JP3746565B2 - Tape unbonded part detection device for taping belt for packaging electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a device for detecting an unbonded portion of a tape in an electronic component packaging taping band.
[0002]
[Prior art]
Conventionally, surface-mounted electronic components such as chip resistors are packaged in a sandwiched state by a taping band made of a plurality of layers of tape, and then the tape is wound around a reel for a predetermined length before being shipped. Yes.
[0003]
The taping band for electronic component packaging is
(B) A two-layered product formed from a carrier tape in which concave parts for housing parts are formed at a predetermined pitch in the longitudinal direction, and a cover tape bonded to the upper surface of the carrier tape by thermocompression bonding so as to cover the concave parts for storing parts ,
(B) Formed from a carrier tape having component storage holes drilled at a predetermined pitch in the longitudinal direction, a bottom tape bonded to the lower surface of the carrier tape by thermocompression bonding, and a cover tape bonded to the upper surface of the carrier tape by thermocompression bonding Three-layered,
Are generally used.
[0004]
Then, after the surface-mounted electronic components are individually stored in the component storage recesses of the carrier tape or the storage portion including the component storage holes, the cover tape is thermocompression-bonded to the upper surface of the carrier tape, and the storage portion Is covered.
[0005]
Since the taping band has the above-described configuration, if there is a poorly bonded portion on the cover tape or the bottom tape, these tapes are peeled off from the carrier tape, and the electronic components in the storage section will fall off.
[0006]
Therefore, conventionally, the wound taping band is temporarily collected, and an inspection for adhesion failure is performed by an operator's visual inspection while unwinding from the reel. After the inspection is completed, the tape is wound again on the reel.
[0007]
[Problems to be solved by the invention]
However, the above-described visual inspection requires labor and time, resulting in an increase in cost. In addition, there is a problem that the inspection is not efficient and the quality cannot be stabilized due to frequent inspection errors.
[0008]
This invention makes it the technical subject to provide the unbonded part detection apparatus of the tape in the taping belt | band | zone for electronic component packaging which can solve the said subject.
[0009]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention comprises a carrier tape in which recesses for component storage are formed at a predetermined pitch in the longitudinal direction, and a cover tape adhered to the upper surface of the carrier tape so as to cover the recesses for component storage electronic components packaged in clamping state form electronic parts packaging taping strip, a tape unbonded portion detecting device which detects a non-adhered portion of the carrier tape and the cover tape in the electronic component packaging taping strip When the suction valve connected to the pressure sensor is arranged in the middle of the path for transporting the electronic component packaging taping band in the longitudinal direction, and when the non-bonded portion of the cover tape to the carrier tape is sucked by this suction valve An unadhered portion is detected based on a pressure change of the pressure sensor that is generated to determine an adhesion failure.
[0010]
Further, a plurality of the suction valves are provided, and are arranged differently in the width direction of the cover tape.
[0012]
The electronic component packaging formed from a carrier tape bored parts receiving hole at a predetermined pitch in the long side direction, and a bottom tape to adhere to the lower surface of the carrier tape and a cover tape which adheres to the upper surface of the carrier tape A tape non-adhesive part detecting device for packaging an electronic component in a sandwiched state with a taping band for use and detecting an unadhered part between a carrier tape and a bottom tape in the electronic component packaging taping band. contact pressure sensors in the middle of the path for transferring the taping strip in the longitudinal direction and disposed the air valve and air can configure the air toward the component accommodating hole provided in the carrier tape, the air supply Based on the pressure change of the pressure sensor that occurs when air is released from the unbonded part of the bottom tape and carrier tape due to the air supply by the valve. And configured to determine the adhesion failure by detecting the unbonded portions are.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
The tape non-bonded portion detecting device according to the present invention is provided with a valve for feeding or sucking air in the middle of a path for transporting the electronic component packaging taping band in the longitudinal direction, and the valve and the pressure sensor are arranged. In this configuration, it is possible to detect an adhesive pressure failure by detecting a change in air pressure caused by non-adhesion of the laminated tapes.
