JP3839583B2 - Counting the number of chips in bulk packaging of chip-type electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for counting the number of pieces stored in bulk packaging of chip-type electronic components.
[0002]
[Prior art]
Small electronic components such as chip resistors are packaged at a predetermined number and shipped from the manufacturing plant by tape packaging that holds them one by one with the upper and lower tapes or bulk packaging that stores them in bulk cases in bulk. Yes.
[0003]
2. Description of the Related Art Conventionally, as a bulk wrapping apparatus for bulk wrapping, an index table formed with a large number of cutout parts each storing chip-type electronic components (hereinafter referred to as workpieces), a suction device connected to the cutout parts, and a discharge device After rotating the index table with the suction device holding and holding the workpiece in the notch, the workpiece is checked to determine whether the workpiece is good or not, and the defective product is discharged from the notch. However, when the product reaches the non-defective product discharge part, the discharge device is operated to discharge the good product and store it in the bulk case.
[0004]
That is, the suction device connects a vacuum pump to the insertion nozzle of the nozzle unit facing the notch portion of the index table via a vacuum hose, and the discharge device connects an electromagnetic valve to the air supply hose branched from the vacuum hose. As shown in FIG. 4, when releasing a non-defective product, the index table is stopped (100) and the insertion nozzle is lowered. (200) The on-off valve (solenoid valve) was turned on and opened (300), and air was supplied at a pressure larger than the suction force of the vacuum pump to release the non-defective product downward.
[0005]
In a bulk packaging apparatus for chip-type electronic components having such a configuration, as a counting method for storing a predetermined number of workpieces in a bulk case, as shown in FIG. 4, when opening and closing an on-off valve (electromagnetic valve) ( (300) was detected, and the number of stored signals was counted up every time a signal was detected (400).
[0006]
[Problems to be solved by the invention]
However, with the conventional counting method described above, accurate counting cannot be performed, and a large number difference may occur.
[0007]
That is, the electronic parts stored in the notch portion of the index table are always attracted by the vacuum action of the suction device, and when counting up the number of storage in the bulk case, after stopping the index table, This is done when the nozzle unit is lowered and detects the opening signal of the opening / closing valve of the discharge device, so if the solenoid valve constituting the opening / closing valve deteriorates, the opening signal is output. In some cases, the opening operation is not performed, or the operation delay occurs and the electronic component is not actually released. In this case, the actual number stored in the bulk case is different from the count number. It will be.
[0008]
If the number stored in the bulk case is clearly different, it can be discovered before shipment, but usually it will be shipped as it is, and the displayed number may differ from the actual number at the delivery destination. Once discovered, it becomes a major problem related to manufacturing trust.
[0009]
An object of the present invention is to provide a method for counting the number of stored electronic components in bulk packaging of chip-type electronic components that can solve the above-described problems.
[0010]
[Means for Solving the Problems]
Accordingly, the present invention according to claim 1 comprises an index table having a large number of cutout portions for storing chip-type electronic components one by one, a suction device in communication with the cutout portions, and a discharge device. Rotate the index table with the electronic parts picked up and held in the notch, and determine whether the electronic parts are good or bad while transporting the electronic parts and discharge the defective parts from the notches. In the bulk packaging apparatus for chip-type electronic components that operates the discharge device to discharge the non-defective product and store it in the bulk case, electronic component detection means is disposed on the lower side of the non-defective product discharge portion. When the operation signal of the discharge device is detected and the electronic component detection means detects the absence of the electronic component, the electronic component is counted as being stored in the bulk case. When the operation signal of the discharge device is detected and the electronic component detecting means detects the electronic component, the count-up is not performed, and a state where the count-up is not performed continues for a predetermined number of times. In such a case, the bulk packaging apparatus was stopped.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The present invention discriminates the quality of the chip-type electronic component in the middle of the conveyance path, and after discharging the defective product out of the system, activates the discharge means for discharging the non-defective product to the bulk case in the non-defective product discharge section, When the electronic component detection means that is detected and arranged on the lower side of the non-defective product discharge portion detects the absence of the electronic component, the electronic component is counted as being stored in the bulk case. is there.
