JP3550786B2 - IC socket - Google Patents

Description

[0001]
[Industrial applications]
The present invention relates to an IC socket used for inspecting an IC component packaged with an IC, an LSI, and the like.
[0002]
[Prior art]
In some IC components, the connection terminals are not located on the sides of the IC main body, but are arranged in a lattice shape toward the bottom (bottom) of the IC main body. At present, these IC components include a so-called pin grid array (hereinafter, referred to as PGA) in which pin-shaped connection terminals are arranged in a lattice shape with a downward direction, and solder at least in the vicinity of the peripheral surface. A so-called ball grid array (hereinafter referred to as BGA) formed in a substantially spherical shape is known.
[0003]
In such an IC socket for PGA or BGA, the contact pins must be provided below the mounting surface of the IC component. However, in such a case, when the IC component is loaded into the IC socket, There is a disadvantage that the connection terminal collides with a contact portion formed at the tip of the contact pin, and cannot be set in a proper position in the IC socket in a proper posture. Further, in the case of the BGA, particularly, the connection terminal is called a solder ball and its surface is relatively brittle, so that there is an inconvenience that the connection terminal is damaged by the tip of the contact pin at the time of loading. For this reason, at the time of loading of the IC component, the tip of the contact pin is made to escape sideways from the insertion path of the connection terminal of the IC component, and after the IC component is set in a regular position and in a regular posture, the connection terminal It is preferable that the contact be made.
[0004]
In addition, the connection terminals of the IC component may be dusty or dirty, and an oxide film may be formed on the connection terminals, so that the electrical connection between the connection terminal of the IC component and the contact pin is properly performed. May not be. For this reason, it is required that the contact terminal and the contact pin be brought into contact with each other when the IC component is loaded, and then a sliding motion be given between the two to ensure electrical connection (hereinafter referred to as wiping).
[0005]
From these viewpoints, Japanese Utility Model Laid-Open Publication No. 2-89793 discloses that, when PGA is loaded, the slide member is lowered in conjunction with the pressing down of the cover member, the tip of the contact pin is released to the side, and the PGA is placed on the mounting surface. And thereafter, the slide member is raised in conjunction with the return of the cover member to return, and the contact pin is brought into contact with the connection terminal (pin). In addition, at the same time as the contact operation, by the special shape of the contact pin, the connection terminal, that is, the PGA is moved on the mounting surface in a direction orthogonal to the direction in which the elastic force works by only the elastic force of the contact pin itself, and wiping is performed. Let it do.
[0006]
[Problems to be solved by the invention]
However, as described above, in order to move the connection terminal, that is, PGA, in a direction orthogonal to the direction in which the elastic force acts, only by the elastic force acting in one direction of the contact pin itself, it is necessary to contact the contact terminal. The shape of the contact pin becomes complicated, which is not always a good solution in terms of processing, and moving the PGA itself for wiping is not necessarily anxious in terms of its operation. Absent. Therefore, the production cost is inevitably high.
[0007]
SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide an IC socket for an IC component in which connection terminals are arranged at a lower portion of an IC body, in which a contact pin is elastically deformed. The contact portion can be moved in two directions orthogonal to each other, and the contact portion is brought into contact with the connection terminal only by moving the slide member in one direction upward or downward without moving the IC component. Another object of the present invention is to provide an IC socket capable of reliably performing wiping.
[0008]
Means and Action for Solving the Problems
In order to achieve the above object, an IC socket according to the present invention comprises: mounting means integrated with a socket body for mounting an IC component having connection terminals arranged below the IC body; A cover member which is attached to the mounting means and reciprocates at the time of loading and unloading of the IC component at a position above the mounting means, and which is arranged integrally with the main body at a position below the mounting means so as to correspond to the connection terminal. A contact pin formed at its tip by elastic deformation and movable in first and second horizontal directions perpendicular to each other; and a mounting means interlocked with the socket body in response to reciprocation of the cover member. The contact pins are mounted so as to be movable up and down at positions below and are arranged with holes through which the contact pins respectively penetrate, and elastic deformation of the contact pins is performed for each of the hole positions. A sliding member having a first acting portion and a second acting portion formed therein, the first acting portion being sequentially moved by one of up and down movement of the sliding member when the IC component is loaded. Allow the contact portion to move in the first horizontal direction, and the second operating portion allows the contact portion to move in the second horizontal direction.