[0014]
Such a non-tape-bonding portion detection device automatically performs a series of operations of storing electronic components in a component storage portion provided at a predetermined pitch in the longitudinal direction of the carrier tape and covering the component storage portion with a cover tape. The taping machine can be provided.
[0015]
That is, the taping machine has a path for transporting the electronic component packaging taping band in the longitudinal direction, and in the path, the carrier tape feed section, the cover tape feed section, and the electronic component are stored in the recess for storing the parts. A component supply unit to be loaded on the tape and an adhesive unit for heat-pressing both tapes are provided, and the taping band that has finished packaging the components is sent out to an editing machine that winds it on a reel.
[0016]
In the taping machine having the above-described configuration, the non-bonded portion detection device is disposed in a path on the post-process side of the bonded portion, and the configuration of the device guides the cover tape suction valve connected to the pressure sensor and the taping band. In addition, the suction valve is disposed so that the surface of the cover tape can be sucked.
[0017]
The guide body forms a curved transfer path so that the cover tape of the taping band is curved inward. This curved transfer path makes it easy to peel off when the cover tape is not bonded.
[0018]
With this configuration, the unbonded cover tape of the taping band that passes through the guide body is attracted to the suction valve by the vacuum pressure, and the pressure changes when the unbonded portion of the cover tape is attracted to the valve. Such a change is detected by a pressure sensor to determine adhesion failure.
[0019]
In the case where the taping band has a two-layered form consisting of a carrier tape having a component storage recess and a cover tape covering the same, an air vent hole (carrier tape) formed in the bottom of the component storage recess. (It is formed when the concave part for component storage is extruded at the time of manufacture), and positive pressure is applied from the hole, and if there is an unbonded part of the cover tape, it can be easily peeled off to the suction valve side. The cover tape can be easily adsorbed by the adsorption valve. For this purpose, an air supply valve may be disposed so as to face the adsorption valve with the taping band interposed therebetween.
[0020]
In addition, the electronic component packaging taping band includes a carrier tape having component housing holes formed at a predetermined pitch, a bottom tape that adheres to the lower surface of the carrier tape, and a cover tape that adheres to the upper surface of the carrier tape. In the case of a three-layered form, it is necessary to detect poor adhesion of the bottom tape.
[0021]
Therefore, in addition to the above configuration, the taping machine is further provided with a bottom tape feeding section, and a bottom tape bonding section that heat-presses the bottom tape to the lower surface of the carrier tape is disposed at least on the front side of the component supply section. Keep it.
[0022]
The bottom tape tape is not provided with an air supply valve configured to communicate with the pressure sensor between the bottom tape bonding portion and the component supply portion and to be able to supply air toward the component storage hole of the carrier tape. An adhesive detection device is provided.
[0023]
The air supply valve is provided in a guide body having a curved transfer path similar to the suction valve so that the bottom tape is bent inward.
[0024]
Therefore, if there is an unbonded part on the bottom tape, the supplied air will escape from the component storage hole through the unbonded part of the bottom tape, causing a change in the air pressure. By detecting this, adhesion failure is identified.
[0025]
Thus, in this invention, the adhesion failure of the cover tape and bottom tape of the taping belt | band | zone for electronic component packaging can be reliably detected, conveying a taping belt | band | zone continuously to the longitudinal direction.
[0026]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
[0027]
FIG. 1 shows a taping machine provided with a tape non-adhesive portion detecting device for electronic component packaging taping bands according to the present invention, and an electronic component packaging taping band (hereinafter referred to as taping band 1) in this embodiment is shown in FIG. As shown in FIG. 2, the carrier tape 10 is composed of a long carrier tape 10 and a cover tape 11 covering the carrier tape 10. The carrier tape 10 has a plurality of component storage recesses 12 for individually storing electronic components C. A plurality of carrier holes 10a are formed in the longitudinal direction at one side end portion in the width direction. In this embodiment, the electronic component C is a chip resistor.
[0028]
13 is an air vent hole formed in the bottom of the component storage recess 12, which is provided for air release when the component storage recess 12 is extruded on the carrier tape 10. When taking out C, the electronic component C is projected from the air vent hole 13 with a pin or the like so that it can be easily taken out.
