JP3537585B2 - Photoelectric conversion device - Google Patents
Photoelectric conversion deviceInfo
- Publication number
- JP3537585B2 JP3537585B2 JP10574296A JP10574296A JP3537585B2 JP 3537585 B2 JP3537585 B2 JP 3537585B2 JP 10574296 A JP10574296 A JP 10574296A JP 10574296 A JP10574296 A JP 10574296A JP 3537585 B2 JP3537585 B2 JP 3537585B2
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- conversion element
- external
- conversion device
- external terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Light Receiving Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明はリードフレームに
光電変換素子例えば発光ダイオードなどを載置しこれら
を透明樹脂で一体的に封止した光電変換装置およびその
プリント基板への取り付け方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoelectric conversion device in which a photoelectric conversion element, such as a light emitting diode, is mounted on a lead frame, and these are integrally sealed with a transparent resin, and a method of mounting the same on a printed circuit board. .
【０００２】[0002]
【従来の技術】図５及び図６は従来の一般的な光電変換
装置の形状とプリント基板への固定方法を示す図であ
る。図５（ａ）は図５（ｂ）のＤ−Ｄ’線断面図、図５
（ｂ）は光電変換装置の側面図、図５（ｃ）は下面図で
ある。図５に示す光電変換装置において、リードフレー
ム２は光電変換素子５を載置しこの光電変換素子５と電
気的に接続する。導電性銀ペースト６は光電変換素子５
をリードフレーム２に接着する。金線７は光電変換素子
５とリードフレーム３を電気的に接続する。透明樹脂８
は光電変換素子５とリードフレーム２、３を一体的に封
止している。リードフレーム２、３は光電変換装置の外
部端子２’、３’と一体をなす。2. Description of the Related Art FIGS. 5 and 6 are views showing the shape of a conventional general photoelectric conversion device and a method of fixing it to a printed circuit board. FIG. 5A is a sectional view taken along line DD ′ of FIG.
5B is a side view of the photoelectric conversion device, and FIG. 5C is a bottom view. In the photoelectric conversion device shown in FIG. 5, the lead frame 2 mounts the photoelectric conversion element 5 and is electrically connected to the photoelectric conversion element 5. The conductive silver paste 6 is used for the photoelectric conversion element 5
To the lead frame 2. The gold wire 7 electrically connects the photoelectric conversion element 5 and the lead frame 3. Transparent resin 8
Represents that the photoelectric conversion element 5 and the lead frames 2 and 3 are integrally sealed. The lead frames 2, 3 are integrated with the external terminals 2 ', 3' of the photoelectric conversion device.
【０００３】図６は図５の光電変換装置をプリント基板
へ固定したときの断面図である。図６において、プリン
ト基板９は光電変換装置を固定するものである。プリン
ト基板の穴１０は光電変換装置の外部端子２、３のピッ
チに合わせて穴加工される。半田１１は光電変換装置の
外部端子２、３とプリント基板とを電気的に接続する。
矢印１２、１３は外部端子２’、３’の折り曲げ方向を
示している。図６において光電変換装置をプリント基板
９に固定する場合について説明する。まず光電変換装置
の外部端子２’、３’のピッチに合わせて穴加工をした
プリント基板９の穴１０に光電変換装置の外部端子
２’、３’を挿入する。その後これを各々矢印１２、１
３の方向に折り曲げて固定する。さらに外部端子２’、
３’とプリント基板９とを電気的に接続するために半田
１１で半田処理をする。FIG. 6 is a cross-sectional view when the photoelectric conversion device of FIG. 5 is fixed to a printed circuit board. In FIG. 6, a printed circuit board 9 fixes the photoelectric conversion device. The hole 10 in the printed circuit board is formed in accordance with the pitch of the external terminals 2 and 3 of the photoelectric conversion device. The solder 11 electrically connects the external terminals 2 and 3 of the photoelectric conversion device and the printed board.
Arrows 12 and 13 indicate bending directions of the external terminals 2 ′ and 3 ′. The case where the photoelectric conversion device is fixed to the printed circuit board 9 in FIG. 6 will be described. First, the external terminals 2 ′ and 3 ′ of the photoelectric conversion device are inserted into the holes 10 of the printed circuit board 9, which have been drilled according to the pitch of the external terminals 2 ′ and 3 ′ of the photoelectric conversion device. After that, this is indicated by arrows 12, 1
Fold it in the direction of 3 and fix it. Furthermore, external terminal 2 ',
A soldering process is performed with solder 11 to electrically connect the printed circuit board 3 'to the printed circuit board 3'.
