JP3707979B2 - Display panel cooling apparatus and method, and display panel mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display panel cooling apparatus that cools the display panel when an electronic component is mounted on the display panel such as a liquid crystal panel, and a display panel cooling method that is executed by the display panel cooling apparatus. The present invention also relates to a display panel mounting apparatus including the display panel cooling apparatus.
[0002]
[Prior art]
A liquid crystal panel 1 shown in FIG. 7 includes a liquid crystal display unit 4 formed on a substrate 3 made of glass, for example, and the peripheral edge 1a or the peripheral edge 1b of the liquid crystal panel 1 positioned around the display 4 or the peripheral edge. An electronic component (hereinafter referred to as “IC chip”) 2 for driving the display unit is mounted on 1a and the peripheral portion 1b. Further, the display unit 4 is provided with a polarizing plate 5 as shown in FIG.
When mounting the IC chip 2, as shown in FIG. 8, after an anisotropic conductive film (hereinafter referred to as “ACF”) 6 is attached to the IC mounting positions in the peripheral portions 1 a and 1 b, The IC chip 2 is placed on the ACF 6. The liquid crystal panel 1 carried into the bonding apparatus is disposed on the support member 8 provided in the bonding apparatus so as to correspond to the peripheral edge 1a or 1b, and the IC chip 2 is heated by the heating and pressing head 7 provided in the bonding apparatus. Is heated and pressed to the substrate 3 through the ACF 6. The ACF 6 is crushed between the electrode of the IC chip 2 and the transparent electrode on the substrate 3 by the heating and pressing, and electrical conduction between the electrode of the IC chip 2 and the transparent electrode on the substrate 3 is performed via the ACF 6. The obtained IC chip 2 is fixed onto the substrate 3.
[0003]
The peripheral portions 1a and 1b are preferably as small as possible in order to reduce the size of the device to which the liquid crystal panel 1 is mounted. Therefore, since the IC chip 2 is mounted on the peripheral portions 1a and 1b having a small area, the IC chip 2 and the display unit 4 are arranged in a very close state. The distance from the display unit side end surface of the IC chip 2 to the IC chip side end surface of the polarizing plate 5 is about 1-2 mm. On the other hand, the vicinity of the IC chip pressing portion of the heating and pressing head 7 has a temperature of about 300 ° C. when the IC chip 2 is heated and pressed.
[0004]
[Problems to be solved by the invention]
Therefore, when the IC chip 2 is pressed by the heating and pressing head 7, the heat of the heating and pressing head 7 is transmitted to the transparent electrode pattern formed on the substrate 3 through the IC chip 2 and further reaches the polarizing plate 5. Further, although the influence is small compared to the heat transfer, the radiant heat from the heating and pressing head 7 also affects the polarizing plate 5. In the large panel described below, a temperature of about 120 ° C. is reached in the portion of the polarizing plate 5 close to the peripheral portions 1a and 1b. In addition, it is said that the heat-resistant temperature of the polarizing plate 5 is about 60 degreeC.
Therefore, the polarizing plate 5 is damaged by the heat transfer and radiant heat. The thermal damage of the polarizing plate 5 causes display unevenness particularly in the vicinity of the peripheral portions 1a and 1b of the display unit 4. In particular, due to the recent increase in size of liquid crystal panels, large-sized panels of 10 inches or more, such as 10 to 15 inches, have higher image definition, higher viewing angles, and higher contrast than small panels. Therefore, display unevenness due to the thermal damage of the polarizing plate 5 becomes obvious.
[0005]
In the liquid crystal panel 1 described above, since the substrate 3 is made of glass, the substrate 3 itself has a relatively high heat resistance. However, in the case of a plastic or film liquid crystal panel that is expected to be developed in the future, the heat resistance of the substrate itself is low. Since it is lower than glass, not only the thermal damage of the polarizing plate 5 but also the thermal damage of a substrate such as plastic becomes a problem.
The present invention has been made to solve such problems, and includes a cooling device for a display panel that cools the display panel when the electronic component is mounted on the display panel, and a cooling device for the display panel. An object of the present invention is to provide a display panel cooling method to be executed, and a display panel mounting apparatus including the display panel cooling apparatus.
