JP3600136B2 - Circuit device manufacturing method - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a circuit device, and more particularly to a method for manufacturing a thin circuit device using a recognition pattern that prevents diffused reflection.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a circuit device set in an electronic device is used for a mobile phone, a portable computer, and the like, and therefore, a reduction in size, thickness, and weight is required.
[0003]
For example, taking a semiconductor device as an example of a circuit device, a general semiconductor device is a packaged semiconductor device sealed with a conventional transfer mold. This semiconductor device is mounted on a printed circuit board PS as shown in FIG.
[0004]
In this package type semiconductor device, the periphery of the semiconductor chip 2 is covered with a resin layer 3, and lead terminals 4 for external connection are led out from the side of the resin layer 3.
[0005]
However, in this package type semiconductor device 1, the lead terminals 4 are protruded from the resin layer 3, so that the overall size is large, and the size, thickness, and weight are not satisfied.
[0006]
For this reason, companies have competed to develop various structures in order to realize miniaturization, thinning and weight reduction, and recently called a CSP (chip size package), a wafer scale CSP equivalent to the chip size, or chip size A CSP with a size slightly larger than that has been developed.
[0007]
FIG. 13 shows a CSP 6 that employs a glass epoxy substrate 5 as a support substrate and is slightly larger than the chip size. Here, description will be made assuming that the transistor chip T is mounted on the glass epoxy substrate 5.
[0008]
A first electrode 7, a second electrode 8, and a die pad 9 are formed on the front surface of the glass epoxy substrate 5, and a first back electrode 10 and a second back electrode 11 are formed on the back surface. The first electrode 7 and the first back electrode 10 are electrically connected to each other, and the second electrode 8 and the second back electrode 11 are electrically connected to each other through the through hole TH. The bare transistor chip T is fixed to the die pad 9, the emitter electrode of the transistor is connected to the first electrode 7 via a thin metal wire 12, and the base electrode of the transistor and the second electrode 8 are connected to the thin metal wire 12. Connected through. Further, a resin layer 13 is provided on the glass epoxy substrate 5 so as to cover the transistor chip T.
[0009]
Although the CSP 6 employs the glass epoxy substrate 5, unlike the wafer scale CSP, the extending structure from the chip T to the back surface electrodes 10 and 11 for external connection is simple and has an advantage that it can be manufactured at low cost.
[0010]
The CSP 6 is mounted on a printed circuit board PS as shown in FIG. The printed circuit board PS is provided with electrodes and wiring constituting an electric circuit, and the CSP 6, the package type semiconductor device 1, the chip resistor CR or the chip capacitor CC and the like are electrically connected and fixed.
[0011]
The circuit formed by the printed circuit board is mounted in various sets.
[0012]
Next, a method of manufacturing the CSP will be described with reference to FIGS.
[0013]
First, a glass epoxy substrate 5 is prepared as a base material (support substrate), and Cu foils 20 and 21 are pressure-bonded to both surfaces thereof via an insulating adhesive. (See FIG. 14A above)
Subsequently, Cu foils 20 and 21 corresponding to the first electrode 7, the second electrode 8, the die pad 9, the first back surface electrode 10 and the second back surface electrode 11 are coated with an etching-resistant resist 22, The foils 20 and 21 are patterned. The patterning may be performed separately on the front and back sides. (See FIG. 14B above)
Subsequently, a hole for the through hole TH is formed in the glass epoxy substrate by using a drill or a laser, and the hole is plated to form the through hole TH. The first electrode 7 and the first back electrode 10 and the second electrode 8 and the second back electrode 10 are electrically connected by the through hole TH. (See FIG. 14C above)
Although not shown in the drawings, the first electrode 7 and the second electrode 8 serving as bonding posts are plated with Au, and the die pads 9 serving as die bonding posts are plated with Au, and the transistor chip T is die-bonded. I do.
[0014]
Finally, the emitter electrode of the transistor chip T and the first electrode 7, and the base electrode of the transistor chip T and the second electrode 8 are connected via a thin metal wire 12 and covered with a resin layer 13. (See FIG. 14D above)
By the above manufacturing method, a CSP type electric element using the support substrate 5 is completed. This manufacturing method is the same even when a flexible sheet is used as the support substrate.
