JP3846320B2 - Electronic component mounting apparatus and air blow circuit abnormality detection method in electronic component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate and an electronic component mounting apparatus for detecting the presence or absence of an abnormality in an air blow circuit that discharges positive pressure air from a suction nozzle that sucks and holds the electronic component in the electronic component mounting apparatus. The present invention relates to an air blow circuit abnormality detection method.
[0002]
[Prior art]
As a method for holding an electronic component in an electronic component mounting apparatus for mounting the electronic component on a substrate, a method using vacuum suction is used. In this method, the electronic component is held by using the negative pressure generated by vacuum suction from the suction hole in a state where the suction nozzle having the suction hole provided at the lower end is in contact with the upper surface of the electronic component. is there. When mounting the electronic component held by the suction nozzle on the substrate, the electronic component is detached from the suction nozzle by releasing the vacuum suction. At this time, in order to quickly and reliably remove the electronic components, positive pressure air is applied to the suction nozzle to break the vacuum in the suction circuit, and the electronic components are removed by slightly blowing air from the suction nozzle. Air blow is performed.
[0003]
[Problems to be solved by the invention]
In this air blow system, the discharge state tends to change due to malfunction of each part of the air blow system, such as an air supply source for applying positive pressure and a blow valve that turns on and off the air blow, and reliable removal of electronic components is not guaranteed There is a drawback. For this reason, in an electronic component mounting apparatus provided with an air blow system, it is necessary to check whether the air blow system is functioning normally.
[0004]
However, in the air blow system functional inspection, it is necessary to remove the functional parts such as the blow valve from the transfer head and inspect the individual parts for abnormalities. However, simplification of work has been desired.
[0005]
Accordingly, the present invention provides an electronic component mounting apparatus capable of detecting the presence or absence of an abnormality in an air blow circuit for discharging positive pressure air from an adsorption nozzle by a simple method, and an abnormality detection method for an air blow circuit in the electronic component mounting apparatus. With the goal.
[0006]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that picks up an electronic component by vacuum suction from a component supply unit by a suction nozzle of a transfer head and mounts it on a substrate, and vacuums the electronic component from the suction nozzle. A vacuum suction means; an air blow means for discharging positive pressure air from the suction nozzle; a switching means for selectively connecting the vacuum suction means and the air blow means to the suction nozzle; and an air blow circuit from the air blow means to the suction nozzle A flow sensor for measuring the flow rate of air passing through an air blow circuit, and an air blow system for discharging positive pressure air from the suction nozzle based on a flow rate pattern indicating a change with time of the flow rate obtained by the flow rate sensor Determination means for determining the presence or absence of abnormalities.
[0007]
An abnormality detection method for an air blow system in an electronic component mounting apparatus according to claim 2, wherein the electronic component mounting apparatus picks up the electronic component by vacuum suction from the component supply unit by the suction nozzle of the transfer head and mounts the electronic component on the substrate. a method for detecting abnormality air blow circuit for detecting abnormality from the air blow means for supplying positive pressure air to the nozzle of the air blow circuit leading to the suction nozzle, the air blowing system while discharging positive pressure air to drive the air blow means Whether there is an abnormality in the air blow circuit based on a process of measuring the flow rate of air passing through the air blow circuit by a flow sensor interposed in the air blow circuit and a flow rate pattern indicating a change in flow rate over time determined by the flow rate measurement Determining.
[0008]
According to the present invention, the step of measuring the flow rate of air passing through the air blow circuit supplies positive pressure air to drive the air blow means by the flow rate sensor which is interposed in the air blow circuit Lae Aburo system, flow rate By determining the presence / absence of an abnormality in the air blow circuit based on a flow rate pattern indicating a temporal change in the flow rate obtained by measurement, the presence / absence of an abnormality in the air blow circuit can be detected by a simple method.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a diagram illustrating a configuration of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing the configuration of a vacuum suction / air blow system and a control system of the electronic component mounting apparatus of one embodiment, and FIG. 4 is a flow pattern for detecting an abnormality of the air blow system in the electronic component mounting apparatus of one embodiment of the present invention. It is explanatory drawing.
