JP3765883B2 - Non-contact type IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a non-contact type IC card that transmits and receives data with an external device in a non-contact manner .
[0002]
[Prior art]
In recent years, an IC card on which an IC circuit using a semiconductor element is mounted has become widespread from the viewpoint of excellent data processing efficiency and security. Such IC cards include a contact type in which an external terminal is connected to a terminal of an external device to transmit / receive data, and a non-contact type in which an antenna is provided to transmit / receive data to / from an external device using electromagnetic waves. is there. Recently, the driving power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card that does not incorporate a battery is increasing.
[0003]
For example, as shown in FIG. 10, a conventional non-contact type IC card has a configuration in which an IC module including an IC chip 68 and an antenna 66 is incorporated between a front resin sheet 62 and a back resin sheet 64. It has become.
In this non-contact type IC card, in the manufacturing process, for example, a transparent oversheet and a white oversheet sandwich the upper and lower surfaces of a vinyl chloride resin in a sandwich shape and heat-press and compress it with a hot press to create an antenna, non-contact A concave portion matching the shape of a component such as a system IC module, a coil, a capacitor, and a battery is cut, and a front resin sheet 62 and a back resin sheet 64 are separately manufactured. Next, for example, after a thermosetting adhesive is applied to the back resin sheet 64, components such as the IC chip 68 and the antenna 66 are mounted according to the positions of the recesses, and the front resin sheet 62 is attached to the adhesive. It is pressed and laminated with a press until it is cured. Then, predetermined printing such as photographs, figures, and characters is performed on the surfaces of the front resin sheet 62 and the back resin sheet 64.
[0004]
[Problems to be solved by the invention]
However, in the above-described method for manufacturing a non-contact type IC card, after mounting components such as the IC chip 68, predetermined printing such as photographs, figures and characters is performed on the surface of the front resin sheet 62 and the back resin sheet 64. As a result, there is a problem in that printing performed on the surface of the front resin sheet 62 and the back resin sheet 64 may be defective. This is because, in a state where components such as the IC chip 68 are mounted, irregularities corresponding to these components are generated on the surface of the front resin sheet 62 and the back resin sheet 64, and the printing quality is deteriorated by the influence of the irregularities. Because.
[0005]
In addition, when a card is manufactured by sandwiching an electronic component between upper and lower vinyl chloride resin sheets and heating and compressing the card, the unevenness of the electronic component is reflected on the front or back resin sheet, and the surface is depressed. In some cases, warping or thermal sagging may occur due to the difference in thermal conductivity between the electronic component and the resin sheet, resulting in poor appearance, or failure due to pressure or heat applied to the electronic component.
[0006]
The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a method of manufacturing a non-contact type IC card that can perform high-quality printing on the surface of the non-contact type IC card.
Another object of the present invention is to provide a method of manufacturing a non-contact type IC card that can suppress appearance defects due to warpage or thermal sag during manufacturing .
[0007]
[Means for Solving the Problems]
According to the non-contact type IC card manufacturing method of the present invention, a dummy member made of a material that is not fused to the antenna base during hot pressing is incorporated from both sides of the antenna base incorporating the antenna having the connection terminals. The resin sheet is hot-pressed so that the connection terminal and the dummy member are in contact with each other, the second resin sheet is hot-pressed from the other side of the antenna base, and the first resin sheet that has been hot-pressed is connected. The circuit module is removed so that the connection terminal is exposed and the IC circuit is electrically connected to the connection terminal by removing the dummy member from the opposite side to the terminal and removing the dummy member. Install in the recess.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
First Embodiment Hereinafter, an embodiment of a method for manufacturing a non-contact type IC card according to a first embodiment of the present invention will be described.
[0013]
1 and 2 are diagrams for explaining a method of manufacturing a non-contact type IC card according to this embodiment.
First, as shown in FIG. 1, the thin resin films 2 and 4 and the substrate 3 are manufactured according to the shape of the non-contact type IC card to be manufactured. The resin films 2 and 4 and the substrate 3 are manufactured using, for example, glass epoxy, polyimide, PET (polyethylene terephthalate), or the like. Then, the coiled antenna 6 and the connection terminals 5a. 5b.