[0029]
As shown in FIG. 1, the taping machine T includes a carrier tape delivery unit 3, a cover tape delivery unit 4, and a component supply unit 5 that loads an electronic component C into the component storage recess 12. The carrier tape 10 and the cover tape 11 are provided with a cover tape bonding portion 6 or the like that heat-presses the carrier tape 10 and the transfer tape R to form a transfer path R, and the taping band 1 can be transferred in the longitudinal direction by the path R. Reference numeral 7 denotes a control and management device for the taping machine T.
[0030]
In FIG. 1, D is an editing machine attached to the taping machine T via the transfer path R, and devices for winding up the taping band 1 after packaging the electronic parts C around the editing machine body D1. And a reel 14 for finally winding the taping band 1. D2 is a weight part for pushing down the taping band 1 through a roller and pulling it out to the reel 14, and D3 is a carriage for transporting the reel 14 around which the taping band 1 is wound.
[0031]
The side wall of the taping machine main body T1, that is, the middle part of the transfer path R in the taping machine T, and the side wall in the middle of leading the taping band 1 from the cover tape bonding part 6 to the weight part D1 of the editing machine D. The tape non-bonded portion detection device A, which is the gist of the present invention, is provided.
[0032]
As shown in FIG. 1, the tape non-bonded portion detection device A is disposed in the device casing A1, and as shown in FIGS. 3 and 4, three cover tape adsorption valves respectively connected to the pressure sensor 30. 31 is attached to the valve block 32 in a penetrating manner, and the valve block 32 is connected to a guide body 33 that guides the taping band 1, and the adhering valve 31 is not bonded to the cover tape 11. By detecting the change in air pressure that occurs when the air is adsorbed, it is possible to determine poor adhesion.
[0033]
That is, as shown in FIG. 4, the guide body 33 includes a first guide part 35 that forms a transfer surface 34 of the taping band 1 and a second guide part 36 that holds the taping band 1 from the transfer surface 34 so as not to float. The transfer surface 34 of the first guide part 35 is formed in a concave curve in the transfer direction, while the convex curve surface 37 is formed in the second guide part 36 so as to coincide with the transfer surface 34. is doing.
[0034]
In the curved transfer path 38 formed between the curved surfaces 34 and 37, the taping band 1 is transferred so that the cover tape 11 is curved inward, that is, the cover tape 11 is on the upper surface. ing.
[0035]
Further, as shown in FIG. 5, the three suction valves 31 are attached in series along the curved transfer path 38, and any of the left, right, and center portions in the width direction of the cover tape 11 is used. In order to reliably detect the occurrence of an unbonded portion at the position, the three disposed positions are positioned so as to be staggered in the width direction of the curved transfer path 38.
[0036]
In addition, three air supply valves 39 are arranged at opposing positions across the taping band 1 so as to correspond to the respective suction valves 31 and are normally directed from the air supply valves 39 toward the air vent holes 13. Pressure air is ejected so that the cover tape 11 at the unbonded portion is easily peeled off from the carrier tape 10. The air pressure is preferably in the range of 0.1 to 0.4 HPa.
[0037]
With this configuration, if there is an unbonded portion of the cover tape 11 in the taping band 1, the unbonded portion is adsorbed by the adsorption valve 31 while passing through the curved transfer path 38, and the change in air pressure caused by the adsorption Can be detected by the pressure sensor 30.
[0038]
In this way, it is possible to automatically detect the adhesive state of the cover tape 11 of the taping band 1, that is, the presence or absence of an unbonded portion, while transporting the taping band 1 in the longitudinal direction.
[0039]
Next, as another embodiment, the case of the taping band 2 having the configuration shown in FIG. 6 will be described.
[0040]
That is, the carrier tape 20 in which the taping band 2 is formed with the component accommodation holes 23 at a predetermined pitch in the longitudinal direction, the bottom tape 22 bonded to the lower surface of the carrier tape 20, and the cover tape bonded to the upper surface of the carrier tape 20 In the case of the three-layered shape formed from 21, it is necessary to detect the adhesion failure of the bottom tape 22.
