JP3763361B2 - Waveguide connection - Google Patents

Description

  The present invention relates to a connection portion of a waveguide terminal provided on a dielectric substrate, which is used in a high frequency band such as a microwave and a millimeter wave band.

  FIG. 21 is an exploded perspective view showing a configuration when a waveguide terminal provided on a dielectric substrate is connected in a conventional waveguide connection portion. FIG. 22 is a side view when the waveguide terminals are connected at the conventional waveguide connection section. In the figure, 1a and 1b are dielectric substrates, 2a, 2b, 2c, 2d and 2e are waveguide terminals, 3a and 3b are carriers, 4 is a waveguide adapter, and 5 is a screw hole provided in the waveguide adapter. , 6 are screws.

  Next, a conventional waveguide connection portion will be described. 21 and 22, dielectric substrates 1a and 1b provided with waveguide terminals 2a and 2e are bonded, soldered or brazed to carriers 3a and 3b provided with waveguide terminals 2b and 2d, respectively. , Joined. The two joined dielectric substrates and the carrier are aligned with the waveguide adapter 4 provided with the waveguide terminal 2c so that the positions of the waveguide terminals 2b, 2c, and 2d coincide with each other. 5. Screwed with screws 6. Thus, conventionally, when connecting dielectric substrates provided with waveguide terminals, they are screwed via a carrier and a waveguide adapter.

  For example, on the dielectric substrates 1a and 1b, a transmission / reception circuit that mutually converts a high-frequency radio wave transmitted through a waveguide and an electrical signal transmitted through a conductor is provided. The transmission circuit generates a high-frequency signal according to a signal input from the outside to the dielectric substrate, and sends it out from the waveguide terminals 2a and 2e to the carriers 3a and 3b. On the other hand, the receiving circuit converts a high-frequency signal input to the waveguide terminals 2a and 2b from the carrier 3a and 3b side into an electric signal, and outputs the signal to the outside, for example.

  As described above, the conventional waveguide connection portion uses an expensive carrier and a waveguide adapter and is screwed by hand, so that there are problems such as low cost of the connection portion and deterioration of workability. there were. In addition, the coefficient of linear expansion due to heat is generally different among the dielectric substrate, the carrier, and the waveguide adapter, and when the dielectric substrate is bonded and fixed to the carrier or the waveguide adapter, the adhesion surface peels off or the member breaks. There was a fear. In addition, wiring for inputting / outputting electric signals to / from circuits on the dielectric substrate is performed by connecting a wire to the upper surface of the dielectric substrate by bonding or the like. There was a problem.

  The present invention has been made in order to solve such a problem, and a waveguide in which connection work of a waveguide terminal of a dielectric substrate on which a high-frequency circuit is formed is simplified and the cost is reduced. It aims at providing a connection part.

The waveguide connecting portion according to the present invention is a waveguide connecting portion in which a resin substrate and a ceramic substrate are arranged opposite to each other, and the waveguide terminals respectively configured on the respective substrates are connected to each other. Each of the substrates has a contact region that is electrically connected to the ground conductor of the waveguide terminal at a position that surrounds each of the waveguide terminals and faces each other in a connected state of the both waveguide terminals. The substrates are joined to each other by a plurality of conductive joining members arranged in a rectangular shape so as to surround the waveguide terminal between the contact regions facing each other, and the waveguide terminal of the ceramic substrate is The conductive bonding members arranged in a rectangular shape are formed with through holes arranged in a rectangular shape facing the waveguide terminals of the resin substrate inside the arrangement of the conductive bonding members, and provided on the ceramic substrate. spirit Is connected to the sealed high-frequency circuit, wherein the resin substrate is a facing surface and the opposite surface of the ceramic substrate, is bonded to a metal material having a waveguide terminal having a rectangular hole, the resin The waveguide terminal of the substrate is configured by providing a rectangular hole surrounded by the conductive bonding member, and is connected to the waveguide terminal of the metal material, and the plurality of conductive bonding members are: The conductive joint members arranged in a double row around the waveguide terminal and arranged in the outer row are connected to an electrical terminal connected to the high frequency circuit of the ceramic substrate and to the electrode of the resin substrate. The high-frequency circuit is electrically connected to an external circuit through a conductive joining member that is connected and arranged in the outer row .

  The plurality of conductive joining members are solders having a spherical shape, a barrel shape, or a cylindrical shape, and the two dielectric substrates are joined to each other by soldering.

  Further, the plurality of conductive joining members are metal objects or metal-containing materials having a spherical shape, a barrel shape, or a cylindrical shape, and the two dielectric substrates are thermocompression bonding of the metal objects or the metal-containing materials. It is what is joined by.

  The resin substrate is a glass epoxy substrate.

Further, the distance L1 between the first conductive joint member rows arranged on two opposite sides of the rectangular circumference parallel to the short side of the waveguide terminal, and the long side of the waveguide terminal The distance L2 between the second conductive joint member array arranged on two opposite sides of the rectangular circumference parallel to the waveguide terminal end and the waveguide terminal end is defined as the wavelength of the high-frequency signal passing through the waveguide terminal. It is determined so as to satisfy the following relational expression including λ ×× (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2 .
In addition, a gap between the plurality of rows of the conductive joint members parallel to each side of the waveguide terminal is within a range of ¼ wavelength ± 30% of the high-frequency signal passing through the waveguide terminal. It shall be.

  According to the present invention, the conductive junction is formed around the first waveguide terminal provided on the first dielectric substrate, and at a location electrically connected to the ground conductor of the first waveguide terminal. The member is disposed, and the conductive material is disposed around the second waveguide terminal to which the first waveguide terminal is connected, and at a place electrically connected to the ground conductor of the second waveguide terminal. The second dielectric substrate is arranged so that the conductive bonding member is arranged, and both the dielectric substrates are joined, thereby simplifying the connecting operation of the waveguide terminal, which has been conventionally screwed manually. Can be Further, since it is not necessary to use expensive parts such as a waveguide adapter and a carrier, the price can be reduced.

  According to the present invention, both dielectric substrates are connected by sandwiching a spherical, barrel-shaped or cylindrical conductive joint member between the ground conductors of the respective waveguide terminals, and a plurality of dielectric substrates are arranged around the waveguide terminals. As a result, a difference in the thermal expansion coefficient of the dielectric substrate is absorbed without impairing the high-frequency passage characteristics at the waveguide connection portion, and stress is hardly generated in the other due to deformation due to thermal expansion of one of the dielectric substrates. Thus, cracks and the like of the dielectric substrate on the other side are prevented.