[0009]
Further, in the IC socket of the present invention, preferably, the first action portion and the second action portion are formed such that the phase is shifted by 90 ° from the inner wall surface of the hole arranged in the slide member or an extension surface thereof. At the time of loading the IC component, at least the second operating portion moves the contact portion in the second horizontal direction against the elasticity of the contact pin.
[0010]
Further, in the IC socket according to the present invention, preferably, the contact portion is formed in a forked shape, and the inner wall surface of the hole in which the first operating portion and the second operating portion are arranged in the slide member or an extended surface thereof. The first working portion is capable of expanding the fork against the elasticity of the contact portion.
[0011]
【Example】
First embodiment
The first embodiment of the present invention shows an open top type IC socket for BGA. Although BGA is well known, an example thereof is shown in FIG. 1, in which FIG. 1 (a) is a side view and FIG. 1 (b) is a bottom view. On the bottom surface of the BGA, a plurality of spherical solder balls B having a diameter of about 0.75 mm are arranged in a grid pattern as connection terminals.
[0012]
First, an outline of the overall configuration of the present embodiment will be described with reference to FIGS. 2 is a plan view of the IC socket of the present embodiment, FIG. 3 is a partial cross-sectional view taken along line AA of FIG. 2, and FIG. 4 is a cross-sectional view taken along line BB of FIG. It is. A locate board 2 is attached to the bottom side of the main body 1 so as to be vertically movable in FIG. As is well known, locate board 2 facilitates positioning of contact pins when mounting an IC socket on a printed wiring board. This locate board 2 is shown in a state separated from the main body 1 in FIG. 3 and in a state in contact with the main body 1 in FIG.
[0013]
On the upper surface side of the main body 1, first, a slide plate 3 is arranged. The slide plate 3 is guided by four reference pins 4 each having one end inserted into the main body 1 and can move up and down with respect to the main body 1 in FIG. An upper plate 5 is arranged above the slide plate 3. The upper plate 5 is attached to the main body 1 and has four receiving holes into which the other ends of the reference pins 4 are inserted. A coil spring 6 is wound around the reference pin 4, and pushes the slide plate 3 toward the main body 1, that is, the lower side in FIG. 3 with respect to the upper plate 5. Further, eight guides 5a are formed on the upper surface side of the upper plate 5 as clearly shown in FIG. Each guide 5a is formed with a slope toward the center of the IC socket in FIG. Therefore, the BGA can be appropriately guided and placed on the upper surface of the upper plate 5.
[0014]
A cover 7 is arranged above the upper plate 5. The cover 7 has an opening 7a so that the BGA can be loaded from above. The cover 7 is pushed upward in FIG. 3 by the coil springs 8 (FIG. 4) provided between the cover 7 and the main body 1 at the four corners in FIG. However, the upper limit position is the position shown in FIGS. 3 and 4 where the flexible hook portions 7b provided at the four corners are locked to the hook portions 1a of the main body 1. The main body 1, the locate board 2, the slide plate 3, the upper plate 5, and the cover 7 described above are all made of synthetic resin.
[0015]
As shown in FIG. 3, two slide bars 9 are attached to the cover 7, and both are arranged in an X shape. Similarly, another pair is symmetrically arranged on the opposite side. As shown in FIG. 4, one end of the slide bar 9 is rotatably attached to the press-fit pin 10 in a slit 7 c formed in the cover 7. At the other end of the slide bar 9, a shaft 11 is provided. When the cover 7 moves up and down in FIG. 3, it slides on the slide support 12 right and left. The detailed configuration and operation will be described later.
[0016]
A plurality of contact pins 13 are attached to the main body 1 by press fitting. The connection terminals protruding from the bottom surface side of the main body 1 penetrate through a plurality of holes arranged on the locate board 2, and the contact pieces on the upper surface side have flexibility, and a plurality of contact pieces arranged on the slide plate 3 are arranged. The holes penetrate the holes and their tips are inserted into a plurality of holes 5 b arranged in the upper plate 5. The shape of the contact pin 13 and the shape of each hole will be described later in detail.
[0017]
Since it is considered that the overall configuration of the present embodiment has been roughly understood from the above description, the configuration of each unit will be described in detail. First, the main body 1 will be described with reference to FIGS. FIG. 5 is a plan view of the main body 1, and FIG. 6 is a cross-sectional view taken along line CC of FIG. 7 is a sectional view taken along line DD of FIG. 5, and FIG. 8 is a rear view of FIG. 9A and 9B show a plurality of hole shapes formed in the main body 1. FIG. 9A is an enlarged view of a frame A in FIG. 5, and FIG. 9B is a cross-sectional view taken along line EE in FIG. FIG.
