JP3573738B2 - Component housing and method of manufacturing the same - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to, for example, a housing structure for a power amplifying unit arranged in a power amplifying unit of a mobile phone base station. For example, the present invention can efficiently dissipate and generate heat generated by heat-generating components in a power amplifying unit. The present invention relates to a compact, lightweight and low-cost component housing structure that can be realized.
[0002]
BACKGROUND OF THE INVENTION
A conventional power amplifying unit arranged in a power amplifying unit of a mobile phone base station has a plurality of electronic components including a module (heating component) that generates heat during operation. In most cases, these electronic components need to be shielded in order to prevent the influence of external electromagnetic waves.
[0003]
Conventionally, as shown in FIG. 11, a module M is mounted in a metal module case 30 for shielding the module M, and a heat dissipating mechanism 40 including a plurality of fins is provided on an outer bottom surface of the module case 20. The module M is mounted and cooled by the heat radiating mechanism 40.
[0004]
However, since the heat dissipating mechanism (fin) 40 is a cast product or an extruded product, there is a limit in reducing the plate thickness and the heat dissipating mechanism (fin) of the part to which the module case 30 is attached. For this reason, there has been a problem that the heat generated in the module M cannot be sufficiently diffused into the air, and the heat radiation effect is not sufficient. Therefore, the transmission power could not be increased to a certain value or more.
[0005]
In addition, since a plurality of power amplifying units are usually arranged to configure a power amplifying unit in order to secure a large power, the overall configuration of the mobile phone base station must be increased, and the operating cost can be reduced. There was a problem that can not be.
It has been found that if the plate thickness of the heat dissipating mechanism 40 at the portion in contact with the module M can be reduced, the heat dissipating effect increases, and the power amplifier unit, and consequently, the overall size of the mobile phone base station can be reduced.
[0006]
An object of the present invention is to provide a small and lightweight component housing capable of efficiently dissipating and cooling heat generated by a mounted heat-generating component.
Another object of the present invention is to provide a method for efficiently manufacturing such a component housing.
[0007]
[Means for Solving the Problems]
A component housing of the present invention that solves the above problems is a metal component housing for mounting a heat-generating component, for example, a component housing made of an aluminum material or an alloy thereof, and has a front surface portion and a back surface portion. The surface portion has a plurality of partition walls for forming a space for accommodating the heat-generating components on a substantially flat bottom surface, and when a shield cover of a predetermined size is covered, the shield cover is provided. Has a structure in which the accommodation space formed by the inner surface and the partition wall is shielded from the outside. In addition, a heat dissipating mechanism in which a plurality of fins are arranged in the same direction is formed at least on the rear surface side of the rear surface portion where the heat generating component is mounted.
At least one of the plurality of partition walls is a main partition wall that is thicker than other partition walls and extends or traverses the entire surface portion, and the arrangement direction of the plurality of fins is orthogonal to the main partition wall.
In the component housing having such a structure, the main partition wall is formed in a direction orthogonal to the arrangement direction of the fins, so that the rigidity against the force acting on the front and back portions is increased. In addition, since the rigidity of the portion where the heat radiating mechanism is attached is increased, the thickness of the housing at the surface can be reduced.
[0008]
The plurality of partition walls on the front side and the plurality of fins on the back side may be integrally formed from one metal work. In this case, the heat resistance is reduced, and the heat radiation efficiency is increased.
[0009]
All of the plurality of fins may be formed at a predetermined fin pitch into a thin plate shape having a notch. Such a heat dissipating mechanism having a fin structure can efficiently discharge debris and the like at the time of molding, and can enhance the heat radiation efficiency at the time of molding and at the time of use.
[0010]
A substrate support for supporting a substrate for an electronic component may be further integrally formed. In this case, the end on the front surface side of the substrate support is formed in a shape flush with the ends of the plurality of partition walls and in contact with the inner surface of the shield cover, and the rear surface of the substrate support is formed. The end on the side is formed at a height at which the wiring portion of the board supported by the end contacts the core wire of the external connector.
[0011]
The manufacturing method of the present invention includes a front surface portion having a plurality of partition walls for forming a region for mounting the heat-generating component, and a back surface portion in which a plurality of fins are arranged in the same direction at least on the back side of the heat-generating component. A method for manufacturing a component housing having
Excavating the plurality of fins from one metal work, and forming the plurality of partition walls by excavating the metal work while cooling the heat generated during the processing by the plurality of fins, Forming one partition wall so as to be thicker than the other partition walls and to extend in a direction perpendicular to the arrangement direction of the plurality of fins.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
In the present embodiment, an integrally molded component housing made of an aluminum material, which is an example of a lightweight metal having excellent heat conductivity, will be described.