[0006]
[Means for Solving the Problems]
The display panel cooling method according to the first aspect of the present invention is arranged in a display unit provided in the display panel when the electronic component is mounted by heating and pressing at an electronic component mounting position on the component heating pressing surface of the display panel. The polarizing plate is cooled.
[0007]
  The display panel cooling device according to the second aspect of the present invention is an electronic component mounting portion of the display panel.With a heating press headHeat is removed from the first polarizing plate end of the first polarizing plate provided in the display portion of the display panel, which is close to the electronic component to be heated and pressed, and the first polarizing plate is removed. A first heat removal member that performs heat;
  A second moving device that moves the first heat removal member in a direction in which the first heat removing member is in contact with or separated from the first polarizing plate.And
The first heat removal member has a first plate-like member that continuously contacts at substantially the entire length of the first polarizing plate at one end of the first polarizing plate along one side of the display portion. ,
It is characterized by that.
[0008]
  The second aspect may further include a first refrigerant supply device that supplies a refrigerant to the first heat removal member, and the first plate-like member is connected to the first refrigerant supply device. The 1st plate-shaped member cooling part which cools the said 1st plate-shaped member with the supplied refrigerant | coolant can also be provided. In the second aspect, the first plate-like member may be in contact with the end of the first polarizing plate adjacent to the electronic component to be heated and pressed, on one side of the display unit. In addition, a first moving device that moves the first plate-shaped member along one side of the display unit may be further provided. The first plate-shaped member includes a first heat transfer removing unit that removes heat transferred through the wiring pattern formed on the display panel and reaching the first polarizing plate during the heating and pressing. A first radiant heat removing unit that is formed integrally with the first heat transfer removing unit and that is not in contact with the first polarizing plate and blocks radiant heat to the first polarizing plate during the heating and pressing; and the first radiant heat removing unit. And a first connecting part that is connected to the first plate-like member cooling part and performs heat exchange between the heat transfer, the radiant heat, and the heat of the refrigerant. .
[0009]
In the cooling device for a display panel according to the second aspect, the second polarizing plate end portion facing the first polarizing plate end portion of the second polarizing plate provided facing the first polarizing plate in the display portion. It is also possible to further include a second heat removal member that removes heat in step 2 to remove heat from the second polarizing plate, and a second refrigerant supply device that supplies refrigerant to the second heat removal member.
[0010]
The display panel mounting device of the third aspect of the present invention is an anisotropic conductive film sticking device for sticking an anisotropic conductive film to an electronic component mounting location on a component heating pressing surface of a display panel;
An IC joining device that heats and presses an electronic component disposed on the anisotropic conductive film and attaches the electronic component to the display panel;
A cooling device for a display panel that cools a polarizing plate disposed in a display unit provided in the display panel when the electronic component is heated and pressed by the IC bonding device;
It is provided with.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Referring to the drawings, a display panel cooling device according to an embodiment of the present invention, a display panel cooling method executed by the display panel cooling device, and a display panel mounting device including the display panel cooling device are described. However, it will be described below. In addition, the same code | symbol is attached | subjected about the same component in each figure.
Further, as an example of the display panel to be processed by the display panel cooling device or the like, in the present embodiment, the liquid crystal panel 1 in which the substrate 3 is made of glass as described above is taken as an example, but the liquid crystal panel 1 is limited thereto. Instead, the substrate 3 may be a display panel made of plastic instead of glass or a film display panel.
In addition, since the liquid crystal panel 1 to be processed in the present embodiment is an example of a type in which light is transmitted from the back side by a backlight, polarizing plates are provided on both the front and back sides of the display unit. However, the liquid crystal panel 1 is not limited to the backlight type, and may be a so-called reflection type.