[0014]
Next, as shown in FIG. 1, lamination processing is performed in a state where the substrate 3 is sandwiched between the resin films 2 and 4 to manufacture the card substrate 7. Lamination processing of the resin films 2 and 4 and the substrate 3 is performed by so-called insert molding using a heat press, an adhesive, or the like, or by fixing the components in an injection mold and molding them integrally.
[0015]
Then, predetermined printing such as photographs, figures and characters is performed on the surface of the card substrate 7.
Next, as shown in FIG. 2, countersink processing is performed on the surface of the card substrate 7 to form a recess 7 a, and the connection terminals 5 a and 5 b printed on the surface of the substrate 3 are exposed.
[0016]
Next, as shown in FIG. 2, an adhesive is used so that the connection terminals 5a and 5b and the connection terminals 9a and 9b are electrically connected to the IC module 8 having the connection terminals 9a and 9b on the lower surface. Is inserted into the recess 7a of the card substrate 7 to complete the non-contact type IC card 1. In the bonding, a conductive adhesive is used for at least the bonding surfaces of the connection terminals 5a and 5b and the connection terminals 9a and 9b, respectively, so that the connection terminals 5a and 5b and the connection terminals 9a and 9b are insulated from each other. It is necessary to keep sex.
[0017]
The IC module 8 is configured by resin-molding a substrate on which an IC circuit using a semiconductor element or the like and other electronic components are mounted so that the connection terminals 9a and 9b are exposed.
As described above, in the non-contact type IC card manufacturing method according to the present embodiment, the IC chip and electronic components other than the antenna 6 are printed on the surface of the card substrate 7 that is not incorporated in the card substrate 7. Printing can be performed with high accuracy. That is, since no IC chip or electronic component other than the antenna 6 is incorporated in the card substrate 7 when printing is performed, the surface of the card substrate 7 has relatively little unevenness and favorable printing conditions. .
[0018]
In the non-contact type IC card manufacturing method according to the present embodiment, the card substrate 7 to be printed and the IC module 8 are manufactured separately, so that the yield is improved and the manufacturing time is shortened. Can do.
Hereinafter, the operation of the non-contact type IC card 1 manufactured by the manufacturing method according to the above-described embodiment will be described.
[0019]
For example, as shown in FIG. 3, an electric field corresponding to a communication signal from the data processing device is generated in the coil 73 through the amplifier 70, and the magnetic field from the coil 73 causes the magnetic field to be non-conductive to the antenna 6 of the non-contact type IC card 1. Induced by contact.
The current due to the electromotive force generated by the magnetic field induced in the antenna 6 is rectified by the rectifier circuit 72 via the capacitor C1, and the communication signal from the data processing device is sent to the IC chip 40 via the capacitor C2 and the resistor R. The IC chip 40 detects a communication signal from the data processing device based on this voltage.
[0020]
On the other hand, when a communication signal is output from the IC chip 40 to the data processing device, the signal is propagated in a flow reverse to the flow described above.
Second embodiment The method of manufacturing a non-contact type IC card according to the present embodiment is basically the same as the method of manufacturing the non-contact type IC card according to the first embodiment described above. The difference is that the anisotropic conductive film is used as an adhesive sheet, and the IC module 8 is fitted into the concave portion 7a of the card substrate 7 to be bonded.
[0021]
FIG. 4 is a view for explaining the method of manufacturing the non-contact type IC card of this embodiment.
In the non-contact type IC card manufacturing method of this embodiment, as shown in FIG. 4, the IC module 8 is fitted and fixed in the recess 7 a of the card substrate 7 through the anisotropic conductive film 10. The anisotropic conductive film 10 is a film having conductivity in the thickness direction and insulating properties in the surface direction. When the IC module 8 is fitted into the recess 7a, the connection terminals 9a and 9b and the connection terminals 5a and 5b are positioned to face each other through the anisotropic conductive film 10. Accordingly, the connection terminals 9a, 9b and the connection terminals 5a, 5b are electrically connected by the conductivity in the thickness direction of the anisotropic conductive film 10, and the connection terminals 5a, 5b and the connection terminals 9a, 9b are connected to each other. Insulation properties are maintained.