[0015]
On the other hand, a manufacturing method employing a ceramic substrate is shown in the flow of FIG. After a ceramic substrate as a support substrate is prepared, through holes are formed, and thereafter, front and rear electrodes are printed and sintered using a conductive paste. After that, until the resin layer of the previous manufacturing method is covered, the manufacturing method is the same as that of FIG. 14, but the ceramic substrate is very fragile. There is a problem that can not be molded. Therefore, after potting and hardening the sealing resin, polishing for flattening the sealing resin is performed, and finally, individual separation is performed using a dicing apparatus.
[0016]
[Problems to be solved by the invention]
In FIG. 13, the transistor chip T, the connection means 7 to 12 and the resin layer 13 are necessary components for electrical connection to the outside and protection of the transistor. It has been difficult to provide a circuit element that realizes reduction in thickness, thickness, and weight.
[0017]
Further, the glass epoxy substrate 5 serving as a support substrate is not necessary as described above. However, due to the manufacturing method, the glass epoxy substrate 5 was employed as a support substrate for bonding the electrodes, and the glass epoxy substrate 5 could not be eliminated.
[0018]
Therefore, the use of the glass epoxy substrate 5 increases the cost, and further, the glass epoxy substrate 5 is thick, so that the circuit element becomes thick, and there is a limit in reducing the size, thickness, and weight.
[0019]
Further, in the case of a glass epoxy substrate or a ceramic substrate, a through-hole forming step for connecting electrodes on both sides is indispensable, and the manufacturing process becomes long, which is not suitable for mass production.
[0020]
[Means for Solving the Problems]
The present invention has been made in view of the above-mentioned many problems, prepares a conductive foil, and has a shallower than the thickness of the conductive foil on the conductive foil in a region excluding a conductive pattern that forms at least a large number of circuit element mounting portions. Forming a separation groove to form a conductive pattern for each block, forming a recognition pattern in a region of the conductive foil other than the conductive pattern, and fixing a circuit element to each of the mounting portions of the desired conductive pattern A step of indirectly recognizing the position of the conductive pattern by the recognition pattern, and a step of forming a connection means for electrically connecting an electrode of a circuit element of each mounting portion and a desired conductive pattern. A step of collectively covering the circuit elements of each mounting portion and performing a common molding with an insulating resin so as to fill the separation groove; and a step of: Ring by characterized by comprising the step of separating.
[0021]
In the present invention, the conductive foil forming the conductive pattern is the starting material, and the conductive foil has a supporting function until the insulating resin is molded, and the insulating resin has the supporting function after the molding. The substrate can be eliminated, and the conventional problem can be solved.
[0022]
Further, in the present invention, since the position of each conductive pattern is indirectly recognized by the recognition pattern, it is possible to prevent erroneous recognition due to irregular reflection of light in the separation groove which occurs when directly recognizing the conductive pattern. Since the process can be performed by performing the position recognition twice, mass production with a very simplified wire bonding process can be realized, and the conventional problem can be solved.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
First, a method for manufacturing a circuit device according to the present invention will be described with reference to FIG.
[0024]
The present invention provides a conductive foil, and forms a separation groove shallower than the thickness of the conductive foil in the conductive foil in an area excluding at least a conductive pattern forming a large number of circuit element mounting portions, and forms a conductive pattern for each block. Forming a recognition pattern in a region of the conductive foil other than the conductive pattern, fixing a circuit element to each mounting portion of the desired conductive pattern, and indirectly by the recognition pattern A step of recognizing a position of a conductive pattern, a step of forming a connection means for electrically connecting an electrode of a circuit element of each mounting portion and a desired conductive pattern, and Applying a common mold with an insulating resin so as to fill the separation groove, separating the block from the conductive foil, and forming a plurality of blocks with the insulating resin. A step of abutting and attaching to an adhesive sheet; a step of measuring characteristics of the circuit element of each mounting portion of the block while being attached to the adhesive sheet; and a state of attaching to the adhesive sheet. And dicing the insulating resin of the block for each mounting portion by dicing.
[0025]
Although the flow shown in FIG. 1 does not coincide with the above-described steps, the formation of the conductive pattern and the recognition pattern is performed by three flows of Cu foil, Ag plating, and half etching. The bonding of the circuit element to each mounting portion is performed by the die bonding flow. In the position recognition flow, the position of each conductive pattern is recognized by detecting the recognition pattern. The electrodes of the circuit elements are connected to the conductive patterns by the wire bonding flow. In the transfer mold flow, a common mold using an insulating resin is performed. In the flow for removing the back surface Cu foil, the conductive foil in the thickness portion having no separation groove is etched. In the flow of the back surface processing, the electrode processing of the conductive pattern exposed on the back surface is performed. In the block separation flow, each block is mechanically separated from the connecting portion of the conductive foil. In the flow of the adhesive sheet, a plurality of blocks are attached to the adhesive sheet. In the measurement flow, non-defective products and characteristic ranks of circuit elements incorporated in each mounting section are determined. In the dicing flow, individual circuit elements are separated from the insulating resin by dicing.
