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JP6752566B2 - Board transfer device - Google Patents
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JP6752566B2 - Board transfer device - Google Patents

Board transfer device Download PDF

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JP6752566B2
JP6752566B2 JP2015205764A JP2015205764A JP6752566B2 JP 6752566 B2 JP6752566 B2 JP 6752566B2 JP 2015205764 A JP2015205764 A JP 2015205764A JP 2015205764 A JP2015205764 A JP 2015205764A JP 6752566 B2 JP6752566 B2 JP 6752566B2
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substrate
conveyor
rails
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moving member
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JP2017077934A (en
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勇夫 藤榮
勇夫 藤榮
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Description

本発明は、基板を搬送する基板搬送装置に関する。 The present invention relates to a substrate transfer device that conveys a substrate.

例えば、特許文献1には、ワークを搬送する第1ベルトと、第1ベルトの搬送方向下流側に第1ベルトに隣接して配置され、ワークを載置するステージと、ステージに対し搬送方向下流側にステージに隣接して配置され、ワークを搬送する第2ベルトと、ワークを把持して第1ベルトからステージに搬入し、この搬入の際にステージ上のワークをステージから第2ベルトに押し出して搬入する搬送手段とを備える搬送装置が記載されている。この搬送装置では、搬送手段の搬送速度が第1、第2ベルトの搬送速度よりも速い速度となるように設定されるので、ワークの搬入時間を短縮できる。 For example, in Patent Document 1, a first belt for transporting a work, a stage arranged adjacent to the first belt on the downstream side in the transport direction of the first belt and mounting the work, and a stage downstream in the transport direction with respect to the stage The second belt, which is arranged adjacent to the stage on the side and conveys the work, grips the work and carries it from the first belt to the stage, and at the time of this carrying, pushes the work on the stage from the stage to the second belt. A transport device including a transport means for carrying in is described. In this transfer device, the transfer speed of the transfer means is set to be faster than the transfer speed of the first and second belts, so that the work loading time can be shortened.

特開2003−137422号公報Japanese Unexamined Patent Publication No. 2003-137422

特許文献1に記載の搬送装置では、第2ベルトが、第2ベルトの搬送方向下流側に配置される作業装置にワークを搬入するように設けられている場合、ワークを第2ベルトにおける搬送方向下流側の端部の作業装置に近接する位置に搬送して位置決めすることで、タクトタイムの短縮を図れる。しかし、特許文献1には、搬送手段でステージ上のワークをステージから第2ベルトに押し出して搬入することまでしか記載されておらず、第2ベルトにおけるワークの搬送位置決めについては記載されていない。 In the transport device described in Patent Document 1, when the second belt is provided so as to carry the work into the work device arranged on the downstream side in the transport direction of the second belt, the work is conveyed in the transport direction in the second belt. The tact time can be shortened by transporting and positioning the work device at the downstream end close to the work device. However, Patent Document 1 only describes the process of pushing the work on the stage from the stage to the second belt and carrying it in by the transport means, and does not describe the transport positioning of the work on the second belt.

本発明は上記事情に鑑みてなされたものであり、その目的は、基板を高精度に搬送位置決めできる基板搬送装置を提供することにある。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transport device capable of transporting and positioning a substrate with high accuracy.

上述した課題を解決するために、基板を搬送する基板搬送装置であって、並べて平行に配置される一対のレールと、前記一対のレール上に載置される前記基板に当接・離間可能で前記レールに沿って移動可能な移動部材と、前記レールにおける部材待機位置に位置する前記移動部材を前記基板に当接させて移動させ、当該移動させた後に前記移動部材を前記基板から離間させて前記部材待機位置へ移動させる移動装置と、前記一対のレールと直列に配置されるコンベアと、前記コンベアを駆動する駆動装置と、を備え、前記移動装置及び前記駆動装置を駆動し、前記基板の搬送方向前端が前記レールにおける基板待機位置に位置する前記基板の全長のうちの一部であり前記コンベアのみを駆動させることで前記基板の搬送が可能である当該基板の搬送方向前端から所定距離分だけを、前記コンベアによる前記基板の搬送速度よりも前記基板の搬送速度が速くなるように設定した前記移動部材の駆動によって、前記レールから前記駆動装置で駆動させた前記コンベアに乗り移りさせ、当該乗り移りさせた前記基板を前記コンベアのみで搬送し、前記基板の搬送方向前端を前記コンベアにおける基板移動位置に位置決めする。このように、レールにおいては基板待機位置を予め設定し、コンベアにおいては基板移動位置を予め設定しているので、両位置等の関係に基づいて、基板を基板移動位置に精度よく位置決めできる。 In order to solve the above-mentioned problems, it is a board conveyor that conveys a substrate, and can abut and separate a pair of rails arranged side by side in parallel and the substrate placed on the pair of rails. A moving member that can move along the rail and the moving member located at a member standby position on the rail are brought into contact with the substrate to move, and after the movement, the moving member is separated from the substrate. A moving device for moving to the member standby position, a conveyor arranged in series with the pair of rails, and a driving device for driving the conveyor are provided, and the moving device and the driving device are driven to drive the substrate. predetermined distance from the conveying direction front end of the substrate transport is possible for the substrate by causing a is driven only the conveyor part of the entire length of the base plate conveyance direction front end is positioned in the substrate standby position in the rail By driving the moving member, which is set so that the transfer speed of the substrate is faster than the transfer speed of the substrate by the conveyor, only the minutes are transferred from the rail to the conveyor driven by the drive device. The transferred substrate is conveyed only by the conveyor, and the front end of the substrate in the conveying direction is positioned at the substrate moving position on the conveyor. As described above, since the substrate standby position is preset in the rail and the substrate moving position is preset in the conveyor, the substrate can be accurately positioned at the substrate moving position based on the relationship between both positions and the like.