[0022]
Therefore, according to the manufacturing method of the non-contact type IC card according to the present embodiment, the card substrate 7 and the IC module 8 can be bonded by a simple method, and the yield is further improved and the manufacturing time is shortened. be able to.
The present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the case where printing is performed on the surface of the card substrate 7 after the card substrate 7 is manufactured is illustrated. However, the present invention may be applied to the resin films 2 and 4 before the card substrate 7 is manufactured, for example. You may make it print on the surface.
[0023]
In the above-described embodiment, the case where the card substrate 7 is subjected to countersink processing to form the concave portion 7a as the concave portion has been illustrated, but the present invention is, for example, the concave portion 7a integrally with the card substrate 7 at the time of injection molding. May be formed.
Third Embodiment FIG. 5 is a configuration diagram of the non-contact type IC card 11 of the present embodiment.
[0024]
As shown in FIG. 5, in the non-contact type IC card 11, resin films 13a and 13b are arranged so as to sandwich a substrate 14 on which an antenna (not shown) is configured from both sides. Further, oversheets 12a and 12b are arranged so as to sandwich the resin films 13a and 13b from both sides.
[0025]
Here, an antenna made of a copper foil having a thickness of about 15 to 30 μm is incorporated in the substrate 14. The substrate 14 is configured using glass epoxy or polyimide.
The resin films 13a and 13b and the oversheets 12a and 12b are made of vinyl chloride (PVP) or the like.
[0026]
In the non-contact type IC card 11, the thickness of the substrate 14 is 0.26 mm, the thickness of the resin films 13a and 13b is 1.15 mm, and the thickness of the oversheets 12a and 12b is 0.1 mm, respectively. It is 0.76 mm.
[0027]
Similarly to the first embodiment, the non-contact type IC card 11 has a concave portion formed by countersinking on the surface, and an IC module is fitted in the concave portion, and the antenna incorporated in the substrate 14 And the IC module are electrically connected. The IC module is realized by, for example, COB (Chip On Board).
[0028]
As shown in FIG. 5, the non-contact type IC card 11 is hot pressed from both sides in a state where the oversheet 12b, the resin film 13b, the substrate 14, the resin film 13a and the oversheet 12a are overlapped, and recessed by countersinking. And an IC module is mounted in the recess.
[0029]
At this time, the thermal conductivity of the resin films 13 a and 13 b is about 3 to 4 times higher than the thermal conductivity of the substrate 14. Therefore, if the thickness of the resin films 13a and 13b is different, warping and heat sagging may occur when performing hot pressing. However, according to the non-contact type IC card 11, the thickness of the resin films 13a and 13b is reduced. By making them equal, it is possible to effectively suppress the occurrence of such warpage and thermal sag.
[0030]
Fourth Embodiment FIG. 6 is a configuration diagram of the non-contact type IC card 21 of the present embodiment.
The non-contact type IC card 21 uses two layers of substrates 24a and 24b incorporating an antenna. The reason why the antenna is formed in two layers is to obtain a desired output.
[0031]
As shown in FIG. 6, the non-contact type IC card 21 has a configuration in which the core substrate 25 is sandwiched between the substrates 24a and 24b from both sides, and the substrates 24a and 24b are sandwiched between the oversheets 22a and 22b from both sides.
Here, antennas made of copper foil having a thickness of about 15 to 30 μm are incorporated in the substrates 24a and 24b. The substrates 24a and 24b are made of glass epoxy or polyimide. The substrate 24a and the core substrate 25 are configured using vinyl chloride or the like.
[0032]
According to the non-contact type IC card 21, by making the thickness of the substrates 24a and 24b equal, the configuration in the thickness direction of the card is vertically symmetrical with respect to the core substrate 25, which is the same as in the case of the third embodiment described above. In addition, it is possible to effectively suppress warping and thermal sagging of the card during the manufacturing process.
[0033]
Fifth embodiment Fig. 7 is a diagram for explaining a non-contact type IC card 31 according to this embodiment.
The non-contact type IC card 31 is basically the same as the non-contact type IC card 1 of the first embodiment described above.