[0012]
FIG. 4 shows the display panel mounting apparatus according to the above embodiment, in which the liquid crystal panel 1 is moved along a linear transport path for each process from loading to unloading of the liquid crystal panel 1 with respect to the display panel mounting apparatus. A so-called line type display panel mounting apparatus 101 that performs various processes on the liquid crystal panel 1 while being moved is shown. The display panel mounting device 101 is roughly divided into a display panel carry-in device 111, an ACF sticking device 112, an IC temporary joining device 113, an IC main joining device 114, a display panel cooling device 201, and a display panel carry-out device 115. . Here, the components other than the display panel cooling device 201 are basically the same as those provided in the conventional line type liquid crystal panel mounting device, and will be briefly described below. Will be described in detail.
[0013]
The display panel carry-in device 111 is a device that carries the liquid crystal panel 1 described above into the display panel mounting device 101, and the ACF sticking device 112 is located at the IC mounting position in the peripheral portions 1 a and 1 b of the liquid crystal panel 1. An apparatus for attaching the ACF. The peripheral portions 1a and 1b function as electronic component mounting locations where the IC chip 2 that functions as an electronic component is mounted. The IC provisional bonding device 113 aligns the IC chip 2 and the liquid crystal panel 1, and places the IC chip 2 on the IC mounting position where the ACF is pasted to place the IC chip on the liquid crystal panel 1. 2 is an apparatus for performing temporary bonding of 2. The IC main bonding apparatus 114 includes the heating and pressing head 7, and the heating and pressing head 7 heats and presses the IC chip 2 against the substrate 3, whereby the IC chip 2 electrode and the transparent electrode on the substrate 3 are pressed. The ACF 6 is crushed between the electrodes and the electrodes of the IC chip 2 and the transparent electrodes on the substrate 3 are electrically connected via the ACF 6, and the IC chip 2 is fixed on the substrate 3. The display panel carry-out device 115 is a device that conveys the liquid crystal panel having the IC chip 2 fixed on the substrate 3 to the next process device. The liquid crystal panel to which the IC chip 2 is fixed is hereinafter referred to as “liquid crystal panel 11”.
[0014]
The display panel cooling device 201 is provided at the place where the IC main bonding device 114 is installed. When the heating and pressing head 7 heats and presses the IC chip 2 against the substrate 3, as shown in FIG. The first polarizing plate 5a covering the display unit 4 of the liquid crystal panel 1 on the component heating pressing surface 20 side, which is the surface on which the IC chip 2 being heated and pressed is mounted, and the component heating pressing This is a device for cooling the second polarizing plate 5 b provided corresponding to the display unit 4 of the liquid crystal panel 1 on the IC non-heating pressing surface 21 side facing the surface 20.
[0015]
Specifically, as shown in FIGS. 1 and 2, the display panel cooling apparatus 201 includes a first plate member 211, a first plate member cooling unit 212, a second plate member 213, A two-plate member cooling unit 214, a cooling water supply device 150, and a control device 180 are provided. The first plate-like member 211 and the first plate-like member cooling part 212 are examples that fulfill the function of the first heat removal member, and the second plate-like member 213 and the second plate-like member cooling part 214. These are examples which fulfill | perform the function of the member for 2nd heat removal. The cooling water supply device 150 and the control device 180 are examples that fulfill the function of the first refrigerant supply device that supplies the refrigerant to the first heat removal member, and the refrigerant is supplied to the second heat removal member. It is also an example which fulfill | performs the function of the 2nd refrigerant | coolant supply apparatus to supply. Thus, in this embodiment, although the said 1st refrigerant | coolant supply apparatus and the said 2nd refrigerant | coolant supply apparatus are combined, of course, it can also provide separately independently.
[0016]
The first plate-like member 211 is in contact with the edge portion 51 of the first polarizing plate 5a provided on the component heating pressing surface 20 side and adjacent to the peripheral edge portion 1a or the peripheral edge portion 1b. This is a thin plate-like member having flexibility, which performs heat removal of the end portion 51 in particular. The first plate-like member cooling unit 212 cools the first plate-like member 211 with the refrigerant to which the first plate-like member 211 is connected and supplied.
