JP3761065B2 - Build-up resin lamination method for printed wiring boards - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of laminating each printed wiring board constituting a buildup multilayer wiring board with a buildup resin when manufacturing the buildup multilayer wiring board.
[0002]
[Prior art]
The build-up multilayer printed wiring board is formed by laminating a number of printed wiring boards each provided with a wiring pattern by inner layer processing in an insulated state. As a method for manufacturing such a build-up multilayer printed wiring board, build-up resin films are laminated on each printed wiring board and the build-up resin is vacuum-laminated on each printed wiring board. The printed wiring boards laminated with the resin film are laminated to each other.
[0003]
When laminating a build-up resin on a printed wiring board, a printed wiring board having a wiring pattern provided by inner layer processing is prepared, and a build-up resin film is laminated on each surface of the printed wiring board, Is done. The build-up resin film has a thickness of about 50 μm to 200 μm and is configured to have electrical insulation.
[0004]
Thus, when a laminate in which build-up resin films are laminated on each surface of the printed wiring board is obtained, the laminate is sandwiched between carrier films cut to a predetermined length, and the carrier film At the same time, it is supplied into a laminator that vacuum laminates the build-up resin film.
[0005]
The laminated body accommodated in the laminator is pressurized while being heated to about 80 to 100 ° C. by a heater. Thereby, each buildup resin film is vacuum laminated on each surface of the printed wiring board.
[0006]
In this case, the carrier film sandwiching the laminate is pressed against the surface of each build-up resin film in the laminate by pressurizing the inside of the work storage chamber.
[0007]
If it will be in such a state, a laminated body will be taken out from a laminator with a carrier film, and a carrier film will peel from a laminated body. Thereby, the laminated body by which each surface of the printed wiring board was vacuum-laminated by the buildup resin film is obtained. And it is set as a buildup multilayer printed wiring board using the obtained laminated body.
[0008]
[Problems to be solved by the invention]
When the build-up resin film is vacuum-laminated on each surface of the printed wiring board, the build-up resin film is heated to a temperature of about 80 to 100 ° C. to become a molten state and adheres firmly to the printed wiring board. Has been. In this case, the carrier film is also strongly pressed against the build-up resin film, and there is a problem that it is not easy to peel the carrier film from the build-up resin film in a subsequent process.
[0009]
Therefore, as shown in FIG. 8, when the carrier film 32 is peeled from the laminate 31 in which the build-up resin film is vacuum-laminated on each surface of the printed wiring board, one end of the laminate 31 is removed. The respective corner portions of the carrier film 31 positioned on the pair of corner portions are simultaneously peeled from the laminated body 31, and the carrier film 32 is sequentially peeled along the longitudinal direction of the laminated body 31.
[0010]
However, since the carrier film 32 is in close contact with the build-up resin film that has been heated and melted, each corner portion at each end of the carrier film 32 is simultaneously subjected to a strong force. Despite being peeled off, the carrier film 32 may not be peeled off reliably. As a result, it takes a long time to peel off the carrier film 32, and the laminate work of the build-up resin film on the printed wiring board cannot be performed efficiently.
[0011]
The carrier film 32 peeled from the laminate 31 can be used again for transporting the laminate 31. However, when the carrier film 32 is peeled from the laminate 31, a part of the build-up resin film may adhere to each side edge of the carrier film 32 as resin waste. Thus, when resin waste is attached to each side edge of the carrier film 32, it is necessary to remove the resin waste in order to reuse the carrier film 32, but it is heated and melted. There is a problem that it is not easy to remove the resin waste that is formed from the carrier film 32. If it takes a long time to remove the resin waste from the carrier film 32, the overall work efficiency will be reduced.
[0012]
The present invention solves such problems, and its purpose is to efficiently carry out peeling of a carrier film, removal of resin debris from a carrier film, etc. An object of the present invention is to provide a build-up resin laminating method for a printed wiring board that does not cause a decrease in the laminating efficiency of the resin film.