本発明の基板搬送装置(第1、第2基板搬送装置)の実施の形態を備える部品実装ラインの概略を示す平面図である。It is a top view which shows the outline of the component mounting line which comprises embodiment of the substrate transfer apparatus (the first and second substrate transfer apparatus) of this invention. 図1の第1部品実装機をY方向に見た概略図である。It is the schematic which looked at the 1st component mounting machine of FIG. 1 in the Y direction. 第1、第2基板搬送装置に設定される基板に関する位置と距離及び移動部材に関する位置と距離を示す図である。It is a figure which shows the position and distance about a substrate set in the 1st and 2nd substrate transfer apparatus, and the position and distance about a moving member. 第1、第2基板搬送装置の第1の動作を説明するためのフローチャートである。It is a flowchart for demonstrating the 1st operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第1の動作で基板が基板待機位置に位置決めされた状態を示す図である。It is a figure which shows the state which the substrate is positioned at the substrate standby position by the 1st operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第1の動作で移動部材が基板に当接した状態を示す図である。It is a figure which shows the state which the moving member came into contact with a substrate in the 1st operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第1の動作で基板がレールからコンベアに乗り移った状態を示す図である。It is a figure which shows the state which the substrate was transferred from a rail to a conveyor by the 1st operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第1の動作で移動部材が基板から離間した状態を示す図である。It is a figure which shows the state which the moving member separated from the substrate by the 1st operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第1の動作で基板がコンベアの移動で基板移動位置に位置決めされた状態を示す図である。It is a figure which shows the state which the substrate is positioned at the substrate moving position by the movement of the conveyor in the 1st operation of the 1st and 2nd substrate transporting apparatus. 第1、第2基板搬送装置の第2の動作を説明するためのフローチャートである。It is a flowchart for demonstrating the 2nd operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第2の動作で基板が基板待機位置に位置決めされた状態を示す図である。It is a figure which shows the state which the substrate is positioned at the substrate standby position by the 2nd operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第2の動作で移動部材が基板に当接した状態を示す図である。It is a figure which shows the state which the moving member came into contact with a substrate by the 2nd operation of the 1st and 2nd substrate transfer apparatus. 第1、第2基板搬送装置の第2の動作で基板がレールからコンベアに乗り移って移動部材が基板から離間した状態を示す図である。It is a figure which shows the state which the substrate moves from the rail to the conveyor by the 2nd operation of the 1st and 2nd substrate transfer apparatus, and the moving member is separated from the substrate. 第1、第2基板搬送装置の第2の動作で基板がコンベアの移動で基板移動位置に位置決めされた状態を示す図である。It is a figure which shows the state which the substrate is positioned at the substrate movement position by the movement of the conveyor by the 2nd operation of the 1st and 2nd substrate transfer apparatus.

(1.基板搬送装置を備える部品実装ラインの概略構成)
以下、本発明の基板搬送装置の実施の形態を備える部品実装ラインを図面に基づいて説明する。なお、図において、基板PBの搬送方向をY軸線方向、Y軸線方向と直交する水平方向をX軸線方向、X軸線方向及びY軸線方向と直交する垂直方向をZ軸線方向とする。
図1に示すように、部品実装ライン1は、第1部品実装機2と、第2部品実装機3と、第1部品実装機2に備えられる第1基板搬送装置4及び第1、第2部品実装機2,3の間に配置される第2基板搬送装置5でなる本実施形態の基板搬送装置とを備える。
(1. Schematic configuration of a component mounting line equipped with a board transfer device)
Hereinafter, a component mounting line including an embodiment of the substrate transfer device of the present invention will be described with reference to the drawings. In the figure, the transport direction of the substrate PB is the Y-axis direction, the horizontal direction orthogonal to the Y-axis direction is the X-axis direction, and the X-axis direction and the vertical direction orthogonal to the Y-axis direction are the Z-axis directions.
As shown in FIG. 1, the component mounting line 1 includes a first component mounting machine 2, a second component mounting machine 3, a first board transfer device 4 provided in the first component mounting machine 2, and first and second components. The board transfer device of the present embodiment, which is the second board transfer device 5 arranged between the component mounting machines 2 and 3, is provided.

図1及び図2に示すように、第1部品実装機2は、主にアキシャル部品やラジアル部品等のリード部品を基板上に装着する装置である。この第1部品実装機2は、基台2a上面の奥側(図1の上側、図2の右側)に配設され、基板PBを搬入出する第1基板搬送装置4と、基台2a上面の手前側(図1の下側、図2の左側)に配設され、リード部品を供給する部品供給装置22と、基台2a上面の上方に配設され、供給されるリード部品を移送して、搬入される基板PB上に装着する部品移載装置23と、第1基板搬送装置4の一対のレール41a,41b間の下方に配設され、搬入される基板PBに挿入されるリード部品のリードを所定長に切断するリード切断装置24(本発明の「作業装置」に相当)等とを備える。 As shown in FIGS. 1 and 2, the first component mounting machine 2 is a device for mounting lead components such as axial components and radial components on a substrate. The first component mounting machine 2 is arranged on the back side of the upper surface of the base 2a (upper side of FIG. 1, right side of FIG. 2), and the first board transfer device 4 for loading and unloading the board PB and the upper surface of the base 2a. The component supply device 22 which is arranged on the front side (lower side of FIG. 1 and the left side of FIG. 2) to supply the lead parts and the lead parts which are arranged above the upper surface of the base 2a and are supplied are transferred. A lead component that is arranged below between the pair of rails 41a and 41b of the component transfer device 23 and the first substrate transfer device 4 to be mounted on the board PB to be carried in, and is inserted into the board PB to be carried in. It is provided with a lead cutting device 24 (corresponding to the "working device" of the present invention) and the like for cutting the leads of the above to a predetermined length.

第1基板搬送装置4は、シャトル式の搬送装置であり、基板PBを載置して搬送するための一対のレール41a,41bと、基板PBを押して移動させる移動部材42と、移動部材42を移動させる部材移動装置43等とを備える。
一対のレール41a,41bは、X軸線方向断面がL字状に形成され、L字の脚が対向するようにY軸線方向に延在し基板PBの幅に合わせた間隔をあけて互いに平行に配置される。なお、図示省略するが、一対のレール41a,41bの間隔を基板PBの幅に合わせるため、一方のレール41aはX軸線方向に移動可能に構成される。
The first substrate transfer device 4 is a shuttle type transfer device, and includes a pair of rails 41a and 41b for mounting and transporting the substrate PB, a moving member 42 for pushing and moving the substrate PB, and a moving member 42. It is provided with a member moving device 43 or the like to be moved.
The pair of rails 41a and 41b have an L-shaped cross section in the X-axis direction, extend in the Y-axis direction so that the L-shaped legs face each other, and are parallel to each other at intervals according to the width of the substrate PB. Be placed. Although not shown, one rail 41a is configured to be movable in the X-axis direction in order to match the distance between the pair of rails 41a and 41b with the width of the substrate PB.

図3に示すように、レール41a,41bには、リード切断装置24による切断作業を行うために基板PBを位置決めする基板作業位置Pr及び当該切断作業が完了した基板PBをコンベア51に乗り移させる前に待機させる基板待機位置Pwが予め設定される。基板作業位置Prは、リード切断装置24の上方に設定され、基板待機位置Pwは、基板作業位置Prよりも搬送方向下流側のレール41a,41bの端部における第2基板搬送装置5のコンベア51に近接する位置に設定される。基板作業位置Pr及び基板待機位置Pwには、基板PBの搬送方向前端が位置決めされる。 As shown in FIG. 3, on the rails 41a and 41b, the substrate work position Pr for positioning the substrate PB for performing the cutting operation by the lead cutting device 24 and the substrate PB for which the cutting operation has been completed are transferred to the conveyor 51. The board standby position Pw to be made to stand by before is set in advance. The board work position Pr is set above the lead cutting device 24, and the board standby position Pw is the conveyor 51 of the second board transfer device 5 at the ends of the rails 41a and 41b on the downstream side in the transfer direction from the board work position Pr. It is set to a position close to. The front end of the substrate PB in the transport direction is positioned at the substrate working position Pr and the substrate standby position Pw.

