JPH0777254B2 - Semiconductor mounting board - Google Patents
Semiconductor mounting boardInfo
- Publication number
- JPH0777254B2 JPH0777254B2 JP11136286A JP11136286A JPH0777254B2 JP H0777254 B2 JPH0777254 B2 JP H0777254B2 JP 11136286 A JP11136286 A JP 11136286A JP 11136286 A JP11136286 A JP 11136286A JP H0777254 B2 JPH0777254 B2 JP H0777254B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor pin
- semiconductor mounting
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は，各種の半導体素子，チップ素子等を搭載する
ために用いられる半導体搭載用基板に関する。Description: TECHNICAL FIELD The present invention relates to a semiconductor mounting substrate used for mounting various semiconductor elements, chip elements and the like.
本発明に関する半導体搭載用基板は，外部接続用導体ピ
ンを有するプリント配線板に，半導体素子，チップ素子
等を搭載し，更にこれらの周囲を樹脂などで封止した，
半導体パッケージの一つであり，コンピューターなどの
各種回路基板に実装して用いられる。The semiconductor mounting substrate according to the present invention has semiconductor elements, chip elements, etc. mounted on a printed wiring board having conductor pins for external connection, and the periphery thereof is sealed with resin or the like.
It is one of the semiconductor packages and is used by mounting it on various circuit boards such as computers.
従来，半導体搭載用基板に挿入していた導体ピンは，第
４図及び第５図に示すように，略円形状の金属線の一部
に金属線の直径より大きい鍔を有し，かつその近傍に金
属線の直径より太い突出部が二方向と，直径より細かい
扁平部が二方向に形成されたものがあった。Conventionally, a conductor pin that has been inserted into a semiconductor mounting substrate has a flange that is larger than the diameter of the metal wire in a part of the substantially circular metal wire, as shown in FIGS. 4 and 5. In the neighborhood, there were two protrusions that were thicker than the diameter of the metal wire and two flat portions that were smaller than the diameter.
しかしながら，前記形状の導体ピンは，プリント配線板
のスルーホールに嵌入された場合，二方向の突出部を支
点とし，扁平部方向にぐらつきが生じ易い。そのため，
嵌入された導体ピンは位置精度において不安定であり，
その結果，ピン先端部が不整列となり，該半導体搭載用
基板をマザーボードに実装するのが困難であるという欠
点があった。また，上記従来例においては，導体ピンの
引き抜き強度においても十分ではなかった。However, when the conductor pin having the above-described shape is fitted into the through hole of the printed wiring board, the projecting portion in two directions serves as a fulcrum, and wobble tends to occur in the direction of the flat portion. for that reason,
The inserted conductor pin is unstable in position accuracy,
As a result, the tips of the pins are misaligned, which makes it difficult to mount the semiconductor mounting board on a mother board. Further, in the above-mentioned conventional example, the pull-out strength of the conductor pin was not sufficient.
そこで，突出部をスルーホールの直径に対して大きくす
る方法が考えられる。しかし，このことにより，導体ピ
ンの引き抜き強度は向上するが，スルーホールが破損し
やすく，導体ピンとプリント配線板との間の電気的接続
信頼性が低くなってしまうという欠点があった。Therefore, it is conceivable to make the protrusion larger than the diameter of the through hole. However, although this improves the pull-out strength of the conductor pin, it has a drawback in that the through hole is easily damaged and the electrical connection reliability between the conductor pin and the printed wiring board is reduced.
このことは，特に樹脂素材のプリント配線板を用いる場
合に問題となる。即ち，樹脂素材のプリント配線板は，
軽量で加工し易いため，好都合であるが，一方ではセラ
ミック製基板に比して柔軟性があるため，導体ピンをス
ルーホール内に密に固着し難いという問題がある。ま
た，導体ピンを強く嵌入し過ぎると，スルーホールの内
壁を破損したり，更には樹脂素材であるプリント配線板
にクラックを生ずるという問題もある。This becomes a problem especially when a printed wiring board made of a resin material is used. That is, the printed wiring board made of resin material is
This is convenient because it is lightweight and easy to process, but on the other hand, it has a problem that it is difficult to firmly fix the conductor pins in the through holes because it is more flexible than the ceramic substrate. Further, if the conductor pins are fitted too tightly, there is a problem that the inner wall of the through hole is damaged and further the printed wiring board made of a resin material is cracked.