[0013]
[Means for Solving the Problems]
The printed wiring board build-up resin laminating method of the present invention is formed by laminating a build-up resin film on a printed wiring board provided with an inner layer circuit pattern to form a laminated body, and sandwiching and transporting the laminated body with a carrier film. By laminating the buildup resin film on the printed wiring board by applying pressure while heating with the carrier film, and forcing the laminate with the buildup resin film laminated on the printed wiring board to the room temperature together with the carrier film A cooling step for cooling the substrate, a peeling step for peeling the carrier film from the laminate, and a resin waste removing step for removing resin waste from the peeled carrier film.
[0014]
In the peeling step, the corner portion of the carrier film laminated on one corner portion of the laminate is peeled off, and the carrier film is sequentially peeled along the diagonal direction of the laminate.
[0015]
In the cooling step, the laminate in which the build-up resin film is laminated on the printed wiring board is cooled by the cooling plate.
[0016]
In the resin waste removal step, the carrier film is passed between a pair of resin waste removal bodies arranged so that the side edges of the carrier film are in contact with each other, thereby being attached to the side edges of the carrier film. Resin waste is removed.
[0017]
In the resin waste removing step, the resin waste is removed by a solution that dissolves the resin waste.
[0018]
The carrier film peeled from the laminate in the peeling step is reused.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The printed wiring board build-up resin laminating method of the present invention produces a build-up multilayer printed wiring board formed by laminating a large number of printed wiring boards each provided with a wiring pattern by inner layer processing in an insulated state. In doing so, a build-up resin film provided between the printed wiring boards stacked on each other is carried out for vacuum lamination on the printed wiring boards. Each printed wiring board laminated with a build-up resin film has a through hole formed in a predetermined part by photoresist, drill, etc. to electrically connect each wiring pattern when they are laminated to each other Then, copper plating is provided on the surface of the build-up resin film and the inner peripheral surface of the through hole. And after forming the wiring pattern of an outer layer by copper plating, it is set as a buildup multilayer wiring board by putting each printed wiring board into a lamination state.
[0020]
In the buildup resin laminating method of the present invention, as shown in FIG. 1, a carrier film 11 is prepared for conveying a printed wiring board provided with a wiring pattern by inner layer processing. The carrier film 11 is made of, for example, polyester, is fed out from a state wound in a roll shape, and is cut into an appropriate length by an auto cutter.
[0021]
On the other hand, as shown in FIG. 2, a printed wiring board 12a provided with a wiring pattern by inner layer processing is prepared, and a buildup resin film 12b is laminated on each surface of the printed wiring board 12a to form a laminated body 12. The The build-up resin film 12b has a thickness of about 50 μm to 200 μm, and is configured to have electrical insulation with an epoxy resin or the like as a main component. Such a build-up resin film 12b is usually marketed in a state wound in a roll shape. The buildup resin film 12b may be laminated only on one surface of the printed wiring board 12a.
[0022]
Thus, when the laminated body 12 by which the buildup resin film 12b was each laminated | stacked on each surface of the printed wiring board 12a is obtained, this laminated body 12 will be in carrier film 11 cut | disconnected by predetermined length. In a state of being sandwiched, the carrier film 11 and the laminator 20 shown in FIG. In addition, in FIG. 3, each carrier film 11 which pinches | interposes the laminated body 12 is abbreviate | omitting illustration.
[0023]
The laminator 20 has a rectangular laminating chamber 21 whose cross section is elongated in the horizontal direction inside, and the laminating chamber 21 includes an upper work piece by a horizontal partition wall 22 made of a rubber sheet. Divided into a storage chamber 21a and a lower air chamber 21b. The upper work accommodation chamber 21a has a larger vertical dimension than the lower air chamber 21b, and the laminate 12 is accommodated together with the carrier film 11 in the work accommodation chamber 21a. Air is introduced into the lower air chamber 21b and pressurized. The insides of the work chamber 21a and the air chamber 21b are configured to be kept airtight, and the inside of the workpiece chamber 21a is heated to about 80 to 100 ° C. by a heater. It has become.
[0024]
When the laminate 12 is accommodated together with the carrier film 11 in the workpiece accommodating chamber 21a of the laminating chamber 21, the workpiece accommodating chamber 21a and the air chamber 21b are held in an airtight state, and the workpiece accommodating chamber 21a is heated by a heater. It is heated to about 80-100 ° C. When the inside of the work storage chamber 21a is heated, the buildup resin film 12b is in a molten state.