[0010]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed in the center of the base 1 in the X direction. The conveyance path 2 conveys the board 3 and positions it at the mounting position of the electronic component. On both sides of the conveyance path 2, component supply units 4 are arranged, and each component supply unit 4 has a large number of tape feeders 5 arranged in parallel. The tape feeder 5 accommodates electronic components held on the tape, and supplies the electronic components by pitch feeding the tape.
[0011]
Y-axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. The X-axis tables 7A and 7B are equipped with a transfer head 8 and a camera 9 that moves integrally with the transfer head 8, respectively.
[0012]
When the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B are driven in combination, the transfer head 8 moves horizontally, and the electronic components are picked up from the respective component supply units 4 by suction nozzles 10 ( 2) and is mounted on the substrate 3 positioned in the transport path 2. The camera 9 that has moved onto the substrate 3 captures and recognizes the substrate 3. A line camera 19 is disposed along the path from the component supply unit 4 on the substrate 3 to the transport path 2. The line camera 19 images the electronic components held by the respective transfer heads 8 from below.
[0013]
Next, the transfer head 8 will be described with reference to FIG. As shown in FIG. 2, the transfer head 8 is of a multi-type and has a configuration including eight unit transfer heads 8a as component holding means. Each of these unit transfer heads 8a is provided with a suction nozzle 10 that sucks and holds an electronic component at its lower end, and can be moved up and down individually. Here, the suction nozzle 10 is detachably mounted on a mounting portion 8b (see FIG. 3) provided at the lower portion of the unit transfer head 8a, and is exchanged according to the type of electronic component.
[0014]
Here, the configuration of a vacuum suction / air blow system for vacuum suction from the suction nozzle 10 and discharge of positive pressure air from the suction nozzle 10 and a control system for controlling the vacuum suction / air blow system will be described with reference to FIG. As shown in FIG. 3, a switching valve 11 which is a three-way valve is connected to a mounting portion 8b to which the suction nozzle 10 is mounted in the unit transfer head 8a. A port on one side of the switching valve 11 is connected to a vacuum pump 13 which is a vacuum suction means, and a mount blow valve 20 which is an on / off valve is connected to a port on the other side via a flow rate sensor 12. The switching valve 11 is a switching unit that selectively connects a vacuum suction unit and an air blowing unit, which will be described later, to the suction nozzle 10.
[0015]
The suction pump 10 is connected to the vacuum pump 13 by driving the vacuum pump 13 with the suction nozzle 10 attached to the mounting portion 8b and switching the switching valve 11 to the vacuum pump 13 side. Vacuum suction is performed from the suction hole 10a provided on the suction surface. The circuit from the suction nozzle 10 to the vacuum pump 13 is a vacuum suction circuit through which air passes during vacuum suction. A filter 18 is built in the mounting portion 8 b, and the air sucked from the suction nozzle 10 passes through the filter 18, whereby the foreign matter sucked together with the air during vacuum suction is collected by the filter 18.
[0016]
The mount blow valve 20 is connected to an air supply source 21, and the suction nozzle 10 is connected to the air supply source 21 via the mount blow bubble 20 by switching the switching valve 11 to the mount blow valve 20 side. By opening the mount blow valve 20 in this state, the positive pressure air supplied from the air supply source 21 is discharged from the suction nozzle 10. This air blow operation is performed in order to cause the electronic component to be detached from the suction nozzle 10 after the electronic component sucked and held by the suction nozzle 10 is landed on the mounting point of the substrate 3. The air supply source 21 serves as an air blowing means for discharging positive pressure air from the suction nozzle 10, and the circuit from the suction nozzle 10 to the air supply source 21 is an air blow circuit through which positive pressure air passes during air blowing. .
[0017]
In this air blowing operation, the flow rate sensor 12 interposed in the air blowing circuit between the mount blow valve 20 and the switching valve 11 detects the temperature difference of the fluid flowing through the air blowing circuit, and the air blowing circuit per unit time by air blowing. The amount of air flowing inside is measured as a flow rate pattern (see FIG. 4) showing a change in flow rate over time. The measurement result of the flow sensor 12 is sent to the determination unit 14.