本発明は，樹脂素材製プリント配線板のスルーホールに
対して導体ピンを安定した状態で確実に固定できると共
に，スルーホールの破損がない，電気的接続信頼性の高
い半導体搭載用基板を提供しようとするものである。The present invention is to provide a semiconductor mounting substrate which is capable of reliably fixing a conductor pin to a through hole of a resin-made printed wiring board in a stable state, and having no damage of the through hole and having high electrical connection reliability. It is what
本発明は，導体ピンを有する樹脂素材によって作製され
たプリント配線板と該プリント配線板のスルーホールに
嵌入した導体ピンとを有する半導体搭載用基板におい
て，該導体ピンは断面が略円形状の金属線の一部に，金
属線の直径より大きい鍔を有し，かつ該鍔の近傍に金属
線の直径より太い突出部が同一断面上に三方向以上形成
されており，また，上記突出部は導体ピンの軸線に対し
て外方へ弧状に膨出していると共に突出部の外周部分は
円弧状表面を形成しており， 上記スルーホール内に上記導体ピンの突出部を嵌入した
状態においては，突出部の外周部分の円弧状表面が樹脂
素材のプリント配線板のスルーホール内に圧入されて，
スルーホールの内壁が上記円弧状表面によって内方へ円
弧状に変形されて，導体ピンがスルーホールに固着され
ていることを特徴とする半導体搭載用基板にある。The present invention relates to a semiconductor mounting board having a printed wiring board made of a resin material having a conductor pin and a conductor pin fitted in a through hole of the printed wiring board, wherein the conductor pin has a substantially circular cross section. Has a flange that is larger than the diameter of the metal wire in a part of the wire, and a protrusion that is thicker than the diameter of the metal wire is formed in the vicinity of the flange in three or more directions on the same cross section. It bulges outward in an arc shape with respect to the axis of the pin, and the outer peripheral portion of the protruding portion forms an arcuate surface. When the protruding portion of the conductor pin is fitted in the through hole, it does not protrude. The arcuate surface of the outer peripheral part of the part is press-fitted into the through hole of the printed wiring board made of resin material,
The semiconductor mounting board is characterized in that the inner wall of the through hole is deformed inward by the arcuate surface so that the conductor pin is fixed to the through hole.
本発明において最も注目すべきことは，上記導体ピンに
おける突出部が同一断面上に三方向以上形成されている
こと，該突出部は外方へ弧状に膨出していると共に突出
部の外周部分は円弧状表面を有していること，そしてス
ルーホールに導体ピンを嵌入した状態においては，上記
円弧状表面がスルーホール内に圧入されて，スルーホー
ルの内壁が内方へ円弧状に変形されていることである。What is most noticeable in the present invention is that the protrusions of the conductor pin are formed in three or more directions on the same cross section, the protrusions are bulged outward in an arc shape, and the outer peripheral portion of the protrusion is When the conductor pin has an arcuate surface and the conductor pin is fitted in the through hole, the arcuate surface is press-fitted into the through hole and the inner wall of the through hole is deformed inward in an arc shape. It is that you are.
本発明においては，導体ピンは，上記のごとく，三方向
以上へ突出した突出部を有しており，該突出部がプリン
ト配線板のスルーホールに圧入されている。また，上記
突出部は導体ピンの軸線に対して外方へ弧状に膨出して
いる（第２図参照）。In the present invention, the conductor pin has the protruding portion protruding in three or more directions as described above, and the protruding portion is press-fitted into the through hole of the printed wiring board. Further, the protruding portion bulges outward in an arc shape with respect to the axis of the conductor pin (see FIG. 2).
そのため，まず導体ピンの突出部をスルーホールに嵌入
していく際には，上記弧状の膨出部がスルーホールの内
壁を徐々に押し広げてスルーホールの内部へ進入してい
く。そのため，スルーホールの内壁は徐々に拡開されて
いき，弧状の膨出を有せず直方状の膨出を有する場合の
ごとく，スルーホールが一挙に拡開され，スルーホール
が破損するということがない。Therefore, when the protruding portion of the conductor pin is first fitted into the through hole, the arcuate bulging portion gradually expands the inner wall of the through hole and enters the inside of the through hole. Therefore, the inner wall of the through-hole gradually expands, and the through-hole expands at once and breaks the through-hole, as in the case where the through-hole does not have an arcuate bulge but a rectangular bulge. There is no.
