JP3799043B2 - Soaking equipment - Google Patents

Description

  The present invention relates to a heat equalizing apparatus capable of uniformly heating or cooling an object to be processed or molded on a surface plate, such as a synthetic resin molded product or a semiconductor wafer.

  As a conventional soaking apparatus, there is one disclosed in Patent Document 1, for example. Further, as an improvement, there is Patent Document 2, and an outline thereof is shown in FIGS. 17 and 18. In each of these drawings, 1 is a product to be molded such as a synthetic resin molded product or a semiconductor wafer. For example, a surface plate 3 on which a plurality of flow passages 2 made of concentric annular grooves are formed, 3 is a plate-like member joined to the surface plate 1 so as to cover the flow passages 2 formed on the surface plate 1, A part of the plate-like member 3 protrudes outward, communicates with the inside of the flow passage 2, and stores a working fluid 5 that is sealed after the inside of the flow path 2 is vacuum-depressed. This is a storage body that penetrates through the body 4 and is immersed in the hydraulic fluid 5 to store the heater 7 therein.

  Next, the operation will be described. When the molded product needs to be heat-molded, the molded product is placed on the surface plate 1, and the heater 7 inside the container 6 that is immersed in the working liquid 5 through the liquid reservoir 4 is energized. . The hydraulic fluid 5 is heated through the storage body 6 by energization of the heater 7. The heated hydraulic fluid 5 evaporates and spreads through the flow path 2 of the surface plate 1 to the entire surface of the surface plate 1, and the latent heat is transferred to the surface plate 1 part through the wall surface of the flow path 2 to heat-mold the product to be molded. . The vapor of the hydraulic fluid 5 deprived of latent heat condenses and liquefies on the wall surface of the flow passage 2 and recirculates to the liquid reservoir 4 again. By performing a series of these operations, the product to be molded is uniformly heated on the surface of the surface plate 1.

JP-A-6-278139 JP-A-8-89508

  However, the above-described conventional apparatus has a structure in which the heat generated from the heater 7 is transferred to the surface of the surface plate 1 by the latent heat of the working fluid 5 sealed in the liquid reservoir 4 after the vacuum pressure reduction. And the storage body 6 that stores the heater 7, a thermal resistance is increased and heat transfer efficiency is reduced, so that the surface of the surface plate 1 cannot be uniformly and efficiently heated. There was a point.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat equalizing apparatus capable of heating a surface plate surface uniformly and efficiently.

  A heat equalizing apparatus according to claim 1 of the present invention is a platen on which a product to be molded is placed and a flow passage is formed, and a plate shape joined to the platen so as to cover the flow passage formed on the platen. A member, a part of the plate-like member protruding outward, a liquid reservoir that communicates with the inside of the flow passage and stores the working fluid, a heat source disposed outside the liquid reservoir, a liquid A heat source installation part that is formed on the outer peripheral surface of the reservoir and installs the heat source, and a pressing plate that attaches the heat source installed in the heat source installation part to the liquid reservoir are provided.

  According to a second aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow passage is formed, and a plate-like member joined to the platen so as to cover the flow passage formed on the platen. A part of the plate-like member that protrudes outward, a fluid reservoir that stores the working fluid in communication with the inside of the flow path, a hole formed in a part of the fluid reservoir, and the hole And a heat source that is detachably attached to the liquid reservoir and a heat source that penetrates the working fluid sealed in the liquid reservoir through the hole and through the hole.

  According to a third aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow passage is formed, and a plate-like member joined to the platen so as to cover the flow passage formed on the platen. And a reservoir that is formed by projecting a part of the plate-like member outward, communicates with the inside of the flow passage and stores the working fluid, and a storage that is immersed in the working fluid through the reservoir. And a heat source that is mounted in the storage body and includes an insulator and a heating element disposed in the insulator.

  According to a fourth aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow passage is formed, and a plate-like member joined to the platen so as to cover the flow passage formed on the platen. And a reservoir that is formed by projecting a part of the plate-like member outward, communicates with the inside of the flow passage and stores the working fluid, and a storage that is immersed in the working fluid through the reservoir. A body and a heat source that is mounted in the storage body and is arranged with the positions of both ends spaced apart from the end face of the storage body toward the center side.

