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JP3673101B2 - Article fixing device - Google Patents
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JP3673101B2 - Article fixing device - Google Patents

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Publication number
JP3673101B2
JP3673101B2 JP36433298A JP36433298A JP3673101B2 JP 3673101 B2 JP3673101 B2 JP 3673101B2 JP 36433298 A JP36433298 A JP 36433298A JP 36433298 A JP36433298 A JP 36433298A JP 3673101 B2 JP3673101 B2 JP 3673101B2
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JP
Japan
Prior art keywords
article
circuit board
magnetic
electromagnet
fixing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP36433298A
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Japanese (ja)
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JP2000188468A (en
Inventor
彰男 古澤
哲夫 福島
章二 中井
憲一郎 末次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP36433298A priority Critical patent/JP3673101B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、物品固定槽内に充填された強磁性材料からなる粒体群で保持される物品を固定する物品固定装置に関し、主としてはリサイクルを目的として、回路基板から電子部品等を取外すために回路基板を物品固定槽内に固定する回路基板固定装置に関するものである。
【0002】
【従来の技術】
近年においては、あらゆる産業分野においてリサイクルの必要性が提唱されており、廃家電の構成部品も例外ではない。基板に電子部品が実装された回路基板を埋め立てたり焼却処分すると、基板や電子部品に含まれる有害物質が溶出して大気・水質・土壌汚染等の公害問題となる。
【0003】
そこでリサイクルを目的として回路基板を解体処理するためには、基板に実装されている電子部品等を取外す必要がある。そのための装置としては、チャック等で基板を固定し、基板における電子部品のはんだ付け部を溶融半田槽に浸すことによってはんだ溶融して衝撃を与えたり、金属羽根によってかき取る装置がある。しかしこれらの装置は電子部品の取外しのために固定できる回路基板の形状や寸法が限られたものとなり、汎用性に欠けるという欠点があった。
【0004】
そこで最近では、回路基板のはんだ面切削装置等において、物品固定槽内に強磁性材料からなる粒体群を充填し、その粒体群内に回路基板の電子部品を埋入させると共に、基板と電子部品を挟んでN極とS極が対向するように1対の電磁石を配することによって回路基板を磁力によって固定する装置が用いられている。
【0005】
【発明が解決しようとする課題】
ところが、強磁性材料からなる粒体群に磁力を作用させて基板を固定する装置では、固定できる基板の形状や寸法範囲が大きく広がって汎用性が大きくなるものの、単に粒体群に磁力を作用させるだけでは基板を安定して固定することのできる大きな磁力を得ることができない。つまり、一方の電磁石から出た磁力線はその大部分が電磁石に戻り、他方の電磁石に到達する磁力線がわずかになるので、物品固定槽の中央部の磁束密度も小さくなり、回路基板を粒体群内で確実に保持することができない。そのため、回路基板は不安定な状態で固定され、回路基板を解体処理するためのはんだ面切削作業等を安定して行うことができないという問題があった。
【0006】
そこで本発明は上記のような問題点を解決し、回路基板等の物品を保持する粒体群に十分な磁力を作用させることによって、さまざまな形状や寸法の物品を確実に粒体群で保持して固定層内で安定して固定し、例えば、回路基板の解体作業等を容易に行うことができる物品固定装置ないし回路基板固定装置を提供することを目的とするものである。
【0007】
【課題を解決するための手段】