また，本発明の導体ピンにおける突出部は，その外周部
分が円弧状表面を形成している。そのため，上記のごと
く，突出部をスルーホールに嵌入していく際にも，上記
円弧状表面がスルーホールの内壁を徐々に拡げていく。
それ故，外周部分の角部によってスルーホールが損傷を
受けるということもない。The outer peripheral portion of the protruding portion of the conductor pin of the present invention forms an arcuate surface. Therefore, as described above, the arcuate surface gradually expands the inner wall of the through hole even when the protrusion is fitted into the through hole.
Therefore, the corners of the outer peripheral portion do not damage the through hole.
更に，突出部の外周部分が円弧状表面を形成しているた
め，導体ピンをスルーホール内に嵌入した状態において
は，スルーホールの内壁が上記突出部の外周部分によっ
て円弧状に変形され，導体ピンがスルーホールに確実に
密着固定される（第３図参照）。また，そのため，突出
部の外周部分はその位置において，スルーホールの内壁
に抱き込まれた状態となる。それ故，導体ピンはその軸
中心に回動することがなく，確実に保持される。Furthermore, since the outer peripheral portion of the protruding portion forms an arcuate surface, the inner wall of the through hole is deformed in an arc shape by the outer peripheral portion of the protruding portion when the conductor pin is fitted in the through hole, and The pin is firmly fixed to the through hole (see Fig. 3). Therefore, the outer peripheral portion of the projecting portion is held in the inner wall of the through hole at that position. Therefore, the conductor pin is securely held without rotating about its axis.
また，上記突出部は，三方向以上に設けてあるため，上
記突出部の弧状膨出形状及び外周部分の円弧状表面形状
による作用効果と相乗効果を発揮し，導体ピンはスルー
ホール内に安定した状態で確実に保持される。Further, since the protrusions are provided in three or more directions, they exert a synergistic effect with the arcuate bulging shape of the protrusions and the arcuate surface shape of the outer peripheral portion, and the conductor pin is stable in the through hole. It is securely held in the condition.
また，本発明においては，セラミック基板に比較して比
較的柔軟な樹脂素材のプリント配線板を対象としている
が，導体ピンが上記構造を有するので，スルーホールの
破損，プリント配線板の破損を生ずることなく，確実に
導体ピンを嵌入することができる。Further, in the present invention, the printed wiring board made of a resin material which is relatively flexible as compared with the ceramic substrate is targeted, but since the conductor pin has the above structure, the through hole and the printed wiring board are damaged. Without fail, the conductor pin can be securely inserted.
したがって，本発明によれば，樹脂素材製プリント配線
板のスルーホールに対して導体ピンを安定した状態で確
実に固定できると共に，スルーホールの破損がない，電
気的接続信頼性の高い半導体搭載用基板を提供すること
ができる。Therefore, according to the present invention, the conductor pin can be securely fixed to the through hole of the resin-made printed wiring board in a stable state, and the through hole is not damaged and the electrical connection is highly reliable for semiconductor mounting. A substrate can be provided.
次に，本発明の実施例にかかる半導体搭載用基板を図面
に基づいて詳細に説明する。Next, a semiconductor mounting substrate according to an embodiment of the present invention will be described in detail with reference to the drawings.
本例の半導体搭載用基板は，第１図に示すごとくピング
リッドアレイ基板である。第１図において，符号１は樹
脂素材からなるプリント配線板であり，例えばガラスエ
ポキシ基板，紙フェノール基板，紙エポキシ基板，ガラ
スポリイミド基板，ガラス変性トリアジン基板などを用
いる。符号２はプリント配線板の表面に形成された回路
であり常法により形成される。The semiconductor mounting substrate of this example is a pin grid array substrate as shown in FIG. In FIG. 1, reference numeral 1 is a printed wiring board made of a resin material, and for example, a glass epoxy substrate, a paper phenol substrate, a paper epoxy substrate, a glass polyimide substrate, a glass modified triazine substrate or the like is used. Reference numeral 2 is a circuit formed on the surface of the printed wiring board and is formed by a conventional method.
符号３は前記回路と接続するスルーホールである。符号
４は，半導体素子を搭載する部分を示し，ザグリ加工に
より凹部が形成されている場合である。符号５は，前記
スルーホールに嵌入固定された入出力用の導体ピンであ
る。Reference numeral 3 is a through hole connected to the circuit. Reference numeral 4 indicates a portion on which a semiconductor element is mounted, and is a case where a recess is formed by counterboring. Reference numeral 5 is an input / output conductor pin fitted and fixed in the through hole.