【０００４】[0004]
【発明が解決しようとする課題】一般に光電変換装置を
プリント基板に半田付けする際に半田付け時の振動によ
る装置の傾きやズレが発生する。この傾きやズレを防止
するためには光電変換装置の外部端子をプリント基板の
穴に挿入した後折り曲げて固定する必要がある。また光
電変換装置に使用する透明樹脂は、高い変換効率を得る
ためにフィラーの添加をおさえた高純度のエポキシ樹脂
を使用している。そのため外部からの機械的、熱的スト
レスに弱く、従来の図５の光電変換装置を図６のプリン
ト基板９に固定する場合次のような問題がある。すなわ
ち電気的に接続した外部端子２’、３’を折り曲げる際
の機械的ストレスとこの外部端子をプリント基板に半田
付けするときの、半田付けによる熱ストレスの複合作用
で、外部端子２’、３’と一体をなすリードフレーム
２、３と透明樹脂８の界面がリードフレーム２、３の側
面１４で剥離し、そのため光電変換素子５まで水分が浸
入したり、リードフレーム２、３の保持力が弱くなった
りして金線７が断線する要因となる。本発明はこのよう
な問題を解決することを課題とする。Generally, when a photoelectric conversion device is soldered to a printed circuit board, the device is inclined or displaced due to vibration during soldering. In order to prevent the inclination and the displacement, it is necessary to insert the external terminal of the photoelectric conversion device into the hole of the printed circuit board and then bend and fix it. Further, as the transparent resin used for the photoelectric conversion device, a high-purity epoxy resin containing no filler is used in order to obtain high conversion efficiency. Therefore, the conventional photoelectric conversion device is vulnerable to external mechanical and thermal stresses, and the following problem arises when the conventional photoelectric conversion device of FIG. 5 is fixed to the printed circuit board 9 of FIG. That is, due to the combined effect of mechanical stress when the externally connected external terminals 2 ′ and 3 ′ are bent and thermal stress due to soldering when the external terminals are soldered to a printed circuit board, the external terminals 2 ′ and 3 ′ are combined. The interface between the lead frames 2 and 3 and the transparent resin 8 which is integral with the ′ is peeled off at the side surface 14 of the lead frames 2 and 3, so that moisture may enter the photoelectric conversion element 5, and the holding force of the lead frames 2 and 3 may be reduced. It becomes a factor of breaking the gold wire 7 due to weakening. An object of the present invention is to solve such a problem.
【０００５】[0005]
【課題を解決するための手段】本発明の光電変換装置
は、光電変換素子と電気的に接続をしたリードフレーム
と一体をなす外部端子以外に、光電変換素子と電気的に
分離した外部リードを設け、透明樹脂で前記リードフレ
ームと前記光電変換素子とを一体的に封止したものであ
る。こうすると電気的に分離した外部リードで支持、取
り付けされるため、電気的に接続した外部端子を折り曲
げる必要がないので外部端子には機械的ストレスが加わ
らず、したがって外部端子と一体となっているリードフ
レームにも機械的ストレスが加わらない。したがって、
リードフレームと透明樹脂との界面剥離や、リードフレ
ームの保持力低下による金線の断線を防止できる。According to the present invention, there is provided a photoelectric conversion device comprising, in addition to an external terminal integral with a lead frame electrically connected to the photoelectric conversion element, an external lead electrically separated from the photoelectric conversion element. The lead frame and the photoelectric conversion element are integrally sealed with a transparent resin. In this case, since the external terminals are supported and attached by the electrically separated external leads, there is no need to bend the electrically connected external terminals, so that no mechanical stress is applied to the external terminals, and thus the external terminals are integrated with the external terminals. No mechanical stress is applied to the lead frame. Therefore,
It is possible to prevent the peeling of the interface between the lead frame and the transparent resin and the breaking of the gold wire due to the decrease in the holding force of the lead frame.