Further, according to the present invention, the distance L1 between the two first conductive joint member rows arranged parallel to the short side of the waveguide terminal and sandwiching the waveguide terminal, the long side of the waveguide terminal A distance L2 from the waveguide terminal end to the second conductive joint member row end in the two second conductive joint member rows arranged in parallel with the waveguide terminal and passing through the waveguide terminal. Waveguides are set by setting L1 and L2 so that the relationship of the signal wavelength λ is λ × (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2. Loss at the pipe connection can be minimized.

  Further, the distance between the first conductive joint member array arranged on two opposite sides of the rectangular circumference parallel to the short side of the waveguide terminal and the end of the waveguide terminal, the long side of the waveguide terminal, Losses in the waveguide connection portion can also be obtained by setting the distance between the second conductive joint member array arranged on two opposite sides of the parallel rectangular circumference and the waveguide terminal end to 0.5 mm or less, respectively. Can be minimized.

  In addition, according to the present invention, by providing a bonding member resist film on the ground conductor surface of the dielectric substrate so as to expose a plurality of contact regions in which the conductive bonding member is disposed on the ground conductor surface, The accuracy of the arrangement position of the joining member can be improved, and particularly the accuracy of the interval between the adjacent conductive joining members is ensured, and the loss at the waveguide connection portion is reduced.

  Further, according to the present invention, the dielectric substrate is provided with a plurality of pads for disposing the conductive bonding member at a position separated from the ground conductive surface conducting to the ground conductor of the waveguide terminal on the surface of the dielectric substrate. Is electrically connected to the ground conductor of the waveguide terminal by the inner layer and through-hole of the dielectric substrate having a multi-layer structure, so that the placement accuracy of the conductive bonding member is improved, and accordingly, in the waveguide connection portion Loss is reduced.

  Further, according to the present invention, the dielectric substrate is provided with a plurality of pads for disposing the conductive bonding member at a position separated from the ground conductive surface conducting to the ground conductor of the waveguide terminal on the surface of the dielectric substrate. By providing the connection line connecting the pad and the ground conductive surface, the arrangement accuracy of the conductive bonding member is improved, and the loss in the waveguide connection portion is reduced accordingly.

  The same effect can be obtained by the configuration of the present invention using a dielectric substrate in which a plurality of conductive bonding members are arranged in one contact region.

  Further, according to the present invention, the use of a dielectric substrate in which a plurality of rows and conductive bonding members are arranged in parallel with each side of the waveguide terminal around the rectangular waveguide terminal makes it possible to The degree of coupling with the waveguide terminal can be kept small.

  Further, according to the present invention, when a plurality of conductive joining members are arranged around a rectangular waveguide terminal in parallel to each side of the waveguide terminal, the parallel conductive joining member rows By arranging the gap so that it is in the range of ¼ wavelength ± 30% of the high-frequency signal passing through the waveguide terminal, the degree of coupling with the adjacent waveguide terminal can be further reduced.

  Further, according to the present invention, a plurality of waveguide terminals are provided in the dielectric substrate, and the conductive bonding member disposed around each waveguide terminal is shared between the waveguide terminals. As a result, a plurality of waveguide terminals 2 can be arranged in a small space.

Embodiment 1 FIG.
FIG. 1 is an exploded perspective view of a waveguide connecting portion showing Embodiment 1 of the present invention. In the figure, 1a and 1b are dielectric substrates, 2a and 2b are waveguide terminals provided in the dielectric substrate, 7 is a solder which is a conductive joining member, and 8a and 8b are electrically connected to the ground conductor of the waveguide terminal. And a GND surface (grounding conductive surface) disposed on the surface of the substrate.

  Next, the connection portion of the waveguide terminal will be described. In the figure, dielectric substrates 1a and 1b have waveguide terminals 2a and 2b inside, respectively, and a GND surface electrically connected to the ground conductor of the waveguide terminals 2a and 2b on the substrate surface. 8a and 8b are arranged. The two dielectric substrates 1a and 1b are arranged so that the GND surfaces 8a and 8b face each other. Then, the solder 7 is disposed between the GND surfaces 8a and 8b so as to be in contact with the GND surfaces 8a and 8b and to surround the waveguide terminals 2a and 2b, and the two dielectric substrates 1a and 1b are disposed. Are soldered and the waveguide terminals are connected.

  Further, even when the dielectric substrates 1a and 1b shown in FIG. 1 are formed of a multilayer dielectric substrate, the same configuration can be adopted.

  Thus, by connecting the waveguide terminals provided on the dielectric substrate by soldering, the connection work of the waveguide terminals, which has been conventionally screwed manually, can be simplified. Further, since it is not necessary to use expensive parts such as a waveguide adapter and a carrier, the price can be reduced.

Embodiment 2. FIG.
FIG. 2 is an exploded perspective view of a waveguide connection portion showing Embodiment 2 of the present invention. FIG. 3 is a longitudinal sectional view and a top view of the dielectric substrate when a dielectric substrate provided with a rectangular hole is used. FIG. 4 is a longitudinal sectional view and a top view of the dielectric substrate when a dielectric substrate in which through holes are arranged in a rectangular shape to constitute a waveguide terminal is used. In the figure, 1a, 1b, 2a, 2b, 8a and 8b are the same as in the first embodiment, 7 is a spherical, barrel-shaped or cylindrical solder, and 9a and 9b are through holes.

  Next, the connection portion of the waveguide terminal will be described. In the figure, dielectric substrates 1a and 1b, waveguide terminals 2a and 2b, and GND surfaces 8a and 8b are arranged in the same manner as in the first embodiment and have the same functions. The GND surface 8a is disposed on the surface of the dielectric substrate 1a on the dielectric substrate 1b side, and is omitted in FIG. Then, a plurality of spherical, barrel-shaped, or cylindrical solders 7 are arranged so as to be sandwiched between the GND surfaces 8a and 8b, in a position in contact with the GND surfaces 8a and 8b, and to surround the waveguide terminals 2a and 2b. Yes. The spherical, barrel-shaped or cylindrical solders 7 are arranged in a row so that the gap between the adjacent solders 7 is equal to or less than ¼ wavelength of the high-frequency signal passing through the waveguide terminals 2a and 2b. It is arranged. As described above, the two dielectric substrates 1a and 1b and the spherical, barrel-shaped or cylindrical solder 7 are arranged and soldered, whereby the waveguide terminals 2a and 2b provided on the dielectric substrates 1a and 1b are formed. Connected.

