JP3832297B2 - Electronic component assembly equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component assembling apparatus for assembling an electronic component structure on a lead frame.
[0002]
[Prior art]
A conventional electronic component assembly positioning method for assembling an electronic component component into a lead frame will be described with reference to the drawings. FIG. 3 is a perspective view of an essential part of an electronic component assembling apparatus for assembling an electronic component structure on a conventional lead frame.
[0003]
In FIG. 3, a lead frame 1 made of a metal material such as strip-like iron, copper, or an alloy thereof is an electronic component for placing and storing an electronic component component 3 that forms various electronic components. A plurality of guide portions 2 formed by connecting lead terminals 6 are arranged at regular intervals, and the electronic component components 3 are supplied to the guide portions 2 sequentially or simultaneously by a mounting mechanism (not shown) or the like. Is done.
[0004]
A plurality of pilot holes 4 are provided at regular intervals on both side bands of the lead frame 1, and a pair of pilot pins 5 are sequentially inserted into the pilot holes 4, whereby the lead frame 1, that is, the electronic component component 3 and the guide. The part 2 was positioned and a predetermined electronic component was assembled.
[0005]
[Problems to be solved by the invention]
However, in order to provide the guide part 2 in the lead frame 1 in the electronic component assembly positioning method, a step of bending a part of the lead frame 1 is required.
[0006]
Further, since it is necessary to provide the lead frame 1 with an unfolded portion of the guide portion 2 (which occupies an occupied area), the assembly position pitch of the electronic component component 3 is increased, and the lead frame 1 per unit length of the lead frame 1 is increased. The number of electronic parts that can be obtained as a product also decreases.
[0007]
Furthermore, there are various types of electronic component components 3 corresponding to various types of electronic components, and in some cases, a large number of electronic component components 3 may be assembled. The preparation of the lead frame 1 provided with 2 has a problem that the cost is high, and maintenance and management are troublesome.
[0008]
An object of the present invention is to provide an electronic component assembling apparatus capable of assembling an electronic component structure with high accuracy without providing a dedicated guide portion on a lead frame. To do.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0010]
The invention according to claim 1 of the present invention is particularly a plate-like positioning in which insertion holes for inserting electronic component components are arranged at regular intervals, and a pair of guide holes are provided diagonally at the peripheral portions on both sides. The pallet has a guide pin at a position corresponding to the guide hole of the positioning pallet, and has tapered grooves on both sides that match the tip of the taper block for positioning with respect to the electronic component component transferred by the assembly head. A pilot hole, which is a plate-shaped tray plate, is supplied and arranged between the positioning pallet and the tray plate, and is provided on both side bands of the lead frame on which the electronic component component is placed, and a guide hole of the positioning pallet An electronic component assembling apparatus that inserts guide pins of the tray plate to perform assembly positioning of the electronic component structural body. Assembling and positioning of the electronic component components placed on the lead frame is performed by inserting into the id hole and matching the tip of the taper groove and the taper block for positioning with respect to the assembly head. No part is required, the lead frame is not restricted, and various electronic component components can be assembled and positioned, and the positioning pallet as a positioning jig and the tray plate itself can be transported integrally with the lead frame. The electronic component component can be stably positioned even during lead frame conveyance.
[0011]
The invention according to claim 2 of the present invention has a configuration in which the positioning pallet and the tray plate are adsorbed by magnets fitted in the four corners of the positioning pallet in the invention according to claim 1. Thus, the positioning pallet and the tray plate can be stably fixed and held.
[0012]
According to a third aspect of the present invention, in the first aspect of the present invention, in particular, a bush that slides with the guide pin is embedded in the guide hole of the positioning pallet, and the guide pin is made of a material having lower hardness than the bush. Thus, even if the positioning jig is used many times and the guide pin is worn, the assembly positioning accuracy can be secured only by exchanging the guide pin.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
Hereinafter, the invention according to the first to third aspects of the present invention will be described using the first embodiment of the present invention.
[0014]
FIG. 1 is a perspective view of a main part of an electronic component assembling apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of a main part of a fixing part between a positioning pallet and a tray plate using the magnet.
[0015]
In addition, the same code | symbol is provided to the structural member same as the structural member demonstrated with the said prior art, and detailed description is abbreviate | omitted.
[0016]