【０００６】[0006]
【発明の実施の形態】請求項１に記載した発明に係る光
電変換装置は、光電変換素子を載置してこの光電変換素
子の一方の電極と電気的に接続した第１のリードフレー
ムと、前記光電変換素子の他方の電極に電気的に接続を
した第２のリードフレームと、前記第１と第２のリード
フレームとそれぞれ一体をなす第１と第２の外部端子
と、前記第１と第２の外部端子と同一方向でかつ前記第
１と第２の外部端子を含む面に前記光電変換素子と電気
的に分離した２つの外部リードと、前記光電変換素子と
前記第１と第２のリードフレームを一体的に封止した透
明樹脂と、を有し、前記２つの外部リードを前記光電変
換素子と電気的に接続した２つの外部端子の両外側に配
置したものである。これにより光電変換装置は光電変換
素子と電気的に接続された外部端子とは別に、前記光電
変換素子と電気的に分離した外部リードを有したものと
なる。The photoelectric conversion device according to the first aspect of the present invention includes a first lead frame having a photoelectric conversion element mounted thereon and electrically connected to one electrode of the photoelectric conversion element. A second lead frame electrically connected to the other electrode of the photoelectric conversion element, first and second external terminals respectively integrated with the first and second lead frames, and two external leads which said the photoelectric conversion element electrically separated plane containing and a second external terminal in the same direction the first and the second external terminal, and the photoelectric conversion element and the first second It has a integrally sealed transparent resin, the a lead frame, the two external leads the photoelectric conversion
On both sides of two external terminals electrically connected to the switching element.
Is placed. Accordingly, the photoelectric conversion device has external leads electrically separated from the photoelectric conversion element, in addition to the external terminals electrically connected to the photoelectric conversion element.
【０００７】これにより光電変換素子と電気的に接続さ
れた外部端子を曲げることなくプリント基板に半田付け
できる。[0007] This is a can be soldered to the printed circuit board without bending the photoelectric conversion element is electrically connected to an external terminal.
【０００８】請求項２に記載した発明に係る光電変換装
置は、請求項１に記載したものにおいて、光電変換素子
と電気的に分離された外部リードの幅を、光電変換素子
と電気的に接続した２つの外部端子の幅より狭くしたも
のである。これにより外部リードをプリント基板に固定
する際のリード折り曲げ力を弱くでき、光電変換装置へ
の機械的ストレスを緩和できる。According to a second aspect of the present invention, in the photoelectric conversion device according to the first aspect, the width of the external lead electrically separated from the photoelectric conversion element is electrically connected to the photoelectric conversion element. The width is smaller than the width of the two external terminals. Thus, the bending force of the lead when fixing the external lead to the printed circuit board can be reduced, and the mechanical stress on the photoelectric conversion device can be reduced.
【０００９】請求項３に記載した発明に係る光電変換装
置は、請求項１に記載したものにおいて、光電変換素子
と電気的に分離された外部リードの幅を折り曲げ部のみ
狭くしたものである。これにより外部リードをプリント
基板に固定する際のリード折り曲げ力を弱くでき、光電
変換装置への機械的ストレスを緩和できる。According to a third aspect of the present invention, there is provided the photoelectric conversion device according to the first aspect, wherein the width of the external lead electrically separated from the photoelectric conversion element is reduced only in the bent portion. Thus, the bending force of the lead when fixing the external lead to the printed circuit board can be reduced, and the mechanical stress on the photoelectric conversion device can be reduced.
【００１０】請求項４に記載した発明に係る光電変換装
置は、請求項１に記載したものにおいて、光電変換素子
と電気的に分離された外部リードの透明樹脂から外部に
出ている部分の長さを、光電変換素子と電気的に接続し
た２つの外部端子の前記透明樹脂から外部に出ている部
分の長さより長くしたものである。これにより外部リー
ドを折り曲げる際、外部端子が邪魔にならず容易に折り
曲げることができる。According to a fourth aspect of the present invention, there is provided a photoelectric conversion device according to the first aspect, wherein a length of a portion of the external lead that is electrically separated from the photoelectric conversion element and that is exposed to the outside from the transparent resin is provided. The length of the two external terminals electrically connected to the photoelectric conversion element is made longer than the length of a portion of the two external terminals that are exposed to the outside from the transparent resin. Thus, when the external lead is bent, the external terminal can be easily bent without obstructing the external terminal.