[0034]
However, in the non-contact type IC card 31, the thickness in the vicinity of the connection terminals 5a and 5b of the antenna 6 incorporated in the base body 3 shown in FIGS.
For example, when the tolerance of the countersinking is 10 to 50 μm, the thickness near the connection terminals 5a and 5b is set to 35 μm to 100 μm.
[0035]
Accordingly, it is possible to effectively suppress the connection terminals 5a and 5b from being scraped off when the IC module mounting recess is formed by countersinking.
Sixth Embodiment FIG. 8 is a diagram for explaining a manufacturing process of the non-contact type IC card 41 according to the present embodiment.
[0036]
The configuration of the non-contact type IC card 41 is basically the same as the non-contact type IC card 11 of the third embodiment described above.
As shown in FIG. 8, in the manufacturing process of the non-contact type IC card 41, first, the oversheet 42b, the resin film 43b, the substrate 44, the resin film 43a, and the oversheet 42a are hot pressed from both sides. Thus, the card base 41b is manufactured.
[0037]
Here, the antenna is incorporated in the substrate 44 by a copper foil having a thickness of about 15 to 30 μm, and connection terminals 5a and 5b are provided at the ends of the antenna. The substrate 44 is configured using PVC or polycarbonate (PC).
The resin films 43a and 43b are configured using PVC or the like. The oversheets 42a and 42b are configured using PVC or the like.
[0038]
A dummy spacer 45 used for forming the concave portion 41a for mounting the IC module 8 is incorporated in the resin film 43a. The dummy spacer 45 is arranged so as to be in contact with the connection terminals 5a and 5b formed on the substrate 44 at the time of hot pressing according to the position of the recess 41a to be finally formed.
[0039]
The dummy spacer 45 is made of PET (polyethylene terephthalate), polyimide, or the like that is not thermally fused to the base body 44 during hot pressing. Further, the size and shape of the dummy spacer 45 are determined according to the IC module 8.
[0040]
The thickness of the substrate 44 is 0.26 mm, the thickness of the resin films 43a and 43b is 0.15 mm, the thickness of the oversheets 42a and 42b is 0.1 mm, respectively, and the thickness of the base body 41b is 0.76 mm as a whole. Yes.
Next, the oversheet 42a and the resin film 43a are subjected to countersink processing to form a recess 41a1 that becomes a part of the recess 41a in which the IC module 8 is mounted. At this time, the countersinking is performed up to a position reaching the surface of the dummy spacer 45. Further, the countersinking process is performed to a depth reaching the vicinity of the resin film 43b, and a recess 41a3 that finally becomes a part of the recess 41a is formed. Here, the concave portion 41a3 is a portion that accommodates the mold portion including the IC and the capacitor of the IC module 8 when the IC module 8 is mounted.
[0041]
Next, the dummy spacer 45 is removed to form a recess 41a2 that becomes a part of the recess 41a. Thereby, the recessed part 41a comprised by recessed part 41a1, 41a2, 41a3 is completed.
Then, the IC module 8 is mounted and fixed in the recess 41a, and the connection terminals 5a and 5b of the card base and the connection terminals 8b and 8c of the IC module are conducted through an anisotropic conductive sheet.
[0042]
As described above, according to the manufacturing method of the non-contact type IC card 41, the connection terminals 5a and 5b are recessed by using the dummy spacer 45 without damaging the connection terminals 5a and 5b by the countersink process. 41a can be exposed. As a result, the yield in the thermal process in the manufacturing process of the non-contact type IC card 41 can be improved.
[0043]
Seventh Embodiment FIG. 9 is a diagram for explaining a manufacturing process of the non-contact type IC card 51 according to the present embodiment.
In the manufacturing process of the non-contact type IC card 51, as shown in FIG. 9, injection molding is performed using a mold 52 composed of an upper mold 52a and a lower mold 52b provided with a movable piece 53 at a predetermined position. Done. The mold 52 has a shape corresponding to the non-contact type IC card 51 to be manufactured.