[0018]
As can be seen from FIGS. 5 and 8, the above-described hook portions 1a are formed at four corners. Similarly, cylindrical holes 1b for accommodating the above-described coil springs 8 are formed at the four corners. Further, four cylindrical holes 1c into which one ends of the reference pins 4 are inserted are formed. In addition, four hooks 1d, eight hooks 1e, and one pin 1f are formed on the upper surface side of the main body 1. On the other hand, four pins 1g for positioning on the printed wiring board are formed on the bottom surface side. Further, a plurality of through-holes 1h are formed in the main body 1 in a diagonal direction of the main body 1 as shown in FIG. 9A so as to press-fit and attach the contact pins 13 thereto. A pair of parallel elongated holes 1i are formed through which the slide support 12 is press-fitted.
[0019]
The above-mentioned locate board 2 is shown in detail in FIG. (A) is a plan view of the locate board 2, (b) is a partial cross-sectional view as viewed from the right side of (a), and (c) is a rear view. The locate board 2 is formed with four flexible hook portions 2a. The hooks 2a protrude upward from below the main body 1 in FIGS. 3 and 6, and are engaged with the hooks 1d. On the back surface of the locate board 2, there are formed pins 2b for positioning on the printed wiring board and eight legs 2c for keeping a predetermined space between the pins 2b and the printed wiring board. Further, a plurality of holes 2d are formed in the locate board 2 to allow the connection terminals of the contact pins 13 to pass therethrough. Since the role of locate board 2 is well known, its description is omitted.
[0020]
Next, the slide plate 3 will be described with reference to FIGS. 11A is a plan view of the slide plate 3, FIG. 11B is a partial cross-sectional view taken along line FF in FIG. 11A, and FIG. FIG. FIG. 12A is an enlarged view of a frame B in FIG. 11A, and FIG. 12B is a cross-sectional view taken along a line GG of FIG. The slide plate 3 is formed with four through-holes that fit with the reference pins 4 described above, and is fitted with the pins 1f of the main body 1 so as not to mistake the mounting direction to the main body 1. A hole 3b is formed.
[0021]
In this slide plate 3, two shaft portions 3c are formed in the vertical direction in FIG. 11 (a), and the upper two shaft portions 3c are longer on the left side than on the right side and two lower shaft portions 3c. The shaft portion 3c is formed longer on the right side than on the left side. The shaft portion 3c comes in contact with the slide bar 9 as shown in FIG. A plurality of holes 3d are formed in the slide plate 3 to allow the contact pins 13 to penetrate, and besides the holes 3d, protruding portions 3e are formed on the upper surface side as is apparent in FIG. ing. Further, the inside of the hole 3d has a special shape, which will be described later.
[0022]
The upper plate 5 will be described with reference to FIGS. 13A is a plan view of the upper plate 5, FIG. 13B is a cross-sectional view taken along line HH of FIG. 13A, and FIG. 13C is a rear view of the upper plate 5. . FIG. 14A is an enlarged view of a hole shown in the frame E of FIG. 13A, and FIG. 14B is a sectional view taken along line JJ of FIG. 14A. As described above, eight guides 5a having inclined surfaces are formed on the upper surface of the upper plate 5 to regulate the position of the BGA. On the back side of the upper plate 5, four holes 5c into which the other ends of the reference pins 4 are inserted are formed. Both ends of the coil spring 6 wound around the reference pins 4 are formed with the holes 5c. It is received by a substantially circular groove formed in the hole 3 a of the slide plate 3.
[0023]
The upper plate 5 is attached to the main body 1 by engaging eight flexible hooks 5d formed on the rear surface thereof with hooks 1e formed on the main body 1. Accordingly, the urging force of the coil spring 6 is exclusively used to move the slide plate 3 downward in FIG. Further, as shown in FIG. 14, the shape of the plurality of holes 5b provided through the upper plate 5 is such that the cross section for receiving the tip of the contact pin 13 has a substantially square shape, and the solder of the BGA is formed. The cross section for receiving the ball B has a shape synthesized with a circular portion.