[0018]
The determination unit 14 determines whether there is an abnormality in the air blow system by comparing the flow rate measurement result of the flow sensor 12 with a reference flow rate pattern stored in the storage unit 16 or a determination parameter extracted from the flow rate pattern. To do. The determination unit 14 serves as a determination unit that determines the presence or absence of an abnormality in the air blow system based on a flow rate pattern indicating a change with time of the flow rate obtained by the flow rate sensor 12. The determination result is sent to the control unit 15, and the control unit 15 controls the notification unit 17 based on the determination result, thereby issuing a notification instructing replacement / cleaning of functional parts such as the mount blow valve 20 constituting the air blow system. Do.
[0019]
Next, abnormality detection of an air blow system that performs air blow by discharging positive pressure air supplied from the air supply source 21 from the suction nozzle 10 will be described. Here, the abnormality of the air blow system means a defective state mainly caused by deterioration with time in the components of the air blow circuit extending from the suction nozzle 10 to the air supply source 21. Here, an explanation will be given taking as an example the abnormality of the mount blow valve 20 that connects and disconnects the air blow circuit.
[0020]
In general, the mount blow valve has a valve capacity indicated by the flow rate of air allowed in the open state, and the control means in addition to the sealing performance that reliably shuts off the air flow in the closed state. Responsiveness that operates reliably within a predetermined time in response to the signal from the signal is required. Since it is difficult to confirm such valve operating status by simple inspections such as visual inspection, the vacuum valve has been removed from the transfer head in the past during maintenance inspections, and performance inspection was performed using a dedicated test device. Therefore, it is necessary to determine whether the operation state is acceptable.
[0021]
On the other hand, in the present embodiment, the characteristics indicating the operating state of the mount blow valve 20 are expressed by a flow rate pattern described below, so that the pass / fail of the operating state can be confirmed while the mount blow valve 20 to be inspected is still attached to the actual machine. Judgment can be made. That is, the flow rate pattern when air blow is performed by causing the mount blow valve 20 to open and close is determined, and the flow rate pattern is compared with a reference flow rate pattern stored in advance, thereby determining pass / fail of the valve operation state at that time. Like to do.
[0022]
Hereinafter, the flow rate pattern will be described with reference to FIG. 4 (a) and 4 (b) show that while the reference suction nozzle for measurement is mounted on the mounting portion 8b of the unit transfer head 8a shown in FIG. 3, the air supply source 21 is driven to perform vacuum suction. The flow rate in the air blow circuit when the mount blow valve 20 is opened and closed is continuously measured by the flow rate sensor 12, and the change over time in the flow rate is graphically represented as a flow rate pattern.
[0023]
FIG. 4A shows a reference flow rate pattern. When a normal mount blow valve 20 with a guaranteed operating characteristic is mounted, air blow is performed, and the mount blow valve 20 is opened and closed. Is shown. Here, the flow rates f1 and f2 indicate a lower limit flow rate and an upper limit flow rate as a threshold range for determining whether or not the valve capacity of the mount blow valve 20 is normal, and the ultimate flow rate f is a predetermined mount. It is a condition for determining that the mount blow valve 20 is normal that it exceeds the predetermined flow rate f1 and falls below the upper limit flow rate f2 within the blow time TB.
[0024]
In the flow rate pattern a shown in FIG. 4A, the flow rate increases from the timing t1 when the mount blow valve 20 is opened, and the actual reached flow rate fa is within the threshold range at the timing t2 when the mount blow time TB has elapsed. In this case, the condition for determining that the mount blow valve 20 is normal is satisfied. In contrast, FIG. 4B shows an example of abnormal valve operation. The flow rate pattern b indicated by the solid line indicates that the actual reach flow rate fb is less than the lower limit flow rate f1 at the timing t2 when the mount blow time TB has elapsed, and an abnormality that blocks the flow path such as adhesion of foreign matter has occurred. Yes.
[0025]
Next, the abnormality detection process of the vacuum suction system will be described. This abnormality detection process is a process that is executed periodically when the electronic component mounting apparatus is continuously operated, or at any time when a malfunction that is recognized as being caused by an air blow system occurs, every predetermined cumulative operation time. It is.
[0026]
First, a reference suction nozzle for measurement is mounted on the unit transfer head 8a of the target transfer head 8, and the state of the air blow system is set as a measurement condition. Next, the air supply source 21 is driven, and the mount blow valve 20 is opened while the further switching valve 11 is switched to the air blow side. Thereby, positive pressure air is discharged from the suction nozzle 10.