  According to a fifth aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow path is formed, and a plate shape joined to the surface plate so as to cover the flow path formed on the surface plate. A member, and a part of the plate-like member protruding outward, a liquid reservoir that stores the working fluid in communication with the inside of the flow path, and is immersed in the working fluid through the liquid reservoir, The storage body in which the dimension of both ends is formed larger than the dimension of the central part, and the heat source that is mounted in the storage body and the positions of both ends are arranged at the end of the central part of the storage body are provided.

  According to a sixth aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow path is formed, and a plate shape joined to the surface plate so as to cover the flow path formed on the platen. A member, a liquid reservoir that is formed by projecting a part of the plate-like member outward, communicates with the inside of the flow passage, and stores the working fluid; and a storage body that is immersed in the working fluid in the fluid reservoir. And a connection body that is made of a material having a lower thermal conductivity than the storage body, attaches the storage body to the liquid reservoir, and a heat source mounted in the storage body.

  A heat equalizing apparatus according to claim 1 of the present invention is a platen on which a product to be molded is placed and a flow passage is formed, and a plate shape joined to the platen so as to cover the flow passage formed on the platen. A member, a part of the plate-like member protruding outward, a liquid reservoir that communicates with the inside of the flow passage and stores the working fluid, a heat source disposed outside the liquid reservoir, a liquid The heat source can be easily fixed by providing a heat source installation part that is formed on the outer peripheral surface of the reservoir, and a holding plate that attaches the heat source installed in the heat source installation part to the liquid reservoir. In addition, since the adhesiveness between the liquid reservoir and the heat source is further improved by pressing the heat source with the presser plate, the thermal resistance due to the contact can be reduced.

  According to a second aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow passage is formed, and a plate-like member joined to the platen so as to cover the flow passage formed on the platen. A part of the plate-like member that protrudes outward, a fluid reservoir that stores the working fluid in communication with the inside of the flow path, a hole formed in a part of the fluid reservoir, and the hole And a heat source immersed in the working fluid sealed in the liquid reservoir through the hole and through the hole, and a heat source immersed in the liquid reservoir. There is no need to consider the gap, and the heat generated from the heat source is directly transmitted to the working fluid as it is, so that the thermal resistance can be remarkably reduced and the thermal efficiency can be greatly improved.

  According to a third aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow passage is formed, and a plate-like member joined to the platen so as to cover the flow passage formed on the platen. And a reservoir that is formed by projecting a part of the plate-like member outward, communicates with the inside of the flow passage and stores the working fluid, and a storage that is immersed in the working fluid through the reservoir. And a heat source that is mounted in the storage body and includes an insulator and a heating element disposed in the insulator, so that the heat source is filled with the insulator and integrated with the storage body. Therefore, it is not necessary to consider any gap between the heat source and the storage body, and assemblability can be improved.

  According to a fourth aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow passage is formed, and a plate-like member joined to the platen so as to cover the flow passage formed on the platen. And a reservoir that is formed by projecting a part of the plate-like member outward, communicates with the inside of the flow passage and stores the working fluid, and a storage that is immersed in the working fluid through the reservoir. The heat resistance between the heat source and the end surface of the storage body is increased by providing a body and a heat source that is mounted in the storage body and is arranged with the positions of both ends spaced apart from the end surface of the storage body toward the center portion. Thus, heat transmitted from the end wall of the storage body to the liquid reservoir wall and directly transmitted to the surface of the surface plate can be reduced, and the soaking characteristic of the surface of the surface plate can be further improved than that of the above-mentioned claims. be able to.

  According to a fifth aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow path is formed, and a plate shape joined to the surface plate so as to cover the flow path formed on the surface plate. A member, and a part of the plate-like member protruding outward, a liquid reservoir that stores the working fluid in communication with the inside of the flow path, and is immersed in the working fluid through the liquid reservoir, By providing a storage body in which the dimensions of both ends are larger than the dimensions of the central part, and a heat source that is mounted in the storage body and the positions of both ends are arranged at the end of the central part of the storage body. The heat directly transmitted to the board surface can be reduced, and the same effect as that of the above-described fourth aspect can be achieved. In addition, by providing a gap between both ends of the heat source and both ends of the storage body, the size of the heat source can be increased, so the amount of heat generated per unit area is reduced and the life of the heat source is compared. Can be maintained for a long time.