FIG. 1 is an external perspective view of a front surface portion of the component housing 1, and FIG. 2 is an external perspective view of a rear surface portion. 3A is a plan view of the surface of the component housing 1, FIG. 3B is a left side view, FIG. 3C is a right side view, FIG. 3D is a front view, and FIG. is there. FIG. 4 is a plan view of the back surface of the component housing 1.
[0013]
<Structure of housing surface>
As shown in FIG. 1 and FIG. 3A, the surface of the component housing 1 has a bottom surface except for an outer peripheral frame 10a, a first partition 10b, a second partition 10c, and a substrate support 10d. 10f is hollowed out substantially flat, and has a structure in which a first section 101, a second section 102, and a third section 103 for mounting a plurality of modules (electronic components) each operating in a high frequency band are formed.
One end of the second partition wall 10c is integrally formed with the outer peripheral frame 10a of the component housing 1, and a gap 10i is formed between the other end and the first partition wall 10b. This gap 10i is used for wiring routing between the section 101 and the section 102. Each of the sections 101 to 103 is formed with a positioning recess 10g for mounting a module as a heat-generating component, an auxiliary partition wall 10m described later, and a plurality of screw holes 10h for mounting a module.
[0014]
The first partition wall 10b has a thickness approximately twice that of the outer peripheral frame 10a, the second partition wall 10c, and the substrate support 10d, and extends through the component housing 1 in the longitudinal direction. Thereby, the strength in the longitudinal direction is ensured.
[0015]
The outer peripheral frame 10a is formed by dropping into a two-stage frame structure of an inner frame and an outer frame. The inner wall height of the inner frame 100a is a height that is included on the same plane as the surface side end of each of the first partition wall 10b, the second partition wall 10c, and the substrate support 10d. The height (outer wall height) is higher than the height of the inner frame 100a by the thickness of a shield cover described later.
Further, screw holes 10j for attaching a shield cover, which will be described later, are formed at predetermined intervals in the inner frame 100a, the first partition wall 10b, the second partition wall 10c, and the front end portion of the substrate support 10d. . Each end is thinner than the screw hole 10j except for the screw hole 10j, so that the wall thickness of the component housing 1 is reduced in weight and the surface area is secured. .
[0016]
When the module is mounted in each of the sections 101 to 103, the board is supported by the board support 10d, and the wiring is performed by a cable or the like, the routing of the signal lines is as shown in FIG.
In FIG. 6, a solid line is a signal line to be disposed inside the component housing 1, and a broken line is a signal line to be routed through the outside of the component housing 1 via a connector. As can be seen from FIG. 6, the substrate support 10d, the second section 102 and the first section 101, and the first section 101, the second section 102, and the third section 103 are each wired by external routing. . This is to prevent the high frequency signal to be used from wrapping around and to enhance the shielding effect from external electromagnetic waves.
[0017]
<Back side structure>
Next, the structure of the back surface of the component housing 1 will be described.
As shown in FIGS. 2 and 4, the rear surface of the component housing 1 has an opening at a portion where the substrate support 10 d is formed. On the back side of the part where the module is mounted, a heat dissipating mechanism in which a plurality of fins 20 and 21 having the same shape are arranged in a direction orthogonal to the longitudinal direction is provided on the back surface main surface 10k (the bottom surface 10f). It is a structure integrally molded with the back).
[0018]
All the fin surfaces of the fins 20 and 21 are formed in a thin plate shape with a narrow fin pitch, and a plurality of notches are formed in a longitudinal direction. By molding at a narrow fin pitch, a certain strength or more is secured even if the fin surface is thinned. The notch portion of the fin is mainly formed to make it easier for debris, cutting oil and the like generated during molding to flow.
With such a heat dissipation mechanism, a sufficient heat dissipation area can be secured while keeping the heights of the fins 20 and 21 low. Further, since the thermal resistance is small, sufficient heat transfer efficiency can be obtained.
[0019]
The outer peripheral frame on the back surface side of the substrate support 10d is dropped into a two-stage frame structure of an inner frame and an outer frame, and the inner wall height of the inner frame is equal to the thickness of the back surface shield cover described later. It is lower than the back surface main surface 10k. Further, the height of the rear end portion of the substrate support 10d is lower than the height of the outer peripheral frame 10a by the thickness of the substrate. This is placed on the core wire of the connection connector when the connection connector is connected to the mounting hole 101 formed in a predetermined portion of the outer peripheral frame 10a and on the back side end of the substrate support 10d. This is for accurate positioning with the printed wiring portion on the substrate. This will be described with reference to FIG.