  FIG. 3 is a longitudinal sectional view and a top view of the dielectric substrates 1a and 1b in the waveguide connecting portion described in FIG. In FIG. 3, dielectric substrates 1a and 1b are provided with waveguide terminals 2a and 2b therein, and GND surfaces 8a and 8b connected to the ground conductors of the waveguide terminals 2a and 2b are connected to the substrates. It is arranged on the surface. A plurality of spherical, barrel-shaped, or cylindrical solders 7 are arranged in rows on the GND surfaces 8a and 8b of the dielectric substrates 1a and 1b and around the waveguide terminals 2a and 2b. At this time, the gap between adjacent spherical, barrel-shaped or cylindrical solders 7 is equal to or less than ¼ wavelength of the high-frequency signal passing through the waveguide terminals 2a and 2b as described above.

  Further, like the dielectric substrates 1a and 1b shown in FIG. 4, the through-holes 9a and 9b are arranged in a rectangular shape to constitute the waveguide terminals 2a and 2b, and the GND connected to the through-holes 9a and 9b. Even when the surfaces 8a and 8b are arranged, it is possible to configure the same as in FIG.

  Further, even when the dielectric substrates 1a and 1b shown in FIGS. 3 and 4 are multilayer dielectric substrates, they can be configured similarly to FIG.

  Thus, by connecting the waveguide terminals provided on the dielectric substrate by soldering, the connection work of the waveguide terminals, which has been conventionally screwed manually, can be simplified. Further, since it is not necessary to use expensive parts such as a waveguide adapter and a carrier, the price can be reduced.

  FIG. 5 is a schematic view showing a longitudinal section of a high-frequency device using the waveguide connection portion according to the present invention. The apparatus shown in the figure is a structure in which the structure having the waveguide connection portion of the above embodiment including the dielectric substrates 1a and 1b is attached to the inside of the housing 20, and the millimeter wave band is formed on the upper surface of the dielectric substrate 1a. A high-frequency circuit that operates in is mounted. The GND surface 8a of the waveguide terminal 2a of the dielectric substrate 1a and the GND surface 8b of the waveguide terminal 2b of the dielectric substrate 1b are connected by solder 7a. The solder 7a is disposed so as to surround the waveguide terminals 2a and 2b as described above. The housing 20 is made of metal, and the housing 20 is provided with a waveguide terminal 2c disposed to face the waveguide terminal 2b. The dielectric substrate 1b and the housing 20 are fixed by bonding or screwing. The high-frequency circuit between the high-frequency circuit on the dielectric substrate 1a and the outside of the housing 20 via the waveguide terminals 2a, 2b, and 2c of the dielectric substrates 1a and 1b and the housing 20 laminated in this way. I / O is performed.

  In addition, an electrical signal can be transmitted through the conductor between the high-frequency circuit on the dielectric substrate 1a and the external circuit. This electrical signal is transmitted through the through-hole provided in the dielectric substrate 1a, the electrode 22a taken out on the back surface of the dielectric substrate 1a, the electrode 22b disposed on the surface of the dielectric substrate 1b, and the electrodes 22a, This can be done via solder 7b connecting 22b. That is, the operation of connecting the wire to the upper surface of the dielectric substrate 1a by bonding or the like is not necessary, and at the same time in the step of constructing the waveguide connection by overlapping the dielectric substrate 1a and the dielectric substrate 1b, Electrical terminals connected to the high frequency circuit can be taken out on the dielectric substrate 1b.

  Now, the high frequency circuit mounted on the dielectric substrate 1a is hermetically sealed to prevent characteristic deterioration. Here, a generally used glass epoxy substrate is not suitable for hermetic sealing because it causes moisture adsorption. Therefore, the dielectric substrate 1a is configured using a ceramic substrate that does not cause such a problem and is suitable for hermetic sealing. On the other hand, the housing 20 is made of metal as described above, and generally, the thermal expansion coefficient between the dielectric substrate 1a and the housing 20 is different. The ceramic material constituting the dielectric substrate 1a is generally easy to break, and if the difference in the coefficient of thermal expansion between the housing 20 and the dielectric substrate 1a is large, there is a risk that the dielectric substrate 1a may be cracked, which is not preferable. .

  Therefore, in this apparatus, consideration is given to selecting a metal material that constitutes the housing 20 that has a small difference in thermal expansion coefficient from the ceramic material that constitutes the dielectric substrate 1a, and at the same time, the dielectric located between them. The material of the dielectric substrate 1b is selected so that the thermal expansion coefficient of the body substrate 1b is an intermediate value between the thermal expansion coefficients of the dielectric substrate 1a and the housing 20. That is, each material is selected so that the coefficient of thermal expansion changes in the order of the dielectric substrate 1a, the dielectric substrate 1b, and the housing 20. For example, the casing 20 made of metal usually has a larger thermal expansion than the dielectric substrate 1b. In this case, when the dielectric substrate 1b is attached to one surface of the housing 20, the thermal expansion of the housing 20 is reduced on the surface side, and the influence of the thermal expansion of the housing 20 on the dielectric substrate 1a is mitigated. . Further, the dielectric substrate 1a and the dielectric substrate 1b are connected by point contact with the solders 7a and 7b, and the solders 7a and 7b themselves and the soldering connection between the solder and each dielectric substrate are relatively elastic. Therefore, in this portion, the difference in deformation due to thermal expansion of the dielectric substrate 1a and the dielectric substrate 1b is absorbed, and the stress inside the dielectric substrate 1a is relieved.

  As an example, when the dielectric substrate 1a is made of a ceramic material and the casing 20 is made of aluminum (Al), the dielectric substrate 1b can be made of a glass epoxy substrate.