上記目的を達成するために本願の第1発明は、物品固定槽内に強磁性材料からなる粒体群を充填し、その粒体群内に物品の凹凸部を埋入させると共に、物品を挟んでN極とS極が対向するように1対の電磁石を配することによって物品を固定する物品固定装置において、1対の電磁石をこれらの先端部が物品固定槽内に臨み前記粒体群に接触するように配設すると共に、両電磁石の基端部間を強磁性材料からなる連結部材で短絡し、前記粒体群の透磁率よりも大きい透磁率を有する材料からなるブロックを、前記1対の電磁石の少なくとも一方と前記物品との間で前記粒体群に埋入させて配設したことを特徴とする。
【0008】
この第1発明によれば、前記粒体群の透磁率よりも大きい透磁率を有する材料からなるブロックが設けられる。このため、少なくとも一方の電磁石から出た磁力線は、前記粒体群の透磁率よりも大きい透磁率を有するブロックを通過して他方の電磁石に到達する。よって、物品固定槽に位置する物品が電磁石と離れていても物品付近では十分な磁束密度を得ることができ、物品を粒体群で確実に保持して物品固定槽内で安定して固定することができる
【0009】
また本願の第2発明は上記目的を達成するために、前記物品固定装置において、物品が基板上に電子部品を実装した回路基板であって、物品固定槽内の粒体群に前記電子部品を埋入させることによって回路基板を固定することを特徴とする。
【0010】
この第2発明によれば、第1発明と同様にして物品固定槽位置する回路基板と電子部品が電磁石と離れていても回路基板と電子部品付近で十分な磁束密度を得ることができ、回路基板を粒体群で確実に保持して物品固定槽内で安定して固定することができる。よって、物品固定槽の粒体群内に上方を向いた状態で固定されるはんだ面の切削作業等を容易に行うことができ、基板に実装されている電子部品を切削用カッター等を用いて効率的に取り外すことが可能になる。
【0011】
また、連結部材の磁気抵抗を、電磁石の磁心の磁気抵抗よりも小さくしたり、電磁石の磁心の横断面形状が、回路基板の埋入部分の各位置での横断面外接長方形の最大のものにほぼ対応した長方形にすると好適であり、物品固定槽の中央部における磁束密度をより大きくして物品をより確実に固定することができる。
【0012】
更に、回路基板の埋入部分に発生している磁界の強さを、電磁石の磁心の周囲に巻いたコイルに流れる電流値の大きさで測定すると好適であり、測定が容易な電磁石のコイルに流れる電流値によってそれと比例関係にある回路基板の埋入部分の磁束密度を管理をすることができ、安定した基板固定が可能になると共に、コイルの電流量の大、小に対応して連結部材の任意の部分にコイルを巻く等して適切な電流値でモニタすることも可能となる
【0013】
【発明の実施の形態】
以下、本発明の物品固定装置を回路基板の解体処理に用いる回路基板固定装置に具体的に実施した場合を例にとり、図1〜図5を参照しながら説明する。
【0014】
図1は第1実施形態の回路基板固定装置を概略して示し(a)はその平面図、(b)はその側面図である。この回路基板固定装置は、回路基板5を解体処理するために基板5b上に実装されている電子部品6等を取外す際、例えば回路基板5のはんだ面5a上に位置するはんだを切削用カッターによって切削するはんだ面切削装置の一部を構成する。
【0015】
1は非磁性体の基板固定槽(物品固定槽)であり、強磁性材料からなる粒体群2が充填され、その中にリード線付き電子部品6が実装された回路基板5を、はんだ面5aを上方にして位置決め状態に固定している。強磁性材料としては鉄やニッケル等の鋼球等が用いられる。その大きさは、基板5bやそれに実装されている電子部品6の大きさや形状により考慮する必要があるが、家電製品の回路基板5の場合、直径2mmから5mm程度が有効であり、また直径の異なるものを混在させるのも有効である。
【0016】
基板固定槽1の開口周縁部には切欠き1aが設けられ、この切欠き1aにコイル9を巻いた1対の電磁石3を、その先端部3c、3cが基板固定槽1内に臨み粒体群2に接触するように配設される。電磁石3は図1(b)に示すように、基板固定槽1内で電子部品6が実装された回路基板5の埋入部分である回路基板固定部15を挟んでN極とS極が対向し、前記切欠き1aに配設することによって、それらの磁極3aが粒体群2に接触する。また、磁極3の基端部3d、3d間を強磁性材料からなる連結部材4で連結することによって、磁極3a、3aとは反対側の磁極3b、3bを短絡している。尚、先端部3c、3cが粒体群2に接触するように配設する構造は、前記切欠き1aに限定されず、例えば基板固定槽1の側面に設ける開口部であってもよい。
【0017】
このように構成された回路基板固定装置において、磁束密度を測定した結果を図2及び図3を用いて説明する。
【0018】