  According to a sixth aspect of the present invention, there is provided a platen on which a product to be molded is placed and a flow path is formed, and a plate shape joined to the surface plate so as to cover the flow path formed on the platen. A member, a liquid reservoir that is formed by projecting a part of the plate-like member outward, communicates with the inside of the flow passage, and stores the working fluid; and a storage body that is immersed in the working fluid in the fluid reservoir. And a connection body for attaching the storage body to the liquid reservoir, and a heat source mounted in the storage body, thereby providing a connection between the both ends of the heat source and the connection body. There is a gap between them, and the same effect as that of claim 5 described above can be obtained. Furthermore, since the connection body located between the storage body and the liquid reservoir is made of a material having a lower thermal conductivity than the storage body, it is transferred from the heat source to the storage body, greatly increasing the heat transfer to the liquid reservoir wall. The soaking characteristic can be improved from the above-mentioned claim 10.

Embodiment 1 FIG.
A first embodiment of the present invention will be described below with reference to FIGS. In these drawings, 1 is a surface plate, 2 is a flow passage, 3 is a plate-like member, 4 is a liquid reservoir, 5 is working fluid, 6 is a heat source consisting of a heater, for example. 8 is a boiling accelerator that is disposed on the outer periphery of the storage body 6 and promotes the boiling of the hydraulic fluid 5, and is composed of a porous body such as a wick or a wire mesh.

  Next, the operation will be described. When the molded product needs to be heat-molded, the molded product is placed on the surface plate 1, and the heat source 7 inside the container 6 that is immersed in the working fluid 5 through the liquid reservoir 4 is energized. . The hydraulic fluid 5 is heated via the storage body 6 by energization of the heat source 7. The heated hydraulic fluid 5 evaporates and spreads through the flow path 2 of the surface plate 1 to the entire surface of the surface plate 1, and the latent heat is transferred to the surface plate 1 part through the wall surface of the flow path 2 to heat-mold the product to be molded. . The vapor of the hydraulic fluid 5 deprived of latent heat condenses and liquefies on the wall surface of the flow passage 2 and recirculates to the liquid reservoir 4 again. By performing a series of these operations, the product to be molded is uniformly heated on the surface of the surface plate 1. In this case, the heat amount of the heat source 7 is diffused from the vapor of the working fluid 5 into the inside of the closed vessel including the flow passage 2 and the liquid reservoir 4, and heat is transferred by condensation on the wall surface of the flow passage 2. One surface can be heated uniformly.

  Moreover, in this Embodiment 1, the boiling promotion body 8 comprised, for example from a wick, a wire net, etc. is arrange | positioned in the outer peripheral part of the storage body 6, and the promotion of the boiling of the hydraulic fluid 5 and a heat-transfer area are increased. It is possible to reduce the thermal resistance in boiling and vaporization, so that it is possible to obtain a heat equalizing device having excellent thermal efficiency.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIG. In FIG. 2, reference numeral 9 denotes a surface treatment applying body that is formed on the outer peripheral portion of the storage body 6 and promotes boiling of the hydraulic fluid 5, and is applied to the porous body by surface treatment such as spraying.

  In this Embodiment 2, since it has the same effect as Embodiment 1 mentioned above, and also the surface treatment construction body 9 was formed in the outer peripheral part of the storage body 6 by surface treatment, implementation mentioned above Since it is not necessary to fix the boiling promotion body 8 to the storage body 6 as in the first embodiment, the assemblability is improved.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIG. In FIG. 3, reference numeral 10 denotes a high heat conductive material made of, for example, heat transfer grease or the like filled in a gap between the housing 6 and the heat source 7.

  In the third embodiment, for example, a high thermal conductive material 10 made of heat transfer grease or the like is filled in a gap between the housing body 6 and the heat source 7, so that the thermal resistance between the housing body 6 and the heat source 7 is reduced. It is possible to obtain a heat equalizing device that can be reduced in size and further improved in thermal efficiency. Moreover, when the high heat conductive material 10 to be filled is a material having high fluidity, a lid 11 may be installed at the end of the housing 6, and thus the filling operation can be performed even with the high heat conductive material 10 having high fluidity. It can be done easily.