  In order to perform hermetic sealing at the waveguide terminal as in this apparatus, the waveguide terminal 2a is guided as shown in FIG. 4 rather than the structure in which the waveguide terminal 2a has a large opening as shown in FIG. A structure in which the tube terminals 2a are constituted by through holes 9a arranged in a rectangular shape is more preferable. In the structure shown in FIG. 4, there is a dielectric substrate inside the through hole 9a, and the through hole 9a can be easily filled with a metal and closed. By blocking the waveguide terminal 2a in this way, the waveguide terminal 2a can transmit high frequency while inhibiting the flow of the substance.

Embodiment 3 FIG.
FIG. 6 is a top view of the dielectric substrate in the waveguide connection portion showing the third embodiment of the present invention. In the figure, 1 to 9 are the same as those in the second embodiment, 71 is a spherical shape and a barrel. A first solder row in which the cylindrical or cylindrical solders 7 are arranged in parallel with the short side of the waveguide terminal 2, and 72 is a spherical, barrel-like or cylindrical solder 7. It is the 2nd solder row arranged in parallel with the long side.

  FIG. 7 is a graph showing the loss of the waveguide connection portion. The distance between the two first solder rows 71 arranged with the waveguide terminal 2 interposed therebetween is L1, and the waveguide terminal 2 is sandwiched. When the distance from the waveguide terminal 2 end to the second solder row 72 end in the two second solder rows 72 arranged in (2) is L2, the transmission efficiency when L1 is fixed and L2 is changed The characteristics are shown.

6A, the dielectric substrate 1 has a waveguide terminal 2 provided therein, and a GND surface 8 that is electrically connected to the ground conductor of the waveguide terminal 2 is disposed on the substrate surface. Yes. A plurality of spherical, barrel-shaped, or cylindrical solders 7 are arranged in a row on the GND surface 8 of the dielectric substrate 1 and around the waveguide terminal 2. At this time, the gap between adjacent spherical, barrel-shaped, or cylindrical solders 7 is equal to or less than ¼ wavelength of the high-frequency signal that passes through the waveguide terminal 2. Further, the distance between the two first solder rows 71 arranged with the waveguide terminal 2 interposed therebetween is L1, and the waveguide terminals 2 in the two second solder rows 72 arranged with the waveguide terminal 2 interposed therebetween. When the distance from the end to the second solder row 72 end is L2, the relationship between the wavelength λ of the high-frequency signal passing through the waveguide terminal 2 and L1 and L2 is λ × (0.7 to 1.3). ) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2 so that L1 and L2 are set.

Next, the passage characteristic in the waveguide connecting portion will be described. As shown in FIG. 7, when the distance L2 is changed while the distance L1 is fixed, the loss at the waveguide connection portion changes greatly, and the loss becomes the smallest at the optimum L2 in the drawing. The optimum L2 in this figure can be derived by the above-mentioned λ × (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2 .

  By setting L1 and L2 in this way, the waveguide terminal connection work can be simplified and reduced in the same manner as in the first embodiment while minimizing the loss in the waveguide connection portion (maximizing the amount of passage). Price can be realized.

  As shown in FIG. 6B, the through hole 9 is arranged in a rectangular shape on the dielectric substrate 1 to constitute the waveguide terminal 2, and the GND surface 8 electrically connected to the through hole 9 is arranged. Even in this case, the same effect can be obtained.

  Further, even when the dielectric substrate 1 shown in FIG. 6 is formed of a multilayer dielectric substrate, the same effect can be obtained.

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

  As can be understood from FIG. 7, the loss at the waveguide connection portion is minimized at the above-described optimum L2 and also minimized at L2 = 0. That is, corresponding to the case of L2 = 0, the first solder row 71 and the second solder row 72 are arranged close to the edge of the waveguide terminal 2 (for example, L2 = 0.2 to 0.5 mm). As a result, the loss at the waveguide connection portion can be minimized. Thus, by arranging the solder row close to the edge of the waveguide terminal 2, the area occupied by the waveguide connecting portion surrounded by the solder row and the dielectric substrates 1a and 1b is reduced. As a result, the size of the dielectric substrates 1a and 1b can be reduced, and the cost can be reduced. In particular, the ceramic material is relatively expensive, and when the dielectric substrate 1a or 1b is configured using this ceramic material, the effect of reducing the cost is great. In addition, when the waveguide connection portion including the dielectric substrates 1a and 1b is used in an actual device, stress may be generated on the dielectric substrate due to a difference in thermal expansion from a housing or the like to which the dielectric substrate is attached. Here, if the thickness of the dielectric substrate is constant, the strength of the dielectric substrate is larger when the area is smaller. Therefore, by reducing the area of the dielectric substrate by arranging the solder rows as described above, it becomes possible to prevent the ceramic substrate from cracking against thermal expansion and the like, and the reliability of the device is improved. To do.

Embodiment 4 FIG.
FIG. 8 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing Embodiment 4 of the present invention. In the figure, 1 to 9 are the same as Embodiment 3, and 10 Is a solder resist that is a bonding member resist film, 11 is a pad that forms part of the GND surface 8 and has spherical, barrel-shaped or cylindrical solder 7 disposed thereon, and 12 is a GND that is disposed on the inner layer of the multilayer dielectric substrate. It is a pattern.

  8A is a top view of the dielectric substrate 1, FIG. 8B is a longitudinal sectional view when the dielectric substrate 1 is composed of a single layer, and FIG. 8C is a multilayer structure of the dielectric substrate 1. The longitudinal cross-sectional view in the case is shown. 8 (a) and 8 (b), the dielectric substrate 1 has a waveguide terminal 2 provided therein, and the GND surface 8 connected to the ground conductor of the waveguide terminal 2 is defined as the substrate surface. Is arranged. A solder resist 10 is provided on a portion of the GND surface 8 except for the pad 11 portion for disposing the spherical, barrel-shaped or cylindrical solder 7, and a portion of the GND surface 8 is spherical, barrel-shaped or A pad 11 on which the cylindrical solder 7 is disposed is formed.

  Further, FIG. 8C shows the dielectric substrate 1 in FIG. 8A as a multilayer, and is guided through the GND pattern 12 disposed in the inner layer of the dielectric substrate 1 and the through hole 9. The GND surface 8 is connected to the ground conductor of the tube terminal 2. The arrangement of the solder resist 10 and the formation of the pad 11 on which the spherical, barrel-shaped, or cylindrical solder 7 is disposed are the same as in FIG.