[0025]
In such a state, air is introduced into the air chamber 21b. As a result, as shown in FIG. 4, the air chamber 21b is pressurized and the partition 22 made of a rubber sheet that separates the air chamber 21b and the work storage chamber 21a is expanded so as to enter the work storage chamber 21a. As a result, the volume in the workpiece storage chamber 21a decreases, and the internal pressure of the workpiece storage chamber 21a increases. Thereby, each buildup resin film 12b laminated | stacked on the printed wiring board 12a is pressurized and each crimped | bonded to each surface of the printed wiring board 12a. Since each buildup resin film 12b is heated and in a molten state, each buildup resin film 12b is laminated in a vacuum state on each surface of the printed wiring board 12a.
[0026]
In this case, the carrier film 11 with the laminated body 12 sandwiched therebetween is pressure-bonded to the surface of each build-up resin film 12b in the laminated body 12 by pressurizing the inside of the work accommodating chamber 21a.
[0027]
If it will be in such a state, the laminated body 12 will be taken out from the workpiece | work storage chamber 21a of the laminator 20 with the carrier film 11. FIG. Thereafter, the laminate 12 is forcibly cooled together with the carrier film 11 until the temperature reaches room temperature. The laminated body 12 is forcibly cooled to room temperature by being brought into contact with a cooling plate made of, for example, copper, copper alloy, aluminum, aluminum alloy or the like and cooled to an appropriate temperature. The cooling plate is provided with cooling fins on the surface in order to improve the cooling efficiency. The cooling plate may be either configured to contact one side of the laminate 12 or configured to contact both sides.
[0028]
Thus, when the laminated body 12 is forcedly cooled to normal temperature, the carrier film 11 pressure-bonded to the surface of each buildup resin film 12b of the laminated body 12 is peeled off. In this case, as shown in FIG. 5, the corner portion of the carrier film 11 laminated on one corner portion at the end of the buildup resin film 12 b that laminates the surface of the laminate 12 is peeled off from the laminate 12. The laminated body 12 is peeled off sequentially along the diagonal direction. The carrier film 11 is peeled off by, for example, winding with a motor.
[0029]
Thus, after the heated buildup resin film 12a is cooled to room temperature, the carrier film 11 is peeled off along the diagonal direction from one corner of the buildup resin film 12b. The force required to peel the film 11 is remarkably reduced, and the carrier film 11 can be easily and reliably peeled from the laminate 12. As a result, the carrier film 11 can be peeled off from the laminate 12 in a short time, and there is no possibility that the continuous laminating process of the build-up resin film 12b on the printed wiring board 12a will stay.
[0030]
The laminated body 12 from which the carrier film 11 has been peeled has the build-up resin film 12b vacuum-laminated on both sides of the printed wiring board 12a, and the obtained laminated body 12 is applied to a predetermined portion by a photoresist, a drill or the like. After the through hole is formed, copper plating is provided on the surface of the buildup resin film and the inner peripheral surface of the through hole, and an outer layer wiring pattern is formed on the buildup resin film. Then, a plurality of printed wiring boards are laminated to form a build-up multilayer wiring board.
[0031]
The carrier film 11 peeled from the laminate 12 is wound up and reused for transporting the laminate 12. In this case, when the build-up resin film 12b is heated and laminated on the printed wiring board 12a, a part of the build-up resin film 12b adheres to the carrier film 11 as resin waste, so that the resin waste is removed from the carrier film 11. It is. Since the resin waste usually tends to adhere to each side edge of the carrier film 11, for example, as shown in FIG. 6, a pair of resin scraps arranged at an appropriate interval corresponding to the width dimension of the carrier film 11. The resin waste removing body 15 is used. The carrier film 11 is passed between the resin waste removing bodies 15, and each side edge of the carrier film 11 is resin waste while the carrier film 11 passes between the resin waste removing bodies 15. Resin waste adhering to each side edge portion is removed by contacting the removed body 15.