[0024]
The cover 7 disposed above the upper plate 5 in FIG. 3 will be described with reference to FIGS. 15 is a plan view of the cover 7, FIG. 16 is a sectional view taken along the line KK in FIG. 15, and FIG. 17 is a rear view. The cover 7 has an opening 7a at the center thereof, which is necessary for attaching and detaching the BGA as described above. In addition, four flexible hooks 7b are formed at the four corners so as to engage with the hooks 1a of the main body 1. Further, at the four corners, there are provided four shaft portions 7d which are slidably fitted in the holes 1b of the main body 1 in the axial direction. As shown in FIG. 3, a coil spring 8 is housed in the hole 1b, and one end of the coil spring 8 is fitted in a substantially circular hole formed at the tip of the shaft portion 1d.
[0025]
The slit 7c is formed only on two opposing sides as shown in FIG. 17, and the shape is not straight. The reason for this is that two slide bars 9 are arranged in an X shape for each side as described above. For this reason, as described above, the length of the shaft 3c formed on the slide plate 3 is also different between the left and right. Holes 7e are formed at four places on the side surface of the cover 7, and as described above, the press-fit pins 10 (FIG. 3) for rotatably mounting the slide bar 9 are press-fitted into the holes 7e. .
[0026]
Next, a configuration in which the slide plate 3 is moved up and down by the slide bar 9 will be described with reference to FIGS. 18 to 20 are cross-sectional views of the main parts in FIG. 3, FIG. 18 shows a state where the cover 7 is at an upper limit position before operation, FIG. 19 shows a state where the cover 7 is at a lower limit position, and FIG. Each position is in the middle of returning from the position to the upper limit position, and FIG. 21 is an explanatory sectional view of a main part of FIG.
[0027]
The bases 12a of the slide support 12 are press-fitted into eight holes 1i formed in the main body 1, respectively. The slide support 12 is formed by stamping a plate material and has the same shape, but is press-fitted with its orientation changed according to the hole position as shown in the figure. The slide support 12 has a recess 12b for sliding the shaft 11, and receives one shaft 11 by a pair of slide supports 12 as shown in FIG.
[0028]
The slide bar 9 has one end rotatably attached to the press-fit pin 10 as described above, and the other end prevents the shaft 11 from coming off the slide bar 9 by a well-known retaining ring 14 such as an E-ring. Attached. In FIG. 21, the interval between the shaft 11 and the two retaining rings 14 is intentionally enlarged for clarity. In the vicinity of the other end of the slide bar 9, a pushing portion 9a that slides on the shaft portion 3c of the slide plate 3 is formed.
[0029]
Finally, the shape of the contact pin 13 of the present embodiment and the configuration directly related thereto will be described in detail with reference to FIGS. FIG. 22 shows an initial state in which the BGA is not loaded. FIG. 22A is a plan view showing the position of the contact pin 13 in the hole 5b of the upper plate 5, and FIG. 22) is a cross-sectional view as viewed from below, and FIG. 22 (c) is a cross-sectional view as viewed from the right side of FIG. 22 (b). Similarly, FIG. 23 shows a state in which the cover 7 is being pushed down, FIG. 24 shows a state in which the cover 7 is pushed down, FIG. 25 shows a state in which the BGA is being placed on the upper plate 5 and is being returned, and FIG. This shows the operation completed state. FIG. 27 is a detailed view of the tip shape of the contact pin 13, FIG. 27 (a) is a side view, and FIG. 27 (b) is a perspective view.
[0030]
The contact pin 13 is formed by punching and bending a beryllium copper plate material by a press machine. As can be seen in FIG. 22, the base 13a is pressed into the hole 1h (FIG. 9) of the main body 1. The connection terminal 13b is loosely fitted in the hole 2d of the locate board 2. The upper portion of the base portion 13a is flexible, and bends in the left-right direction in FIG. 22 (b) and also in the left-right direction in FIG. 22 (c). Then, two inclined surfaces 13c and 13d are formed at an angle of 90 °, and the contact portion 13e at the tip is bent to approximately 90 °. As shown in FIG. 27, the tip of the contact portion 13e forms a corner 13e3 between the groove 13e1 and the rectangular surface 13e2.
[0031]
Most of the slope portion 13c is in the hole 3d (FIG. 12) of the slide plate 3, and the contact pin 13 is bent by being pushed by the step 3f formed in the hole 3d. . FIG. 22 (c) shows a state of being bent rightward by the step 3f. The slope 13 d is located between the slide plate 3 and the upper plate 5, is formed beside the hole 3 d of the slide plate 3, and is pushed by a protrusion 3 e having an extended surface of the inner wall surface of the hole 3 d to make contact. The pin 13 is bent leftward in FIG. 22 (b).