第２図は，本発明の半導体搭載用基板に用いられた導体
ピンの側面図であり，導体ピンは，四方向に突出部を形
成している。第２図において，符号６は鍔であり，この
鍔は導体ピン５をプリント配線板１のスルーホールに嵌
入する際の位置合わせや係止の役割を果たすものであ
る。FIG. 2 is a side view of a conductor pin used in the semiconductor mounting substrate of the present invention, and the conductor pin has protrusions formed in four directions. In FIG. 2, reference numeral 6 is a collar, and this collar plays a role of positioning and locking when the conductor pin 5 is fitted into the through hole of the printed wiring board 1.
また，符号７は前記鍔の近傍に形成された，金属線の直
径より太い突出部であり，本例では四方向に突出部を形
成したものを示す。この突出部７は，プリント配線板１
のスルーホール３の直径よりも大きい。Further, reference numeral 7 is a protruding portion formed in the vicinity of the brim and thicker than the diameter of the metal wire. In this example, the protruding portion is formed in four directions. The protrusion 7 is formed on the printed wiring board 1.
Is larger than the diameter of the through hole 3.
そして，ここに注目すべきことは，まず第２図に示すご
とく，実施例突出部７は導体ピン５の軸線に対して外方
へ弧状に膨出していることである。また，第３図に示す
ごとく突出部７の外周部分は円弧状表面を形成している
ことである。It should be noted that, as shown in FIG. 2, the projecting portion 7 of the embodiment bulges outward in an arc shape with respect to the axis of the conductor pin 5. Further, as shown in FIG. 3, the outer peripheral portion of the projecting portion 7 forms an arcuate surface.
そして，スルーホール３内に導体ピン５の突出部７を嵌
入した状態においては，第３図に示すごとく，突出部７
の外周部分の円弧状表面が樹脂素材のプリント配線板１
のスルーホール３内に圧入されて，スルーホール３の内
壁が上記円弧状表面によって円弧状に変形され，導体ピ
ン５がスルーホール３に固着されていることである。In the state where the projecting portion 7 of the conductor pin 5 is fitted in the through hole 3, as shown in FIG.
Printed wiring board 1 whose outer surface has an arc-shaped surface made of resin material
Is press-fitted into the through hole 3, the inner wall of the through hole 3 is deformed into an arc shape by the arc surface, and the conductor pin 5 is fixed to the through hole 3.
符号８及び９は，導体ピン５の上端面及び下端面であ
り，この端面に曲面又はテーパー面を形成することによ
り，スルーホール３への導体ピン５の嵌入が容易とな
る。Reference numerals 8 and 9 denote the upper end surface and the lower end surface of the conductor pin 5, and by forming a curved surface or a tapered surface on this end surface, the conductor pin 5 can be easily fitted into the through hole 3.
また，第３図に示すごとく，突出部７の直径D1,D2は，
スルーホール３の直径よりも大きい。Further, as shown in FIG. 3, the diameters D 1 and D 2 of the protruding portion 7 are
It is larger than the diameter of the through hole 3.
これらの導体ピンは金属線から加工されるものであり，
金属線の材質としては，鉄，鉄系合金，銅，銅系合金な
どが好ましい。例えば,42アロイ，コバール，りん青銅
などがある。金属線から加工された導体ピンの表面に
は，金，銀，スズ，半田などの金属メッキを施すことに
より金属線の腐食を防止することが可能である。These conductor pins are machined from metal wire,
As the material of the metal wire, iron, iron-based alloy, copper, copper-based alloy, etc. are preferable. For example, 42 alloy, Kovar, phosphor bronze, etc. Corrosion of the metal wire can be prevented by plating the surface of the conductor pin processed from the metal wire with metal such as gold, silver, tin, or solder.
特に半田メッキ層は，表面硬度が小さいため導体ピンを
プリント配線板のスルーホールへ嵌入する場合，スルー
ホールの損傷を著しく減少する効果がある。In particular, since the solder plating layer has a small surface hardness, when the conductor pin is fitted into the through hole of the printed wiring board, there is an effect of remarkably reducing damage to the through hole.