[0027]
At this time, the flow sensor 12 continuously measures the flow rate flowing through the air blow circuit, and this flow rate measurement data is taken in by the sequential determination unit 14. When a predetermined valve opening time has elapsed, the mount blow valve 20 is closed and the flow rate measurement data is taken in thereafter. Based on the flow rate pattern obtained by the flow rate measurement, the determination unit 14 determines whether there is an abnormality in the air blow system mount blow valve 20.
[0028]
That is, as shown in FIG. 4, the actual flow rate f after opening the mount blow valve 20 is obtained from the obtained flow rate pattern. Then, the obtained value is compared with the threshold range stored in the storage unit 16 to determine whether the mount blow valve 20 is abnormal. This determination result is transmitted to the control unit 15, and when the rain and blow valve 20 needs to be cleaned or replaced by the determination result, the notification unit 17 notifies that.
[0029]
As described above, by determining whether there is an abnormality in the vacuum suction system based on the flow rate pattern obtained by the flow measurement, the vacuum suction system abnormality can be detected in a simple manner without removing functional parts from the transfer head. It is possible to detect the presence or absence of a malfunction and to reduce the occurrence of malfunctions due to abnormalities in the air blow system.
[0030]
In the above embodiment, the abnormality of the air blow system mount blow valve has been described. However, the characteristics that cause the flow rate to change due to deterioration with time or abnormal mounting such as other functional parts constituting the air blow system, such as filters and pipe joints. If it has, it can be the object of the present invention.
[0031]
In the above embodiment, an example is shown in which the reached flow rate is used as a parameter for determining whether or not the flow rate is correct. However, what parameters are extracted from the flow rate pattern indicating the change over time in the flow rate is arbitrary, and the rate of change in the flow rate It is possible to define various parameters according to the object such as the flow rate integral value and the flow rate integral value and use them for the determination.
[0032]
【The invention's effect】
According to the present invention, the step of measuring the flow rate of air passing through the air blow circuit by the flow rate sensor provided in the air blow circuit of the air blow system while driving the air blow means and supplying positive pressure air is obtained by the flow rate measurement. Since the presence / absence of abnormality of the air blow circuit is determined based on the flow rate pattern indicating the change of the flow rate with time, the presence / absence of abnormality of the air blow circuit can be detected by a simple method.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a configuration of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a block diagram showing the configuration of a vacuum suction / air blow system and a control system of the electronic component mounting apparatus according to the embodiment. FIG. 4 is a flow pattern for detecting abnormality of the air blow system in the electronic component mounting apparatus according to the embodiment of the present invention. Explanation drawing [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 3 Substrate 4 Parts supply part 8 Transfer head 10 Adsorption nozzle 11 Switching valve 12 Flow rate sensor 13 Vacuum pump 14 Determination part 15 Control part 16 Storage part 20 Mount blow valve 21 Air supply source

Claims (2)

An electronic component mounting apparatus for picking up an electronic component from a component supply unit by a suction nozzle of a transfer head by vacuum suction and mounting the electronic component on a substrate, wherein vacuum suction means for vacuum suction from the suction nozzle, and positive pressure from the suction nozzle An air blowing means for discharging air; a switching means for selectively connecting the vacuum suction means and the air blowing means to the suction nozzle; and A flow rate sensor for measuring a flow rate, and a determination unit for determining whether or not there is an abnormality in an air blow system that discharges positive pressure air from the suction nozzle based on a flow rate pattern indicating a temporal change in the flow rate obtained by the flow rate sensor. An electronic component mounting apparatus comprising the electronic component mounting apparatus. In the electronic component mounting apparatus of the electronic component by the suction nozzle of the mounting head from a component supply unit is picked up by vacuum suction mounted on the substrate, air blow circuit extending from the air blow means for supplying positive pressure air to the suction nozzle in the suction nozzle A method for detecting an abnormality in an air blow circuit for detecting an abnormality in the air blow, wherein the air flow passing through the air blow circuit is detected by a flow sensor provided in the air blow circuit of the air blow system while discharging the positive pressure air by driving the air blow means. And an air blow in an electronic component mounting apparatus comprising: a step of determining the presence or absence of an abnormality in the air blow circuit based on a flow rate pattern indicating a change over time of the flow rate obtained by the flow rate measurement. Circuit abnormality detection method.

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