The second plate member 213 is provided opposite to the first plate member 211 on the IC non-heated pressing surface 21 side, and has the same arrangement and function as the first plate member 211. That is, the second plate-shaped member 213 comes into contact with the end 52 of the second polarizing plate 5b provided on the IC non-heated pressing surface 21 side and removes heat from the second polarizing plate 5b, in particular, removes the end 52. It is a thin plate-like member having heat and performing flexibility. In addition, the edge part 52 of the 2nd polarizing plate 5b exists in the position facing the edge part 51 of the 1st polarizing plate 5a. Similar to the first plate member cooling unit 212, the second plate member cooling unit 214 cools the second plate member 213 with the refrigerant to which the second plate member 213 is connected and supplied.
Although the refrigerant supplied to the first plate-like member cooling unit 212 and the second plate-like member cooling unit 214 uses water in the present embodiment, it is not limited to water. The cooling water is supplied to the first plate-like member cooling unit 212 and the second plate-like member cooling unit 214 by the cooling water supply device 150 whose operation is controlled by the control device 180.
[0017]
In the present embodiment, the first plate member 211 and the second plate member 213 use a trade name “super graphite” made of a heat removal material. The material has a heat transfer coefficient about 5 times that of copper, and thus can effectively remove heat from the first polarizing plate 5a and the second polarizing plate 5b. The material of the first plate-like member 211 and the second plate-like member 213 is not limited to the above-mentioned super graphite, but is a material having a good heat transfer rate and a high heat removal effect, that is, the IC chip 2 by the heating and pressing head 7. Any material can be used as long as it can remove heat from the polarizing plates 5a and 5b to the extent that the display unevenness of the display unit 4 due to the heating and pressing operation is not generated. For example, a copper plate can be used.
[0018]
Each of the first plate-like member 211 and the second plate-like member 213 is formed by integrally forming a heat transfer removal portion, a radiant heat removal portion, and a connection portion. That is, the first plate-like member 211 includes a heat transfer removing unit 215, a radiant heat removing unit 216, and a connecting unit 217, and the second plate-like member 213 includes a heat transfer removing unit 218 and a radiant heat removing unit 219. And a connecting part 220. The heat transfer removing unit 215 is in contact with the end 51 of the first polarizing plate 5a and transmits the wiring pattern formed on the liquid crystal panel 1 during the heating and pressing by the heating and pressing head 7, thereby transmitting the first polarizing plate 5a. Remove the heat transfer reaching. Similarly to the heat transfer removal unit 215, the heat transfer removal unit 218 contacts the end 52 of the second polarizing plate 5b, and removes the heat that has reached the second polarizing plate 5b during the heating and pressing.
[0019]
In this embodiment, the heat transfer removing portions 215 and 218 transfer heat to the end surface 51a of the end portion 51 of the first polarizing plate 5a and the end surface 52a of the end portion 52 of the second polarizing plate 5b as shown in FIG. Although the end surfaces 215a and 218a of the removal units 215 and 218 are arranged to coincide with each other, the first polarizing plate 5a and the second polarizing plate 5b are present at least in the actual information display portion in the display unit 4. Therefore, the arrangement relationship between the end faces 51a and 52a and the end faces 215a and 218a is not necessarily limited to the arrangement shown in FIG. The heat transfer removing portions 215 and 218 cool at least the actual information display portion in the vicinity of the heated and pressed IC chip 2 in the first polarizing plate 5a and the second polarizing plate 5b. That's fine. Therefore, when the actual information display portion on the display unit 4 is positioned on the right side in FIG. 2 with respect to the positions of the end surfaces 51a and 52a shown in FIG. 2, the end surfaces 215a and 218a correspond to the actual information display portions. It is also possible to shift the position to the right side to the position to be moved.
Conversely, at least the heat transfer removing unit 215 disposed on the component heating and pressing surface 20 side where the heating and pressing head 7 is disposed is replaced with the heat transfer removing unit 215 as shown by a two-dot chain line in FIG. You may extend within the distance until it matches the end surface 4a. With such an arrangement, it is possible to more effectively suppress the temperature rise of the first polarizing plate 5a located on the component heating pressing surface 20 side. Of course, the heat transfer removing unit 218 may be extended similarly to the heat transfer removing unit 215.