  As described above, the solder resist 10 is provided with the pads 11 of the spherical, barrel-shaped, or cylindrical solder 7, so that the placement location of the spherical, barrel-shaped, or cylindrical solder 7 can be accurately set, and the second embodiment. In the same manner, the connection work of the waveguide terminal can be simplified and the price can be reduced. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  The same effect can be obtained even when a through hole is arranged in a rectangular shape on the dielectric substrate 1 to constitute a waveguide terminal and the GND surface 8 electrically connected to the through hole is arranged. .

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

  Now, if the solder resist 10 is not applied to the substrate surface between the solders 7, if the distance between the solders 7 is small, the adjacent solder 7 is heated by heating when the dielectric substrates 1 a and 1 b are connected by the solder 7. Can melt and spread on the surface of the substrate to connect with each other and further integrate. The integration basically occurs between two adjacent solders 7, and the distance between the solders 7 in the integrated part is basically 0, and conversely, the distance between the integrated solder pair and the adjacent solder 7. Becomes wider than the design value, and the interval between the solders 7 becomes non-uniform.

  On the other hand, if the solder resist 10 is applied between the positions where the solder 7 is disposed as in this embodiment, the solder 7 is reliably separated from each other even if the distance between the adjacent solders 7 is small. Can be easily maintained at a constant value. That is, in the waveguide connection portion corresponding to a higher frequency, it is easy to set the interval of the solder 7 to a design value such as a quarter wavelength, and the loss of the high frequency signal is reduced.

  In this case as well, the loss at the waveguide connection portion is suppressed by determining the positional relationship between the solder rows arranged on the rectangular circumference and the waveguide terminals in the same manner as in the third embodiment. be able to. Incidentally, when the solder row and the edge of the waveguide terminal are arranged close to each other, an area where the solder resist 10 is applied is arranged between the edge of the waveguide terminal and the pad 11. In that case, the distance between the solder row and the waveguide terminal cannot be zero, but can be reduced to 0.5 mm or less according to the current patterning technique for the solder resist, thereby obtaining suitable pass characteristics. be able to.

Embodiment 5. FIG.
FIG. 9 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing Embodiment 5 of the present invention. In the figure, 1 to 12 are the same as those in Embodiment 4.

  9A is a top view of the dielectric substrate 1, and FIG. 9B is a longitudinal sectional view of the dielectric substrate 1. In the figure, a dielectric substrate 1 has a waveguide terminal 2 provided therein, and a GND surface 8 that is electrically connected to a ground conductor of the waveguide terminal 2 is disposed on the substrate surface. Then, the GND pattern 12 connected to the ground conductor of the waveguide terminal 2 is disposed on the inner layer of the dielectric substrate 1, and the spherical and barrel shapes disposed on the surface of the dielectric substrate 1 through the through holes 9. Alternatively, it is connected to the pad 11 of the cylindrical solder 7.

  As described above, the pad 11 connected to the ground conductor of the waveguide terminal 2 is obtained through the inner layer of the multilayer substrate, and the placement location of the spherical, barrel-shaped or cylindrical solder 7 is set with high accuracy. As in the second embodiment, the waveguide terminal connection work can be simplified and the cost can be reduced. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  This is to form a waveguide terminal by disposing a through hole in a rectangular shape on the dielectric substrate 1, and disposing an inner layer GND pattern 12, a through hole 9, and a pad 11 electrically connected to the through hole. Even in this case, the same effect can be obtained.

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

Embodiment 6 FIG.
10 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing Embodiment 6 of the present invention. In the figure, 1 to 12 are the same as those in Embodiment 5, and FIG. Is a connection line connecting the GND surface 8 and the pad 11.

  10A is a top view of the dielectric substrate 1, FIG. 10B is a longitudinal sectional view when the dielectric substrate 1 is configured with a single layer, and FIG. 10C is a multilayer configuration with the dielectric substrate 1. The longitudinal cross-sectional view in the case is shown. 10 (a) and 10 (b), the dielectric substrate 1 has a waveguide terminal 2 provided therein, and the GND surface 8 conducted to the ground conductor of the waveguide terminal 2 is defined as the substrate surface. Is arranged. The GND surface 8 and the pad 11 of the spherical, barrel-shaped, or cylindrical solder 7 disposed on the surface of the dielectric substrate 1 are connected via a connection line 13. The plurality of pads 11 are also connected by this connection line 13. At this time, the thinner the connecting line 13 is, the more the flow into the GND surface 8 can be prevented when the spherical, barrel-shaped or cylindrical solder 7 is soldered.

  FIG. 10C shows a multilayer dielectric substrate 1 in FIG. 10A, and is guided through the GND pattern 12 disposed in the inner layer of the dielectric substrate 1 and the through hole 9. The GND surface 8 is connected to the ground conductor of the tube terminal 2. The arrangement and functions of the connection line 13 and the pad 11 are the same as in FIG.

  In this way, by obtaining the pad 11 connected to the ground conductor of the waveguide terminal 2 through the connection line 13, while accurately setting the location of the spherical, barrel-shaped or cylindrical solder 7, Similar to the second embodiment, the waveguide terminal connection work can be simplified and the cost can be reduced. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  This is a case where a through hole is arranged in a rectangular shape on the dielectric substrate 1 to constitute a waveguide terminal, and a GND surface 8, a connection line 13, and a pad 11 electrically connected to the through hole are arranged. However, the same effect can be obtained.

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

Embodiment 7 FIG.
FIG. 11 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing Embodiment 7 of the present invention. In the figure, 1 to 12 are the same as those in Embodiment 4.

  11A is a top view of the dielectric substrate 1, FIG. 11B is a longitudinal sectional view when the dielectric substrate 1 is composed of a single layer, and FIG. 11C is a multilayer structure of the dielectric substrate 1. The longitudinal cross-sectional view in the case is shown. 11 (a) and 11 (b), the dielectric substrate 1 has a waveguide terminal 2 provided therein, and the GND surface 8 connected to the ground conductor of the waveguide terminal 2 is defined as the substrate surface. Is arranged. A solder resist 10 is provided on a portion of the GND surface 8 except for the pad 11 portion for disposing the spherical, barrel-shaped or cylindrical solder 7, and a portion of the GND surface 8 is spherical, barrel-shaped or A pad 11 on which the cylindrical solder 7 is disposed is formed. The pad 11 has a rectangular size so that a plurality of spherical, barrel-shaped, or cylindrical solders 7 can be arranged for each pad 11.