[0044]
First, as shown in FIG. 9 (A), the antenna is assembled from the state where a predetermined gap is maintained between the upper mold 52a and the lower mold 52b as shown in FIG. 9 (B) through the gap. The substrate 54 is inserted. At this time, the substrate 54 is arranged so that the connection terminals 55 a and 55 b positioned at the end of the antenna incorporated in the substrate 54 are positioned to face the lower surface of the movable piece 53.
[0045]
Next, as shown in FIG. 9C, the movable piece 53 is lowered toward the connection terminals 55a and 55b of the substrate 54, and the connection terminals 55a and 55b are pressed as shown in FIG. 9D. . At this time, the pressing force by the movable piece 53 is determined in consideration of the strength of the substrate 54. The substrate 54 is configured using, for example, glass epoxy or polyimide.
[0046]
Next, as shown in FIG. 9 (D), vinyl chloride, acrylonitrile-butadiene-styrene copolymer (ABS), or the like, which becomes a resin film of the non-contact type IC card 51, is provided through the resin injection port 52a1. Resin is injected and compressed to form a card. At this time, since the lower surface of the movable piece 53 is pressed against the connection terminals 55a and 55b, no resin is formed on the connection terminals 55a and 55b.
[0047]
Next, as shown in FIG. 9E, the movable piece 53 is moved upward to complete the molding process.
As described above, according to the manufacturing method of the non-contact type IC card of the present embodiment, the exposure of the connection terminals 55a and 55b and the molding of the card are simultaneously performed, thereby reducing the manufacturing process and reducing the cost. Manufacturing time can be shortened.
[0048]
【The invention's effect】
As described above, according to the non-contact type IC card manufacturing method of the present invention, it is possible to perform printing on the card substrate with high accuracy.
In the non-contact type IC card manufacturing method of the present invention, since the card manufacturing including the antenna and the line module are manufactured in separate processes, and the line module is finally attached to the card and integrated, the yield is improved. In addition, the manufacturing time can be shortened.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a method of manufacturing a non-contact type IC card according to a first embodiment of the present invention.
FIG. 2 is a view for explaining a method of manufacturing a non-contact type IC card according to the first embodiment of the present invention.
FIG. 3 is a diagram for explaining a communication form of the non-contact type IC card shown in FIGS. 1 and 2;
FIG. 4 is a diagram for explaining a non-contact type IC card manufacturing method according to a second embodiment of the present invention.
FIG. 5 is a configuration diagram of a non-contact type IC card according to a third embodiment of the present invention.
FIG. 6 is a configuration diagram of a non-contact type IC card according to a fourth embodiment of the present invention.
FIG. 7 is a diagram for explaining a non-contact type IC card manufacturing process according to a fifth embodiment of the present invention.
FIG. 8 is a diagram for explaining a non-contact type IC card manufacturing process according to a sixth embodiment of the present invention.
FIG. 9 is a view for explaining a non-contact type IC card manufacturing process according to a seventh embodiment of the present invention.
FIG. 10 is a diagram for explaining a conventional method of manufacturing a non-contact type IC card.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 2, 4 ... Resin film 3 ... Board | substrate 5a, 5b, 9a, 9b ... Connection terminal 6 ... Antenna 7 ... Card board 7a ... Recessed part 8 ... IC module 8a ... Resin mode part 8b, 8c ... Connection terminal 10 ... Anisotropic conductive film 11, 21, 41 ... Non-contact type IC cards 12a, 12b, 22a, 22b ... Oversheets 13a, 13b ... Resin films 14, 24a, 24b ... Substrate (with antenna incorporated)
25 ... Core substrate 45 ... Dummy spacer 51 ... Non-contact IC card 52 ... Mold 53 ... Movable top

Claims (1)

A first resin sheet incorporating a dummy member made of a material that does not fuse with the antenna substrate during hot pressing from one side of the antenna substrate incorporating the antenna having the connection terminal, the connection terminal and the dummy member And press the second resin sheet from both sides of the antenna base,
Cutting the hot-pressed first resin sheet to a position reaching all the dummy members from the side opposite to the connection terminal,
By removing the dummy member, a concave portion where the connection terminal is exposed is formed,
A method for manufacturing a non-contact type IC card, wherein a circuit module is mounted in the recess so as to electrically connect an IC circuit to the connection terminal.

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