[0013]
In carrying out the present invention, an index table having a large number of cutout portions for storing chip-type electronic components one by one, a suction device in communication with the cutout portions, and a discharge device are provided. When the index table is rotated while being sucked and held in the notch, and the electronic component is conveyed to determine whether the electronic component is good or bad, and the defective product is discharged from the notch. The chip-type electronic component bulk packaging device is configured to operate the discharge device to discharge the non-defective product and store it in the bulk case, and further, the electronic component detecting means is disposed on the lower side of the non-defective product discharge portion Can be kept.
[0014]
By adopting such a configuration, when the operation signal of the emission device is detected and the electronic component detection means detects a state where there is no electronic component, the electronic component is counted as being stored in the bulk case. Can do.
[0015]
That is, as in the prior art, the suction device is connected to the insertion nozzle of the nozzle unit facing the notch portion of the index table via a vacuum hose, and the discharge device is an air supply hose branched from the vacuum hose. In addition, an air supply pump is connected via an on-off valve consisting of a solenoid valve, and after determining the quality of the electronic component, the electronic component determined to be non-defective is rotated and conveyed to the non-defective product discharge part. Stop the index table, lower the nozzle unit located above the index table, turn on and open the on-off valve consisting of a solenoid valve, and send air at a pressure greater than the suction force of the vacuum pump Release the electronic component downward. A shutter is slidably provided at the lower part of the non-defective product discharge section so that it opens in conjunction with the opening of the solenoid valve.
[0016]
Then, when the index table rotates again and the cutout part from which the electronic parts are discharged at the non-defective product discharge part reaches the position where the electronic part detection means is arranged, the detection means detects that there is no electronic part in the cutout part. Only when the electronic component absence signal is output, the electronic component is counted up as being stored in the bulk case.
[0017]
On the other hand, for example, if the solenoid valve that forms the opening / closing valve of the discharge device deteriorates and the operation signal is delayed or not activated even though the solenoid valve open signal is output, Instead of being released, it will stop in the notch.
[0018]
When this unreleased electronic component is detected by the detection means and a detection signal is output, the machine base is stopped as an abnormality.
[0019]
Alternatively, the machine base may not be stopped but may be counted up when the next electronic component is released without simply counting up. Then, when a predetermined number of states that cannot be counted continue, an abnormality is notified and the machine base is stopped.
[0020]
Further, as in the prior art, counting up by an open signal of the electromagnetic valve is employed as it is, and when an electronic component is detected by the detecting means, control can be performed so as to reduce the counting up.
[0021]
As described above, according to the present invention, since the electronic component detection means directly detects whether or not there are any electronic components to be discharged, the electronic components are stored in the bulk case. The counting of the number becomes accurate and the reliability of the quantity compensation is improved.
[0022]
As the electronic component detection means, a photoelectric sensor composed of a light projecting element and a light receiving element can be preferably used. If such a sensor is arranged in an opposing state with a notch portion of the index table interposed therebetween, electronic component detection is possible. The means is separated from the electronic component and does not adversely affect the discharge and transportation of the electronic component.
[0023]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
[0024]
FIG. 1 is an explanatory view of a chip-type electronic component inspection apparatus that also serves as a bulk packaging apparatus, and FIG. 2 is an explanatory view of an electronic component discharge portion provided in the apparatus.
[0025]
As shown in FIGS. 1 and 2, the bulk wrapping apparatus A is formed with a large number of notches 11 for accommodating electronic components such as chip resistors (hereinafter referred to as workpieces B) one by one on the outer periphery. A rotating index table 1 is provided.
[0026]
The index table 1 is provided with a supply port 12 for storing workpieces B conveyed from a parts feeder (not shown) one by one in the notch 11, and the supply port 12 and the parts feeder are conveyed through a conveyance path. Contact through 13.