  FIG. 11C shows a multilayered dielectric substrate 1 in FIG. 11A, and is guided through the GND pattern 12 disposed in the inner layer of the dielectric substrate 1 and the through hole 9. The GND surface 8 is connected to the ground conductor of the tube terminal 2. The arrangement of the solder resist 10 and the formation of the pad 11 on which the spherical, barrel-shaped or cylindrical solder 7 is arranged are the same as in FIG.

  In this way, by providing the pads 11 of the spherical, barrel-shaped, or cylindrical solder 7 with the solder resist 10, the placement location of the barrel-shaped or cylindrical solder 7 is set with high accuracy, and the same as in the second embodiment. In addition, the connection work of the waveguide terminals can be simplified and the price can be reduced. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  In the drawing, the shape of the pad 11 is rectangular. However, the same effect can be obtained even if the shape of the pad 11 surrounds the periphery of the waveguide terminal 2.

  Further, as a result of soldering, the same effect can be obtained even when a plurality of adjacent spherical, barrel-shaped, or cylindrical solders 7 in the same pad 11 are melted and joined together.

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

  Further, the same effect can be obtained even when the dielectric substrate 1 has a through-hole arranged in a rectangular shape to constitute a waveguide terminal and the GND surface 8 electrically connected to the through-hole is arranged.

Embodiment 8 FIG.
12 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing an eighth embodiment of the present invention. In the figure, reference numerals 1 to 11 are the same as those in the fourth embodiment.

  FIG. 13 shows a high frequency to adjacent waveguide terminals (not shown in FIG. 12, but arranged outside the barrel-shaped or cylindrical solder 7 arranged in a row). It is a graph which shows the coupling degree of a signal.

  12A is a top view of the dielectric substrate 1, and FIG. 12B is a longitudinal sectional view of the dielectric substrate 1. In the figure, a dielectric substrate 1 has a waveguide terminal 2 provided therein, and a GND surface 8 that is electrically connected to a ground conductor of the waveguide terminal 2 is disposed on the substrate surface. A solder resist 10 is provided on a portion of the GND surface 8 except for the pad 11 portion for disposing the spherical, barrel-shaped or cylindrical solder 7, and a portion of the GND surface 8 is spherical, barrel-shaped or A pad 11 on which the cylindrical solder 7 is disposed is formed. At this time, the pads 11 are arranged around the rectangular waveguide terminal 2 in two rows in parallel to each side of the waveguide terminal 2, and two rows of spherical, barrel-shaped, or cylindrical solders 7 are arranged. I try to arrange it.

  In FIG. 13, a curve a indicates the degree of coupling of high-frequency signals to adjacent waveguide terminals when spherical, barrel-shaped, or cylindrical solders 7 are arranged in a row in the circumferential direction of the waveguide terminal 2. Curve b shows the degree of coupling when two rows are arranged. In this way, by arranging a plurality of rows of spherical, barrel-shaped or cylindrical solders 7, the degree of coupling with adjacent waveguide terminals can be kept small, and a plurality of waveguide terminals 2 are disposed. This is effective.

  In this way, by arranging a plurality of rows of spherical, barrel-shaped or cylindrical solders 7, the degree of coupling with adjacent waveguide terminals can be suppressed to a small level. It is possible to set the location of the barrel-shaped or cylindrical solder 7 with high accuracy, simplify the connection work of the waveguide terminal, and realize a low price. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  The same effect can be obtained even when a through hole is arranged in a rectangular shape on the dielectric substrate 1 to constitute a waveguide terminal and the GND surface 8 electrically connected to the through hole is arranged. .

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

Embodiment 9 FIG.
FIG. 14 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing Embodiment 9 of the present invention. In the figure, reference numerals 1 to 11 are the same as those in Embodiment 8.

  FIG. 15 shows an adjacent waveguide terminal (not shown in FIG. 14 but arranged outside the spherical, barrel-shaped, or cylindrical solder 7 arranged in a row). It is a graph which shows the coupling | bonding degree of high frequency signal.

  14A is a top view of the dielectric substrate 1, and FIG. 14B is a longitudinal sectional view of the dielectric substrate 1. In the figure, the configuration of the dielectric substrate 1, the waveguide terminal 2, the GND surface 8, the solder resist 10, and the pad 11 is the same as that of the eighth embodiment. The pad 11 and the barrel-like or cylindrical solder 7 are arranged in two rows around the rectangular waveguide terminal 2 in parallel with each side of the waveguide terminal 2, and the gap is guided. It is set in the range of ¼ wavelength ± 30% of the high-frequency signal (frequency is F0) passing through the wave tube terminal 2.

  In FIG. 15, a curve c indicates the degree of coupling of the high-frequency signal to the adjacent waveguide terminals when the spherical, barrel-shaped, or cylindrical solders 7 are arranged in two rows with an arbitrary gap in the circumferential direction of the waveguide terminal 2. The curve d shows the degree of coupling when the gap is set in the range of ¼ wavelength ± 30% of the high-frequency signal (frequency is F0) passing through the waveguide terminal 2. Thus, when the gap is set in the range of ¼ wavelength ± 30% of the high-frequency signal passing through the waveguide terminal 2 between the spherical, barrel-shaped or cylindrical solder 7, The degree of coupling can be further reduced only in the frequency band of the high-frequency signal, which is effective when a plurality of waveguide terminals 2 are arranged.

  In this way, by arranging a plurality of rows of spherical, barrel-shaped or cylindrical solders 7 with gaps in the range of a high-frequency signal ¼ wavelength ± 30% passing through the waveguide terminal 2, adjacent waveguides are arranged. While the degree of coupling with the tube terminal can be kept small, similarly to the fourth embodiment, the placement location of the spherical, barrel-shaped, or cylindrical solder 7 can be set with high accuracy, and the waveguide terminal can be easily connected. And lower prices. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  The same effect can be obtained even when a through hole is arranged in a rectangular shape on the dielectric substrate 1 to constitute a waveguide terminal and the GND surface 8 electrically connected to the through hole is arranged. .

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

Embodiment 10 FIG.
FIG. 16 is a top view and a longitudinal sectional view of a dielectric substrate in a waveguide connection portion showing Embodiment 10 of the present invention. In the drawing, 1 to 11 are the same as those in Embodiment 4.