図1及び図2に戻って、移動部材42は、直方体状に形成され、一対のレール41a,41b上に載置される基板PBの搬送上流側の後部に当接・離間可能に配置される。そして、図3に示すように、移動部材42の搬送方向下流側の側面、すなわち基板PBの後部に当接する面は、基板PBの搬送直前には、基板作業位置Prよりも搬送方向上流側のレール41a,41bの上方に設定される部材待機位置Pbに位置決めされる。ここで、基板待機位置Pwに位置決めされる基板PBの搬送方向後端から部材待機位置Pbまでの距離をaと定義する。 Returning to FIGS. 1 and 2, the moving member 42 is formed in a rectangular parallelepiped shape, and is arranged so as to be in contact with and separated from the rear portion on the transport upstream side of the substrate PB mounted on the pair of rails 41a and 41b. .. Then, as shown in FIG. 3, the side surface of the moving member 42 on the downstream side in the transport direction, that is, the surface in contact with the rear portion of the substrate PB is on the upstream side in the transport direction from the substrate work position Pr immediately before the substrate PB is transported. It is positioned at the member standby position Pb set above the rails 41a and 41b. Here, the distance from the rear end of the substrate PB positioned at the substrate standby position Pw in the transport direction to the member standby position Pb is defined as a.

図1及び図2に戻って、部材移動装置43は、円筒状に形成され、先端に移動部材42が円筒軸線と直角になるように固着されるアーム部材44と、アーム部材44の後端が固着され、アーム部材44をY軸線回りで揺動させる揺動シリンダ45と、アーム部材44とともに揺動シリンダ45をY軸線方向に移動させるボールねじ機構46と、ボールねじ機構46を駆動するモータ47と、揺動シリンダ45のY軸線方向の移動を案内するガイドレール48等とを備える。 Returning to FIGS. 1 and 2, the member moving device 43 has an arm member 44 formed in a cylindrical shape and fixed to the tip so that the moving member 42 is perpendicular to the cylindrical axis, and a rear end of the arm member 44. A swing cylinder 45 that is fixed and swings the arm member 44 around the Y axis, a ball screw mechanism 46 that moves the swing cylinder 45 together with the arm member 44 in the Y axis direction, and a motor 47 that drives the ball screw mechanism 46. And a guide rail 48 or the like that guides the movement of the swing cylinder 45 in the Y-axis direction.

部品供給装置22は、複数のリード部品を収容して供給する複数のフィーダ25がY軸線方向に沿ってセットされるフィーダホルダ部26等を備える。フィーダ25の後部には、複数の例えばアキシャル部品をリードの延伸方向と直角な方向に並べ、部品本体の一端部から延びるリード同士及び他端部から延びるリード同士を2本のテープでそれぞれ連結した部品テープが装填される部品テープ装填部が設けられる。フィーダ25の前部には、部品テープで供給されるリード部品を部品移載装置23の部品把持爪36で把持させる部品把持部が設けられる。 The component supply device 22 includes a feeder holder portion 26 or the like in which a plurality of feeders 25 for accommodating and supplying a plurality of lead components are set along the Y-axis direction. At the rear of the feeder 25, a plurality of, for example, axial parts are arranged in a direction perpendicular to the extending direction of the leads, and the leads extending from one end of the component body and the leads extending from the other end are connected by two tapes, respectively. A component tape loading section for loading component tape is provided. The front portion of the feeder 25 is provided with a component gripping portion for gripping the lead component supplied by the component tape with the component gripping claw 36 of the component transfer device 23.

部品移載装置23は、リード部品を把持して移送する装置であり、XYロボット30によって水平面内で移動されるヘッドホルダ31等を備える。XYロボット30は、一対の固定レール32a,32bと、ヘッド移動レール33等とを備える。一対の固定レール32a,32bは、第1基板搬送装置4の両端部の上方にX方向に延在し互いに平行に配置される。ヘッド移動レール33は、Y方向に延在して配置されて両端が固定レール32a,32bに沿って移動可能に支持される。ヘッド移動レール33の移動は、ボールねじを介してサーボモータ(いずれも図示省略)により制御される。 The component transfer device 23 is a device that grips and transfers lead components, and includes a head holder 31 and the like that are moved in a horizontal plane by an XY robot 30. The XY robot 30 includes a pair of fixed rails 32a and 32b, a head moving rail 33, and the like. The pair of fixed rails 32a and 32b extend in the X direction above both ends of the first substrate transport device 4 and are arranged in parallel with each other. The head moving rail 33 is arranged so as to extend in the Y direction, and both ends thereof are movably supported along the fixed rails 32a and 32b. The movement of the head movement rail 33 is controlled by a servomotor (all not shown) via a ball screw.

ヘッドホルダ31は、ヘッド移動レール33に沿って移動可能に支持される。ヘッドホルダ31の移動は、ボールねじを介してサーボモータ(いずれも図示省略)により制御される。ヘッドホルダ31には、フィーダ25の部品把持部に供給されるリード部品の認識や基板PBにおける部品装着位置の認識が可能な認識用カメラ34、及びZ軸線回りを回転可能且つZ軸線方向に昇降可能な実装ヘッド35が保持される。この実装ヘッド35には、リード部品を把持する部品把持爪36を着脱可能に保持する把持爪ホルダ37が下方に突設される。 The head holder 31 is movably supported along the head moving rail 33. The movement of the head holder 31 is controlled by a servomotor (all not shown) via a ball screw. The head holder 31 includes a recognition camera 34 capable of recognizing lead parts supplied to the part gripping portion of the feeder 25 and recognizing the component mounting position on the board PB, and a recognition camera 34 that can rotate around the Z axis and move up and down in the Z axis direction. A possible mounting head 35 is held. A gripping claw holder 37 that detachably holds the component gripping claw 36 that grips the lead component is projected downward from the mounting head 35.

部品把持爪36が装着された把持爪ホルダ37は、実装ヘッド35からZ軸線方向に昇降可能に且つZ軸線回りで回転可能に支持される。部品把持爪36が装着された把持爪ホルダ37の昇降は、ボールねじを介してサーボモータ(いずれも図示省略)により制御され、部品把持爪36が装着された把持爪ホルダ37の回転は、ギヤ機構を介してサーボモータ(いずれも図示省略)により制御される。また、部品移載装置23と部品供給装置22の間には部品把持爪36の部品の把持状態の認識が可能な部品認識用カメラ38が取り付けられる。 The gripping claw holder 37 on which the component gripping claw 36 is mounted is supported so as to be able to move up and down in the Z-axis direction from the mounting head 35 and rotatably around the Z-axis line. The elevation of the gripping claw holder 37 on which the component gripping claw 36 is mounted is controlled by a servomotor (all not shown) via a ball screw, and the rotation of the gripping claw holder 37 on which the component gripping claw 36 is mounted is a gear. It is controlled by a servomotor (all not shown) via a mechanism. Further, a component recognition camera 38 capable of recognizing the gripping state of the component of the component gripping claw 36 is attached between the component transfer device 23 and the component supply device 22.