[0026]
Hereinafter, each step of the present invention will be described with reference to FIGS.
[0027]
In the first step of the present invention, as shown in FIGS. 2 to 4, a conductive foil 60 is prepared, and a conductive foil 60 is applied to at least the conductive foil 60 in a region excluding the conductive pattern 51 where a large number of mounting portions for the circuit elements 52 are formed. The separation groove 61 shallower than the thickness of the foil 60 is formed to form the conductive pattern 51 for each block, and the recognition pattern 100 is formed in a region of the conductive foil 60 other than the conductive pattern 51.
[0028]
In this step, first, as shown in FIG. 2A, a sheet-shaped conductive foil 60 is prepared. The material of the conductive foil 60 is selected in consideration of the adhesiveness, bonding property, and plating property of the brazing material. As the material, a conductive foil mainly containing Cu, a conductive foil mainly containing Al, or Fe -A conductive foil made of an alloy such as Ni is employed.
[0029]
The thickness of the conductive foil is preferably about 10 μm to 300 μm in consideration of the later etching, and here, a copper foil of 70 μm (2 oz) was employed. However, it is basically good to be 300 μm or more and 10 μm or less. As will be described later, it is only necessary that the separation groove 61 shallower than the thickness of the conductive foil 60 can be formed.
[0030]
In addition, the sheet-shaped conductive foil 60 is prepared by being wound in a roll shape with a predetermined width, for example, 45 mm, and may be conveyed to each step described later, or may be a strip shape cut to a predetermined size. The conductive foil 60 may be prepared and transported to each step described later.
[0031]
Specifically, as shown in FIG. 2B, four or five blocks 62 on which a large number of mounting portions are formed are arranged on the strip-shaped conductive foil 60 at a distance. Slits 63 are provided between the blocks 62 to absorb the stress of the conductive foil 60 generated by a heat treatment in a molding process or the like. Index holes 64 are provided at regular intervals at the upper and lower peripheral edges of the conductive foil 60, and are used for positioning in each step.
[0032]
Subsequently, the conductive pattern 51 for each block 62 is formed.
[0033]
First, as shown in FIG. 3, a conductive film MF having corrosion resistance to an etching solution is selectively coated on the Cu foil 60 by plating. That is, the conductive film MF is patterned so that the conductive foil 60 excluding the region that becomes the conductive pattern 51 is exposed. Then, as shown in FIG. 4A, the conductive foil 60 is selectively etched via the conductive film MF. The conductive film MF serves as an etching protection film, and the separation groove 61 can be etched without using a resist.
[0034]
The material considered as the conductive film MF is Ag, Ni, Au, Pt, Pd, or the like. Moreover, these corrosion-resistant conductive films MF have a feature that they can be used as they are as die pads and bonding pads. For example, the Ag film adheres to Au and also adheres to the brazing material. Therefore, when the Au film is coated on the back surface of the chip, the chip can be thermocompression-bonded to the Ag film on the conductive pattern 51 as it is, and the chip can be fixed via a brazing material such as solder. Since the Au thin wire can be bonded to the Ag conductive film, wire bonding is also possible. Therefore, there is an advantage that these conductive films MF can be used as die pads and bonding pads as they are.
[0035]
The depth of the separation groove 61 formed by etching is, for example, 50 μm, and the side surface thereof is roughened, so that the adhesiveness to the insulating resin 50 is improved.
[0036]
The side wall of the separation groove 61 is schematically shown as a straight line, but has a different structure depending on the removing method. In this removing step, ferric chloride or cupric chloride is mainly used as an etchant, and the conductive foil is dipped in the etchant or showered with the etchant. Here, since the wet etching is generally performed non-anisotropically, the side surface has a curved structure.
[0037]
This step is a characteristic step of the present invention. As shown in FIG. 4B, the recognition pattern 100 is formed in a region other than the conductive pattern 51 of the conductive foil 60. Since this recognition pattern is formed simultaneously with the plating of the conductive film MF described above, the positional relationship with the conductive pattern 51 matches. The shape of the recognition pattern 100 is cross-shaped, but may be triangular or square as long as accurate position recognition can be performed.