  16A is a top view of the dielectric substrate 1, and FIG. 16B is a longitudinal sectional view of the dielectric substrate 1. In the figure, a dielectric substrate 1 is provided with two waveguide terminals 2 therein, and a GND surface 8 conducted to the ground conductor of the two waveguide terminals 2 is disposed on the substrate surface. . A solder resist 10 is provided on a portion of the GND surface 8 except for the pad 11 portion for disposing the spherical, barrel-shaped or cylindrical solder 7, and a portion of the GND surface 8 is spherical, barrel-shaped or A pad 11 on which the cylindrical solder 7 is disposed is formed. Here, the pad 11 is also arranged around and between the two waveguide terminals 2.

  In this way, a plurality of waveguide terminals 2 are arranged adjacent to each other, and a spherical, barrel-shaped or cylindrical solder 7 is arranged around and between the plurality of waveguide terminals 2 so that the plurality of waveguide terminals 2 are arranged in a small space. As in the fourth embodiment, the placement location of the spherical, barrel-shaped, or cylindrical solder 7 can be set with high accuracy while arranging, and the waveguide terminal connection work can be simplified and the cost can be reduced. Further, as in the third embodiment, the waveguide connection is obtained by deriving and setting the positions (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped or cylindrical solder 7 is arranged. It is possible to minimize part loss.

  The same effect can be obtained even when a through hole is arranged in a rectangular shape on the dielectric substrate 1 to constitute a waveguide terminal and the GND surface 8 electrically connected to the through hole is arranged. .

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

Embodiment 11 FIG.
FIG. 17 is a top view of the dielectric substrate in the waveguide connection portion showing the eleventh embodiment of the present invention and a longitudinal sectional view after connection. In the figure, reference numerals 1 to 13 denote the fourth embodiment and the embodiment. This is the same as the sixth aspect.

  The dielectric substrate 1a is a substrate disposed on the upper side of FIG. 17B, and has a waveguide terminal 2a provided therein, and a GND surface 8a electrically connected to the ground conductor of the waveguide terminal 2a. Is disposed on the surface of the substrate. The GND surface 8a and the pad 11a of the spherical, barrel-shaped, or cylindrical solder 7 disposed on the surface of the dielectric substrate 1a are connected via a connection line 13. The plurality of pads 11a are also connected by this connection line 13. Further, the GND surface 8a is connected to the ground conductor of the waveguide terminal 2a through the GND pattern 12 and the through hole 9 arranged in the inner layer of the dielectric substrate 1a.

  The dielectric substrate 1b is a substrate disposed on the lower side in FIG. 17B, and has a waveguide terminal 2b provided therein, and is connected to the ground conductor of the waveguide terminal 2b. 8b is arranged on the substrate surface. Then, a solder resist 10 is provided on a portion of the GND surface 8b except for the pad 11b portion for arranging the spherical, barrel-shaped or cylindrical solder 7, and a portion of the GND surface 8b is spherical, barrel-shaped or A pad 11b on which the cylindrical solder 7 is arranged is formed.

  These two dielectric substrates 1a and 1b are arranged so that the pads 11a and 11b face each other, and a spherical, barrel-like or cylindrical solder 7 is arranged between the pads 11a and 11b, soldered, and guided. The wave tube terminals 2a and 2b are connected.

  As a result, it is possible to simplify and reduce the cost of connecting the waveguide terminals as in the second embodiment while accurately setting the location where the spherical, barrel-shaped, or cylindrical solder 7 is arranged. Further, as in the third embodiment, by deriving and setting the positions (L1 and L2; omitted in the drawing) where the barrel-like or cylindrical solder 7 is disposed, Loss can be minimized.

  In the above description, the solder 7 has a spherical shape, a barrel shape, or a cylindrical shape, but the same effect can be obtained with other shapes such as a plate shape.

Embodiment 12 FIG.
18 is an exploded perspective view and a longitudinal sectional view of a waveguide connection portion showing Embodiment 12 of the present invention. In the figure, 1a, 1b, 2a, 2b, 8a and 8b are the same as those in the first embodiment, and 14 is a conductive adhesive.

  Next, the connection portion of the waveguide terminal will be described. In the figure, dielectric substrates 1a and 1b have waveguide terminals 2a and 2b inside, respectively, and a GND surface electrically connected to the ground conductor of the waveguide terminals 2a and 2b on the substrate surface. 8a and 8b are arranged. The two dielectric substrates 1a and 1b are arranged so that the GND surfaces 8a and 8b face each other. Then, a conductive adhesive 14 is disposed between the GND surfaces 8a and 8b, in contact with the GND surfaces 8a and 8b, and so as to surround the waveguide terminals 2a and 2b. 1a and 1b are bonded and the waveguide terminals are connected.

  Further, even when the dielectric substrates 1a and 1b shown in FIG. 18 are formed of multilayer dielectric substrates, the same configuration can be adopted.

  In this way, the waveguide terminal provided on the dielectric substrate is bonded and connected with a conductive adhesive, so that the waveguide terminal is conventionally manually screwed in the same manner as in the first embodiment. Connection work can be simplified. Further, since it is not necessary to use expensive parts such as a waveguide adapter and a carrier, the price can be reduced.

Embodiment 13 FIG.
19 is an exploded perspective view and a longitudinal sectional view of a waveguide connecting portion showing Embodiment 13 of the present invention. In the figure, 1a, 1b, 2a, 2b, 8a and 8b are the same as those in the first embodiment, and 15 is a spherical, barrel-shaped or cylindrical metal object.

  Next, the connection portion of the waveguide terminal will be described. In the figure, dielectric substrates 1a and 1b, waveguide terminals 2a and 2b, and GND surfaces 8a and 8b are arranged in the same manner as in the first embodiment and have the same functions. And it is sandwiched between the GND surfaces 8a and 8b, is in a position in contact with the GND surfaces 8a and 8b, and surrounds the periphery of the waveguide terminals 2a and 2b, for example, a spherical, barrel-shaped or cylindrical metal object such as gold A plurality of 15 are arranged. The spherical, barrel-shaped, or cylindrical metal objects 15 are arranged so that the gap between the adjacent metal objects 15 is equal to or less than ¼ wavelength of the high-frequency signal that passes through the waveguide terminals 2a and 2b. Arranged. And the waveguide terminals 2a and 2b provided on the dielectric substrates 1a and 1b are connected by thermocompression bonding the two dielectric substrates 1a and 1b.