リード切断装置24は、カッタ49等を備える。カッタ49は、基板PBに穿孔されているリード穴に、基板PBの上面側から挿入されているリード部品のリードを所定長に切断する。カッタ49は、基板PBの範囲内においてXYZ軸線方向に移動可能に構成される。 The lead cutting device 24 includes a cutter 49 and the like. The cutter 49 cuts the leads of the lead component inserted from the upper surface side of the substrate PB into the lead holes formed in the substrate PB to a predetermined length. The cutter 49 is configured to be movable in the XYZ axis direction within the range of the substrate PB.

第2基板搬送装置5は、コンベア式の搬送装置であり、一対のレール41a,41bと直列に配置されるコンベア51と、コンベア51を駆動する駆動装置50等とを備える。コンベア51は、一対のローラ51a,51bと、一対のローラ51a,51b間に架け渡されるベルト52等とを備える。一対のローラ51a,51bは、ローラ軸をX軸線方向に向けて所定間隔をあけて互いに平行に配置される。ベルト52は、無限ベルトである。駆動装置50は、一方のローラ51aに取り付けられ、ギヤ機構53と、モータ54と、エンコーダ55(本発明の「検出装置」に相当)等とを備える。 The second substrate transfer device 5 is a conveyor type transfer device, and includes a conveyor 51 arranged in series with a pair of rails 41a and 41b, a drive device 50 for driving the conveyor 51, and the like. The conveyor 51 includes a pair of rollers 51a and 51b and a belt 52 and the like spanned between the pair of rollers 51a and 51b. The pair of rollers 51a and 51b are arranged in parallel with each other at a predetermined interval with the roller axes oriented in the X-axis direction. The belt 52 is an infinite belt. The drive device 50 is attached to one of the rollers 51a and includes a gear mechanism 53, a motor 54, an encoder 55 (corresponding to the “detection device” of the present invention), and the like.

図3に示すように、コンベア51には、レール41a,41bの基板待機位置Pwから搬送される基板PBを第2部品実装機3の基板搬送装置6に乗り移させる前に一旦停止させる基板移動位置Pmが予め設定される。基板移動位置Pmは、コンベア51の搬送方向下流側の端部における第2部品実装機3の基板搬送装置6に近接する位置に設定される。基板移動位置Pmには、基板PBの搬送方向前端が位置決めされる。ここで、基板待機位置Pwに位置決めされる基板PBの搬送方向前端から基板移動位置Pmまでの距離をbと定義する。 As shown in FIG. 3, the conveyor 51 has a substrate movement in which the substrate PB conveyed from the substrate standby positions Pw of the rails 41a and 41b is temporarily stopped before being transferred to the substrate transfer device 6 of the second component mounting machine 3. The position Pm is preset. The board moving position Pm is set at a position close to the board transport device 6 of the second component mounting machine 3 at the end of the conveyor 51 on the downstream side in the transport direction. The front end of the substrate PB in the transport direction is positioned at the substrate moving position Pm. Here, the distance from the front end in the transport direction of the substrate PB positioned at the substrate standby position Pw to the substrate moving position Pm is defined as b.

また、コンベア51のローラ51aの回転中心を通るZ軸線方向の直線Lが通るベルト52上の位置Ps、すなわち第1基板搬送装置4から搬送されてくる基板PBの搬送方向前端がベルト52に接触し、基板PBがベルト52で搬送可能となる基板乗り移り位置Psと、第1基板搬送装置4における基板待機位置Pwとの間の距離は、dとなるように予め設定される。 Further, the position Ps on the belt 52 through which the straight line L in the Z-axis direction passing through the rotation center of the roller 51a of the conveyor 51 passes, that is, the front end of the substrate PB conveyed from the first substrate conveying device 4 contacts the belt 52. The distance between the substrate transfer position Ps at which the substrate PB can be conveyed by the belt 52 and the substrate standby position Pw in the first substrate transfer device 4 is preset to be d.

図1及び図2に戻って、第2部品実装機3は、主にベアチップ部品を基板上に装着する装置である。この第2部品実装機3は、既存の部品実装機と同一であり、概略構成について以下説明する。第2部品実装機3は、基板搬送装置6と、部品供給装置7と、部品移載装置8等とを備える。
基板搬送装置6は、コンベア式の搬送装置であり、基板PBを一対のガイドレール61a,61bによりY方向に案内しつつ一対のコンベアベルト62a,62bにより部品実装位置まで搬送し、クランプ装置63によりコンベアベルト62a,62bから押し上げてクランプし位置決め固定する。
Returning to FIGS. 1 and 2, the second component mounting machine 3 is a device that mainly mounts bare chip components on a substrate. The second component mounting machine 3 is the same as the existing component mounting machine, and a schematic configuration will be described below. The second component mounting machine 3 includes a board transfer device 6, a component supply device 7, a component transfer device 8, and the like.
The board transfer device 6 is a conveyor type transfer device, in which the substrate PB is guided in the Y direction by a pair of guide rails 61a and 61b and conveyed to a component mounting position by a pair of conveyor belts 62a and 62b, and is conveyed by a clamp device 63. It is pushed up from the conveyor belts 62a and 62b, clamped, and positioned and fixed.

部品供給装置7は、複数のベアチップ部品を収容したキャリアテープが巻回されたリールRを後部に搭載可能な複数のカセット式のフィーダ71を備え、リールRからキャリアテープを所定ピッチで引き出し、ベアチップ部品をフィーダ71の前部に順次送り込む。
部品移載装置8は、ベアチップ部品を吸着して移送する装置であり、フィーダ71の前部に送り込まれるベアチップ部品を、ヘッドホルダ81に取り付けられる部品吸着ノズル82により吸着しヘッド移動レール83a,83b,83cに沿って部品実装位置に位置決めされた基板PBまで移送し、部品吸着ノズル82により基板PB上の部品装着位置に装着する。
The component supply device 7 includes a plurality of cassette-type feeders 71 capable of mounting a reel R on which a carrier tape containing a plurality of bare chip components is wound at the rear, pulls out the carrier tape from the reel R at a predetermined pitch, and bare chips. The parts are sequentially fed to the front part of the feeder 71.
The component transfer device 8 is a device for sucking and transferring bare chip parts, and the bare chip parts sent to the front part of the feeder 71 are sucked by the parts suction nozzle 82 attached to the head holder 81, and the head moving rails 83a and 83b are sucked. , 83c, is transferred to the board PB positioned at the component mounting position, and mounted at the component mounting position on the board PB by the component suction nozzle 82.