図2(a)は電磁石3を連結部材4で短絡しない回路基板固定装置における磁力線の分布を示している。この装置においては、一方の電磁石3から出た磁力線7はその大部分が同じ電磁石3に戻ってきており、他方の電磁石3に到達する磁力線7aはわずかである。そのため基板固定槽1の中央部に位置する回路基板固定部15では磁束密度が小さくなり、回路基板5を安定して固定することができない。これに対して図2(b)のように電磁石3を連結部材4で短絡すると、電磁石3から出た磁力線7の大部分の磁力線7aは磁気抵抗の小さい強磁性体である粒体群2の部分を通過して他方の電磁石3に到達する。よって基板固定槽1の中央部に位置する回路基板固定部15では十分な磁束密度を得ることができ、回路基板5を安定して固定することができ、その解体処理のための作業を容易に行うことができる。そして作業を終えて、電磁石3に流す電流をストップすることにより粒体群2の磁力結合が解かれて電子部品6が取外された基板5bを基板固定槽1から容易に取出すことができる。
【0019】
上記比較実験により得られた磁束密度の測定データを図3に示す。グラフのa線は図2(a)で示した連結部材4によって磁極3bを短絡しない回路基板固定装置であり、グラフのb線は図2(b)で示した連結部材4によって磁極3bを短絡する回路基板固定装置である。基板5bから電子部品6を取外すために、はんだ面5aを切削するはんだ面切削装置を用いた切削実験の結果では、1300rpmで回転している切削用カッターにより、はんだ面5aを切削する場合は150Gの磁束密度があれば切削が可能であることが確認されている。図2(b)で示した装置では、磁束密度は150G以上となるので、切削用カッターによる切削作業を確実に行うことが確認できた。
【0020】
以上のように第1実施形態によれば、さまざまな形状や寸法の回路基板5は充分な磁束密度を確保できる電磁石3の磁力によって安定して固定されるので、そのはんだ面5aを切削用カッターにより容易に切削することができるので、基板5bに取付けられている電子部品6を効率的に取外すことが可能になる。
【0021】
なお第1実施形態において磁極3bを短絡する連結部材4の磁気抵抗は、電磁石3の磁心の磁気抵抗よりも小さいことが望ましい。磁極3bと短絡する連結部材4の透磁率が等しいならば、短絡する連結部材4の断面積は電磁石3の磁心の断面積よりも大きくなければならない。そうすることにより、基板固定槽1内の磁束密度を最大にすることが可能となる。
【0022】
また図4に示すように、電磁石3の磁心の断面形状を、基板固定槽1内の回路基板5の埋入部分である回路基板固定部15の各位置での横断面外接長方形の最大のものにほぼ対応した長方形にすれば、回路基板固定部15の磁束密度が大きくなり、基板固定槽1の中央部に位置する回路基板5を十分な磁力で保持することができる。
【0023】
基板固定槽1内の粒体群2の透磁率は磁極3aの透磁率に対して小さいため、磁極3aと回路基板固定部15とが離れていると回路基板固定部15の磁束密度は急激に小さくなる。そこで図5に示す第2実施形態のように、磁極3aから回路基板固定部15近傍まで、透磁率の大きい材質で造られたブロック8を埋め込むことも効果的である。
【0024】
また上記回路基板固定装置により回路基板5を安定して固定するためには、電磁石3から出ている磁束密度をモニタする必要がある。ガウスメータ等の測定器もあるが精密機器であるので、前記はんだ面切削作業等で使用するには不向きである。電磁石3の周囲に巻いたコイル9に流れる電流値と回路基板固定部15に発生する磁束密度との間には比例関係がある。そこで電磁石3のコイル9に流れる電流値をモニタして磁束密度の管理をすれば安定した回路基板の固定が可能となる。なお、コイル9を流れる電流が大きすぎる、または小さすぎるのであれば、磁極3bを短絡している連結部材4の任意の部分の任意の巻数のコイルを設ければ、適切な電流値でモニタすることが可能となる。
【0025】
本発明は上記の実施形態に示すほか、種々の態様に構成することができる。例えば、基板解体処理において、切削用カッターを用いたはんだ面切削装置に適用できるだけでなく、回転ブラシを用いたはんだ面の表面実装型部品を回転ブラシで除去するはんだ面部品除去装置にも用いることができる。また、何らかの作業をするのに物品の固定を必要とし、凹凸部があるために固定が難しく強磁性材料からなる粒体群で保持できる物品であれば、上記回路基板に限らない。その物品を固定する場合は、物品の凹凸部を粒体群内に埋入させて上記同様にして物品固定槽内に安定して固定することができる。
【0026】
【発明の効果】
以上のように本発明によれば、回路基板等の物品を挟んで対向する電磁石の先端物品を物品固定槽内に臨ませることと、その基端部間を強磁性材料からなる連結部材で短絡することと、粒体群の透磁率よりも大きい透磁率を有する材料からなるブロックを、前記1対の電磁石の少なくとも一方と前記物品との間で前記粒体群に埋入させて配設したこととによって、回路基板等の物品を保持する粒体群に十分な磁力を作用させ、さまざまな形状や寸法の物品を確実に粒体群で保持して固定層内で安定して固定し、例えば、回路基板の解体作業等を容易に行うことができる物品固定装置ないし回路基板固定装置を提供できる。
【図面の簡単な説明】
【図1】本発明の第1実施形態の概略構成を示し(a)は平面図、(b)は縦断側面図。