Embodiment 4 FIG.
Embodiment 4 of the present invention will be described with reference to FIG. In FIG. 4, reference numeral 12 denotes a storage body that penetrates the liquid reservoir 4 and is immersed in the hydraulic fluid 5, and 13 has the same dimensions as the internal dimensions of the storage body 12 or larger than the internal dimensions of the storage body 12, It is a heat source composed of, for example, a heater that is press-fitted into the storage body 12. That is, the inner dimension of the storage body 12 is the same as the outer dimension of the heat source 13 or smaller than the outer dimension of the heat source 13.

  In the fourth embodiment, since the heat source 13 is press-fitted into the storage body 12, there is no gap between the storage body 12 and the heat source 13, so that the high heat conductive material 10 is not filled as in the third embodiment described above. Thermal resistance can be reduced, and thermal efficiency and workability can be further improved. Moreover, since the heat source 13 is firmly fixed to the storage body 12 by press-fitting, it is not necessary to consider a fixing method of the heat source 13.

Embodiment 5. FIG.
Embodiment 5 of the present invention will be described with reference to FIG. In FIG. 5, reference numeral 14 denotes a planar heat source disposed in contact with the outer peripheral surface of the liquid reservoir 4, for example, the outer peripheral wall at the bottom of the liquid reservoir 4.

  In the fifth embodiment, since the planar heat source 14 is disposed in contact with the outer peripheral wall of the liquid reservoir 4, the heat resistance is improved by the gap between the heat source and the storage body as in the above-described embodiments. Can be easily performed, and the heat source 14 can be easily attached and replaced, and the maintenance can be improved. Further, even if the heat source 14 is arranged in contact with the outer peripheral wall of the side portion of the liquid reservoir 4, the same effect can be obtained.

Embodiment 6 FIG.
A sixth embodiment of the present invention will be described with reference to FIG. In FIG. 6, 15 is formed by projecting a part of the plate-like member 3 outward, and is connected to the inside of the flow passage 2 to store the hydraulic fluid 5, and 16 is the outside of the liquid reservoir 15. For example, a heat source comprising a heater or the like, 17 is formed by, for example, recessing the bottom of the liquid reservoir 15 toward the inside of the liquid reservoir 15, a heat source installation portion for installing the heat source 16, and 18 a heat source installation portion 17. It is a presser plate that attaches the heat source 16 installed to the liquid reservoir 15.

  In the sixth embodiment, the heat source 16 is installed in the heat source installation portion 17 formed by indenting the bottom of the liquid reservoir 15 to the inside thereof, and is fixed by the presser plate 18. Fixing can be easily performed, and by pressing the heat source 16 with the pressing plate 18, the adhesion between the liquid reservoir 15 and the heat source 16 is further improved, so that the thermal resistance due to contact can be reduced. Furthermore, since assembly is possible by screwing or the like, the assemblability can be improved. Further, even if the heat source installation portion 17 is disposed on the side portion of the liquid reservoir 15, the same effect can be obtained.

Embodiment 7 FIG.
A seventh embodiment of the present invention will be described with reference to FIG. In FIG. 7, 19 is a hole formed in a part of the liquid reservoir 4, 20 is a flange that closes the hole 19 and is detachably attached to the liquid reservoir 4, and 21 passes through the flange 20 and passes through the hole 19. It is a heat source consisting of, for example, a heater or the like immersed in the working fluid 5 sealed in the liquid reservoir 4 through.

  In the seventh embodiment, since the heat source 21 is immersed in the hydraulic fluid 5, there is no need to consider the gap between the heat source and the storage body as in the first to fourth embodiments, and the heat source 21. Since the heat generated from the heat is directly transferred to the hydraulic fluid 5 as it is, the thermal resistance can be remarkably reduced, and the thermal efficiency can be greatly improved. Further, since the flange 20 is provided on the heat source 21 and is detachably attached to the liquid reservoir 4 by screws or the like, the heat source 21 can be easily attached or replaced.

Embodiment 8 FIG.
An eighth embodiment of the present invention will be described with reference to FIG. In FIG. 8, reference numeral 22 denotes a heat source that is mounted in the storage body 4 and includes an insulator 22 a that is filled in the storage body 4 and a heating element 22 b that includes a heating wire or the like disposed in the insulator 22 a. .

  In the eighth embodiment, since the heat source 22 is integrated with the storage body 4 by filling the storage body 4 with the insulator 22a, there is no need to consider any gap between the heat source and the storage body. Assembling property can be improved.