(2.基板搬送装置の動作)
次に、本実施形態の基板搬送装置を構成する第1基板搬送装置4及び第2基板搬送装置5の第1の動作を部品実装ライン1のホストコンピュータが制御する場合について、図4のフローチャート及び図5A−図5Eの動作状態図を参照して説明する。ここで、図5Aに示すように、第1基板搬送装置4に搬入される基板PBは、移動部材42でレール41a,41b上の基板作業位置Prに位置決めされ、部品移載装置23でリード部品が部品供給装置22から移送されて装着され、リード切断装置24で当該リード部品のリードが切断された後、移動部材42でレール41a,41b上の基板待機位置Pwに移動されて位置決めされているものとする。また、移動部材42は、部材待機位置Pbに位置決めされているものとする。また、基板PBの搬送方向の長さwは既知とする。
(2. Operation of board transfer device)
Next, the flowchart of FIG. 4 and the case where the host computer of the component mounting line 1 controls the first operation of the first board transfer device 4 and the second board transfer device 5 constituting the board transfer device of the present embodiment. This will be described with reference to the operating state diagram of FIGS. 5A-5E. Here, as shown in FIG. 5A, the substrate PB carried into the first substrate transport device 4 is positioned at the substrate work position Pr on the rails 41a and 41b by the moving member 42, and is a lead component by the component transfer device 23. Is transferred from the component supply device 22 and mounted, and after the lead of the lead component is cut by the lead cutting device 24, the lead component 42 is moved to the substrate standby position Pw on the rails 41a and 41b and positioned. It shall be. Further, it is assumed that the moving member 42 is positioned at the member standby position Pb. Further, the length w of the substrate PB in the transport direction is known.

まず、ホストコンピュータは、移動部材42による基板Pbの搬送速度をコンベア51による基板Pbの搬送速度よりも許容範囲内で速くなるように設定する(図4のステップS1)。この搬送速度の許容範囲とは、基板Pbがレール41a,41bからコンベア51に乗り移るときに基板Pbに滑りや摩耗等が発生しない範囲であり、具体的には移動部材42による基板Pbの搬送速度は、コンベア51による基板Pbの搬送速度の数パーセントの範囲内で速くなるように設定する。 First, the host computer sets the transfer speed of the substrate Pb by the moving member 42 to be faster than the transfer speed of the substrate Pb by the conveyor 51 within an allowable range (step S1 in FIG. 4). The permissible range of the transfer speed is a range in which the substrate Pb does not slip or wear when the substrate Pb moves from the rails 41a and 41b to the conveyor 51. Specifically, the transfer speed of the substrate Pb by the moving member 42. Is set to be high within a few percent of the transfer speed of the substrate Pb by the conveyor 51.

次に、ホストコンピュータは、移動部材42の移動を開始し(図4のステップS2)、コンベア51の駆動を開始する(図4のステップS3)。両者の開始タイミングは、同時でもよく、若干ずれていてもよい。そして、図5Bに示すように、移動部材42が、部材待機位置Pbから距離a移動すると、基板待機位置Pwに位置決めされている基板PBの搬送方向後端に当接する。これにより、基板PBは、移動部材42に押されてレール41a,41b上で搬送される。 Next, the host computer starts moving the moving member 42 (step S2 in FIG. 4) and starts driving the conveyor 51 (step S3 in FIG. 4). The start timings of the two may be simultaneous or slightly different. Then, as shown in FIG. 5B, when the moving member 42 moves a distance a from the member standby position Pb, it comes into contact with the rear end of the substrate PB positioned at the substrate standby position Pw in the transport direction. As a result, the substrate PB is pushed by the moving member 42 and conveyed on the rails 41a and 41b.

次に、ホストコンピュータは、基板PBが当該基板PBの搬送方向前端から所定距離分だけレール41a,41bからコンベア51に乗り移ったか否かを判断する(図4のステップS4)。この所定距離とは、基板PBが移動部材42を介さずにコンベア51のみで搬送可能となる距離であり、本例では基板PBの搬送方向の長さwの1/2に設定される。そして、ホストコンピュータは、移動部材42の部材待機位置Pbからの移動距離、基板乗り移り位置Psと基板待機位置Pwとの間の距離d及び基板PBの搬送方向の長さwに基づいて、基板PBの搬送方向前端が基板乗り移り位置Psからw/2だけ搬送されたか否かを判断する。 Next, the host computer determines whether or not the substrate PB has moved from the rails 41a and 41b to the conveyor 51 by a predetermined distance from the front end of the substrate PB in the transport direction (step S4 in FIG. 4). This predetermined distance is a distance at which the substrate PB can be conveyed only by the conveyor 51 without passing through the moving member 42, and is set to 1/2 of the length w of the substrate PB in the conveying direction in this example. Then, the host computer determines the substrate PB based on the moving distance of the moving member 42 from the member standby position Pb, the distance d between the substrate transfer position Ps and the substrate standby position Pw, and the length w of the substrate PB in the transport direction. It is determined whether or not the front end in the transport direction of is transported by w / 2 from the substrate transfer position Ps.

ホストコンピュータは、図5Cに示すように、基板PBが当該基板PBの搬送方向前端から所定距離(w/2)分だけレール41a,41bからコンベア51に乗り移ったと判断したら(図4のステップS4のYes)、図5Dに示すように、移動部材42を基板PBから離間させて部材待機位置Pbに戻す(図4のステップS5)。そして、ホストコンピュータは、基板PBが当該基板PBの搬送方向前端から所定距離(w/2)分だけレール41a,41bからコンベア51に乗り移った時点でエンコーダ55で基板移動位置Pmに達したか否かを判断し(図4のステップS6)、図5Eに示すように、基板PBが基板移動位置Pmに達したと判断したら(図4のステップS6のYes)、コンベア51の駆動を停止する(図4のステップS7)。 When the host computer determines that the board PB has moved from the rails 41a and 41b to the conveyor 51 by a predetermined distance (w / 2) from the front end of the board PB in the transport direction as shown in FIG. 5C (in step S4 of FIG. 4). Yes), as shown in FIG. 5D, the moving member 42 is separated from the substrate PB and returned to the member standby position Pb (step S5 in FIG. 4). Then, the host computer determines whether or not the substrate PB has reached the substrate moving position Pm by the encoder 55 when the substrate PB is transferred from the rails 41a and 41b to the conveyor 51 by a predetermined distance (w / 2) from the front end of the substrate PB in the transport direction. (Step S6 in FIG. 4), and as shown in FIG. 5E, when it is determined that the substrate PB has reached the substrate moving position Pm (Yes in step S6 in FIG. 4), the drive of the conveyor 51 is stopped (Yes). Step S7 in FIG. 4).