In this embodiment, the length of the heat transfer removing portions 215 and 218 in contact with the first polarizing plate 5a and the second polarizing plate 5b, that is, the dimension of “II” shown in FIG. 2 is set to about 20 mm. ing.
[0020]
The radiant heat removal unit 216 is formed integrally with the heat transfer removal unit 215 and transmits heat removed from the first polarizing plate 5a. Further, the radiant heat removing unit 216 is disposed so as to cover the first polarizing plate 5a in a non-contact state with the first polarizing plate 5a, and therefore, the first polarizing plate by the heating and pressing head 7 at the time of the heating and pressing. Blocks radiant heat to 5a. The radiant heat removing unit 219 has the same configuration as the radiant heat removing unit 216, transmits heat removed from the second polarizing plate 5b, and blocks radiant heat from the second polarizing plate 5b.
The connecting portion 217 is formed integrally with the radiant heat removing portion 216 and connected to the first plate member cooling portion 212, and exchanges heat between the heat transfer and the radiant heat and the heat of the refrigerant. I do. The connection part 220 also has the same configuration as the connection part 217, and performs heat exchange between the heat of the refrigerant supplied to the second plate member cooling part 214, the heat transfer, and the radiant heat. As shown in the figure, the connecting portions 217 and 220 can be attached to and detached from the first plate-like member cooling portion 212 and the second plate-like member cooling portion 214 with a fastening member 221.
[0021]
Further, as shown in FIG. 1, the first plate member cooling unit 212 is connected to the liquid crystal panel 1 set in the IC main bonding device 114 for the heating and pressing operation by a cooling unit vertical moving device 151. Then, it moves between the heat removal operation position and the standby position along the thickness direction of the set liquid crystal panel 1. 1 and 2 illustrate a state in which the first plate member cooling unit 212 is disposed at the heat removal operation position.
On the other hand, the second plate-like member cooling unit 214 is fixed to the frame 152 of the display panel mounting apparatus 101.
[0022]
The operations executed by the display panel mounting apparatus 101 configured as described above will be described below. The display panel carry-in apparatus 111, the ACF sticking apparatus 112, the IC temporary bonding apparatus 113, the IC main bonding apparatus 114, Since the operation of the display panel carry-out device 115 is the same as that performed in the conventional liquid crystal panel mounting device, the description thereof will be omitted, and the operation of the display panel cooling device 201 will be described below. .
The liquid crystal panel 1 carried into the IC main joining device 114 from the IC temporary joining device 113 is the heat transfer heat removal unit 218 of the second plate-like member 213 before the start of the heating and pressing by the heating and pressing head 7. Is placed in the place for heating and pressing the IC chip 2 while being in contact with the second polarizing plate 5b. In addition, when the said arrangement | positioning of the liquid crystal panel 1 is performed, the 1st plate-shaped member cooling part 212 is arrange | positioned in the said standby position, and contributes so that carrying in of the liquid crystal panel 1 can be performed easily. After the above arrangement, the cooling unit vertical moving device 151 is operated, and the first polarizing plate 5a and the display unit are formed by the heat transfer removing unit 215 of the first plate member 211 and the heat transfer removing unit 218 of the second plate member 213. 4 and the 2nd polarizing plate 5b, the 1st plate-shaped member cooling part 212 is arrange | positioned from the stand-by position to the said heat removal operation position, Thereby, the heat-transfer removal part 215 of the 1st plate-shaped member 211 is arranged. It is made to contact the edge part 51 of the 1st polarizing part 5a. Of course, the first plate member 211 and the second plate member 213 are already cooled by the refrigerant. Then, after the contact of the heat transfer removal unit 215, the heating pressing of the IC chip 2 is performed.
After the pressing operation of the IC chip 2 is finished, the cooling unit vertical moving device 151 is operated to place the first plate member cooling unit 212 from the heat removal operation position to the standby position. Then, the liquid crystal panel 11 on which the IC chip 2 is mounted is unloaded from the IC main bonding apparatus 114 and transferred to the next process.