Embodiment 9 FIG.
A ninth embodiment of the present invention will be described with reference to FIG. In FIG. 9, reference numeral 23 denotes a heat source composed of, for example, a heater or the like that is mounted in the storage body 4 and is disposed with the positions of both end portions 23 a spaced apart from the end surface of the storage body 4 by L dimension. That is, the heat source 23 is made shorter than that of the above-described embodiment, and the entire heat source 23 is stored inside the storage body 4.

  In the ninth embodiment, since the positions of both end portions 23a of the heat source 23 are spaced apart from the end face of the storage body 4 by the L dimension and located at the center portion side, between the heat source 23 and the end face of the storage body 4 The heat resistance of the surface plate 1 can be reduced from the end wall of the storage body 4 through the liquid storage body 4 wall, and the heat directly transmitted to the surface of the surface plate 1 can be reduced. The soaking characteristic of the surface can be further improved.

Embodiment 10 FIG.
A tenth embodiment of the present invention will be described with reference to FIG. In FIG. 10, a storage body 24 penetrates the liquid reservoir 4 and is immersed in the hydraulic fluid 5, and the size of both end portions 24 a is larger than that of the central portion 24 b, and 25 is mounted in the storage body 24. The central portion 25a is located at the central portion 24b of the storage body 24, and the positions of both end portions 25b are heat sources such as heaters disposed at the both end portions 24a of the storage body 24. A gap is formed between both ends 24 a of the body 24.

  In the tenth embodiment, the gap formed between the both end portions 25b of the heat source 25 and the both end portions 24a of the storage body 24 is transmitted from the wall of the both end surfaces 24a of the storage body 24 to the wall of the liquid reservoir 4 and fixed. The heat directly transmitted to the surface of the board 1 can be reduced, and the same effect as in the ninth embodiment described above can be obtained. Further, by providing a gap between both end portions 25b of the heat source 25 and both end portions 24a of the storage body 24, the size of the heat source 25 can be increased, so that the amount of heat generated per unit area is reduced. The life of the heat source 25 can be maintained relatively long.

Embodiment 11 FIG.
An eleventh embodiment of the present invention will be described with reference to FIG. In FIG. 11, reference numeral 26 denotes a storage body that is immersed in the hydraulic fluid 5 in the liquid storage body 4, and 27 and 28 are made of a material having a lower thermal conductivity than the storage body 26, and the storage body 26 is stored in the liquid storage body 26. The connection body is attached to the body 4, and the figure shows, as an example, a case where the storage body 26 is located on the inner side of the connection bodies 27 and 28, and is fixed by welding or the like, for example. Reference numeral 29 denotes a heat source composed of, for example, a heater or the like mounted in the storage body 26.

  In the eleventh embodiment, since the storage body 26 is located on the inner side of the connection bodies 27 and 28, a gap is generated between both ends of the heat source 29 and the connection bodies 27 and 28, and the above-described implementation is performed. There exists an effect similar to the form 10. Further, since the connecting bodies 27 and 28 positioned between the storage body 26 and the liquid reservoir 4 are made of a material having a lower thermal conductivity than the storage body 26, the connection bodies 27 and 28 are transmitted from the heat source 29 to the storage body 26 and stored in the liquid reservoir Heat transfer to the wall of the body 4 can be greatly reduced, and soaking characteristics can be improved as compared with the tenth embodiment described above.

  By the way, in FIG. 11 described above, the connection bodies 27 and 28 and the housing body 26 are fixed by welding. However, as shown in FIG. be able to.

Embodiment 12 FIG.
A twelfth embodiment of the present invention will be described with reference to FIGS. In each of these drawings, 1 is a surface plate, 2 is a flow passage, 3 is a plate-like member, 30 is provided on the outer peripheral portion of the surface plate 1, and a liquid phase portion 30a for storing the working fluid 31 and the liquid phase portion 30a. A liquid reservoir having an upper gas phase portion 30b, 32 is a heat source composed of, for example, a heater disposed around the liquid phase portion 30a of the liquid reservoir 30, and the figure shows an example of the liquid reservoir as shown by a solid line. Although the case where it provides in the outer peripheral wall of 30 liquid phase parts 30a is shown, as shown by a broken line, you may provide in the peripheral wall inside the bottom part of liquid phase part 30a, or the inside of liquid phase part 30a. Reference numeral 33 denotes a heat insulating material attached to the plate-like member 3 below the surface plate 1.