【００１１】[0011]
【００１２】[0012]
【実施例】以下、本発明の実施例について、図面を用い
て説明する。図１は本発明の光電変換装置の第１の実施
例を示す図であり、図１（ａ）は図１（ｂ）のＡ−Ａ’
線断面図、図１（ｂ）は側面図、図１（ｃ）は下面図で
ある。図１において、リードフレーム２は例えば発光ダ
イオードなどの光電変換素子５を載置しこの光電変換素
子５と電気的に接続する。外部リード１、４は光電変換
素子５と電気的に分離されている。導電性銀ペースト６
は光電変換素子５をリードフレーム２と電気的に接着を
する。金線７は光電変換素子５とリードフレーム３を電
気的に接続する。透明樹脂８は光電変換素子５とリード
フレーム２、３を一体的に封止している。図２は本発明
の光電変換装置のプリント基板への取り付け方法の実施
例である。 図２において、プリント基板９に外部端子
２’、３’と外部リード１、４のピッチに合わせて穴加
工をする。プリント基板の穴１０は光電変換装置の外部
端子２’、３’のピッチに合わせて穴加工されたもので
ある。半田１１は外部リードおよび外部端子とプリント
基板を固定するためのものである。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of a photoelectric conversion device according to the present invention, and FIG. 1 (a) is AA ′ of FIG. 1 (b).
1B is a side view, and FIG. 1C is a bottom view. In FIG. 1, a lead frame 2 has a photoelectric conversion element 5 such as a light emitting diode mounted thereon and is electrically connected to the photoelectric conversion element 5. The external leads 1 and 4 are electrically separated from the photoelectric conversion element 5. Conductive silver paste 6
Electrically bonds the photoelectric conversion element 5 to the lead frame 2. The gold wire 7 electrically connects the photoelectric conversion element 5 and the lead frame 3. The transparent resin 8 integrally seals the photoelectric conversion element 5 and the lead frames 2 and 3. FIG. 2 shows an embodiment of a method for mounting the photoelectric conversion device of the present invention on a printed circuit board. In FIG. 2, holes are formed in the printed circuit board 9 in accordance with the pitch of the external terminals 2 ', 3' and the external leads 1, 4. The holes 10 in the printed circuit board are formed by drilling according to the pitch of the external terminals 2 ', 3' of the photoelectric conversion device. The solder 11 is for fixing the external leads and external terminals to the printed circuit board.
【００１３】図３、図４は本発明の光電変換装置の第２
と第３の実施例を示す図である。図３（ａ）は図３
（ｂ）のＢ−Ｂ’線断面図、図３（ｂ）は第２の実施例
の光電変換装置の側面図、図３（ｃ）は下面図である。
図３の実施例では、光電変換素子５と電気的に分離され
た外部リード１、４の幅を、光電変換素子５と電気的に
接続する外部端子２’、３’の幅より狭くすることで、
プリント基板に固定する際のリード折り曲げ力を弱くで
き、光電変換装置への機械的ストレスを緩和できる。ま
た図示はしていないが、光電変換素子と電気的に分離さ
れた外部リードの幅を折り曲げ部のみ狭くすることによ
っても、プリント基板に固定する際のリード折り曲げ力
を弱くでき、光電変換装置への機械的ストレスを緩和で
きる。図４（ａ）は図４（ｂ）のＣ−Ｃ’線断面図、図
４（ｂ）は第３の実施例の光電変換装置の側面図、図４
（ｃ）は下面図である。図４の実施例では、光電変換素
子５と電気的に接続をした外部端子２’、３’の透明樹
脂から外部に出ている部分の長さを、プリント基板の厚
みに合わせて光電変換素子５と電気的に分離された外部
リード１、４の透明樹脂から外部に出ている部分の長さ
より短くしたことで、プリント基板挿入後外部リード
１、４を折り曲げる際、外部端子２’、３’が邪魔にな
らず容易に折り曲げることができ、また半田付け前に行
う外部端子２’、３’のリードカットを不要にできる。FIGS. 3 and 4 show a second embodiment of the photoelectric conversion device according to the present invention.
It is a figure showing a 3rd example. FIG. 3A shows FIG.