[0038]
The recognition patterns 100 are provided on the upper and lower peripheral edges of the conductive foil 60 on which the conductive patterns 51 of the respective blocks 62 are provided, and are arranged at four corners of the conductive patterns 51 of the respective blocks 62. Further, the recognition patterns 100 are arranged so that the horizontal direction is determined by a combination of the horizontal directions and the vertical direction is determined by a combination of the vertical directions, and these directions completely match the directions of the conductive patterns. That is, by recognizing the recognition pattern 100, the coordinates of the position of each conductive pattern of each block 62 can be automatically determined indirectly.
[0039]
FIG. 4B shows a specific conductive pattern 51. This figure corresponds to an enlarged one of the blocks 62 shown in FIG. 2B. One of the portions painted black is one mounting portion 65, which constitutes the conductive pattern 51, and one block 62 has a large number of mounting portions 65 arranged in a matrix of 5 rows and 10 columns. The same conductive pattern 51 is provided every 65. A frame-shaped pattern 66 is provided around each block, and a positioning mark 67 at the time of dicing is provided inside the pattern 66 slightly apart therefrom. The frame-shaped pattern 66 is used for fitting with a mold and has a function of reinforcing the insulating resin 50 after the back surface etching of the conductive foil 60.
[0040]
The conductive pattern 51 is covered with a resist layer (not shown) at the time of etching the conductive pattern 51 so that the separation groove 61 is not formed in the remaining portion indicated by dots outside the frame-shaped pattern 66 of the conductive foil 60. As a result, the periphery of the recognition pattern 100 remains as the first conductive foil 60, and the separation groove 61 is not formed.
[0041]
In the second step of the present invention, as shown in FIG. 5, the circuit element 52 is fixed to each mounting portion 65 of the desired conductive pattern 51, and the position of the conductive pattern 51 is indirectly recognized by the recognition pattern 100. Another object of the present invention is to form connection means for electrically connecting the electrodes of the circuit element 52 of each mounting portion 65 and the desired conductive pattern 51.
[0042]
The circuit element 52 is a semiconductor element such as a transistor, a diode, or an IC chip, or a passive element such as a chip capacitor or a chip resistor. Although the thickness is increased, a face-down semiconductor element such as CSP or BGA can be mounted.
[0043]
Here, a bare transistor chip 52A is die-bonded to the conductive pattern 51A, and an emitter electrode and the conductive pattern 51B, and a base electrode and the conductive pattern 51B are fixed by ball bonding by thermocompression bonding or wet bonding by ultrasonic waves or the like. Connected via 55A. Reference numeral 52B denotes a chip capacitor or a passive element, which is fixed with a brazing material such as solder or a conductive paste 55B.
[0044]
Subsequently, in this step, the position of each conductive pattern 51 of each block 62 is recognized using the recognition pattern 100. As described above, since the recognition pattern 100 is formed of the conductive film MF on the conductive foil 60 and does not have the separation groove 61 around it, light is irregularly reflected on the inner wall of the separation groove 61 even when detected by the camera of the bonding apparatus. Since there is no need to do so, the outline can be clearly distinguished. Therefore, after accurately recognizing the positions of the four recognition patterns 100, the bonding wire 55A can be accurately fixed to the predetermined conductive pattern 51 using the coordinates of each conductive pattern 51 stored in the bonding apparatus. Of course, it is needless to say that the pattern of the electrode on the semiconductor element side is accurately recognized by the camera of the bonding apparatus.
[0045]
In this step, since a large number of conductive patterns 51 are integrated in each block 62, there is an advantage that the fixing of the circuit element 52 and the wire bonding can be performed very efficiently.
[0046]
In the third step of the present invention, as shown in FIG. 6, the circuit elements 52 of each mounting portion 63 are collectively covered, and are commonly molded with the insulating resin 50 so as to fill the separation grooves 61. .
[0047]
In this step, as shown in FIG. 6A, the insulating resin 50 completely covers the circuit elements 52A, 52B and the plurality of conductive patterns 51A, 51B, 51C. 50 is fitted to the curved structure on the side surface of the conductive patterns 51A, 51B, 51C filled therein, and is firmly coupled. The conductive pattern 51 is supported by the insulating resin 50.