【図2】同実施形態における磁力線の分布の状態を、従来例と比較して示した説明図。
【図3】図2における比較実験により得られた磁束密度の測定データを示すグラフ。
【図4】同実施形態における磁極の断面形状を示す概略図。
【図5】本発明の第2実施形態の概略構成を示す平面図。
【符号の説明】
1 基板固定槽
1a 切欠き
2 強磁性材料からなる粒体群
3 電磁石
3a、3b 磁極(N極とS極)
3c 先端部
3d 基端部
4 強磁性材料からなる連結部材
5 回路基板
5a はんだ面
5b 基板
6 電子部品
7、7a 磁力線
9 コイル
15 回路基板固定部(回路基板の埋入部分)
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an article fixing device for fixing an article held by a group of particles made of a ferromagnetic material filled in an article fixing tank, mainly for removing electronic components from a circuit board for the purpose of recycling. The present invention relates to a circuit board fixing device for fixing a circuit board in an article fixing tank.
[0002]
[Prior art]
In recent years, the necessity of recycling has been advocated in all industrial fields, and the components of waste home appliances are no exception. When a circuit board on which electronic components are mounted on a board is buried or incinerated, harmful substances contained in the board and electronic parts are eluted, resulting in pollution problems such as air, water, and soil contamination.
[0003]
Therefore, in order to disassemble the circuit board for the purpose of recycling, it is necessary to remove the electronic components mounted on the board. As an apparatus for that purpose, there is an apparatus in which a substrate is fixed with a chuck or the like, and a soldered portion of an electronic component on the substrate is immersed in a molten solder tank to give an impact by melting or scraping with a metal blade. However, these devices are limited in the shape and dimensions of a circuit board that can be fixed for removing electronic components, and have a drawback of lacking versatility.
[0004]
Therefore, recently, in a soldering surface cutting device for a circuit board, etc., a group of particles made of a ferromagnetic material is filled in an article fixing tank, and the electronic components of the circuit board are embedded in the group of grains, A device is used that fixes a circuit board by a magnetic force by arranging a pair of electromagnets so that the N pole and the S pole face each other with an electronic component interposed therebetween.