FIG. 3B is a sectional view taken along the line BB ′, FIG. 3B is a side view of the photoelectric conversion device of the second embodiment, and FIG. 3C is a bottom view.
In the embodiment of FIG. 3, the width of the external leads 1 and 4 electrically separated from the photoelectric conversion element 5 is made smaller than the width of the external terminals 2 ′ and 3 ′ electrically connected to the photoelectric conversion element 5. so,
The lead bending force at the time of fixing to a printed circuit board can be reduced, and the mechanical stress on the photoelectric conversion device can be reduced. Although not shown, by reducing the width of the external lead electrically separated from the photoelectric conversion element only at the bent portion, the lead bending force at the time of fixing to the printed circuit board can be weakened, and the photoelectric conversion device can be used. Mechanical stress can be reduced. 4A is a cross-sectional view taken along line CC ′ of FIG. 4B, FIG. 4B is a side view of the photoelectric conversion device of the third embodiment,
(C) is a bottom view. In the embodiment shown in FIG. 4, the length of the portion of the external terminals 2 ′ and 3 ′ that are electrically connected to the photoelectric conversion element 5 and that is exposed from the transparent resin is adjusted to the thickness of the printed circuit board. When the external leads 1 and 4 are bent after the printed circuit board is inserted, the external terminals 2 ′ and 3 ′ are bent when the external leads 1 and 4 are electrically separated from the external leads 1 and 4. Can be easily bent without obstruction, and lead cutting of the external terminals 2 'and 3' before soldering can be eliminated.
【００１４】また本発明の他の実施例として図には示し
ていないが、光電変換素子と電気的に分離された外部リ
ード１、４の幅を、光電変換素子と電気的に接続をした
外部端子２’、３’の幅より狭くしたうえで、前記外部
端子２’、３’の透明樹脂から外部に出ている部分の長
さを、プリント基板の厚みに合わせて前記外部リード
１、４の透明樹脂から外部に出ている部分の長さより短
くした光電変換装置があることはいうまでもない。Although not shown in the drawings as another embodiment of the present invention, the width of the external leads 1 and 4 electrically separated from the photoelectric conversion element is set to the width of the external lead electrically connected to the photoelectric conversion element. After making the width of the terminals 2 ′ and 3 ′ smaller than the width of the external terminals 2 ′ and 3 ′, the lengths of the portions of the external terminals 2 ′ and 3 ′ which are exposed to the outside from the transparent resin are adjusted according to the thickness of the printed circuit board. Needless to say, there is a photoelectric conversion device that is shorter than the length of the portion of the transparent resin that extends outside.
【００１５】なお本実施例では光電変換素子として発光
ダイオードを採り上げたが、これ以外の光電変換素子、
例えばホトトランジスタやホトダイオードについても同
様に本発明を適用できる。In this embodiment, a light emitting diode is used as a photoelectric conversion element.
For example, the present invention can be similarly applied to a phototransistor and a photodiode.
【００１６】[0016]
【発明の効果】本発明は以上説明したようなものである
から、以下に記載されるような効果を生ずる。本発明の
光電変換装置では、光電変換素子の一方と他方の電極に
それぞれ電気的に接続されたリードフレームとそれぞれ
一体をなす第１と第２の外部端子と、光電変換素子と電
気的に分離した少なくとも１つ以上の外部リードを別々
に設けるようにした。そのため外部リードで光電変換装
置をプリント基板に取り付ければよく、外部端子をプリ
ント基板への取り付けに用いる必要がない。したがって
外部端子と一体をなす前記リードフレームに熱的あるい
は機械的ストレスが加わらない。そして光電変換素子と
電気的に分離した外部リードを光電変換素子と電気的に
接続した外部端子の両外側に配することにより、外部端
子を折り曲げた状態で半田付けする必要がなくなるた
め、機械的ストレスと熱的ストレスが前記リードフレー
ムの封止部に複合的にかかることはない。それ故リード
フレームと透明樹脂の界面剥離や、リードフレームの保
持力の低下による金線の断線を防止できる。Since the present invention has been described above, the following effects can be obtained. In the photoelectric conversion device of the present invention, the first and second external terminals that are respectively integrated with the lead frame electrically connected to one and the other electrodes of the photoelectric conversion element are electrically separated from the photoelectric conversion element. At least one or more external leads are separately provided. Therefore, the photoelectric conversion device may be attached to the printed board with external leads, and there is no need to use external terminals for attaching to the printed board. Therefore, no thermal or mechanical stress is applied to the lead frame integrated with the external terminal. By arranging external leads electrically separated from the photoelectric conversion element on both outer sides of the external terminal electrically connected to the photoelectric conversion element, there is no need to solder the external terminal in a bent state, so that mechanical Stress and thermal stress are not applied to the sealing portion of the lead frame in a combined manner. Therefore, it is possible to prevent peeling of the interface between the lead frame and the transparent resin and breakage of the gold wire due to a decrease in the holding force of the lead frame.