次に、本実施形態の基板搬送装置を構成する第1基板搬送装置4及び第2基板搬送装置5の第2の動作を部品実装ライン1のホストコンピュータが制御する場合について、図6のフローチャート及び図7A−図7Dの動作状態図を参照して説明する。ここで、図7Aに示すように、第1基板搬送装置4に搬入される基板PBは、移動部材42でレール41a,41b上の基板作業位置Prに位置決めされ、部品移載装置23でリード部品が部品供給装置22から移送されて装着され、リード切断装置24で当該リード部品のリードが切断された後、移動部材42でレール41a,41b上の基板待機位置Pwに移動されて位置決めされているものとする。また、移動部材42は、部材待機位置Pbに位置決めされているものとする。また、基板PBの搬送方向の長さwは既知とする。 Next, the flowchart of FIG. 6 and the case where the host computer of the component mounting line 1 controls the second operation of the first board transfer device 4 and the second board transfer device 5 constituting the board transfer device of the present embodiment. This will be described with reference to the operating state diagram of FIGS. 7A-7D. Here, as shown in FIG. 7A, the substrate PB carried into the first substrate transport device 4 is positioned at the substrate work position Pr on the rails 41a and 41b by the moving member 42, and is a lead component by the component transfer device 23. Is transferred from the component supply device 22 and mounted, and after the lead of the lead component is cut by the lead cutting device 24, the lead component 42 is moved to the substrate standby position Pw on the rails 41a and 41b and positioned. It shall be. Further, it is assumed that the moving member 42 is positioned at the member standby position Pb. Further, the length w of the substrate PB in the transport direction is known.

まず、部品実装ライン1のホストコンピュータは、コンベア51による基板PBの搬送距離を、基板待機位置Pwに位置する基板PBの搬送方向後端から部材待機位置Pbまでの距離a、及び基板待機位置Pwに位置する基板PBの搬送方向前端から基板移動位置Pmに位置する基板PBの搬送方向前端までの距離bの和a+bとなるように設定する。さらに、移動部材42による基板Pbの搬送速度と、コンベア51による基板Pbの搬送速度とを同一もしくは略同一の搬送速度となるように設定する(図6のステップS11)。なお、略同一の搬送速度とは、基板Pbがレール41a,41bからコンベア51に乗り移るときに基板Pbに滑りや摩耗等が発生しない範囲で誤差があってもよいという意味である。 First, the host computer of the component mounting line 1 sets the transport distance of the substrate PB by the conveyor 51 to the distance a from the rear end of the substrate PB located at the substrate standby position Pw in the transport direction to the member standby position Pb, and the substrate standby position Pw. The sum of the distances b from the front end of the substrate PB located in the transport direction to the front end of the substrate PB located at the substrate movement position Pm in the transport direction is set to be a + b. Further, the transfer speed of the substrate Pb by the moving member 42 and the transfer speed of the substrate Pb by the conveyor 51 are set to be the same or substantially the same transfer speed (step S11 in FIG. 6). Note that substantially the same transfer speed means that there may be an error within a range in which the substrate Pb does not slip or wear when the substrate Pb is transferred from the rails 41a and 41b to the conveyor 51.

次に、ホストコンピュータは、移動部材42の移動と、コンベア51の駆動とを略同一に開始する(図6のステップS12)。そして、図7Bに示すように、移動部材42が、部材待機位置Pbから距離a移動すると、基板待機位置Pwに位置決めされている基板PBの搬送方向後端に当接する。これにより、基板PBは、移動部材42に押されてレール41a,41b上で搬送される。 Next, the host computer starts moving the moving member 42 and driving the conveyor 51 substantially in the same manner (step S12 in FIG. 6). Then, as shown in FIG. 7B, when the moving member 42 moves a distance a from the member standby position Pb, it comes into contact with the rear end of the substrate PB positioned at the substrate standby position Pw in the transport direction. As a result, the substrate PB is pushed by the moving member 42 and conveyed on the rails 41a and 41b.

次に、ホストコンピュータは、図4のステップS4で説明したように、基板PBが当該基板PBの搬送方向前端から所定距離(w/2)分だけレール41a,41bからコンベア51に乗り移ったか否かを判断する(図6のステップS13)。ホストコンピュータは、図7Cに示すように、基板PBが当該基板PBの搬送方向前端から所定距離(w/2)分だけレール41a,41bからコンベア51に乗り移ったと判断したら(図6のステップS13のYes)、移動部材42を基板PBから離間させて部材待機位置Pbに戻す(図6のステップS14)。 Next, as described in step S4 of FIG. 4, the host computer determines whether or not the substrate PB has moved from the rails 41a and 41b to the conveyor 51 by a predetermined distance (w / 2) from the front end of the substrate PB in the transport direction. (Step S13 in FIG. 6). When the host computer determines that the substrate PB has transferred from the rails 41a and 41b to the conveyor 51 by a predetermined distance (w / 2) from the front end of the substrate PB in the transport direction as shown in FIG. 7C (in step S13 of FIG. 6). Yes), the moving member 42 is separated from the substrate PB and returned to the member standby position Pb (step S14 in FIG. 6).

そして、ホストコンピュータは、エンコーダ55でコンベア51の駆動開始からの駆動距離が上記距離の和a+bに達したか否かを判断し(図6のステップS15)、図7Dに示すように、コンベア51の駆動開始からの駆動距離が上記距離の和a+bに達した判断したら(図6のステップS15のYes)、基板PBが基板移動位置Pmに達したと判断してコンベア51の駆動を停止する(図6のステップS16)。 Then, the host computer determines with the encoder 55 whether or not the drive distance from the start of driving the conveyor 51 has reached the sum of the distances a + b (step S15 in FIG. 6), and as shown in FIG. 7D, the conveyor 51 When it is determined that the driving distance from the start of driving has reached the sum of the above distances a + b (Yes in step S15 in FIG. 6), it is determined that the substrate PB has reached the substrate moving position Pm, and the driving of the conveyor 51 is stopped (Yes). Step S16 in FIG.

(効果)
以上説明したように、本実施形態の第1、第2基板搬送装置4,5によれば、並べて平行に配置される一対のレール41a,41bと、一対のレール41a,41b上に載置される基板PBに当接・離間可能でレール41a,41bに沿って移動可能な移動部材42と、レール41a,41bにおける部材待機位置Pbに位置する移動部材42を基板PBに当接させて移動させ、当該移動させた後に移動部材42を基板PBから離間させて部材待機位置Pbへ移動させる移動装置43と、一対のレール41a,41bと直列に配置されるコンベア51と、コンベア51を駆動する駆動装置50と、を備える。
(effect)
As described above, according to the first and second substrate transfer devices 4 and 5 of the present embodiment, the pair of rails 41a and 41b arranged side by side and arranged in parallel and the pair of rails 41a and 41b are mounted on the pair of rails 41a and 41b. The moving member 42 that can abut and separate from the substrate PB and can move along the rails 41a and 41b and the moving member 42 located at the member standby position Pb on the rails 41a and 41b are brought into contact with the substrate PB and moved. After the movement, the moving member 42 is separated from the substrate PB and moved to the member standby position Pb, the conveyor 51 arranged in series with the pair of rails 41a and 41b, and the drive for driving the conveyor 51. The device 50 is provided.