次に，第６図及び第８図は，導体ピンをスルーホール内
に嵌入する前の状態の縦断面図である。この図面におい
て符号10はプリント配線板に設けられたスルーホールで
あり，この直径D3は，導体ピンの突出部の直径D1,D2よ
りも小さい。導体ピン11,13は，スルーホール10に対し
てそれぞれ矢印12,14の方向から加圧嵌入する。また逆
に導体ピンに，プリント配線板側から加圧嵌入してもよ
い。Next, FIG. 6 and FIG. 8 are longitudinal sectional views of a state before the conductor pin is fitted into the through hole. In this drawing, reference numeral 10 is a through hole provided in the printed wiring board, and the diameter D 3 is smaller than the diameters D 1 and D 2 of the protruding portions of the conductor pins. The conductor pins 11 and 13 are press-fitted into the through holes 10 in the directions of arrows 12 and 14, respectively. Conversely, the conductor pins may be press-fitted from the printed wiring board side.
第７図及び第９図は，スルーホールに導体ピンを加圧嵌
入した後の状態の縦断面図である。この図面によれば，
スルーホールの一部が導体ピンの突出部に沿ってふくら
んだ状態に拡大変形し，スルーホール壁面に導体ピンの
突出部が完全密着して強固に固定されていることが分か
る。そのため，スルーホールと導体ピンは確実に導通可
能となる。FIG. 7 and FIG. 9 are vertical sectional views showing a state after the conductor pin is press-fitted into the through hole. According to this drawing
It can be seen that a part of the through hole is expanded and deformed to a bulge along the conductor pin protrusion, and the conductor pin protrusion is firmly adhered to the wall of the through hole. Therefore, the through hole and the conductor pin can be surely conducted.
従来の導体ピンでは，第５図に示すように，スルーホー
ルが導体ピンの突出部に沿って二方向にのみ，ふくらん
だ状態で，拡大変形し装着されている。これに対し，本
発明の導体ピンでは，第３図に示すように，スルーホー
ル３が導体ピンの突出部７の外周部分の円弧状表面によ
って，四方向にふくらんだ状態に拡大変形し装着されて
いる。In a conventional conductor pin, as shown in FIG. 5, through holes are enlarged and deformed and attached in a bulging state only in two directions along a protrusion of the conductor pin. On the other hand, in the conductor pin of the present invention, as shown in FIG. 3, the through hole 3 is expanded and deformed in four directions by the arcuate surface of the outer peripheral portion of the protruding portion 7 of the conductor pin and mounted. ing.
このため，嵌入後の導体ピンは非常に安定しており，か
つ四方向でかしめの効果がある。そのため，引き抜き強
度を得るために突出部をスルーホールに対し，それほど
大きくする必要がない。また，そのため，従来の導体ピ
ンに比べ，スルーホールや樹脂素材のプリント配線板を
破損する恐れはない。For this reason, the conductor pin after insertion is very stable and has the effect of crimping in four directions. Therefore, it is not necessary to make the protruding portion much larger than the through hole in order to obtain the pullout strength. Therefore, as compared with the conventional conductor pin, there is no possibility of damaging the through hole and the printed wiring board made of resin.
また，導体ピンとスルーホールとは密接しているので，
高温，高湿下でのスルーホールと導体ピンの接触部の抵
抗変化は見られず，高い電気的接続信頼性を確保するこ
とができる。Also, since the conductor pin and the through hole are in close contact,
There is no change in the resistance of the contact part between the through hole and the conductor pin under high temperature and high humidity, and high electrical connection reliability can be secured.
更に，導体ピンとスルーホールとを半田付けすると，そ
の電気的接続が完全となり，より一層高い電気的接続信
頼性が得られる。Further, when the conductor pin and the through hole are soldered, the electrical connection between them is perfect, and higher electrical connection reliability can be obtained.
第10図は，上記半導体搭載用基板に半導体素子15をダイ
ボンディングし，ワイヤーボンディングを行ない，その
後エポキシ樹脂17で封止した状態の半導体搭載用基板
と，これをマザーボードのスルーホールに実装した時の
縦断面図である。FIG. 10 shows a semiconductor mounting board in which the semiconductor element 15 is die-bonded to the semiconductor mounting board, wire-bonded, and then sealed with epoxy resin 17, and when the semiconductor mounting board is mounted on a through hole of a motherboard. FIG.
