laser light scanning accompanied by adhesion of spatter to a processed side surface.

FIG. 9 is a diagram showing an example of a thin rib electrode for an electric discharge machine machined according to an embodiment of the invention of claim 10 ;

FIG. 10 is a view showing an example of a complex fine shape electrode for an electric discharge machine, which is machined according to another embodiment of the invention of claim 10 ;

FIG. 11 is an explanatory view showing an example of processing a gas vent hole of a concave electrode for an electric discharge machine according to another embodiment of the invention of claim 10 ;

FIG. 12 is a configuration diagram of a conventional laser processing apparatus.

[Explanation of symbols]

1 laser light, 3 reflecting mirror (transmission means), 7 processing object, 8a, 8b rotary table (processing table means),
9a, 9b Workpiece moving table (processing table means), 10 Laser oscillator (laser light source), 12 Condensing lens (irradiating means), 14 Table movement control device (controlling means), 15 Assist gas supply port (flammability) Gas supply means), 16 combustion gas discharge port (recovery means), 17 assist gas supply device (combustible gas supply means), 18 combustion gas recovery device (recovery means), 19 combustible powder supply device (laser light visualization means) ), 20 open / close valve (laser light visualization means), 21 fiberscope (monitor means), 22 measurement monitor (monitor means), 23 image processing device (image processing means), 24 combustible powder (powdered combustible substance) ), 32 Sputter, 39 Laser processing hole diameter measurement camera (imaging means).

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B23K 26/00-26/42

Claims (15)

(57) [Claims] 1. A laser processing method of irradiating a processing region of an object to be processed with laser light, scanning the laser beam within the processing region to process the object, and irradiating the object to be processed with laser light. The desired ratio K of the scanning movement length of the beam spot of the laser beam to the diameter d of the laser processed hole, the diameter d of the laser processed hole, and the laser used when the laser processed hole is formed. The laser light scanning speed v is determined from the light repetition number f, and the value of the laser light overlap coefficient K given by K = 1−v / (d × f) is 0.25 to
Laser oscillation conditions or laser beam scanning conditions so as to be 0.6
A laser processing method characterized by setting the conditions . 2. When forming a three-dimensional shape portion on the object to be processed, the ratio of the scanning movement length is set to be smaller in the rough processing mode of the object to be processed, and the laser beam scanning speed determined by this is set. In the finishing mode of the object to be processed, the ratio of the scanning movement length is set to a larger value, and the three-dimensional processing is performed in the rough processing mode at the laser light scanning speed determined thereby. The laser processing method according to claim 1, wherein the side surface portion of the shaped portion is scanned with laser light one or more times. 3. A laser beam approaches a side surface portion of a target three-dimensionally shaped portion which is already formed so as to limit a scattering direction of the spatter so as not to scatter the spatter generated by laser beam scanning. laser processing method according to claim 1 or claim 2, characterized in that the laser beam is scanned so. 4. After forming the three-dimensional shape portion in said workpiece, according to any one of claims 1 to 3, characterized in that along the contour of the three-dimensional shape portion for scanning the laser beam Laser processing method. 5. The laser processing method according to claim 1 , wherein the diameter of the laser processing hole formed when the laser beam is irradiated onto the object to be processed is measured when the laser beam is scanned. The laser processing method according to claim 1. 6. A laser beam is applied to a processing area of an object to be processed.
Irradiate and scan with laser light in the processing area
In the laser processing method for processing the shape of the flame generated by the combustion of the object during laser irradiation, and detects at least any one balloon way direction of the flame, the detection
Results to determine the working condition of the pressurized coating amount or machined surface shape of the object, to a feature to adjust the laser beam irradiation state to maintain a predetermined combustion state in order to obtain the desired machining state Relais User processing method. 7. When the laser light is invisible, a powdery combustible substance is supplied near the optical path of the invisible laser light in the vicinity of the object to be processed, and the powdery combustible substance is burned by the laser light. To visualize the laser light path,
Claim this visualized the laser optical path to detect the laser beam irradiation state by monitoring, and adjusting the laser beam irradiation state to maintain a predetermined combustion state
6. The laser processing method according to item 6 . 8. claims 1 to 7, characterized in that the periphery of the workpiece at the time of irradiating the laser beam to supply a combustion-supporting gas to hold the combustion sustaining gas atmosphere sufficient concentration The laser processing method according to any one of claims. 9. The laser processing method according to claim 1 , wherein the combustion gas generated by combustion of the object to be processed by laser light irradiation is recovered without being released into the atmosphere. 10. The laser processing method according to claim 1 , wherein the object to be processed is a conductive material. 11. A processing table means for holding and moving an object to be processed, a transmitting means for transmitting a laser beam emitted from a laser light source, and a laser beam for converging the laser beam to irradiate the object to be processed. Laser irradiation means and a control means for controlling the position of at least one of the processing table means and the laser light source to scan a laser beam to form a desired three-dimensionally shaped portion on the object to be processed. In the device, a desired ratio of the scanning movement length of the beam spot of the laser light to the diameter of the laser processing hole formed when the laser beam is irradiated onto the processing target, the diameter of the laser processing hole, and the laser processing. A laser light irradiation state adjusting means for determining the laser light scanning speed from the laser light repetition number when the hole is formed and instructing the laser light scanning speed to the control means is provided. A laser processing device characterized in that 12. The laser light irradiation state adjusting means includes a photographing means for measuring the diameter of a laser processing hole formed when the processing object is irradiated with the laser light; The laser processing apparatus according to claim 11 , further comprising image processing means for processing the image information to be obtained to obtain the diameter of the laser processing hole. 13. The laser processing apparatus supplies a powdery combustible substance near the optical path of the invisible laser light near the object to be processed, and burns the powdery combustible substance with the laser light to produce a laser beam. Further comprising a laser light visualization means for visualizing the optical path, the laser light irradiation state adjusting means comprises a monitor means for monitoring the visualized laser optical path, further, the information output by the monitor means. 13. The laser processing apparatus according to claim 12 , wherein the laser beam irradiation state is detected based on the base, and the laser beam irradiation state is adjusted to maintain a predetermined combustion state. 14. A combustion-supporting gas supply means for supplying a combustion-supporting gas so as to maintain a surrounding atmosphere of the object to be processed in a combustion-supporting gas atmosphere having a sufficient concentration when the laser light is irradiated. The laser processing apparatus according to any one of claims 11 to 13 , wherein: 15. A recovery means is further provided for recovering combustion gas generated by combustion of the object to be processed by laser light irradiation without releasing it into the atmosphere.
The laser processing apparatus according to claim 11 .