[0027]
Further, in the middle of the rotation conveyance path R formed by the rotation of the index table 1, first and second electrical pass / fail judgment units 14 and 15 are provided along the rotation direction of the index table 1, and the lower rotation side thereof is provided. 1 includes a first defective product discharge unit 16, a confirmation unit 17, a second defective product discharge unit 18, and a non-defective product discharge unit 19 in this order. Thus, the bulk wrapping apparatus A according to the present embodiment has a configuration in which the inspection apparatus for the workpiece B is also used.
[0028]
That is, the first and second electrical pass / fail discriminating units 14 and 15 are discharged from the first defective product discharging unit 16, and the electric defective product discriminated by the confirmation unit 17 is further discharged to the second defective product. The product is discharged from the discharge unit 18, and only the non-defective product is conveyed to the non-defective product discharge unit 19. In the non-defective product discharge unit 19, the non-defective product is stored in the bulk case 2 set below the index table 1, and shipped when a predetermined number of products are stored. Like to do.
[0029]
As shown in FIG. 2, a nozzle unit 31 having an insertion nozzle 30 is disposed so as to be movable up and down above the non-defective product discharge portion 19, and the nozzle unit 31 and the vacuum pump 32 are connected via a communication hose 33. Thus, the air supply hose 40 is branched from the middle of the communication hose 33, and the air supply pump 42 is connected to the end of the air supply hose 40 via an open / close valve 41 made of an electromagnetic valve by a connecting hose 43. The discharge device 4 is configured by connection. In FIG. 2, 5 is a table cover disposed above the index table 1, 6 is a storage hose for guiding a non-defective work B to the bulk case 2, and the hose 6 includes the bulk case 2, the index table 1, and the like. In between, the insertion nozzle 30 is interposed in the state facing.
[0030]
Usually, the suction device 3 is operated to rotate and convey the workpiece B in the housed state in which the workpiece B is sucked and held in the notch 11, while the notch 11 containing the non-defective workpiece B is the non-defective product discharger 19. 3, the index table position is stopped as shown in the flowchart of FIG. 3 (a), and the nozzle unit 31 lowers the insertion nozzle 30 into the notch 11 by the thickness of the index table 1 (b). ), An open signal is output to the on-off valve 41 and opened (c), and air is pumped from the air feed pump 42 with a blow pressure larger than the suction force in the vacuum operating state to release the non-defective product downward to the bulk case 2 is accommodated. At this time, although not shown, the non-defective product discharge portion 19 is provided with a shutter slidably below the cutout portion 11 of the index table 1 and opened in conjunction with the lowering of the insertion nozzle 30 and the opening / closing valve 41 opening operation. I am doing so.
[0031]
In the above configuration, the gist of the present invention is that the non-defective product 19 is provided with a photoelectric sensor S as an electronic component detecting means on the lower rotation side of the non-defective product discharge section 19 and the bulk of the non-defective workpiece B is as shown in FIG. When counting the number of cases stored in the case 2, as shown in FIG. 3, an operation signal for operating the discharge device 4 that forms a discharge means for discharging the workpiece B into the bulk case 2, that is, an open / close operation comprising the electromagnetic valve. When the open signal of the valve 41 is detected (c), and the photoelectric sensor S detects that there is no workpiece B in the cutout portion 11 rotating from the non-defective product discharge portion 19 (d) the workpiece B Is counted up as being stored in the bulk case 2 (e).
[0032]
That is, when counting up, it is a condition that at least the photoelectric sensor S confirms that the work B to be discharged is discharged from the notch 11, and the open signal of the on-off valve 41 is simply given. Unlike the method of counting up if detected, accurate counting is possible and the reliability of quantity compensation is significantly improved.
[0033]
In addition, since only the photoelectric sensor S needs to be added to the conventional equipment or the like, a large equipment cost is not required.
[0034]
In addition, when the photoelectric sensor S detects the workpiece B that should be discharged, the bulk packaging apparatus A itself may be stopped, and the cause of the discharge may be investigated and recovered.