  In the twelfth embodiment, the working fluid 31 in the liquid phase portion 30 a of the liquid reservoir 30 is also heated by the heat source 32 from the outer peripheral portion of the surface plate 1. The heated working fluid 31 is evaporated and spreads over the entire gas phase portion 30 b of the liquid reservoir 30 located on the outer peripheral portion of the surface plate 1, and the latent heat is thermally transported to the outer peripheral portion of the surface plate 1. The vapor of the hydraulic fluid 31 that has been deprived of latent heat is condensed and liquefied and recirculated into the liquid phase portion 30 a of the liquid reservoir 30. By performing these series of operations, heat can be transported also from the outer peripheral portion of the surface plate 1, heat radiation from the outer peripheral portion of the surface plate 1 can be prevented, and the outer peripheral portion of the surface temperature distribution of the surface plate 1 can be prevented. Temperature drop can be prevented, and stable soaking characteristics can be obtained. Further, the heat insulating material 33 can prevent heat radiation from the lower side of the surface plate 1, thereby improving the surface temperature distribution of the surface plate 1 and reducing heat loss.

  By the way, in FIG. 13 and FIG. 14 described above, the case where the liquid phase portion 30a of the liquid reservoir 30 has a single layer structure has been described, but as shown in FIG. 15, the liquid phase portion 30a of the liquid reservoir 30 is defined as an outer layer portion. An area in which the entire heat radiation surface of the heat source 32 is in thermal contact with the working liquid 31 by providing a two-layer structure with the inner layer portion and disposing the heat source 32 on the peripheral wall between the outer layer portion and the inner layer portion of the liquid phase portion 30a. Therefore, the amount of steam generated from the hydraulic fluid 31 can be increased, the thermal resistance can be reduced, and the thermal efficiency can be further improved.

Embodiment 13 FIG.
A thirteenth embodiment of the present invention will be described with reference to FIG. In FIG. 16, 34 is provided on the outer periphery of the surface plate 1, a liquid phase part 34 a for storing the hydraulic fluid 35, and a liquid reservoir body having a gas phase part 34 b above the liquid phase part 34 a, 36 is the surface plate 1. A plate that is attached to the liquid reservoir 34 so as to cover the flow passage 2 formed on the inner surface of the liquid reservoir 34 and to be in communication with the liquid reservoir 34 and to facilitate the circulation of the working fluid 35 from the flow passage 2. A member 37 is a heat source such as a heater disposed around the liquid phase portion 34a of the liquid reservoir 34.

  In the thirteenth embodiment, the working fluid 35 in the liquid phase part 34 a of the liquid reservoir 34 is heated by the heat source 37. The heated working fluid 35 evaporates and spreads over the entire gas phase portion 34 b of the liquid reservoir 34 located on the outer peripheral portion of the surface plate 1 and also spreads over the entire flow path 2 of the surface plate 1. The vapor of the hydraulic fluid 35 spreading over the entire flow path 2 of the surface plate 1 passes the latent heat to the surface plate 1 part on the wall surface of the flow path 2 to heat-mold the product to be molded, and the latent heat is deprived of the hydraulic fluid 35 deprived from The steam condenses and liquefies on the wall surface of the flow passage 2 and circulates in the liquid phase portion 34 a of the liquid reservoir 34 along the inclined surface of the plate-like member 36. On the other hand, the vapor of the hydraulic fluid 35 spreading over the entire gas phase portion 34b of the liquid reservoir 34 heats the latent heat to the outer peripheral portion of the surface plate 1, and the vapor of the hydraulic fluid 35 deprived of the latent heat is condensed and liquefied. Then, the liquid recirculates again in the liquid phase portion 34 a of the liquid reservoir 34. By performing these series of operations, heat can be transported from both the inner and outer peripheries of the surface plate 1, heat radiation from the outer peripheral portion of the surface plate 1 can be prevented, and the outer peripheral portion of the surface temperature distribution of the surface plate 1 can be prevented. Temperature drop can be prevented, and stable soaking characteristics can be obtained. Further, by providing the plate member 36 with an inclination, the working fluid 35 condensed and liquefied in the flow passage 2 of the surface plate 1 can smoothly circulate in the liquid phase portion 34a of the liquid reservoir 34. It is possible to prevent a phenomenon in which the hydraulic fluid 35 does not return smoothly to the liquid phase portion 34a of a certain liquid reservoir 34 and die, and a stable operation can be performed.