【００１７】また光電変換素子を電気的に分離した外部
リードの幅を光電変換素子と接続された外部端子の幅よ
り狭くすることにより、外部リードをプリント基板に固
定する際のリード折り曲げ力を弱くでき、光電変換装置
への機械的ストレスを緩和できる。また光電変換素子を
電気的に分離した外部リードの幅を折り曲げ部のみ狭く
することによっても、外部リードをプリント基板に固定
する際のリード折り曲げ力を弱くでき、光電変換装置へ
の機械的ストレスを緩和できる。また光電変換素子と電
気的に分離した外部リードの透明樹脂から外部に出てい
る部分の長さを、外部端子のそれに該当する長さより長
くすることにより、外部リードを折り曲げる際、外部端
子が邪魔にならず容易に折り曲げることができる。Further, by making the width of the external lead electrically separated from the photoelectric conversion element smaller than the width of the external terminal connected to the photoelectric conversion element, the bending force of the lead when fixing the external lead to the printed circuit board is reduced. Thus, mechanical stress on the photoelectric conversion device can be reduced. Also, by narrowing the width of the external lead that electrically separates the photoelectric conversion element only at the bent portion, the lead bending force when fixing the external lead to the printed circuit board can be reduced, and the mechanical stress on the photoelectric conversion device is reduced. Can be relaxed. Also, the length of the part of the external lead that is electrically separated from the photoelectric conversion element and protrudes from the transparent resin is longer than the length of the external terminal corresponding to that.
By Ku, when bending the outer leads can be bent easily not to the external terminal is obstructed.
【００１８】さらに組立に当っては前記光電変換装置
と、前記第１と第２の外部端子と前記外部リードのピッ
チに合わせて穴加工をしたプリント基板を準備する。そ
して外部端子と外部リードをプリント基板の穴に挿入し
た後外部リードを折り曲げて光電変換装置をプリント基
板に固定する。こうすることにより、光電変換装置と電
気的に接続した外部端子を折り曲げた状態で半田付けす
る必要がない。Further, in assembling, a photoelectric conversion device and a printed circuit board having holes formed in accordance with the pitches of the first and second external terminals and the external leads are prepared. Then, after inserting the external terminals and the external leads into the holes of the printed circuit board, the external leads are bent to fix the photoelectric conversion device to the printed circuit board. This eliminates the need to solder the external terminals electrically connected to the photoelectric conversion device in a bent state.
【図１】本発明の光電変換装置の第１の実施例を示す
図。FIG. 1 is a diagram showing a first embodiment of a photoelectric conversion device according to the present invention.
【図２】本発明の第１の実施例の光電変換装置のプリン
ト基板への取り付け方法を示す図。FIG. 2 is a diagram showing a method for mounting the photoelectric conversion device according to the first embodiment of the present invention on a printed circuit board.
【図３】本発明の光電変換装置の第２の実施例を示す
図。FIG. 3 is a diagram showing a second embodiment of the photoelectric conversion device of the present invention.
【図４】本発明の光電変換装置の第３の実施例を示す
図。FIG. 4 is a diagram showing a third embodiment of the photoelectric conversion device of the present invention.
【図５】従来の光電変換装置を示す図。FIG. 5 is a diagram showing a conventional photoelectric conversion device.
【図６】従来の光電変換装置取り付け方法を示す図。FIG. 6 is a diagram showing a conventional method of attaching a photoelectric conversion device.