[0035]
By the way, the photoelectric sensor S has a light projecting element S1 and a light receiving element S2 arranged one above the other with the notch 11 of the index table 1 sandwiched between them (FIG. 2). It doesn't matter.
[0036]
In addition, when the photoelectric sensor S detects the workpiece B that should be released, as another example, the bulk packaging apparatus A is not stopped but simply counted up (no count). When the workpiece B is released, it may be counted up. Then, when a predetermined number of states that cannot be counted continue, an abnormality is notified and the bulk packaging apparatus A is stopped.
[0037]
As still another embodiment, when the open signal of the on-off valve 41 is detected as in the prior art, the count is incremented, and then the index table 1 rotates intermittently at a predetermined pitch to detect the workpiece B from which the photoelectric sensor S should have been released. In such a case, it can be controlled to subtract that amount from the total.
[0038]
Moreover, when implementing this invention, as a structure of the suction apparatus 3 and the discharge | release apparatus 4, it is not limited to what was shown in FIG. For example, when a flow path switching valve is provided at a branch portion between the communication hose 33 that connects the nozzle unit 31 and the vacuum pump 32 and the air supply hose 40 of the discharge device 4, The normal suction operation may be switched to the discharge operation by switching the flow path switching valve.
[0039]
As described above, according to the present invention, since the counting accuracy of the number of stored non-defective workpieces B in the bulk case 2 is improved, the reliability of quantity compensation can be improved.
[0040]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0042]
The present invention includes an index table formed with a large number of cutout portions for storing chip-type electronic components one by one, a suction device in communication with the cutout portions, and a discharge device. When the index table is rotated while being sucked and held on the wafer, the electronic component is conveyed and judged whether the electronic component is good or bad, and the defective product is discharged from the notch. In a bulk packaging apparatus for chip-type electronic components that discharges non-defective products and stores them in a bulk case, an electronic component detection sensor is disposed on the lower side of the non-defective product discharge portion, and an operation signal of the discharging device detects, and, when the electronic component detecting sensor detects the absence of the electronic component counts up as an electronic component is housed in the bulk case, the release When the electronic component detecting means detects an electronic component, the count up is not performed, and the bulk packaging is performed when a predetermined number of states without the count up continues. Since the apparatus is stopped , accurate counting can be performed simply by providing an electronic component detection sensor in the conventional equipment, and the reliability of quantity compensation is significantly improved.
[Brief description of the drawings]
FIG. 1 is an explanatory view of an electronic component inspection apparatus for carrying out a method for counting the number of stored chips in bulk packaging of chip-type electronic components according to the present invention.
FIG. 2 is an explanatory diagram of an emission part of an electronic component provided in the apparatus.
FIG. 3 is a flowchart of a method for counting the number of stored items in bulk packaging according to the present embodiment.
FIG. 4 is a flowchart of a conventional method for counting the number of stored electronic components in bulk packaging.
[Explanation of symbols]
A Bulk packaging equipment B Chip type electronic parts (work)
R Rotation conveyance path (conveyance path)
S Photoelectric sensor (electronic component detection means)
1 Index table 2 Bulk case 3 Suction means (suction device)
4 Discharge means (discharge device)
11 Notch
19 Good product discharge section

Claims (1)

Equipped with an index table formed with a large number of cutouts for storing chip-type electronic components one by one, a suction device in communication with the cutouts, and a discharge device. In this state, the index table is rotated, and the electronic components are conveyed to determine whether the electronic components are good or not, and the defective products are discharged from the cutout portion. In the bulk packaging equipment for chip-type electronic components that release good products and store them in the bulk case,
An electronic component detection means is disposed on the lower side of the non-defective product discharge part,
When the operation signal of the emission device is detected, and the electronic component detection means detects a state where there is no electronic component, the electronic component is counted up as being stored in the bulk case,
When the operation signal of the emission device is detected and the electronic component detection means detects an electronic component, the count-up is not performed,
A method of counting the number of electronic components stored in bulk packaging , wherein the bulk packaging device is stopped when a predetermined number of states where the count-up is not performed are continued .

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