In FIG. 1, reference numeral 1 denotes the above-described lead frame, in which a plurality of pilot holes 4 are provided at regular intervals in both side band portions, and lead terminals 6 of electronic components are connected to each other to form an electronic component component 3. Are provided at regular intervals.
[0017]
Reference numeral 16 denotes a positioning pallet made of a plate-like hard resin or steel material. Magnets 14 are fitted into the projections at the four corners, and in order to accommodate the electronic component component 3, the mounting portion 15 is arranged in the longitudinal direction. The insertion holes 7 are provided at the same regular intervals, and a pair of guide holes 8 provided at predetermined positions on a diagonal line in the periphery of both side band portions.
[0018]
Reference numeral 9 denotes a tray plate made of a plate-like hard resin or steel material. The upper surface of the tray plate 9 is made of a steel material having a tapered tip at the same positional relationship corresponding to the guide hole 8 of the positioning pallet 6. A guide pin 10 is fixed.
[0019]
Reference numeral 11 denotes a pair of assembly heads that can be rotated, horizontally and vertically moved by adsorbing and transferring the electronic component structure 3, and 12 is provided by being cut into both side strips of the tray plate 9, with both ends inclined. A pair of tapered grooves.
[0020]
Reference numeral 13 denotes a pair of taper blocks which are disposed in correspondence with the taper grooves 12 and are horizontally movable in a T-shape with a plate-like steel material whose tips coincide with the taper grooves 12.
[0021]
The assembly positioning operation of the electronic component component 3 is performed by supplying and arranging the lead frame 1 on which the electronic component component 3 is placed between the positioning pallet 16 and the tray plate 9, and a guide fixed to the tray plate 9. By inserting the pin 10 into the pilot hole 4 of the lead frame 1 and the guide hole 8 of the positioning pallet 16, the electronic component constituting body 3 is assembled and positioned on the lead frame 1, that is, the mounting portion 15.
[0022]
In addition, the positioning of the lead frame 1 with respect to the electronic component component 3 that is attracted and transferred by the assembly head 11 is performed by inserting the tip of the taper block 13 into the taper groove 12 of the tray plate 9 so as to match, and thereafter Then, the electronic component structure 3 adsorbed by the assembly head 11 is transferred to the insertion hole 7 of the positioning pallet 16 and inserted and placed.
[0023]
Then, when the positioning pallet 6 is displaced or detached from the tray plate 9 due to the process operation or the like, the tray plate 9 is attracted (attracted by magnetic force) with the magnet 14 fitted in the positioning pallet 16 as shown in FIG. It is prevented by sticking by.
[0024]
Furthermore, in order to ensure the accuracy of assembly positioning, a bush 17 made of a steel material that slides with the guide pins 10 is disposed inside the guide holes 8 of the positioning pallet 6, and the guide pins 10 fixed to the tray plate 9 are arranged. The material is a material whose hardness is lower than that of the bush 17. Thereby, even if the guide pin 10 is worn by being used many times, the positioning accuracy is ensured by exchanging only the guide pin 10.
[0025]
【The invention's effect】
As described above, according to the electronic component assembling apparatus of the present invention, there is an effect that it is possible to easily and reliably assemble and position the electronic component component on the lead frame without providing a guide portion on the lead frame.
[Brief description of the drawings]
FIG. 1 is a perspective view of a main part of an electronic component assembling apparatus according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part of a fixing part between a positioning pallet and a tray plate using the magnet. Perspective view of essential parts of an electronic component assembly apparatus for assembling an electronic component component
DESCRIPTION OF SYMBOLS 1 Lead frame 2 Guide part 3 Electronic component structure 4 Pilot hole 5 Pilot pin 6 Lead terminal 7 Insertion hole 8 Guide hole 9 Tray plate 10 Guide pin 11 Assembly head 12 Taper groove 13 Taper block 14 Magnet 15 Mounting part 16 Positioning pallet 17 Bush

Claims (3)

Insertion holes for inserting electronic component components are arranged at regular intervals, and a plate-like positioning pallet with a pair of guide holes diagonally formed on the periphery on both sides, and a position that matches the guide holes of the positioning pallet The positioning pallet and the tray plate are formed of plate-like tray plates having guide pins and taper grooves on both sides that coincide with the tips of the taper blocks for positioning the electronic component components transferred by the assembly head. An electronic component component is formed by inserting guide pins of the tray plate into pilot holes provided on both side bands of a lead frame on which the electronic component component is mounted and guide holes of the positioning pallet. Electronic component assembly device that performs assembly positioning. The electronic component assembling apparatus according to claim 1, wherein the positioning pallet and the tray plate are attracted by magnets fitted in four corners of the positioning pallet. 2. The electronic component assembling apparatus according to claim 1, wherein a bush that slides with the guide pin is embedded in the guide hole of the positioning pallet, and the guide pin is made of a material having lower hardness than the bush.

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