[0032]
With the above, the description of the configuration of the present embodiment is finished, and then, the mounting / dismounting operation of the BGA will be described. In the IC socket according to the present embodiment, the initial position before the BGA is loaded is shown in FIGS. The posture of the contact pin 13 at this time is shown in FIG. First, from the state of FIG. 18, the cover 7 is pushed down by a mechanical device or the like against the force of the coil spring 8 (FIG. 4). Thereby, the two slide bars 9 arranged in the X-shape move the shaft 11 within the concave portion 12b of the slide support 12, and open rightward and leftward.
[0033]
Due to the movement of the shaft 11, the pushing portion 9a pushes the shaft portion 3c, and pushes the slide plate 3 upward against the force of the coil spring 6 (FIG. 4). In FIG. 22, when the slide plate 3 moves upward, the step 3f in the hole 3d retreats upward from the engagement position with the slope 13c. In FIG. 22C, the contact portion 13e is bent leftward, and the contact portion 13e is similarly moved leftward in FIG. 22C, that is, toward the surface in FIG. 22B. FIG. 20 and FIG. 23 show the state of the movement.
[0034]
When the cover 7 is further pushed down, the projection 3e of the slide plate 3 pushes the slope 13d. Therefore, the contact pin 13 is bent leftward in FIG. 23B against its own elasticity, and the contact portion 13e is similarly moved leftward, that is, in FIG. FIGS. 19 and 24 show a state in which the cover 7 is prevented from descending by the main body 1 or the upper plate 5 in this manner.
[0035]
In this way, the BGA is inserted from the opening 7 a and placed on the upper plate 5 with the cover 7 pushed down to its lower limit position. In this case, as is clear from FIGS. 24 (a) and (b), the contact portion 13e has a cross section that forms a part of the hole 5b completely retreated from a circular portion. Since the diameter is larger than the diameter of the solder ball B of the BGA, the BGA is placed without any trouble by inserting all the solder balls B into the respective holes 5b.
[0036]
After the BGA is placed on the upper plate 5, the pressing force of the cover 7 is released. Thereby, the cover 7 moves up and the slide plate 3 moves down. Since the protruding portion 3e retreats from the slope portion 13d as the slide plate 3 descends, the contact pin 13 performs a return operation by its own elastic force, but the operation stops when the contact portion 13e contacts the solder ball B. . The state of the cover 7, the slide bar 9, and the slide plate 3 at that time is shown in FIGS. At this time, the contact portion 13e bites into the solder ball B at the corner portion 13e3 and is in contact without permission. In addition, since the position is higher than the side surface of the solder ball B (horizontal diameter position in FIG. 25B), the BGA can be removed without applying a force for pressing the BGA against the upper plate 5. It can be securely held at a predetermined position.
[0037]
When the slide plate 3 further descends from such a state, the contact pins 13 are pushed by the stepped portions 3f at the slopes 13c, and are bent rightward in FIG. 25C. At this time, since the corner portion 13e3 of the contact portion 13e is easily inserted into the solder ball B as described above, the solder ball B is slightly rubbed linearly. As a result, it is possible to reliably remove substances that impair the electrical conductivity, such as dust and oxide films, which have adhered to the surface of the solder ball B, and it is possible to enhance the stability of contact due to pressure concentration.
[0038]
Also, in consideration of the case where the BGA is actually joined to a printed wiring board, the required quality for the lower spherical shape of the solder ball B is extremely strict. On the other hand, when inspecting with an IC socket, the solder pins B may be damaged when the contact pins are brought into contact with the solder balls B or during wiping even in a normal case. In this case, the contact portion between the corner portion 13e3 of the contact portion 13e and the solder ball B is located above the side surface of the solder ball B, so that the above-described required quality can be sufficiently satisfied.
[0039]
After the wiping of the solder ball B is performed in this manner, the hook 7b of the cover 7 is locked to the hook 1a of the main body 1, and the loading operation of the BGA is completed. The state of each part at that time is shown in FIGS. When the BGA is taken out of the IC socket after the BGA inspection is performed in this state, a series of operations for pushing down and releasing the cover 7 are performed again. The operation of each part in that case is substantially the same as the case of the loading operation, and therefore detailed description is omitted. However, the operation of the contact pins is performed in the order of FIG. 26, FIG. 25, FIG. 24, FIG. 23, and FIG. At 24, the BGA is taken out.