[0023]
In this way, only the first plate member cooling unit 212 can be moved between the standby position and the heat removal operation position, and the second plate member cooling unit 214 is fixed to the frame 152, so that the drive system Reduction can be achieved to save space and reduce costs.
[0024]
By providing the display panel cooling device 201 in this manner, it is possible to prevent the temperature increase of the polarizing plates 5a and 5b due to the heating and pressing of the IC chip 2 by the heating and pressing head 7, which is significantly higher than the conventional 120 ° C. The temperature can be lowered. Therefore, even in the case of the monitor display unit 4 of 10 inches or more, it is possible to prevent display unevenness.
Even if the substrate 3 of the liquid crystal panel is a plastic or film liquid crystal panel, thermal damage to the plastic substrate or the film liquid crystal panel can be suppressed by cooling with the display panel cooling device 201.
[0025]
In the above-described embodiment, the first plate-like member 211 and the second plate-like member 213, and the first plate-like member cooling unit 212 and the first plate-like member 513 and the second plate-like member 5b can be cooled. Although the 2nd plate-shaped member cooling part 214 is provided, since the heating press head 7 is arrange | positioned at the component heating press surface 20 side as shown in FIG. 1, compared with the 2nd polarizing plate 5b, it is the 1st polarizing plate. 5a receives heat damage. Therefore, as long as the temperature is kept below the heat-resistant temperature, the first plate-like member 211 and the first plate-like member cooling unit 212 may be provided at a minimum.
[0026]
In the above-described embodiment, the first plate-like member 211 extends over almost the entire length along one side of the liquid crystal panel 1 as shown in FIG. 1, but is not limited to this. Absent. That is, as shown in FIG. 3, the first plate-like member 221 is arranged so as to correspond to the portion of the first polarizing plate 5 a adjacent to the IC chip 2 that is heated and pressed by the heating and pressing head 7. A panel cooling device 202 may be provided. Here, the first plate-like member 221 corresponds to the first plate-like member 211 described above, and the configuration and function thereof are the same as those of the first plate-like member 211. The display panel cooling apparatus 202 includes a first plate member cooling unit 222 for cooling the first plate member 221. The first plate-like member cooling unit 222 corresponds to the above-described first plate-like member cooling unit 212, and the configuration and function thereof are the same as those of the first plate-like member cooling unit 212.
[0027]
In such a display panel cooling device 202, for example, only one IC chip 2 is mounted on each of the peripheral portions 1a and 1b of the liquid crystal panel 1, or a plurality of IC chips 2 are mounted on the peripheral portions 1a and 1b. However, when there is only one heating and pressing head 7, the configuration is effective for space saving and cost reduction. Here, the display panel cooling device 202 can be provided with a cooling unit horizontal movement device 153 corresponding to the case where there is only one heating and pressing head 7 and a plurality of IC chips 2 are mounted on the peripheral portions 1a and 1b. . That is, the cooling unit horizontal movement device 153 moves the first plate member cooling unit 222 in the horizontal direction so that the first plate member 221 comes close to the IC chip 2 heated and pressed by the heating and pressing head 7. You can also. In the configuration shown in FIG. 3, the second plate-like member 213 and the second plate-like member cooling unit 214 described above are provided on the IC non-heated pressing surface 21 side, but the first plate-like member 221 and the second plate-like member 221 The same structure as that of the one-plate member cooling unit 222 may be movable in the horizontal direction.
[0028]
In the above-described embodiment, the display panel mounting apparatus 101 has a line type structure as shown in FIG. However, the display panel cooling devices 201 and 202 are rotary types in which an ACF sticking device 112, an IC temporary bonding device 113, and an IC main bonding device 114 are arranged around a rotating body that rotates intermittently by 90 degrees as shown in FIG. It can also be installed in the display panel mounting apparatus 102.