It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 1 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 2 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 3 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 4 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 5 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 6 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 7 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 8 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 9 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 10 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 11 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 11 of this invention. It is a top view which shows the heat equalization apparatus by Embodiment 12 of this invention. It is a cross-sectional view which shows the heat equalizing apparatus by Embodiment 12 of this invention. It is a cross-sectional view which shows the heat equalizing apparatus by Embodiment 12 of this invention. It is a cross-sectional view which shows the heat equalization apparatus by Embodiment 13 of this invention. It is a top view which shows the conventional heat equalization apparatus. It is a cross-sectional view showing a conventional heat equalizer.

Explanation of symbols

1 surface plate, 2 flow passages, 3,36 plate-like member, 4, 15, 30, 34 liquid reservoir,
5, 31, 35 hydraulic fluid, 6, 12, 24, 26 container,
7, 13, 14, 16, 21, 22, 23, 25, 29, 32, 37 heat source,
8 Boiling accelerating body, 9 Surface treatment construction body, 10 High heat conduction material, 17 Heat source installation part,
18 presser plate, 19 holes, 20 flange, 22a insulator, 22b heating element,
23a both ends, 24a end, 24b center, 27, 28 connection body,
30a, 34a Liquid phase part, 30b, 34b Gas phase part.

Claims (6)

A platen on which a product to be molded is placed and a flow passage is formed; a plate-like member joined to the platen so as to cover the flow passage formed in the platen; and one of the plate-like members A reservoir that communicates with the inside of the flow passage and stores the working fluid, a heat source that is disposed outside the reservoir, and an outer peripheral surface of the reservoir. A heat equalizing apparatus, comprising: a heat source installation portion for installing the heat source; and a presser plate for attaching the heat source installed in the heat source installation portion to the liquid reservoir. A platen on which a product to be molded is placed and a flow passage is formed; a plate-like member joined to the platen so as to cover the flow passage formed in the platen; and one of the plate-like members A liquid reservoir body that is formed to project outward and communicates with the inside of the flow passage and stores the working fluid; a hole formed in a part of the liquid reservoir body; A heat equalizing apparatus, comprising: a flange detachably attached to a reservoir; and a heat source that penetrates the flange and passes through the hole and is immersed in the hydraulic fluid enclosed in the liquid reservoir. A platen on which a product to be molded is placed and a flow passage is formed; a plate-like member joined to the platen so as to cover the flow passage formed in the platen; and one of the plate-like members A liquid reservoir body that is formed with a portion projecting outward, and communicates with the inside of the flow passage to store hydraulic fluid; a storage body that penetrates the liquid reservoir body and is immersed in the hydraulic fluid; and A heat equalizing apparatus, comprising: a heat source that is mounted in a housing and includes an insulator and a heating element disposed in the insulator. A platen on which a product to be molded is placed and a flow passage is formed; a plate-like member joined to the platen so as to cover the flow passage formed in the platen; and one of the plate-like members A liquid reservoir body that is formed with a portion projecting outward, and communicates with the inside of the flow passage to store hydraulic fluid; a storage body that penetrates the liquid reservoir body and is immersed in the hydraulic fluid; and A heat equalizing apparatus, comprising: a heat source mounted in a storage body, and disposed at a position at both ends spaced apart from the end surface of the storage body toward a central portion. A platen on which a product to be molded is placed and a flow passage is formed; a plate-like member joined to the platen so as to cover the flow passage formed in the platen; and one of the plate-like members A reservoir that communicates with the inside of the flow passage and stores hydraulic fluid, and is immersed in the hydraulic fluid through the reservoir and has dimensions at both ends. A soaking unit comprising: a storage body formed to be larger than a size of a central portion; and a heat source mounted in the storage body and disposed at both ends at the end of the central portion of the storage body. apparatus. A platen on which a product to be molded is placed and a flow passage is formed; a plate-like member joined to the platen so as to cover the flow passage formed in the platen; and one of the plate-like members A reservoir that is formed by projecting outwardly and communicates with the inside of the flow passage and stores the working fluid; a housing that is immersed in the working fluid in the fluid reservoir; and the housing A heat equalizing apparatus, comprising: a connection body that is made of a material having a lower thermal conductivity, and that attaches the storage body to the liquid reservoir; and a heat source mounted in the storage body.

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