[0005]
[Problems to be solved by the invention]
However, in a device that fixes a substrate by applying a magnetic force to a group of particles made of a ferromagnetic material, the shape and size range of the substrate that can be fixed is greatly expanded, increasing the versatility. It is not possible to obtain a large magnetic force that can stably fix the substrate simply by making it. In other words, most of the magnetic field lines from one of the electromagnets return to the electromagnet, and the magnetic field lines reaching the other electromagnet become small, so the magnetic flux density at the center of the article fixing tank is also reduced, and the circuit board is separated from the group of particles. Cannot be held securely in the inside. Therefore, there is a problem that the circuit board is fixed in an unstable state, and the solder surface cutting work for disassembling the circuit board cannot be stably performed.
[0006]
Therefore, the present invention solves the above-mentioned problems and ensures that articles having various shapes and sizes are held in the grain group by applying sufficient magnetic force to the grain group holding the article such as a circuit board. Thus, it is an object of the present invention to provide an article fixing device or a circuit board fixing device that can be stably fixed in a fixing layer and can easily perform, for example, a circuit board disassembly work.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the first invention of the present application is to fill a particle group made of a ferromagnetic material in an article fixing tank, bury an uneven portion of the article in the particle group, and sandwich the article. In the article fixing device for fixing the article by arranging a pair of electromagnets so that the N pole and the S pole face each other, the tip portion of the pair of electromagnets faces the article fixing tank so as to face the particle group. as well as arranged to be in contact, short-circuit connecting member formed between the base end portions of the two electromagnets of a ferromagnetic material, a block of material having a greater magnetic permeability than the magnetic permeability of the granules group, the 1 It is characterized in that it is embedded in at least one of a pair of electromagnets and the article so as to be embedded in the particle group .
[0008]
According to the first aspect of the present invention, a block made of a material having a magnetic permeability larger than that of the grain group is provided. For this reason, the magnetic field lines emitted from at least one of the electromagnets reach the other electromagnet through a block having a permeability larger than the permeability of the grain group. Therefore, even if the article located in the article fixing tank is separated from the electromagnet, a sufficient magnetic flux density can be obtained in the vicinity of the article, and the article is securely held by the particle group and stably fixed in the article fixing tank. it is possible.
[0009]
According to a second aspect of the present invention, in order to achieve the above object, in the article fixing apparatus, the article is a circuit board in which an electronic component is mounted on a substrate, and the electronic component is placed on a particle group in an article fixing tank. The circuit board is fixed by being embedded.
[0010]
According to the second invention, as in the first invention, a sufficient magnetic flux density can be obtained in the vicinity of the circuit board and the electronic component even if the circuit board and the electronic component located in the article fixing tank are separated from the electromagnet . The circuit board can be securely held in the particle group and stably fixed in the article fixing tank. Therefore, it is possible to easily perform the cutting work of the solder surface fixed in the state of facing upward in the particle group of the article fixing tank, and use the cutting cutter or the like to mount the electronic component mounted on the substrate. It becomes possible to remove efficiently.
[0011]
In addition, the magnetic resistance of the connecting member is made smaller than the magnetic resistance of the magnetic core of the electromagnet, or the cross-sectional shape of the magnetic core of the electromagnet is the largest of the circumscribed rectangle at each position of the embedded portion of the circuit board. It is preferable to use a substantially corresponding rectangle, and the article can be more reliably fixed by increasing the magnetic flux density at the center of the article fixing tank.
[0012]
Furthermore, it is preferable to measure the strength of the magnetic field generated in the embedded portion of the circuit board by the magnitude of the current value flowing through the coil wound around the magnetic core of the electromagnet. The magnetic flux density in the embedded portion of the circuit board that is proportional to the current value can be managed, and it is possible to stably fix the board, and the connecting member corresponding to the large and small amount of coil current It is also possible to monitor with an appropriate current value by, for example, winding a coil around any part of the above .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example in which the article fixing device of the present invention is specifically implemented in a circuit board fixing device used for circuit board disassembly will be described with reference to FIGS.