[0032]
Regardless of the method of physically removing the resin waste adhered to the carrier film 11, the entire carrier film 11 is dissolved to dissolve the resin waste adhered to the carrier film 11, as shown in FIG. The liquid may be removed by a chemical method in which the carrier film 11 is passed through the opening 16 where the liquid is sprayed in a shower shape and the resin waste adhering to the carrier film 11 is dissolved. Further, a physical method and a chemical method may be used in combination.
[0033]
The carrier film 11 from which the resin waste has been removed is used again for transporting the laminate 12.
[0034]
Thus, in each step for laminating the buildup resin 12b on the printed wiring board 12a, as described above, the carrier film is applied to the laminate in which the buildup resin is laminated on the printed wiring board. 11 can be easily peeled off, and resin waste can be easily removed from the peeled carrier film 11, so that it is easy to reuse the carrier film 11.
[0035]
If the carrier film 11 can be used many times in each process for laminating the build-up resin 12b on the printed wiring board 12a, a new carrier film is produced every time the build-up resin 12b is laminated on the printed wiring board 12a. It is not necessary to prepare 11 and the cost can be reduced. Further, it is desirable to reuse the carrier film 11 from the viewpoint of resource utilization.
[0036]
【The invention's effect】
Since the buildup resin laminating method of the printed wiring board of the present invention can easily peel the carrier film from the laminate in which the buildup resin is laminated on the printed wiring board, There is no possibility that the transport of the laminate stays, and there is no possibility that the efficiency of the laminating work will be reduced. In addition, since the resin waste can be easily removed from the peeled carrier film, the carrier film can be easily reused. For this reason, the cost of the carrier film can be reduced and it is economical. Further, reuse of the carrier film is desirable from the viewpoint of effective use of resources.
[Brief description of the drawings]
FIG. 1 is a schematic view of a carrier film used in a method for laminating a printed wiring board according to the present invention.
FIG. 2 is a cross-sectional view of a laminate conveyed by the carrier film.
FIG. 3 is a cross-sectional view of a laminator in which the laminate is accommodated.
FIG. 4 is a cross-sectional view for explaining the operation of the laminator.
FIG. 5 is a schematic view showing an example of a step of peeling a carrier film from a laminate.
FIG. 6 is a schematic view showing an example of a process for removing resin waste from a carrier film.
FIG. 7 is a schematic view showing another example of a process for removing resin waste from a carrier film.
FIG. 8 is a schematic view showing a process of removing resin waste from a carrier film in a conventional printed wiring board build-up resin laminating method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Carrier film 12 Laminated body 12a Printed wiring board 12b Build-up resin film 15 Resin waste removal body 16 Opening part 20 Laminator 21 Laminating chamber 21a Work storage chamber 21b Air chamber 22 Partition

Claims (5)

By by laminating a build-up resin film to form a laminate on the printed circuit board inner layer circuit pattern is provided, is transported by the carrier film by sandwiching the laminate, pressurizing with heating together with the carrier film, a laminating step of laminating a build-up resin film on the printed wiring board,
The laminate in which the build-up resin film on the printed wiring board is laminated with the carrier film, a cooling step for forcibly cooling to ambient temperature,
A peeling step of the carrier film peeled off from the laminate,
A resin debris removal step of removing the resin dust from peeled the carrier film was,
Encompasses,
In the cooling step, the laminate obtained by laminating the build-up resin film on the printed wiring board is cooled by a cooling plate . Wherein in the separation step, it is peeled off the corner portion of the carrier film laminated on one corner portion of the laminate, along a diagonal direction of the laminate, sequentially in claim 1 of removing the carrier film The build-up resin laminating method of the printed wiring board as described. Wherein in the resin chip removing step, by between a pair of resin chip removing body each side edge of the carrier film is arranged to contact the carrier film is passed, each side edge of the carrier film The method for building up a printed wiring board according to claim 1, wherein resin waste adhering to the substrate is removed. Wherein in the resin chip removing step, the build-up resin laminate method for a printed wiring board according to claim 1, wherein the resin scrap is removed by dissolving liquid for dissolving the resin scrap. Build-up resin laminate method for a printed wiring board according to claim 1, re-using the carrier film peeled from the laminate in the peeling step.

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