[0040]
As described above, in this embodiment, the slide plate 3 has the protrusion 3e as the first action portion and the step portion 3f as the second action portion with respect to the contact pin 13, and the phase of their relative positions is 90 °. When the slide plate 3 is lowered, the contact pins 13 are actuated in two horizontal directions perpendicular to each other, so that the contact portions are brought into contact with the connection terminals, and then the wiping is performed. In particular, at the time of wiping, the step portion 3f pushes the slope portion 13c, so that wiping is reliably performed.
[0041]
In the above-described embodiment, the first action portion that presses the slope portion 13d of the contact pin 13 is formed as the protrusion 3e protruding from the upper surface of the slide plate 3, but is formed in the hole 3d. Alternatively, this operation may be performed at the edge of the hole 3d. Further, the phases of the protrusion 3e of the first action portion and the step 3f of the second action portion may be the same without being shifted by 90 °. Further, in the above-described embodiment, the upper plate 5 is used as the mounting means of the BGA. However, if there is no fear of contact between the contact portions 13a of the contact pins 13, only a part of the BGA, for example, only the outer peripheral portion, is attached to the main body 1. May be supported by the mounting means formed in a part of the.
[0042]
Further, in the above embodiment, the case where the test object is a BGA has been described. However, it is needless to say that the present invention can be applied to all IC components such as PGA in which connection terminals protrude from the lower surface of the IC body. Further, in the above embodiment, by changing the shape of a part of the slide plate 3 and the contact pins 13, the contact portion is brought into contact with the connection terminal when the slide plate 3 is lifted, and then wiping is performed. And such are included in the present invention.
[0043]
Second embodiment
The second embodiment of the present invention is shown as an IC socket for a BGA as in the first embodiment. In the first embodiment, when the slide plate 3 is lowered, the contact portion is sequentially brought into contact with the connection terminal of the IC component to perform wiping. However, in the present embodiment, conversely, the slide plate is raised. A description will be given of an example in which the contact portion is sometimes brought into contact with the connection terminal and wiping is performed. The structure of the entire IC socket for moving the slide plate up and down is the same as that described in Japanese Utility Model Application Laid-Open No. 2-89793 as it is, and therefore will not be specifically illustrated and will not be described in detail.
[0044]
First, the shape of the contact pin used in this embodiment will be described with reference to FIG. FIG. 28A is a front view of the contact pin, and FIG. 28A is a perspective view. The contact pin 15 is formed by punching and bending a beryllium copper plate material by a press machine, and press-fits the connection terminal 15a into a main body (not shown) so that the tip protrudes downward. The contact portion has a bifurcated shape, and both the first contact portion 15b and the second contact portion 15c have flexibility, and are bent in the left-right direction and the front-back direction on the paper surface in FIG. I'm sorry. The contact portions 15b and 15c are formed with parallel slopes 15d and 15e and slopes 15f and 15g inclined in opposite directions.
[0045]
FIG. 29 shows an arrangement relationship between the slide plate 16 and the contact pins 15 in this embodiment. Also in this embodiment, a plurality of holes are arranged in a grid pattern on the slide plate 16 corresponding to the connection terminals of the BGA. On the inner wall surface of each hole 16a, a pushing portion 16b is formed as a first acting portion, and a slope portion 16c is formed as a second acting portion. The pushing portion 16b has a shape shown by a dashed line in FIG. 28 (a), and when the slide plate 16 comes down and comes into contact with the slope portions 15f, 15g and pushes, the contact portions 15b, 15c are pressed. It is designed to widen the space. The slope 16c bends the contact pin 15 as shown by a solid line in FIG. 30 due to the interaction with the slopes 15d and 15e.
[0046]
Next, the loading operation of the BGA will be described. When the slide plate 16 is lowered by being pushed by the cover member (not shown), first, in FIG. 29, the lower edge of the hole 16a forming the slope 16c pushes the slopes 15d and 15e. The lower end edges of the slopes 15d and 15e are pushed to flex the contact portions 15b and 15c of the contact pin 15 rightward. Before the rightward bending operation is completed, the pushing portion 16b contacts the slope portions 15f and 15g and spreads between the contact portions 15b and 15c. FIG. 30 shows such a final descending state of the slide plate 16.