[0014]
1A and 1B schematically show a circuit board fixing device according to a first embodiment, wherein FIG. 1A is a plan view and FIG. 1B is a side view thereof. When removing the electronic component 6 or the like mounted on the board 5b in order to disassemble the circuit board 5, the circuit board fixing device uses, for example, a solder located on the solder surface 5a of the circuit board 5 by a cutting cutter. It constitutes a part of the solder surface cutting device for cutting.
[0015]
Reference numeral 1 denotes a non-magnetic substrate fixing tank (article fixing tank), which is filled with a particle group 2 made of a ferromagnetic material, and in which a circuit board 5 on which an electronic component 6 with a lead wire is mounted is connected to a solder surface. 5a is fixed upward in the positioning state. As the ferromagnetic material, steel balls such as iron and nickel are used. The size needs to be considered depending on the size and shape of the substrate 5b and the electronic component 6 mounted on the substrate 5b, but in the case of the circuit board 5 of home appliances, a diameter of about 2 mm to 5 mm is effective. It is also effective to mix different things.
[0016]
A notch 1a is provided at the peripheral edge of the opening of the substrate fixing tank 1, and a pair of electromagnets 3 each having a coil 9 wound around the notch 1a are arranged so that the tip parts 3c and 3c are exposed to the substrate fixing tank 1 and are granulated. It arrange | positions so that the group 2 may be contacted. As shown in FIG. 1 (b), the electromagnet 3 has an N pole and an S pole facing each other across a circuit board fixing portion 15 which is an embedded portion of the circuit board 5 on which the electronic component 6 is mounted in the board fixing tank 1. However, the magnetic poles 3 a come into contact with the particle group 2 by being disposed in the notches 1 a. Further, the magnetic poles 3b and 3b opposite to the magnetic poles 3a and 3a are short-circuited by connecting the base end portions 3d and 3d of the magnetic pole 3 with a connecting member 4 made of a ferromagnetic material. In addition, the structure arrange | positioned so that the front-end | tip parts 3c and 3c may contact the particle group 2 is not limited to the said notch 1a, For example, the opening part provided in the side surface of the board | substrate fixing tank 1 may be sufficient.
[0017]
The result of measuring the magnetic flux density in the circuit board fixing device configured as described above will be described with reference to FIGS.
[0018]
FIG. 2A shows the distribution of the lines of magnetic force in the circuit board fixing device in which the electromagnet 3 is not short-circuited by the connecting member 4. In this apparatus, most of the magnetic force lines 7 emitted from one electromagnet 3 have returned to the same electromagnet 3, and the magnetic force lines 7a reaching the other electromagnet 3 are few. Therefore, the magnetic flux density becomes small in the circuit board fixing part 15 located in the central part of the board fixing tank 1, and the circuit board 5 cannot be stably fixed. On the other hand, when the electromagnet 3 is short-circuited by the connecting member 4 as shown in FIG. 2B, most of the magnetic force lines 7a of the magnetic force lines 7 coming out of the electromagnet 3 are those of the particle group 2 which is a ferromagnetic material having a small magnetic resistance. Pass the part and reach the other electromagnet 3. Therefore, a sufficient magnetic flux density can be obtained in the circuit board fixing part 15 located in the center part of the board fixing tank 1, the circuit board 5 can be stably fixed, and the work for the dismantling process can be easily performed. It can be carried out. Then, by finishing the work and stopping the current flowing through the electromagnet 3, the substrate 5b from which the magnetic coupling of the particle group 2 is released and the electronic component 6 is removed can be easily taken out from the substrate fixing tank 1.
[0019]
The measurement data of the magnetic flux density obtained by the comparative experiment is shown in FIG. The line a in the graph is a circuit board fixing device that does not short-circuit the magnetic pole 3b by the connecting member 4 shown in FIG. 2A, and the line b in the graph short-circuits the magnetic pole 3b by the connecting member 4 shown in FIG. A circuit board fixing device. As a result of a cutting experiment using a solder surface cutting device for cutting the solder surface 5a in order to remove the electronic component 6 from the substrate 5b, 150G is used when cutting the solder surface 5a with a cutting cutter rotating at 1300 rpm. It has been confirmed that cutting is possible with a magnetic flux density of. In the apparatus shown in FIG. 2B, since the magnetic flux density is 150 G or more, it was confirmed that the cutting operation with the cutting cutter was reliably performed.