[0020]
FIG. 5 is a partial cross-sectional view of the side of the component housing 1 on which the substrate support 10d is formed. The printed circuit board B21 is placed and fixed on the rear side end of the substrate support 10d. The state where the connector CN for connection is screwed to the mounting hole 101 of the outer peripheral frame 10a is shown. C11 denotes a front surface shield cover, and C21 denotes a rear surface shield cover, which are fixed to the inner frame of the outer peripheral frame of the component housing 1 by screws. As described above, the height of the rear end portion of the substrate support 10d is designed to be the height at which the core wire CNC of the connection connector CN contacts the printed wiring of the substrate B21.
[0021]
<Unit assembly>
FIG. 7 shows how to assemble a power amplifying unit using the component housing 1 of the present embodiment. The power amplifying unit is arranged in the power amplifying unit of the mobile phone base station. The module, the board, and other unit components, which are the heat-generating components, are fixed to the component housing 1 of the present embodiment with screws. It is completed simply by attaching the front and rear shield cases.
[0022]
That is, as shown in FIG. 7, a connector CN for connecting to another unit or the like is attached to an end of the component housing 1, and auxiliary partitions are provided on the respective partitions 101 to 103 on the surface of the component housing 1. 10 m, and a plurality of modules M11 are screwed and fixed to a predetermined portion of the front surface (bottom surface 10f) of the component housing 1 while supporting the wired module substrate B11 via metal fittings. This completes the mounting operation on the front surface side.
On the back surface of the component housing 1, the substrate B21 is inserted from the opening of the substrate support 10d, and is fixed by screws.
[0023]
FIG. 8 shows the appearance of the surface of the electronic device unit (unshielded state) on which the module M11 and the like are mounted as described above. The auxiliary partition wall 10m is attached with its bottom face side notched as necessary.
In this state, the entire surface of the component housing 1 is covered with the surface shield cover. Thus, all the spaces partitioned by the front-side end portions of the first partition wall 10b, the second partition wall 10c, the auxiliary partition wall 10m, and the substrate support 10d and the inner surface of the front-side shield cover C11 are formed. Electromagnetically shielded from outside.
The substrate support 10d is electromagnetically shielded from both sides by covering the opening on the back surface with a shield cover (not shown) for the back surface.
Thus, the assembly of the power amplification unit is completed.
[0024]
FIG. 9 is an external perspective view of the power amplifying unit after assembly is completed. C11 is a shield cover for the surface portion. As is clear from FIG. 9, the thickness is extremely small while the heat dissipation mechanism and the shielded module housing space are formed. This is because the wall thickness of the component housing 1 is made thinner as a whole, the component housing 1 is formed of an aluminum material having excellent heat conductivity, and the fins 20 and 21 and the module M11 are mounted. This is because the part is integrally formed. Therefore, it is possible to reduce the size and cost of the entire power amplifying unit of the mobile phone base station in which a plurality of such power amplifying units are arranged.
[0025]
<Method of manufacturing component housing 1>
Next, a method for manufacturing the component housing 1 according to the present embodiment will be described.
The component housing 1 is manufactured by excavating a work (material for processing) made of aluminum. The processing procedure in this case will be described with reference to FIG.
[0026]
First, after positioning the work and shaping it into a predetermined shape and size (shape and size required for the unit to be used) (step S101), a plurality of fins 20 and 21 are formed by shaving off corresponding portions on the back surface. (Step S102).
The notch portions of the fins 20 and 21 also serve as guides for removing dust generated during processing.
[0027]
After the excavation of the back surface is completed, the entire front surface is excavated (step S103). At this time, the excavation is performed so that the first partition wall 10b is in a direction orthogonal to the direction of the fins 20 and 21. This makes it possible to secure the strength of the work in the direction that is relatively weak when the fins 20 and 21 are processed, and to suppress deformation due to stress generated during excavation. Further, when the excavation is performed, the work itself generates heat. However, since the heat is radiated as needed from the fins 20 and 21 formed first, deformation due to heat generated during the excavation is suppressed. Accordingly, the bottom surface portion 10f, the outer peripheral frame 10a, the first partition wall 10b, the second partition wall 10c, and the substrate support 10d of the component housing 1 can be accurately and thinly processed.
[0028]
After that, the recess 10g, the screw holes 10h and 10j, and the mounting hole 10l of the connection connector are formed (Step S104), and the manufacture of the component housing 1 is completed.
By molding the work in such a procedure, the component housing 1 can be manufactured with high yield.
[0029]
<Effects of this embodiment>
In the component housing 1 of the present embodiment, since the thin plate-like fins 20 and 21 are concentratedly arranged at a narrow pitch in a portion where heat radiation is required locally, the area of the heat radiation mechanism can be reduced without lowering the cooling capacity. Becomes possible.
[0030]
In addition, since the wall thickness of the component housing 1 is thin throughout, a unit using the same can be reduced in size and weight.