[0041]
Therefore, in this embodiment, the tape non-bonded portion detection device B for the bottom tape 22 is disposed in the taping machine T shown in FIG.
[0042]
As shown in FIG. 1, when the taping band 2 has three layers, a bottom tape delivery unit 8 is provided separately from the carrier tape delivery unit 3 and the cover tape delivery unit 4 in the taping machine body T1. 7, a bottom tape bonding portion 9 is disposed at a joining point between the carrier tape 20 and the bottom tape 22 fed from the carrier tape feeding portion 3, and both the tapes 20 and 22 are heated and pressure-bonded.
[0043]
Then, the two tapes 20 and 22 which are integrated by thermocompression bonding are sent to the component supply unit 5, the electronic component C is stored in the component storage hole 23, and then covered with the cover tape 21 and transferred to the editing machine D. Will do.
[0044]
The tape non-bonded portion detection device B according to the present embodiment is disposed between the bottom tape bonding portion 9 and the component supply portion 5 disposed in the device casing B1 (see FIG. 1). As shown in FIG. 8, an air supply valve 41 connected to the pressure sensor 40 is attached to the valve block 42 and communicated with a tape guide transfer surface 44 formed on the valve block 42, and an unbonded portion is attached to the bottom tape 22. If there is, the pressure change caused by the air supplied from the air supply valve 41 is detected so that the adhesion failure can be determined. In FIG. 7, 20a is a carrier hole, and 25, 26 and 27 are tape guide rollers.
[0045]
That is, as shown in FIG. 8, the valve block 42 covers the block main body 43 and the tape guide transfer surface 44 formed on the block main body 43 so that the taping band 2 (not yet covered with the cover tape 21) does not float. And an air passage 45 in the block main body 43, one end of which is connected to the air supply valve 41, while the other end is branched into a plurality of ends. The tape guide transfer surface 44 is open.
[0046]
The tape guide transfer surface 44 is formed in a concave curve in the transfer direction, and the cover body 46 is formed with a convex curve surface 47 so as to coincide with the transfer surface 44. In the curved transfer path 48 formed between the tape guide transfer surface 44 and the convex curved surface 47, the bottom tape 22 is curved inward, that is, the bottom tape 22 becomes the air supply valve 41 side. The tape is transferred while being in sliding contact with the tape guide transfer surface 44.
[0047]
With this configuration, when the bottom tape 22 of the taping band 2 is well bonded, the air sent toward the component storage hole 23 of the carrier tape 20 stays in the hole 23 and the pressure is kept at a predetermined pressure. However, if there is an unbonded portion, air passes through the unbonded portion and escapes to the outside, and the air pressure decreases, and the change in the air pressure can be detected by the pressure sensor 40.
[0048]
Thus, also in this embodiment, it is possible to automatically detect the presence or absence of an unbonded portion of the bottom tape 22 of the taping band 2 while transporting the taping band 2 in the longitudinal direction.
[0049]
In the present embodiment, detection of non-adhesion of the bottom tape 22 of the taping band 2 has been described. However, even when such a three-layer taping band 2 is used, the adhesion failure of the cover tape 21 By using the tape non-bonded portion detection apparatus A described in the previous embodiment, it is possible to detect the same as in the two-layer taping band 1.
[0050]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0051]
(1) Taping strip for electronic component packaging is used to prevent changes in air pressure caused by non-adhesion of the laminated tape of the electronic component packaging taping strip for packaging electronic components with a plurality of tapes adhered and laminated together. Since it is configured to detect adhesion failure by detecting it in the middle of the transport path, it automatically and reliably detects adhesion failure while continuously transporting the electronic component packaging taping band in the longitudinal direction. It is possible to perform an efficient inspection without any inspection mistake.
[0052]
(2) A taping strip for packaging electronic parts is formed of a carrier tape in which concave parts for storing parts are formed at a predetermined pitch in the longitudinal direction, and a cover tape adhered to the upper surface of the carrier tape so as to cover the concave parts for storing parts. If a cover tape suction valve connected to the pressure sensor is installed in the middle of the path for transporting the electronic component packaging taping band in the longitudinal direction, the unbonded portion of the cover tape is absorbed by the valve. Because it detects the air pressure change that occurs in this case and discriminates the adhesion failure, it automatically and reliably detects the adhesion failure of the cover tape while continuously transporting the taping strip for packaging electronic parts. Can do.