  Thus, by connecting the waveguide terminals provided on the dielectric substrate by thermocompression bonding, the connection operation of the waveguide terminals, which has been conventionally screwed manually, as in the first embodiment, is performed. It can be simplified. Further, since it is not necessary to use expensive parts such as a waveguide adapter and a carrier, the price can be reduced. Further, as in the third embodiment, the waveguide (L1 and L2; omitted in the drawing) where the spherical, barrel-shaped, or cylindrical metal object 15 is arranged is derived and set. It is possible to minimize the loss of the connection portion.

  The same effect can be obtained even when the dielectric substrates 1a and 1b are multilayer dielectric substrates.

  Further, the same effect can be obtained even when a through hole is arranged in a rectangular shape on the dielectric substrate to constitute a waveguide terminal and the GND surface 8 connected to the through hole is arranged.

  FIG. 20 is a longitudinal sectional view of a modified example of the present embodiment, and the structure of the waveguide connection portion when using the dielectric substrates 1a and 1b on which the pads 11 are formed by the solder resist 10 as shown in FIG. Is shown. In this case, the solder 7 is fused to the pad 11 to which the solder resist 10 is not applied.

It is the disassembled perspective view and longitudinal cross-sectional view of Embodiment 1 of the waveguide connection part by this invention. It is a disassembled perspective view of Embodiment 2 of the waveguide connection part by this invention. It is the longitudinal cross-sectional view of Embodiment 2 of the waveguide connection part by this invention, and a top view of a dielectric substrate. It is the longitudinal cross-sectional view of Embodiment 2 of the waveguide connection part by this invention, and a top view of a dielectric substrate. It is a schematic diagram which shows the longitudinal cross-section of the high frequency device using the waveguide connection part by this invention. It is a top view of the dielectric substrate of Embodiment 3 of the waveguide connection part by this invention. It is a figure which shows the characteristic of the waveguide connection part of Embodiment 3 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 4 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 5 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 6 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 7 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 8 of the waveguide connection part by this invention. It is a figure which shows the characteristic of the waveguide connection part of Embodiment 8 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 9 of the waveguide connection part by this invention. It is a figure which shows the characteristic of the waveguide connection part of Embodiment 9 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 10 of the waveguide connection part by this invention. It is the top view and longitudinal cross-sectional view of the dielectric substrate of Embodiment 11 of the waveguide connection part by this invention. It is the disassembled perspective view and longitudinal cross-sectional view of Embodiment 12 of the waveguide connection part by this invention. It is the disassembled perspective view and longitudinal cross-sectional view of Embodiment 13 of the waveguide connection part by this invention. It is a longitudinal cross-sectional view of the modification of Embodiment 13 of the waveguide connection part by this invention. It is a disassembled perspective view of the conventional waveguide connection part. It is a side view of the conventional waveguide connection part.

Explanation of symbols

  1, 1a, 1b Dielectric substrate, 2, 2a, 2b, 2c, 2d, 2e Waveguide terminal, 3a, 3b carrier, 4 Waveguide adapter, 5 Screw hole, 6 Screw, 7 Solder, 71, 72 Solder Row, 8, 8a, 8b GND surface, 9, 9a, 9b through hole, 10 solder resist, 11, 11a, 11b pad, 12 inner layer GND pattern, 13 connection line, 14 conductive adhesive, 15 spherical, barrel shape Or a cylindrical metal object.

Claims (6)

A waveguide connecting portion that connects resin terminals and ceramic substrates facing each other, and connects the waveguide terminals configured on each of the substrates,
Each of the substrates has a contact region that is electrically connected to the ground conductor of the waveguide terminal at a position that surrounds each of the waveguide terminals and faces each other in a connected state of the two waveguide terminals. Each has
The two substrates are joined to each other by a plurality of conductive joining members arranged in a rectangular shape surrounding the waveguide terminal between the contact regions facing each other,
The waveguide terminal of the ceramic substrate is configured by a through hole arranged in a rectangular shape facing the waveguide terminal of the resin substrate inside the arrangement of the conductive bonding members arranged in the rectangular shape. And connected to a hermetic sealed high frequency circuit provided on the ceramic substrate,
The resin substrate is bonded to a metal material having a waveguide terminal provided with a rectangular hole on the surface opposite to the surface facing the ceramic substrate,
The waveguide terminal of the resin substrate is configured by providing a rectangular hole surrounded by the conductive joint member, and is connected to the waveguide terminal of the metal material ,
The plurality of conductive joining members are arranged in a double row in an annular shape around the waveguide terminal,
The conductive bonding members arranged in the outer row are connected to electrical terminals connected to the high-frequency circuit of the ceramic substrate, and are connected to the electrodes of the resin substrate and are arranged in the outer row. A waveguide connection section, wherein the high-frequency circuit is electrically connected to an external circuit through a joining member . The plurality of conductive joining members are solders having a spherical shape, a barrel shape, or a cylindrical shape,
The waveguide connection unit according to claim 1, wherein the two dielectric substrates are joined to each other by soldering. The plurality of conductive joining members are a metal object or a metal-containing object having a spherical shape, a barrel shape, or a cylindrical shape,
The waveguide connection part according to claim 1 or 2 , wherein the two dielectric substrates are joined by thermocompression bonding of the metal or metal-containing material. It said resin substrate, a waveguide connecting portion according to any one of claims 1 to 3, characterized in that, being constituted by a glass epoxy substrate. A distance L1 between the first conductive joining member rows arranged on two opposite sides of the rectangular circumference parallel to the short side of the waveguide terminal and the long side of the waveguide terminal The distance L2 between the second conductive joint member array arranged on two opposite sides of the rectangular circumference and the waveguide terminal end is set as the wavelength λ of the high-frequency signal passing through the waveguide terminal. Including the following relational expression λ × (0.7 to 1.3) = 2 / (1 / L1 ² + 1 / L2 ² ) ^1/2
Waveguide connecting portion according to any one of the set so as to satisfy Equation, claim 1, wherein 4. A gap between a plurality of rows of the conductive joint members parallel to each side of the waveguide terminal is within a range of ¼ wavelength ± 30% of a high-frequency signal passing through the waveguide terminal. , waveguide connecting portion according to claim 1, any one of 5, wherein the.

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