[0047]
In this state of FIG. 30, the BGA is inserted into the IC socket and set on the mounting portion. Next, when the slide plate 16 rises in conjunction with the cover member, the contact portions 15b and 15c follow the upward movement of the pushing portion 16b and the inclined portion 16c, and the contact portions 15b and 15c move leftward in FIG. To perform the return operation, and narrow the interval between them. Then, before returning to the original position shown in FIG. 28, a solder ball as a connection terminal of the BGA is held. When the slide plate 16 is further raised, the contact portions 15b and 15c continue only the return operation to the left in FIG. 29, and the contact portions 15b and 15c wipe the solder ball. Thereafter, the slide plate 16 returns to the state of FIG. 29, and the BGA inspection is performed in that state. In order to take out the BGA from the IC socket, such an operation is repeated, and the BGA is taken out in the state of FIG.
[0048]
In this embodiment, the case where the contact portions are formed in a bifurcated shape and the BGA solder balls are sandwiched therebetween is shown. However, it is needless to say that the object of the present invention can be achieved with only one contact portion. In the present embodiment, the pushing portion 16b as the first operating portion of the slide plate 16 and the inclined portion 16c as the second operating portion are arranged at substantially the same phase position with respect to the contact portion of the contact pin 15. However, the relative positions may be changed by changing their shapes. Also, in this embodiment, the case where the test object is a BGA has been described, but it is needless to say that the present invention can be applied to all IC components such as PGA in which connection terminals are arranged on the lower surface of the IC body. Furthermore, since the first embodiment is shown as an open-top type IC socket, the description has been made on the premise of this embodiment as well. However, in view of the object, the present invention is limited to such a type of IC socket. Not something.
[0049]
【The invention's effect】
As described above, according to the present invention, in an IC socket for an IC component in which connection terminals are arranged at a lower portion of an IC body, a contact pin is elastically deformed so that a contact portion can be moved in two directions orthogonal to each other. Since the contact portion is brought into contact with the connection terminal and wiping is performed only by moving the slide member upward or downward, it is necessary to complicate the shape of the contact pin as in the related art. Therefore, there is no need to move the IC components at the time of wiping, and the desired operation can be reliably performed.
[Brief description of the drawings]
FIGS. 1A and 1B show a BGA applied to a first embodiment of the present invention, in which FIG. 1A is a side view and FIG. 1B is a bottom view.
FIG. 2 is a plan view of the IC socket according to the first embodiment of the present invention.
FIG. 3 is a partial cross-sectional view taken along line AA of FIG. 2;
FIG. 4 is a cross-sectional view of FIG. 2 as seen from line BB.
FIG. 5 is a plan view of a main body according to the first embodiment.
FIG. 6 is a sectional view taken along line CC of FIG. 5;
FIG. 7 is a sectional view taken along line DD of FIG. 5;
FIG. 8 is a rear view of FIG. 5;
FIGS. 9A and 9B show a plurality of hole shapes formed in the main body in the first embodiment. FIG. 9A is an enlarged view of a frame A in FIG. 5, and FIG. It is EE sectional drawing.
10A and 10B show a locate board according to the first embodiment, wherein FIG. 10A is a plan view, FIG. 10B is a partial cross-sectional view as viewed from the right side of FIG. 10A, and FIG. FIG.
11A and 11B show a slide plate according to the first embodiment, in which FIG. 11A is a plan view, and FIG. 11B is a partial cross-sectional view taken along line FF in FIG. (c) is a rear view.
12 (a) is an enlarged view of a frame B in FIG. 11 (a), and FIG. 12 (b) is a sectional view taken along line GG of FIG. 12 (a).
13 (a) is a plan view, FIG. 13 (b) is a sectional view taken along line HH of FIG. 13 (a), and FIG. 13 (c) is a plan view of the upper plate in the first embodiment. It is a rear view.
14 (a) is an enlarged view of a hole shown in the frame E of FIG. 13 (a), and FIG. 14 (b) is a sectional view taken along line JJ of FIG. 13 (a).
FIG. 15 is a plan view of a cover in the first embodiment.
FIG. 16 is a sectional view taken along the line KK in FIG.
FIG. 17 is a rear view of FIG.
FIG. 18 is an explanatory cross-sectional view of main parts showing a state where the cover is at the upper limit position in the first embodiment.
FIG. 19 is an explanatory cross-sectional view of main parts showing a state where the cover is at the lower limit position in the first embodiment.
FIG. 20 is an explanatory cross-sectional view of main parts showing a state in which the cover is in a position halfway from the lower limit position to the upper limit position in the first embodiment.
FIG. 21 is an explanatory sectional view of a main part of FIG. 18;
22A and 22B show an initial state of a contact pin in the first embodiment, where FIG. 22A is a plan view showing a position in a hole of an upper plate, and FIG. 22B is a cross-sectional view of FIG. And (c) is a sectional view seen from the right side of (b) of FIG.