[0020]
As described above, according to the first embodiment, the circuit board 5 having various shapes and dimensions is stably fixed by the magnetic force of the electromagnet 3 that can secure a sufficient magnetic flux density. Therefore, it is possible to efficiently remove the electronic component 6 attached to the substrate 5b.
[0021]
In the first embodiment, the magnetic resistance of the connecting member 4 that short-circuits the magnetic pole 3 b is preferably smaller than the magnetic resistance of the magnetic core of the electromagnet 3. If the magnetic permeability of the connecting member 4 that is short-circuited with the magnetic pole 3 b is equal, the cross-sectional area of the connecting member 4 that is short-circuited must be larger than the cross-sectional area of the magnetic core of the electromagnet 3. By doing so, the magnetic flux density in the substrate fixing tank 1 can be maximized.
[0022]
Further, as shown in FIG. 4, the cross-sectional shape of the magnetic core of the electromagnet 3 is the maximum of the rectangular cross-section circumscribed at each position of the circuit board fixing portion 15 which is the embedded portion of the circuit board 5 in the board fixing tank 1. If the rectangular shape substantially corresponds to, the magnetic flux density of the circuit board fixing portion 15 is increased, and the circuit board 5 located at the center of the substrate fixing tank 1 can be held with a sufficient magnetic force.
[0023]
Since the magnetic permeability of the particle group 2 in the substrate fixing tank 1 is smaller than the magnetic permeability of the magnetic pole 3a, the magnetic flux density of the circuit substrate fixing portion 15 is abrupt when the magnetic pole 3a and the circuit board fixing portion 15 are separated. Get smaller. Therefore, as in the second embodiment shown in FIG. 5, it is also effective to embed a block 8 made of a material having a high magnetic permeability from the magnetic pole 3a to the vicinity of the circuit board fixing portion 15.
[0024]
In order to stably fix the circuit board 5 by the circuit board fixing device, it is necessary to monitor the magnetic flux density emitted from the electromagnet 3. Although there are measuring instruments such as gauss meters, they are precision instruments and are not suitable for use in the solder surface cutting work or the like. There is a proportional relationship between the value of the current flowing in the coil 9 wound around the electromagnet 3 and the magnetic flux density generated in the circuit board fixing portion 15. Therefore, if the current value flowing through the coil 9 of the electromagnet 3 is monitored and the magnetic flux density is managed, the circuit board can be fixed stably. If the current flowing through the coil 9 is too large or too small, a coil with an arbitrary number of turns in an arbitrary part of the connecting member 4 that short-circuits the magnetic pole 3b can be monitored with an appropriate current value. It becomes possible.
[0025]
In addition to the embodiments described above, the present invention can be configured in various ways. For example, in substrate disassembly processing, it can be applied not only to a solder surface cutting device using a cutting cutter, but also to a solder surface component removing device that uses a rotating brush to remove surface-mounted components on the solder surface using a rotating brush. Can do. Further, the circuit board is not limited to the circuit board as long as the article needs to be fixed for some work and the article can be held by a group of particles made of a ferromagnetic material that is difficult to fix due to the uneven portion. When fixing the article, the uneven portion of the article can be embedded in the particle group and stably fixed in the article fixing tank in the same manner as described above.
[0026]
【The invention's effect】
As described above, according to the present invention, the leading end article of the electromagnet facing the article such as the circuit board is placed in the article fixing tank, and the base end portion is short-circuited by the connecting member made of a ferromagnetic material. And a block made of a material having a permeability larger than the permeability of the grain group is embedded in the grain group between at least one of the pair of electromagnets and the article. With this, sufficient magnetic force is applied to the particle group holding the article such as the circuit board, and the articles of various shapes and dimensions are securely held by the particle group and stably fixed in the fixed layer. For example, it is possible to provide an article fixing device or a circuit board fixing device that can easily perform a circuit board disassembly work or the like.