そして、移動装置43及び駆動装置50を駆動し、基板PBの搬送方向前端がレール41a,41bにおける基板待機位置Pwに位置する基板PBを移動部材42で搬送し、当該基板PBをレール41a,41bからコンベア51に乗り移させ、当該乗り移させた基板PBをコンベア51で搬送し、基板PBの搬送方向前端をコンベア51における基板移動位置Pmに位置決めする。このように、レール41a,41bにおいては基板待機位置Pwを予め設定し、コンベア51においては基板移動位置Pmを予め設定しているので、両位置Pw,Pm等の関係に基づいて、基板PBを基板移動位置Pmに精度よく位置決めできる。 Then, the moving device 43 and the driving device 50 are driven, the substrate PB whose front end in the conveying direction of the substrate PB is located at the substrate standby position Pw on the rails 41a and 41b is conveyed by the moving member 42, and the substrate PB is conveyed by the rails 41a and 41b. To the conveyor 51, the transferred substrate PB is conveyed by the conveyor 51, and the front end of the substrate PB in the conveying direction is positioned at the substrate moving position Pm on the conveyor 51. In this way, since the substrate standby position Pw is preset in the rails 41a and 41b and the substrate moving position Pm is preset in the conveyor 51, the substrate PB is set based on the relationship between the two positions Pw, Pm and the like. It can be accurately positioned at the board moving position Pm.

また、第1、第2基板搬送装置4,5は、移動部材42によるPB基板の搬送速度をコンベア51による基板PBの搬送速度よりも速くなるように設定し、移動部材42で搬送される基板PBが当該基板PBの搬送方向前端から所定距離分w/2だけレール41a,41bからコンベア51に乗り移ったとき、移動部材42を基板PBから離間させ、コンベア51で基板PBの搬送方向前端が基板移動位置Pmに位置するまで基板PBを移動させる。これによれば、上述の位置決め精度の向上に加え、レール41a,41bからコンベア51への基板PBの乗り移り時間が短縮されるので、第1、第2基板搬送装置4,5における搬送タクトタイムを短縮できる。 Further, the first and second substrate transfer devices 4 and 5 are set so that the transfer speed of the PB substrate by the moving member 42 is faster than the transfer speed of the substrate PB by the conveyor 51, and the substrate is conveyed by the moving member 42. When the PB is transferred from the rails 41a and 41b to the conveyor 51 by a predetermined distance w / 2 from the front end of the substrate PB in the transport direction, the moving member 42 is separated from the substrate PB, and the front end of the substrate PB in the transport direction is the substrate on the conveyor 51. The substrate PB is moved until it is located at the moving position Pm. According to this, in addition to the above-mentioned improvement in positioning accuracy, the transfer time of the substrate PB from the rails 41a and 41b to the conveyor 51 is shortened, so that the transfer tact time in the first and second substrate transfer devices 4 and 5 can be reduced. Can be shortened.

また、第1、第2基板搬送装置4,5は、コンベア51による基板PBの搬送距離を、基板待機位置Pwに位置する基板PBの搬送方向後端から部材待機位置Pbまでの距離a、及び基板待機位置Pwに位置する基板PBの搬送方向前端から基板移動位置Pmに位置する基板PBの搬送方向前端までの距離の和bとなるように設定するとともに、移動部材42による基板PBの搬送速度とコンベア51による基板PBの搬送速度とを略同一に設定し、移動部材42及びコンベア51で基板PBの搬送方向前端が基板待機位置Pwから基板移動位置Pmに位置するまで基板PBを移動させる。これによれば、上述の搬送タクトタイムの短縮に加え、レール41a,41bからコンベア51への基板PBの乗り移り時のコンベア51に対する基板PBの滑りが抑制されるので、基板PBを基板移動位置Pmにさらに精度よく位置決めできる。 Further, the first and second substrate transfer devices 4 and 5 set the transfer distance of the substrate PB by the conveyor 51 to the distance a from the rear end of the substrate PB located at the substrate standby position Pw in the transfer direction to the member standby position Pb. It is set to be the sum of the distances b from the front end of the substrate PB located at the substrate standby position Pw in the transport direction to the front end of the substrate PB located at the substrate movement position Pm in the transport direction, and the transport speed of the substrate PB by the moving member 42. And the transfer speed of the substrate PB by the conveyor 51 are set to be substantially the same, and the substrate PB is moved by the moving member 42 and the conveyor 51 until the front end of the substrate PB in the transfer direction is located from the substrate standby position Pw to the substrate moving position Pm. According to this, in addition to the above-mentioned shortening of the transport tact time, the slip of the substrate PB with respect to the conveyor 51 when the substrate PB is transferred from the rails 41a and 41b to the conveyor 51 is suppressed, so that the substrate PB is moved to the substrate moving position Pm. Can be positioned more accurately.

また、駆動装置50は、コンベア51による基板PBの搬送距離を検出するエンコーダ55を備えるので、基板PBの搬送位置の割り出しを容易に行うことができる。
また、レール41a,41bは、基板待機位置Pwよりも搬送方向上流側の基板作業位置Prに位置決めされる基板PBに対し、一対のレール41a,41b間の下方から所定の作業を行う作業装置24に設けられ、基板待機位置Pwは、レール41a,41bにおける搬送方向下流側の端部のコンベア51に近接する位置に設定される。これにより、基板作業位置Prでの作業が完了した現基板PBは、基板待機位置Pwに搬送されるので、次基板PBの作業に短時間で取り掛かることができ、作業タクトタイムを短縮できる。そして、基板待機位置Pwに位置決めされる基板PBは、短時間でコンベア51に乗り移ることができるので、搬送タクトタイムを短縮できる。
Further, since the drive device 50 includes an encoder 55 that detects the transfer distance of the substrate PB by the conveyor 51, the transfer position of the substrate PB can be easily determined.
Further, the rails 41a and 41b are working devices 24 that perform predetermined work from below between the pair of rails 41a and 41b with respect to the substrate PB positioned at the substrate working position Pr on the upstream side in the transport direction from the substrate standby position Pw. The substrate standby position Pw is set to a position close to the conveyor 51 at the end of the rails 41a and 41b on the downstream side in the transport direction. As a result, the current board PB that has completed the work at the board work position Pr is conveyed to the board standby position Pw, so that the work of the next board PB can be started in a short time, and the work tact time can be shortened. Then, the substrate PB positioned at the substrate standby position Pw can transfer to the conveyor 51 in a short time, so that the transport tact time can be shortened.

なお、上述の実施形態においては、第2基板搬送装置5は、第1部品実装機2とは独立して設けられているものの、第1部品実装機2内に設けられていてもよい。つまり第1基板搬送装置4と第2基板搬送装置5とが並んだ状態で第1部品実装機2内に設けられていてもよい。
また、第2基板搬送装置5のコンベア51は、一対のローラ51a,51b及びベルト52で構成されるが、ローラ軸線を平行に並べた複数のローラで構成してもよい。
また、移動部材42は、基板PBの搬送方向後端に当接して基板PBを搬送する構成としたが、基板PBの側面もしくは前側上面に突出部を設け、その突出部に当接して基板PBを搬送する構成としてもよい。その場合、突出部の設ける位置に応じて移動部材42の移動距離を求めて基板PBを搬送する。
In the above-described embodiment, although the second substrate transfer device 5 is provided independently of the first component mounting machine 2, it may be provided in the first component mounting machine 2. That is, the first board transfer device 4 and the second board transfer device 5 may be provided in the first component mounting machine 2 in a state of being arranged side by side.
The conveyor 51 of the second substrate transfer device 5 is composed of a pair of rollers 51a and 51b and a belt 52, but may be composed of a plurality of rollers in which the roller axes are arranged in parallel.
Further, the moving member 42 is configured to abut on the rear end of the substrate PB in the transport direction to transport the substrate PB, but a projecting portion is provided on the side surface or the front upper surface of the substrate PB and abuts on the protruding portion of the substrate PB. May be configured to convey. In that case, the substrate PB is conveyed by obtaining the moving distance of the moving member 42 according to the position where the protruding portion is provided.