23A and 23B show a contact pin in a state where the cover is being pushed down in the first embodiment. FIG. 23A is a plan view showing the position in the hole of the upper plate, and FIG. FIG. 3C is a sectional view seen from the right side of FIG.
24A and 24B show the contact pins in a state where the cover is completely pressed down in the first embodiment. FIG. 24A is a plan view showing the position in the hole of the upper plate, and FIG. FIG. 3C is a sectional view seen from the right side of FIG.
25A and 25B show the contact pins in a state where the BGA is placed on the upper plate and the cover is in the process of returning in the first embodiment, and FIG. 25A is a plan view showing the position in the hole of the upper plate, and FIG. Is a cross-sectional view as viewed from below in FIG. (A), and FIG. (C) is a cross-sectional view as viewed from the right side in FIG.
26A and 26B show the contact pins in a state where the loading operation of the BGA is completed in the first embodiment, wherein FIG. 26A is a plan view showing the position in the hole of the upper plate, and FIG. (C) is a cross-sectional view as viewed from the right side of FIG. (B).
FIG. 27 is a detailed view of the tip shape of the contact pin in the first embodiment, wherein FIG. 27 (a) is a side view and FIG. 27 (b) is a perspective view.
28 (a) and 28 (b) show the shapes of contact pins according to a second embodiment of the present invention, wherein FIG. 28 (a) is a front view and FIG. 28 (b) is a perspective view.
FIG. 29 is an explanatory diagram showing a relationship between a slide plate and contact pins in the second embodiment.
FIG. 30 is an explanatory view showing a state in which contact pins are bent by a slide plate in the second embodiment.
[Explanation of symbols]
1 body
1a, 1d, 1e, 2a, 5d, 7b Hook
1b, 1c, 5c hole
1f, 1g, 2b pins
1h, 1i, 2d, 3a, 3b, 3d, 5b, 7e, 16a holes
2 Locate board
2c leg
3,16 slide plate
3c, 7d Shaft
3e Projection
3f step
4 Reference pins
5 Upper plate
5a Guide
6,8 coil spring
7 Cover
7a opening
7c slit
9 Slide bar
9a, 16b Pushing part
10. Press-fit pin
11 shaft
12 slide support
12a, 13a base
12b recess
13,15 Contact pin
13b, 15a connection terminal
13c, 13d, 15d, 15e, 15f, 15g, 16c Slope
13e, 15b, 15c Contact part
13e1 groove
13e2 rectangular surface
13e3 corner
14 retaining ring

Claims (5)

Mounting means integrated with the socket body for mounting an IC component having connection terminals arranged at a lower portion of the IC body; and the IC component mounted on the socket body and positioned above the mounting means. A cover member that performs a reciprocating operation at the time of loading and unloading, and a contact portion that is integrally arranged on the main body at a position below the mounting means so as to correspond to the connection terminal and that is formed at the tip by elastic deformation is orthogonal to each other. A first and a second horizontally movable contact pin; and a contact pin attached to the socket body so as to be vertically movable at a position below the mounting means in conjunction with reciprocation of the cover member. A plurality of holes through which the pins are inserted are arranged, and a first operating portion and a second operating portion are formed at each hole position to enable the contact pin to be elastically deformed. The first working portion allows the contact portion to sequentially move in the first horizontal direction by one of the upper and lower movements of the slide member when the IC component is loaded, An IC socket, wherein the second operating portion allows the contact portion to move in the second horizontal direction. 2. The device according to claim 1, wherein at the time of loading the IC component, at least the second action portion moves the contact portion in the second horizontal direction against the elasticity of the contact pin. 3. IC socket. The said 1st action part and the 2nd action part are formed in the inner wall surface of the said hole arrange | positioned at the said slide member, or the extension surface 90 degrees, The phase is shifted 90 degree | times, The Claim 1 or 2 characterized by the above-mentioned. The IC socket according to 1. The contact portion is formed bifurcated, and the first operating portion and the second operating portion are formed at substantially the same phase position on an inner wall surface or an extension surface of the hole arranged in the slide member, and 3. The IC socket according to claim 1, wherein the action portion is capable of expanding the fork against the elasticity of the contact portion. The cover member has an opening through which the IC component can be inserted and mounted on the mounting means, and is mounted so as to be vertically movable with respect to the socket body. The IC socket according to claim 1.

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