[0048]
Also, this step can be realized by transfer molding, injection molding, or dipping. As the resin material, a thermosetting resin such as an epoxy resin can be realized by transfer molding, and a thermoplastic resin such as a polyimide resin and polyphenylene sulfide can be realized by injection molding.
[0049]
Further, when performing transfer molding or injection molding in this process, as shown in FIG. 6B, each block 62 is provided with the mounting portion 63 in one common mold, and one block of common insulating resin 50 is used for each block. Mold. For this reason, compared with the conventional method of individually molding each mounting portion such as transfer molding, the amount of resin can be significantly reduced, and a common mold can be used.
[0050]
The thickness of the insulating resin 50 coated on the surface of the conductive foil 60 is adjusted so as to cover about 100 μm from the top of the bonding wire 55A of the circuit element 52. This thickness can be increased or reduced in consideration of strength.
[0051]
The feature of this step is that the conductive foil 60 serving as the conductive pattern 51 becomes a support substrate until the insulating resin 50 is covered. Conventionally, as shown in FIG. 12, the conductive paths 7 to 11 are formed by using the support substrate 5 which is not originally required. However, in the present invention, the conductive foil 60 serving as the support substrate is required as an electrode material. Material. Therefore, there is a merit that the operation can be performed while omitting the constituent materials as much as possible, and the cost can be reduced.
[0052]
Further, since the separation grooves 61 are formed shallower than the thickness of the conductive foil, the conductive foils 60 are not individually separated as the conductive patterns 51. Therefore, it can be handled as a sheet-shaped conductive foil 60 integrally, and when the insulating resin 50 is molded, it has a feature that the work of transporting to the mold and mounting on the mold becomes very easy.
[0053]
In the fourth step of the present invention, as shown in FIG. 7, at least the region where the conductive pattern 51 is provided of the block 62 of the conductive foil 60 in the thickness portion where the separation groove 61 is not provided is removed, and the blocks 62 are connected. The purpose is to selectively leave the conductive foil 60 serving as the connecting portion 90.
[0054]
In this step, as shown in FIG. 7A, the back surface of the conductive foil 60 is covered except for at least the region 91 where the conductive pattern 51 of each block 62 is provided and overlaps with the peripheral end of the insulating resin 50. Thereafter, the exposed conductive foil 60 is showered with an etchant to selectively wet-etch the region 91 provided with the conductive pattern 51, thereby exposing the conductive pattern 51.
[0055]
FIG. 7B shows a cross-sectional view after completion of the above-described wet etching. The portions of the upper and lower peripheral edges of the conductive foil 60 and the slits 63 of each block 62 are left as the connecting portions 90 without the conductive foil 60 being etched. Has the function of maintaining as it is. By the function of the connecting portion 90, each block 62 can be taken out of the etching apparatus together with the connecting portion 90.
[0056]
In this step, the region where the conductive pattern 51 is provided is selectively wet-etched on the conductive foil 60 until the insulating resin 50 shown by the dotted line in FIG. 6 is exposed. As a result, the conductive pattern 51 is separated into a conductive pattern 51 having a thickness of about 40 μm, and the back surface of the conductive pattern 51 is exposed to the insulating resin 50. That is, the surface of the insulating resin 50 filled in the separation groove 61 and the surface of the conductive pattern 51 have a structure that substantially matches. Therefore, the circuit device 53 of the present invention does not have a step unlike the conventional back surface electrodes 10 and 11 shown in FIG. 12, so that it can be horizontally moved by the surface tension of solder or the like during mounting and can be self-aligned. Have.
[0057]
Further, the back surface treatment of the conductive pattern 51 is performed to obtain the final structure shown in FIG. That is, a conductive material such as solder is applied to the exposed conductive pattern 51 to form the back electrodes 56A, 56B and 56C, and the circuit device is completed.
[0058]
The fifth step of the present invention is to separate the block 62 from the connecting portion 90 of the conductive foil 60 as shown in FIG. 7B.
[0059]
In this step, each block 62 connected by the connecting portion 90 is pressed so as to protrude from the connecting portion 90 side as indicated by an arrow, and the adhesive surface between the connecting portion 90 and the insulating resin 50 is mechanically peeled off to form each block. Separate 62. Therefore, there is no need for a special cutting die in this step, and there is an advantage that the operation can be performed by an extremely simple method.