また、第1基板搬送装置4及び第2基板搬送装置5の第1、第2の動作においては、基板PBが当該基板PBの搬送方向前端から基板PBの搬送方向の長さwの1/2だけレール41a,41bからコンベア51に乗り移ったとき、移動部材42が基板PBから離間するように設定したが、これに限定されるものではなく、基板PBが移動部材42を介さずにコンベア51のみで搬送可能となる距離であれば任意の距離でよい。また、移動部材42が基板PBから離間するのではなく、移動停止し、もしくは移動速度を徐々に減速するようにしてもよい。 Further, in the first and second operations of the first substrate transfer device 4 and the second substrate transfer device 5, the substrate PB is 1/2 of the length w in the transfer direction of the substrate PB from the front end in the transfer direction of the substrate PB. Only when the moving member 42 is transferred from the rails 41a and 41b to the conveyor 51, the moving member 42 is set to be separated from the substrate PB, but the present invention is not limited to this, and the substrate PB does not go through the moving member 42 but only the conveyor 51. Any distance may be used as long as it can be transported by. Further, the moving member 42 may be stopped moving or the moving speed may be gradually reduced instead of being separated from the substrate PB.

また、コンベア51による基板PBの搬送距離は、エンコーダ55の検出値で演算するようにしたが、コンベア51の上方に光検出器を設置して基板PBの搬送方向前端を検出して演算するようにしてもよい。
また、作業装置としては、リード切断装置24を例に説明したが、これに限定されるものではなく、例えば一対のレール41a,41b間の下方から基板PBを持ち上げて基板PB表面にはんだ印刷する印刷装置等でも同様に適用可能である。
Further, the transfer distance of the substrate PB by the conveyor 51 is calculated by the detection value of the encoder 55, but an optical detector is installed above the conveyor 51 to detect and calculate the front end of the substrate PB in the transfer direction. It may be.
Further, the lead cutting device 24 has been described as an example of the working device, but the present invention is not limited to this. For example, the substrate PB is lifted from below between the pair of rails 41a and 41b and solder-printed on the surface of the substrate PB. The same applies to printing devices and the like.

1…部品実装ライン、2…第1部品実装機、3…第2部品実装機、4…第1基板搬送装置、5…第2基板搬送装置、22…部品供給装置、23…部品移載装置、24…リード切断装置、41a,41b…レール、42…移動部材、43…部材移動装置、49…カッタ、50…駆動装置、51…コンベア、51a,51b…ローラ、52…ベルト、55…エンコーダ、PB…基板 1 ... Parts mounting line, 2 ... 1st component mounting machine, 3 ... 2nd component mounting machine, 4 ... 1st board transfer device, 5 ... 2nd board transfer device, 22 ... Parts supply device, 23 ... Parts transfer device , 24 ... Lead cutting device, 41a, 41b ... Rail, 42 ... Moving member, 43 ... Member moving device, 49 ... Cutter, 50 ... Drive device, 51 ... Conveyor, 51a, 51b ... Roller, 52 ... Belt, 55 ... Encoder , PB ... Substrate

Claims (3)

基板を搬送する基板搬送装置であって、
並べて平行に配置される一対のレールと、
前記一対のレール上に載置される前記基板に当接・離間可能で前記レールに沿って移動可能な移動部材と、
前記レールにおける部材待機位置に位置する前記移動部材を前記基板に当接させて移動させ、当該移動させた後に前記移動部材を前記基板から離間させて前記部材待機位置へ移動させる移動装置と、
前記一対のレールと直列に配置されるコンベアと、
前記コンベアを駆動する駆動装置と、を備え、
前記移動装置及び前記駆動装置を駆動し、前記基板の搬送方向前端が前記レールにおける基板待機位置に位置する前記基板の全長のうちの一部であり前記コンベアのみを駆動させることで前記基板の搬送が可能である当該基板の搬送方向前端から所定距離分だけを、前記コンベアによる前記基板の搬送速度よりも前記基板の搬送速度が速くなるように設定した前記移動部材の駆動によって、前記レールから前記駆動装置で駆動させた前記コンベアに乗り移りさせ、当該乗り移りさせた前記基板を前記コンベアのみで搬送し、前記基板の搬送方向前端を前記コンベアにおける基板移動位置に位置決めする、基板搬送装置。
It is a substrate transfer device that conveys a substrate.
A pair of rails arranged side by side in parallel,
A moving member that can be brought into contact with and separated from the substrate mounted on the pair of rails and can move along the rails.
A moving device that moves the moving member located at the member standby position on the rail in contact with the substrate, moves the moving member, and then separates the moving member from the substrate and moves the moving member to the member standby position.
A conveyor arranged in series with the pair of rails,
A drive device for driving the conveyor is provided.
The mobile device and driving said drive device, the conveying direction front end of the substrate of the substrate at a portion at and be driven only the conveyor of the total length of the base plate located in the substrate standby position in the rail From the rail by driving the moving member set so that the transport speed of the substrate is set to be faster than the transport speed of the substrate by the conveyor for a predetermined distance from the front end in the transport direction of the substrate that can be transported. A board transfer device that transfers to the conveyor driven by the drive device, conveys the transferred substrate only by the conveyor, and positions the front end of the substrate in the transfer direction at a substrate moving position on the conveyor.
前記駆動装置は、前記コンベアによる前記基板の搬送距離を検出する検出装置を備える、請求項1に記載の基板搬送装置。 The substrate transfer device according to claim 1, wherein the drive device includes a detection device that detects a transfer distance of the substrate by the conveyor. 前記レールは、前記基板待機位置よりも搬送方向上流側の基板作業位置に位置決めされる前記基板に対し、前記一対のレール間の下方から所定の作業を行う作業装置に設けられ、
前記基板待機位置は、前記レールにおける搬送方向下流側の端部の前記コンベアに近接する位置に設定される、請求項1又は2に記載の基板搬送装置。
The rail is provided in a work device that performs a predetermined work from below between the pair of rails with respect to the board positioned at a board work position on the upstream side in the transport direction from the board standby position.
The substrate transfer device according to claim 1 or 2 , wherein the substrate standby position is set at a position close to the conveyor at the end of the rail on the downstream side in the transfer direction.
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