この図面において，符号15は半導体素子，符号16はボン
ディングワイヤー，符号17は封止用エポキシ樹脂であ
る。また，符号18は導体ピンであり，この導体ピンは鍔
の下部にも，別の鍔19を有している。この２つの鍔を有
する導体ピンはスタンドオフピンと一般に呼ばれるもの
である。このスタンドオフピンは，半導体搭載用基板に
格子状に配列された導体ピンにおいて，外周上の導体ピ
ンの中の４つのコーナー，又は内周上の４つのコーナー
に，通常は配置されている。In this drawing, reference numeral 15 is a semiconductor element, reference numeral 16 is a bonding wire, and reference numeral 17 is a sealing epoxy resin. Further, reference numeral 18 is a conductor pin, and this conductor pin also has another collar 19 at the lower part of the collar. The conductor pin having the two collars is generally called a standoff pin. The standoff pins are normally arranged at four corners of the conductor pins on the outer circumference or four corners on the inner circumference of the conductor pins arranged in a grid on the semiconductor mounting substrate.
前記スタンドオフピンにより，半導体搭載用基板を普通
のマザーボード20に実装する際，導体ピンの下方の鍔が
マザーボードのスルーホールに係止されることによっ
て，半導体搭載用基板とマザーボードとの間に空間が形
成される。これにより，半導体素子から発生する熱を該
空間へ効率よく放散することができる。When the semiconductor mounting board is mounted on an ordinary mother board 20 by the standoff pins, a collar below the conductor pin is locked in a through hole of the mother board, so that a space is provided between the semiconductor mounting board and the mother board. Is formed. Thereby, the heat generated from the semiconductor element can be efficiently dissipated to the space.
符号21は，導体ピンとマザーボードを接続している半田
を示すものである。Reference numeral 21 indicates a solder connecting the conductor pin and the mother board.
上記のごとく，本例の半導体搭載用基板１においては，
導体ピン５（11,13も同じ）の上記突出部７は，外方へ
弧状に膨出している（第２図）。そのため，突出部７を
スルーホール３（10も同じ）に嵌入していく際には，弧
状の膨出部がスルーホール３の内壁を徐々に押し広げて
進入していく。As described above, in the semiconductor mounting substrate 1 of this example,
The projecting portion 7 of the conductor pin 5 (same for 11, 13) bulges outward in an arc shape (Fig. 2). Therefore, when the protrusion 7 is fitted into the through hole 3 (10 is also the same), the arc-shaped bulging portion gradually pushes the inner wall of the through hole 3 to enter.
それ故，スルーホール３は徐々に拡開され，その内壁が
破損するということがない。Therefore, the through hole 3 is gradually expanded and the inner wall thereof is not damaged.
また，導体ピン５の突出部７は，外周部分が円弧状表面
を有しているため，突出部７をスルーホール３に嵌入し
ていく場合，スルーホールの内壁に徐々に広げていく。
そのため，スルーホールの内壁が破損しない（第３
図）。Further, since the outer peripheral portion of the protruding portion 7 of the conductor pin 5 has an arcuate surface, when the protruding portion 7 is fitted into the through hole 3, the protruding portion 7 is gradually expanded to the inner wall of the through hole.
Therefore, the inner wall of the through hole is not damaged (3rd
Figure).
更に，導体ピンの突出部７をスルーホール内に圧入した
状態においても，スルーホール３の内壁が突出部の外周
部分によって円弧状に変形されるので，導体ピンがスル
ーホールに確実に密着保持される（第３図）。また，第
３図に示すごとく，突出部７の外周部分は，スルーホー
ル３の内壁によって抱き込まれた状態となる。そのた
め，導体ピンはその軸中心に回動することがなく，確実
に保持される。Further, even when the projecting portion 7 of the conductor pin is press-fitted into the through hole, the inner wall of the through hole 3 is deformed into an arc shape by the outer peripheral portion of the projecting portion, so that the conductor pin is securely held in close contact with the through hole. (Fig. 3). Further, as shown in FIG. 3, the outer peripheral portion of the protruding portion 7 is held by the inner wall of the through hole 3. Therefore, the conductor pin is securely held without rotating about its axis.
また，上記突出部７は，三方向以上に設けてあるため，
上記突出部の弧状膨出形状及び外周部分の円弧状表面形
状による作用効果と相乗効果を発揮して，導体ピンはス
ルーホール内に安定した状態で確実に保持できる。In addition, since the protrusions 7 are provided in three or more directions,
The conductor pin can be reliably held in the through hole in a stable state by exerting a synergistic effect with the arcuate bulging shape of the protruding portion and the arcuate surface shape of the outer peripheral portion.