[0060]
In the sixth step of the present invention, as shown in FIG. 9, a plurality of blocks 62 are attached to an adhesive sheet 80 by bringing an insulating resin into contact therewith.
[0061]
After etching the back surface of the conductive foil 60 in the previous step, each block 62 is separated from the conductive foil 60.
[0062]
In this step, the periphery of the pressure-sensitive adhesive sheet 80 is attached to a stainless steel ring-shaped metal frame 81, and four blocks 62 are provided at the center portion of the pressure-sensitive adhesive sheet 80 with an interval such that a blade does not hit during dicing. The insulating resin 50 is abutted and affixed. As the adhesive sheet 80, a UV sheet (manufactured by Lintec Corporation) is used. Since each block 62 is made of the insulating resin 50 and has mechanical strength, an inexpensive dicing sheet can be used.
[0063]
In the seventh step of the present invention, as shown in FIG. 10, the characteristic of the circuit element 52 of each mounting portion 65 of each block 62 which is collectively molded with the insulating resin 50 while being attached to the adhesive sheet 80 is used. Measurement.
[0064]
The back surface of the conductive pattern 51 is exposed on the back surface of each block 62 as shown in FIG. 10, and the mounting portions 65 are arranged in a matrix exactly the same as when the conductive pattern 51 was formed. A probe 68 is applied to the back surface electrode 56 exposed from the insulating resin 50 of the conductive pattern 51, and the characteristic parameters and the like of the circuit elements 52 of each mounting portion 65 are individually measured to determine good or bad, and a defective product is determined. Performs marking with magnetic ink or the like.
[0065]
In this step, since the circuit devices 53 of the respective mounting portions 65 are integrally supported by the insulating resin 50 for each block 62, they are not individually separated. Therefore, the plurality of blocks 62 stuck on the adhesive sheet 80 are vacuum-adsorbed to the mounting table of the tester, and the pitch feed is performed for each block 62 in the vertical and horizontal directions by the size of the mounting portion 65 as indicated by arrows. By doing so, the measurement of the circuit devices 53 of the respective mounting portions 65 of the block 62 can be performed very quickly in large quantities. That is, it is not necessary to determine the front and back sides of the circuit device and to recognize the positions of the electrodes, which are required in the related art. Further, since a plurality of blocks 62 are processed at the same time, the measurement time can be greatly reduced.
[0066]
In the eighth step of the present invention, as shown in FIG. 11, the insulating resin 50 of the block 62 is separated for each mounting portion 65 by dicing while being attached to the adhesive sheet 80.
[0067]
In this step, the plurality of blocks 62 stuck on the adhesive sheet 80 are sucked in vacuum on a mounting table of a dicing device, and the dicing blade 69 is used to insulate the separation grooves 61 along the dicing lines 70 between the mounting portions 65. The conductive resin 50 is diced and separated into individual circuit devices 53.
[0068]
In this step, the dicing blade 69 completely cuts the insulating resin 50, performs dicing at a cutting depth reaching the surface of the pressure-sensitive adhesive sheet, and completely separates each mounting portion 65. At the time of dicing, the positioning mark 67 inside the frame-shaped pattern 66 around each block previously provided in the first step is recognized, and dicing is performed based on this. As is well known, in dicing, after dicing all dicing lines 70 in the vertical direction, the mounting table is rotated by 90 degrees and dicing is performed according to the dicing lines 70 in the horizontal direction.
[0069]
Further, in this process, since only the insulating resin 50 filled in the separation groove 61 is present in the dicing line 70, the dicing blade 69 has a small amount of wear and does not generate metal burrs. .
[0070]
Further, even after this step and after dicing, the adhesive sheet 80 does not disintegrate into individual circuit devices due to the function of the pressure-sensitive adhesive sheet 80, so that the subsequent taping step can be performed efficiently. In other words, the circuit device integrally supported by the adhesive sheet 80 can identify only non-defective products and can be detached from the adhesive sheet 80 and accommodated in the accommodating hole of the carrier tape. For this reason, there is a feature that even a minute circuit device is not separated into pieces even before taping.
[0071]
【The invention's effect】
In the present invention, the conductive foil itself, which is the material of the conductive pattern, functions as a support substrate, and the whole is supported by the conductive foil until the separation groove is formed, the circuit element is mounted, and the insulating resin is attached. When the foil is separated as each conductive pattern, the insulating resin functions as a supporting substrate. Therefore, the circuit element, the conductive foil, and the insulating resin can be manufactured with the minimum necessary. As described in the conventional example, a support substrate is not required for originally configuring the circuit device, and the cost can be reduced. In addition, there is no need for a supporting substrate, the conductive pattern is embedded in the insulating resin, and the thickness of the insulating resin and the conductive foil can be adjusted, so that a very thin circuit device can be formed. There is also.