[0029]
In the above-described embodiment, the first plate member 211 and the second plate member 213 are used as examples of the first heat removal member and the second heat removal member. Heat was removed by directly contacting the second polarizing plate 5b. However, the present invention is not limited to this example, and a display panel cooling apparatus 203 as shown in FIG. 6 may be configured. In the display panel cooling apparatus 203, as an example of the first heat removal member, a cooling having an opening as a first ejection part 232 that blows a gas as a refrigerant onto at least the end part 51 of the first polarizing plate 5a. As an example of the gas supply pipe 231 and the second heat removal member, a cooling gas supply pipe having an opening as a second ejection part 235 that blows a gas as a refrigerant onto at least the end part 52 of the second polarizing plate 5b. 234. Further, a cooling gas supply device 233 and a control device 180 are provided as the first refrigerant supply device and the second refrigerant supply device. Thus, what is called an air cooling type can also be comprised.
By adopting such an air cooling type, it is possible to remove heat from the polarizing plate in a non-contact manner with respect to the liquid crystal panel, thereby eliminating the possibility of damaging the liquid crystal panel.
[0030]
【The invention's effect】
As described above in detail, according to the cooling method for a display panel of the first aspect of the present invention and the cooling device for a display panel of the second aspect, the first heat removal for removing heat from the first polarizing plate of the display panel. Since the member and the first refrigerant supply device are provided, the first polarizing plate is cooled when the electronic component is heated and pressed. Therefore, it is possible to prevent display unevenness from occurring in the display unit due to damage to the first polarizing plate due to the heat during the heating and pressing. Even if the substrate of the display panel is a plastic or film display panel, thermal damage to the plastic substrate or the film display panel can be suppressed by cooling with a display panel cooling device.
[0031]
Furthermore, by providing the second heat removal member and the second refrigerant supply device, the second polarizing plate on the IC non-heated pressing surface side can also be cooled, so that the occurrence of the display unevenness can be prevented more effectively. It is also possible to suppress thermal damage to the plastic substrate and the film display panel.
[0032]
Moreover, the possibility of damaging the display panel can be prevented by disposing the first heat removal member and the second heat removal member in a non-contact manner with respect to the display panel.
[0033]
Further, according to the display panel mounting apparatus of the third aspect of the present invention, since the display panel cooling apparatus of the first aspect is provided, a display panel in which display unevenness does not occur in the display section can be produced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a cooling device for a display panel in an embodiment of the present invention.
2 is a view showing a state in which a heat removal operation of a polarizing plate of a display panel is performed by a plate-like member provided in the display panel cooling apparatus shown in FIG.
FIG. 3 is a perspective view showing a modification of the display panel cooling apparatus shown in FIG. 1;
4 is a block diagram showing a schematic configuration of a display panel mounting apparatus provided with the display panel cooling apparatus shown in FIG. 1 or FIG. 3;
FIG. 5 is a plan view of a modification of the display panel mounting apparatus shown in FIG.
6 is a perspective view showing another embodiment of the cooling device for the display panel shown in FIG. 1. FIG.
FIG. 7 is a perspective view of a display panel.
FIG. 8 is a diagram showing a state in which an IC chip is mounted on a liquid crystal panel by heating and pressing in a conventional liquid crystal panel mounting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Liquid crystal panel, 1a, 1b ... Peripheral part, 2 ... IC chip, 4 ... Display part,
5a ... 1st polarizing plate, 5b ... 2nd polarizing plate, 6 ... ACF,
51, 52 ... end,
101, 102 ... display panel mounting device,
201, 202, 203 ... cooling device for display panel,
211, 221 ... first plate member, 212, 222 ... first plate member cooling section,
213 ... 2nd plate-shaped member, 214 ... 2nd plate-shaped member cooling part,
215, 218 ... heat transfer removal unit, 216, 219 ... radiation heat removal unit,
217, 220 ... connecting part,
232 ... 1st ejection part, 233 ... Cooling gas supply apparatus, 235 ... 2nd ejection part.