１、４ 外部リード ２、３ リードフレーム ２’、３’ 外部端子 ５ 光電変換素子 ６ 導電性銀ペースト ７ 金線 ８ 透明樹脂 ９ プリント基板 １０ プリント基板の加工穴 １１ 半田 １２、１３ 外部端子の折り曲げ方向を示す矢印 １４ リードフレームと透明樹脂の界面剥離 1, 4 external lead 2,3 lead frame 2 ', 3' external terminal 5 photoelectric conversion element 6 conductive silver paste 7 Gold wire 8 Transparent resin 9 Printed circuit board 10. Processing holes in printed circuit boards 11 Solder 12, 13 Arrows indicating the bending direction of the external terminal 14 Peeling of interface between lead frame and transparent resin
Claims (4)
子の一方の電極と電気的に接続した第１のリードフレー
ムと、前記光電変換素子の他方の電極に電気的に接続を
した第２のリードフレームと、前記第１と第２のリード
フレームとそれぞれ一体をなす第１と第２の外部端子
と、前記第１と第２の外部端子と同一方向でかつ前記第
１と第２の外部端子を含む面に前記光電変換素子と電気
的に分離した２つの外部リードと、前記光電変換素子と
前記第１と第２のリードフレームを一体的に封止した透
明樹脂と、 を有し、 前記 ２つの外部リードを前記光電変換素子と電気的に接
続した２つの外部端子の両外側に配置したことを特徴と
する光電変換装置。 1. A photoelectric conversion device comprising:
A first lead frame electrically connected to one electrode of the child
And an electrical connection to the other electrode of the photoelectric conversion element.
Second lead frame, and the first and second leads
First and second external terminals respectively integral with the frame
And in the same direction as the first and second external terminals and
The surface including the first and second external terminals and the photoelectric conversion element
Two external leads separated from each other, and the photoelectric conversion element
The first and second leadframes are integrally sealed and are transparent.
Has a bright resin, and a characterized in that the two outer leads disposed on both outer sides of the two external terminals electrically connected to the photoelectric conversion element
Photoelectric conversion device.
リードの幅を、光電変換素子と電気的に接続した２つの
外部端子の幅より狭くしたことを特徴とする請求項１に
記載の光電変換装置。2. The method according to claim 1, wherein the width of the external lead electrically separated from the photoelectric conversion element is smaller than the width of two external terminals electrically connected to the photoelectric conversion element. Photoelectric conversion device.
リードの幅を折り曲げ部のみ狭くしたことを特徴とする
請求項１に記載の光電変換装置。3. The photoelectric conversion device according to claim 1, wherein the width of the external lead electrically separated from the photoelectric conversion element is reduced only at the bent portion.
リードの透明樹脂から外部に出ている部分の長さを、光
電変換素子と電気的に接続した２つの外部端子の前記透
明樹脂から外部に出ている部分の長さより長くしたこと
を特徴とする請求項１に記載の光電変換装置。4. The length of a portion of the external lead that is electrically separated from the photoelectric conversion element and that is exposed to the outside from the transparent resin is determined by the amount of the transparent resin of two external terminals electrically connected to the photoelectric conversion element. The photoelectric conversion device according to claim 1, wherein the length is longer than a length of a portion that is outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10574296A JP3537585B2 (en) | 1996-04-25 | 1996-04-25 | Photoelectric conversion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10574296A JP3537585B2 (en) | 1996-04-25 | 1996-04-25 | Photoelectric conversion device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09293901A JPH09293901A (en) | 1997-11-11 |
| JP3537585B2 true JP3537585B2 (en) | 2004-06-14 |
Family
ID=14415725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10574296A Expired - Fee Related JP3537585B2 (en) | 1996-04-25 | 1996-04-25 | Photoelectric conversion device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3537585B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6342670B1 (en) * | 2000-09-19 | 2002-01-29 | Lite-On Electronics, Inc. | Photoelectric module device |
| DE102006014247B4 (en) | 2006-03-28 | 2019-10-24 | Robert Bosch Gmbh | Image recording system and method for its production |
| JP4720639B2 (en) * | 2006-06-15 | 2011-07-13 | パナソニック株式会社 | How to attach the terminal block to the printed wiring board |
-
1996
- 1996-04-25 JP JP10574296A patent/JP3537585B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09293901A (en) | 1997-11-11 |
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