[0072]
Also, in the wire bonding process, by recognizing the recognition patterns provided on the upper and lower peripheral edges of the conductive foil, the coordinates of the position of each conductive pattern of each block can be automatically determined indirectly, so that the conductive pattern is directly recognized. There is an advantage that erroneous recognition due to irregular reflection of light in the separation groove, which occurs in the case of performing the above, can be prevented. Furthermore, since the processing can be performed by one position recognition for each block, there is an advantage that mass production can be realized with a wire bonding process being extremely simplified.
[0073]
Further, by adhering a plurality of blocks to the pressure-sensitive adhesive sheet 80, a minute circuit device can be processed without falling apart, and a manufacturing method with extremely high mass production effect can be realized.
[0074]
Further, as is apparent from FIG. 14, the step of forming a through-hole, the step of printing a conductor (in the case of a ceramic substrate), and the like can be omitted. Having. In addition, no frame mold is required at all, and this is a manufacturing method with a very short delivery time.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a manufacturing flow of the present invention.
FIG. 2 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 3 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 4 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 5 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 6 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 7 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 8 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 9 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 10 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 11 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 12 is a diagram illustrating a mounting structure of a conventional circuit device.
FIG. 13 is a diagram illustrating a conventional circuit device.
FIG. 14 is a diagram illustrating a method for manufacturing a conventional circuit device.
FIG. 15 is a diagram illustrating a conventional method for manufacturing a circuit device.
[Explanation of symbols]
REFERENCE SIGNS LIST 50 insulating resin 51 conductive pattern 52 circuit element 53 circuit device 61 separation groove 62 block 100 recognition pattern

Claims (13)

A sheet-shaped conductive foil is prepared , a remaining portion is provided around the block so that a plurality of blocks can be spaced apart from each other, and a conductive pattern that forms at least a large number of circuit element mounting portions in each block is excluded. Forming a conductive pattern by forming a separation groove shallower than the thickness of the conductive foil in the conductive foil in a region, and forming a recognition pattern in the remaining portion;
Fixing a circuit element to each mounting portion of the conductive pattern of each block ;
A step of forming connection means for electrically connecting the electrodes of the circuit elements of the respective mounting portions and the desired conductive pattern while indirectly recognizing the position of the conductive pattern by the recognition pattern;
A step of collectively covering the circuit elements of each mounting portion and performing a common mold with an insulating resin so as to be filled in the separation grooves;
A step of etching the conductive foil to expose the conductive pattern of each block from the back and separating the conductive pattern and the remaining portion,
A portion of the common molded block where the insulating resin is connected to the remaining portion of the conductive foil is peeled off from the remaining portion of the conductive foil without cutting the remaining portion of the conductive foil. Separating,
Separating the insulating resin of each of the blocks by dicing to separate the circuit into individual circuit devices . 2. The method according to claim 1, wherein the recognition patterns are arranged at four corners of each of the remaining blocks. 3. The method according to claim 2, wherein the recognition pattern is arranged at upper and lower peripheral ends of the remaining portion . The method according to claim 1, wherein the conductive foil is made of one of copper, aluminum, and iron-nickel. 2. The method according to claim 1, wherein the surface of the conductive foil is at least partially covered with a conductive film. The method according to claim 4, wherein the conductive film is formed by plating with nickel, gold, or silver. 7. The method according to claim 5, wherein the recognition pattern is formed of the conductive film. 2. The method according to claim 1, wherein the separation groove selectively formed in the conductive foil is formed by chemical or physical etching. The method according to claim 8, wherein the separation groove is not provided around the recognition pattern. 2. The method according to claim 1, wherein one or both of a semiconductor bare chip and a chip circuit component are fixed to the circuit element. The method according to claim 1, wherein the connection unit is formed by wire bonding. 2. The method according to claim 1, wherein the insulating resin is commonly molded for each of the blocks by transfer molding. 2. The method for manufacturing a circuit device according to claim 1, wherein a plurality of blocks in which conductive patterns for forming at least a plurality of circuit element mounting portions are arranged in a matrix on the conductive foil.

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