Claims (13)

A end proximate the electronic component to be heated pressed by heated pressing head to the electronic component mounting portion of the display panel, a first polarizer of the first polarizing plate provided on the display section included in the display panel perform heat removal end, a first heat removing member that performs heat removal of the first polarizer,
A second moving device that moves the first heat removal member in a direction of contacting or separating from the first polarizing plate ;
The first heat removal member has a first plate-like member that continuously contacts at substantially the entire length of the first polarizing plate at one end of the first polarizing plate along one side of the display portion. ,
A cooling device for a display panel. It said the first heat removing member further comprising a first coolant supply equipment for supplying a coolant, the cooling apparatus for a display panel according to claim 1, wherein. 3. The display according to claim 2, further comprising a first plate-like member cooling unit that is connected to the first plate-like member and cools the first plate-like member with a refrigerant supplied by the first refrigerant supply device. Panel cooling system. The display according to any one of claims 1 to 3, wherein the first plate-shaped member is in contact with an end portion of the first polarizing plate adjacent to the electronic component to be heated and pressed among one side of the display portion. Panel cooling system. Said first plate member further comprising a first moving equipment moving along one side of the display unit, according to claim 4 display panel cooling device according. The first plate-like member includes a first heat transfer removal unit that removes heat transfer reaching the first polarizing plate through the wiring pattern formed on the display panel during the heating and pressing, and the first heat transfer. A first radiant heat removing unit that is molded integrally with the heat removing unit and is not in contact with the first polarizing plate and blocks radiant heat to the first polarizing plate at the time of the heating and pressing, and is integrated with the first radiant heat removing unit. to be molded, a portion connected to the first plate member cooling section and a first connecting portion for exchanging heat with the heat of the heat transfer and the radiation heat and the coolant, claim 3 The cooling apparatus for display panels in any one of 5-5. The second polarizing plate provided opposite to the first polarizing plate at the display unit, performs heat removal definitive the second polarizing plate ends facing the first polarizing plate end portion of the second polarizer a second heat removing member that performs heat removal,
A second refrigerant supply equipment for supplying the refrigerant to the second heat removing member,
Further comprising, a display panel cooling device according to claim 1 or al 6. The second heat removing member includes a second plate-shaped member in contact with the second polarizing plate ends, the refrigerant is the second plate-like member is provided at connected and the second refrigerant supply device The display panel cooling device according to claim 7, further comprising a second plate member cooling unit that cools the second plate member.   9. The display panel according to claim 8, wherein the second plate-like member is continuously in contact with one end of the second polarizing plate along one side of the display portion so as to substantially correspond to the entire length of the second polarizing plate. Cooling device. The second plate-shaped member includes a second heat transfer removal unit that removes heat transfer that reaches the second polarizing plate through the wiring pattern formed on the display panel during the heating and pressing, and the second heat transfer. formed integrally with the heat removal portion, the second and the second radiant heat removing portion to cut off the radiant heat to the polarizing plate with respect to the second polarizing plate at the time is the heated pressing a non-contact, integrally with the second radiation heat removing unit to be molded, and a second connecting portion for exchanging heat with the heat of the second plate member portions in a by the heat transfer and the radiation heat and the coolant which is connected to the cooling unit, according to claim 8 Or the cooling apparatus for display panels of 9. The first heat removal member is disposed in non-contact with the end portion of the first polarizing plate, and blows a gas as the refrigerant supplied from the first refrigerant supply device to the end portion of the first polarizing plate. with a 1 ejection part, the cooling apparatus for a display panel according to claim 7 Symbol mounting. The second heat removal member is disposed in non-contact with the second polarizing plate end, and blows a gas as the refrigerant supplied from the second refrigerant supply device to the second polarizing plate end. The cooling device for a display panel according to claim 11, comprising two ejection portions . And the anisotropic conductive film bonding equipment sticking the anisotropically conductive fill beam on the electronic component mounting箇plant definitive the component heat pressing surface of the display panel,
And IC bonding equipment to be mounted on the display panel by heat pressing the electronic components arranged on the anisotropic conductive film on,
The cooling device for a display panel according to any one of claims 1 to 10, wherein when the electronic component is heated and pressed by the IC bonding device, a polarizing plate disposed in a display unit provided in the display panel is cooled. When,
A mounting device for a display panel, comprising:

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