[Brief description of the drawings]
FIG. 1A is a plan view showing a schematic configuration of a first embodiment of the present invention, and FIG.
FIG. 2 is an explanatory diagram showing a state of distribution of magnetic lines of force in the embodiment in comparison with a conventional example.
FIG. 3 is a graph showing magnetic flux density measurement data obtained by a comparative experiment in FIG. 2;
FIG. 4 is a schematic view showing a cross-sectional shape of a magnetic pole in the same embodiment.
FIG. 5 is a plan view showing a schematic configuration of a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate fixing tank 1a Notch 2 Grain group 3 made of ferromagnetic material Electromagnets 3a and 3b Magnetic poles (N pole and S pole)
3c Tip 3d Base 4 Connecting member 5 made of ferromagnetic material Circuit board 5a Solder surface 5b Substrate 6 Electronic component 7, 7a Magnetic field line 9 Coil 15 Circuit board fixing part (embedded part of circuit board)

Claims (5)

物品固定槽内に強磁性材料からなる粒体群を充填し、その粒体群内に物品の凹凸部を埋入させると共に、物品を挟んでN極とS極が対向するように1対の電磁石を配することによって物品を固定する物品固定装置において、1対の電磁石をこれらの先端部が物品固定槽内に臨み前記粒体群に接触するように配設すると共に、両電磁石の基端部間を強磁性材料からなる連結部材で短絡し、前記粒体群の透磁率よりも大きい透磁率を有する材料からなるブロックを、前記1対の電磁石の少なくとも一方と前記物品との間で前記粒体群に埋入させて配設したことを特徴とする物品固定装置。The article fixing tank is filled with a group of particles made of a ferromagnetic material, and an uneven portion of the article is embedded in the group of grains, and a pair of N poles and S poles are opposed to each other with the article interposed therebetween. In an article fixing apparatus for fixing an article by arranging an electromagnet, a pair of electromagnets are arranged such that their tip ends face the article fixing tank and come into contact with the particle group, and the base ends of both electromagnets A block made of a material having a magnetic permeability larger than the magnetic permeability of the grain group is short-circuited between the parts by a connecting member made of a ferromagnetic material, and the block is made between at least one of the pair of electromagnets and the article. An article fixing device, wherein the article fixing device is embedded in a particle group . 連結部材の磁気抵抗を、電磁石の磁心の磁気抵抗よりも小さくした請求項記載の物品固定装置。The magnetic resistance of the connecting member, the article holder of claim 1, wherein the smaller than the magnetic resistance of the magnetic core of the electromagnet. 請求項1又は2記載の物品固定装置において、物品が基板上に電子部品を実装した回路基板であって、物品固定槽内の粒体群に前記電子部品を埋入させることによって回路基板を固定するものである回路基板固定装置。 3. The article fixing apparatus according to claim 1, wherein the article is a circuit board having electronic parts mounted on the board, and the electronic parts are embedded in a group of particles in the article fixing tank to fix the circuit board. A circuit board fixing device. 電磁石の磁心の横断面形状が、回路基板の埋入部分の各位置での横断面外接長方形の最大のものにほぼ対応した長方形である請求項3記載の回路基板固定装置。  4. The circuit board fixing device according to claim 3, wherein the cross-sectional shape of the magnetic core of the electromagnet is a rectangle substantially corresponding to the largest one of the circumscribed rectangles at each position of the embedded portion of the circuit board. 回路基板の埋入部分に発生している磁界の強さを、電磁石の磁心の周囲に巻いたコイルに流れる電流値の大きさで測定する請求項3記載の回路基板固定装置。  4. The circuit board fixing device according to claim 3, wherein the strength of the magnetic field generated in the embedded portion of the circuit board is measured by the magnitude of the current value flowing in the coil wound around the magnetic core of the electromagnet.
JP36433298A 1998-12-22 1998-12-22 Article fixing device Expired - Fee Related JP3673101B2 (en)

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JP3673101B2 true JP3673101B2 (en) 2005-07-20

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