上記より明らかなごとく，本例によれば，樹脂素材製プ
リント配線板１のスルーホール３に対して，導体ピン５
を確実に安定した状態で密着固定できると共に，スルー
ホールの破損がない，電気的接続信頼性の高い半導体搭
載用基板を得ることができる。As is clear from the above, according to this example, the conductor pin 5 is attached to the through hole 3 of the resin-made printed wiring board 1.
It is possible to obtain a semiconductor mounting substrate that can be firmly and firmly fixed in a stable state, has no damage to the through holes, and has high electrical connection reliability.
第１図は本発明の実施例にかかる半導体搭載用基板の斜
視図，第２図は本発明の実施例にかかる導体ピンの側面
図，第３図は導体ピンがスルーホールに嵌入された際の
第２図のＡ−Ａ′線の横断面図，第４図及び第５図は従
来例を示し第４図は従来の導体ピン，第５図は従来の導
体ピンがスルーホールに嵌入された際の第４図のＢ−
Ｂ′線の横断面図，第６図ないし第10図は本発明の実施
例を示し，第６図及び第８図は導体ピンをプリント配線
板へ取付ける方法の一例を示す縦断面図，第７図及び第
９図は導体ピンを取付けたプリント配線板の縦断面図，
第10図は半導体搭載用基板に半導体素子を実装し，マザ
ーボードに実装した状態の縦断面図を示す。 〔符号の説明〕 １……樹脂素材からなるプリント配線板， ２……回路（パターン）， 3,10……スルーホール， ４……半導体搭載部， 5,11,13,18……導体ピン， ６……鍔， ７……突出部， 15……半導体素子， 16……ボンディングワイヤー， 17……封止用エポキシ樹脂， 20……マザーボード， 21……半田，FIG. 1 is a perspective view of a semiconductor mounting board according to an embodiment of the present invention, FIG. 2 is a side view of a conductor pin according to an embodiment of the present invention, and FIG. 3 is a view when a conductor pin is fitted into a through hole. 2 is a cross-sectional view taken along the line AA 'of FIG. 2, FIGS. 4 and 5 show a conventional example, FIG. 4 shows a conventional conductor pin, and FIG. 5 shows a conventional conductor pin fitted in a through hole. B- in FIG.
FIGS. 6 to 10 show an embodiment of the present invention, and FIGS. 6 and 8 are longitudinal sectional views showing an example of a method for attaching the conductor pins to the printed wiring board. 7 and 9 are vertical sectional views of a printed wiring board with conductor pins attached,
Fig. 10 shows a vertical cross-sectional view of a semiconductor mounting board on which semiconductor elements are mounted and mounted on a mother board. [Explanation of symbols] 1 ... Printed wiring board made of resin material, 2 ... Circuit (pattern), 3, 10 ... Through hole, 4 ... Semiconductor mounting part, 5, 11, 13, 18 ... Conductor pin , 6 ... Tsuba, 7 ... Projection, 15 ... Semiconductor element, 16 ... Bonding wire, 17 ... Epoxy resin for sealing, 20 ... Motherboard, 21 ... Solder,
Claims (6)
れたプリント配線板と該プリント配線板のスルーホール
に嵌入した導体ピンとを有する半導体搭載用基板におい
て， 該導体ピンは断面が略円形状の金属線の一部に，金属線
の直径より大きい鍔を有し，かつ該鍔の近傍に金属線の
直径より太い突出部が同一断面上に三方向以上形成され
ており，また，上記突出部は導体ピンの軸線に対して外
方へ弧状に膨出していると共に突出部の外周部分は円弧
状表面を形成しており， 上記スルーホール内に上記導体ピンの突出部を嵌入した
状態においては，突出部の外周部分の円弧状表面が樹脂
素材のプリント配線板のスルーホール内に圧入されて，
スルーホールの内壁が上記円弧状表面によって内方へ円
弧状に変形されて，導体ピンがスルーホールに固着され
ていることを特徴とする半導体搭載用基板。1. A semiconductor mounting board having a printed wiring board made of a resin material having a conductor pin and a conductor pin fitted in a through hole of the printed wiring board, wherein the conductor pin has a substantially circular cross section. A part of the wire has a flange larger than the diameter of the metal wire, and projections thicker than the diameter of the metal wire are formed in the vicinity of the flange in three or more directions on the same cross section. It bulges outward in an arc shape with respect to the axis of the conductor pin, and the outer peripheral portion of the protrusion forms an arc surface. When the protrusion of the conductor pin is fitted in the through hole, The arcuate surface of the outer peripheral part of the protrusion is press-fitted into the through hole of the printed wiring board made of resin material,
A semiconductor mounting board, wherein an inner wall of the through hole is deformed inward by the arcuate surface so that the conductor pin is fixed to the through hole.