[0031]
In addition, since the mounting portion of the heat radiating mechanism and the partition walls 10b and 10c are integrally formed, the rigidity of the portion where the heat radiating mechanism is mounted is increased, and deformation is suppressed.
[0032]
Further, the first partition wall 10b is formed to be thicker than the other partition walls 10c and the like, and to be formed in a direction that traverses the entire surface portion, that is, a direction that is orthogonal to the arrangement direction of the fins 20, 21. The rigidity can be increased.
In the present embodiment, an example is shown in which the first partition wall 10b is formed in a direction that traverses the entire surface portion. However, when the arrangement direction of the fins 20 and 21 is displaced by 90 degrees, the first partition wall 10b is formed. The wall 10b is formed in a direction crossing the entire surface portion.
[0033]
In the present embodiment, the component housing 1 integrally formed by excavation from an aluminum material has been described as a preferred example. However, if the structure of the component housing 1 as a result of this embodiment is obtained as a result, an expected result is obtained. Therefore, the scope of the present invention is not limited to the example of the present embodiment. As the material of the housing, not only the aluminum material but also an aluminum alloy material or another metal member having excellent heat conductivity can be used instead.
[0034]
【The invention's effect】
As is apparent from the above description, according to the present invention, it is possible to provide a small and lightweight component housing capable of efficiently dissipating heat generated in a mounted heat-generating component to the outside and cooling the component.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a surface portion of a component housing according to an embodiment of the present invention.
FIG. 2 is an external perspective view of a back surface portion according to the embodiment.
3A is a plan view of the surface of the component housing according to the embodiment, FIG. 3B is a left side view, FIG. 3C is a right side view, FIG. 3D is a front view, and FIG.
FIG. 4 is a plan view of a back surface according to the embodiment.
FIG. 5 is a partial partial cross-sectional view of a component housing on which a substrate support is formed.
FIG. 6 is an explanatory diagram of a signal line routing path in the component housing.
FIG. 7 is an exploded perspective view showing a procedure for assembling an electronic device unit using the component housing according to the embodiment;
FIG. 8 is an external perspective view of a surface portion of an electronic device unit using the component housing according to the embodiment.
FIG. 9 is an external perspective view of a surface portion of the electronic device unit when completed.
FIG. 10 is an explanatory diagram of the procedure for manufacturing the component housing according to the present embodiment.
FIG. 11 is an external perspective view of a conventional electronic device unit.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component housing 10a Outer frame 10b, 10c, 10m Partition wall 10d Substrate support 10f Bottom part 10g Depression 101-103 Module mounting section 10i Void 10h, 10j Screw hole 100a Inner frame C11, C21 Shield cover 20, 21 Fin 10k Back surface main surface 10l Mounting holes B21, B11 Connector M, M11 module for connecting to substrate CN

Claims (6)

A metal component housing for mounting the heat-generating component, having a front surface portion and a back surface portion,
The surface portion has a plurality of partition walls for forming a space for accommodating the heat-generating components, respectively, on a substantially flat bottom surface, and when a shield cover of a predetermined size is covered, an inner surface of the shield cover is provided. And the storage space formed by the partition wall is shielded from the outside,
At least on the back side of the rear part of the part on which the heat-generating component is mounted, a heat radiating mechanism in which a plurality of fins are arranged in the same direction is formed,
At least one of the plurality of partition walls is a main partition wall that is thicker than the other partition walls and traverses or traverses the entire surface portion,
The arrangement direction of the plurality of fins is orthogonal to the main partition wall,
Parts housing. The plurality of partition walls on the front surface side and the plurality of fins on the back surface side are integrally formed from one metal work,
The component housing according to claim 1. All of the plurality of fins are formed in a thin plate shape with a notch at a predetermined fin pitch,
The component housing according to claim 2. A substrate support for supporting a substrate for electronic components is further integrally molded,
The end on the surface side of the substrate support is formed on the same plane as the ends of the plurality of partition walls so as to be in contact with the inner surface of the shield cover,
The end on the back surface side of the substrate support is formed at a height at which a wiring portion of the substrate supported by the substrate support comes into contact with a core wire of an external connector.
The component housing according to claim 2. Made of aluminum material or its alloy material,
The component housing according to claim 1. Manufactures a component housing having a surface portion having a plurality of partition walls for forming a region for mounting a heat-generating component and a back surface portion having a plurality of fins arranged in the same direction at least on the back side of the heat-generating component. A way to
Excavating the plurality of fins from one metal work;
The metal work is excavated while the heat generated during processing is cooled by the plurality of fins to form the plurality of partition walls, and at least one partition wall is thicker than another partition wall and the plurality of partition walls are thicker than the other partition walls. Molding so as to extend in a direction orthogonal to the arrangement direction of the fins,
Manufacturing method of component housing.

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