[0053]
Therefore, labor and time required for inspection can be saved, and efficient inspection can be performed at low cost.
[0054]
(3) A carrier tape in which electronic component packaging taping bands are perforated with component storage holes at a predetermined pitch in the longitudinal direction, a bottom tape that adheres to the lower surface of the carrier tape, and a cover tape that adheres to the upper surface of the carrier tape In the middle of the path for transporting the electronic component packaging taping band in the longitudinal direction, the pressure sensor is connected to the carrier tape and the air can be fed toward the carrier tape component storage hole. Since the air valve is arranged to detect the air pressure change caused by non-adhesion of the bottom tape, the adhesion failure is discriminated. Thus, it is possible to reliably detect the adhesion failure of the bottom tape.
[0055]
Therefore, labor and time required for the inspection can be saved, and an efficient inspection can be performed at a low cost.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a taping machine equipped with a device for detecting an unbonded portion of a tape in an electronic component packaging tape according to the present invention.
FIG. 2 is an explanatory view showing one embodiment of a taping band for packaging electronic parts.
FIG. 3 is an explanatory diagram of a tape non-bonded portion detection apparatus according to the present invention.
FIG. 4 is an explanatory view in a side view of the tape non-bonded portion detection device.
FIG. 5 is an explanatory diagram in plan view of the tape non-bonded portion detection device.
FIG. 6 is an explanatory view showing one embodiment of a taping band for packaging electronic parts.
FIG. 7 is an explanatory diagram of a tape non-bonded portion detection apparatus according to another embodiment.
FIG. 8 is an explanatory view of the same tape non-bonded portion detection device in a cross-sectional view.
[Explanation of symbols]
A, B Tape unbonded part detection device C Electronic component D Editing machine R Transfer path T Taping machine 1, 2 Taping band for packaging electronic parts
10, 20 Carrier tape
11, 21 Cover tape
22 Bottom tape
30, 40 Pressure sensor
31 Cover tape suction valve
41 Air supply valve

Claims (3)

An electronic component with a tape tape for packaging electronic components formed from a carrier tape in which recesses for storing components are formed at a predetermined pitch in the longitudinal direction, and a cover tape adhered to the upper surface of the carrier tape so as to cover the recesses for storing components the packaged in clamping state, a tape unbonded portion detecting device which detects a non-adhered portion of the carrier tape and the cover tape in the electronic component packaging taping zone,
An adsorption valve connected to the pressure sensor is arranged in the middle of the path for transporting the electronic component packaging taping band in the longitudinal direction,
The adhering valve is configured to detect an unadhered portion based on a pressure change of the pressure sensor generated when an unadhered portion of the cover tape to the carrier tape is adsorbed by the adsorbing valve, and to determine an adhesion failure. A device for detecting an unbonded portion of a tape in an electronic component packaging taping band. 2. The tape non-bonded portion detecting device in an electronic component packaging taping band according to claim 1 , wherein a plurality of the suction valves are provided and are arranged differently in the width direction of the cover tape . A carrier tape bored parts receiving hole at a predetermined pitch in the long side direction, the bottom tape and, for packaging electronic components taped formed from a cover tape which adheres to the upper surface of the carrier tape to be adhered to the lower surface of the carrier tape A tape non-adhesive part detection device that wraps an electronic component in a sandwiched state with a belt and detects an unadhered part between a carrier tape and a bottom tape in the electronic component packaging taping belt,
Contact pressure sensors in the middle of the path for transferring the electronic component packaging taping strip in the longitudinal direction and disposed air valve and air can configure the air toward the component accommodating hole provided in the carrier tape And
Defective adhesion is detected by detecting the non-adhered part based on the pressure change of the pressure sensor that occurs when air is released from the non-adhered part of the bottom tape and carrier tape by air supply by this air supply valve. An apparatus for detecting an unbonded portion of a tape in an electronic component packaging taping band, characterized in that the apparatus is configured as described above .

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