形成されていることを特徴とする特許請求の範囲第１項
記載の半導体搭載用基板。2. The semiconductor mounting substrate according to claim 1, wherein the collar is formed on an upper end portion of the protruding portion of the metal wire.
成されていることを特徴とする特許請求の範囲第１項記
載の半導体搭載用基板。3. The semiconductor mounting substrate according to claim 1, wherein the collar is formed below a protruding portion of the metal wire.
ことを特徴とする特許請求の範囲第３項記載の半導体搭
載用基板。4. The semiconductor mounting substrate according to claim 3, wherein another collar is provided below the collar.
ホールと半田付けされていることを特徴とする特許請求
の範囲第１〜３又は４項記載の半導体搭載用基板。5. The semiconductor mounting board according to claim 1, wherein the conductor pin is soldered to a through hole of a printed wiring board.
レイ基板であることを特徴とする特許請求の範囲第１〜
４又は５項記載の半導体搭載用基板。6. The semiconductor mounting substrate is a pin grid array substrate according to claim 1.
The semiconductor mounting substrate according to item 4 or 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136286A JPH0777254B2 (en) | 1986-05-15 | 1986-05-15 | Semiconductor mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136286A JPH0777254B2 (en) | 1986-05-15 | 1986-05-15 | Semiconductor mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62266858A JPS62266858A (en) | 1987-11-19 |
| JPH0777254B2 true JPH0777254B2 (en) | 1995-08-16 |
Family
ID=14559271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11136286A Expired - Lifetime JPH0777254B2 (en) | 1986-05-15 | 1986-05-15 | Semiconductor mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777254B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0620594A3 (en) * | 1993-04-13 | 1995-01-18 | Shinko Electric Ind Co | Semiconductor device having connection pins. |
| ZA964464B (en) * | 1995-06-01 | 1996-12-11 | Siemens Ag | Base board for an integrated electrical circuit module |
| JP3843514B2 (en) | 1995-12-15 | 2006-11-08 | イビデン株式会社 | Electronic component mounting substrate and method for manufacturing the same |
| JP5994254B2 (en) * | 2012-01-11 | 2016-09-21 | 富士電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810848A (en) * | 1981-07-14 | 1983-01-21 | Toshiba Corp | Lead pin for hybrid integrated circuit |
-
1986
- 1986-05-15 JP JP11136286A patent/JPH0777254B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62266858A (en) | 1987-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5883782A (en) | Apparatus for attaching a heat sink to a PCB mounted semiconductor package | |
| US5367124A (en) | Compliant lead for surface mounting a chip package to a substrate | |
| EP0767495B1 (en) | Surface-mounting type semiconductor device | |
| JP3157611B2 (en) | Integrated circuit device with improved posts for surface mount packages | |
| JPH01217993A (en) | Semiconductor device | |
| JPH11214606A (en) | Resin-sealed semiconductor device and lead frame | |
| US3522490A (en) | Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions | |
| JPH0442940Y2 (en) | ||
| JPH0777254B2 (en) | Semiconductor mounting board | |
| JPS62217476A (en) | magnetic head assembly | |
| US5849609A (en) | Semiconductor package and a method of manufacturing thereof | |
| US6493238B1 (en) | Method and apparatus to compliantly interconnect area grid arrays and printed wiring boards | |
| JP2003208938A (en) | Lead pins for wiring boards | |
| JPH0317240B2 (en) | ||
| JPH0812895B2 (en) | Semiconductor device mounted pin grid array package substrate | |
| JP2579495B2 (en) | Semiconductor mounting substrate | |
| JPH0419806Y2 (en) | ||
| JPH06268086A (en) | Semiconductor integrated circuit device and printed circuit board on which the same is mounted | |
| JP3537585B2 (en) | Photoelectric conversion device | |
| JP2859221B2 (en) | Terminal structure of electronic components | |
| JPH0777243B2 (en) | Surface mount package | |
| JP2000277556A (en) | Solder bump land metal structure | |
| JPH0331086Y2 (en) | ||
| JPH0513963A (en) | Electronic component mounting board | |
| JPH0447965Y2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |