JP4069739B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate by sucking and holding the electronic component with a suction nozzle.
[0002]
[Prior art]
As a method of holding an electronic component in an electronic component mounting apparatus that mounts the electronic component on a substrate, a method using vacuum suction is used. In this method, the electronic component is held by using the negative pressure generated by vacuum suction from the suction hole in a state where the suction nozzle having the suction hole provided at the lower end is in contact with the upper surface of the electronic component. There is an advantage that the holding state can be controlled only by turning on / off the vacuum suction.
[0003]
On the other hand, there is a drawback that the suction operation tends to become unstable depending on the state of the parts constituting the vacuum suction system, such as a suction hole of the suction nozzle and a filter for removing foreign matters incorporated in the suction nozzle. That is, in order to securely hold the electronic component by the suction nozzle, the vacuum pressure of the suction nozzle needs to reach a predetermined pressure, and the vacuum of the suction nozzle is broken to release the suction of the electronic component. It is necessary to return the pressure to atmospheric pressure.However, if the vacuum suction system is stuck or clogged as described above, it may cause an increase in vacuum pressure or vacuum breakage due to these effects. The required response time is delayed, and the desired operation tact time cannot be maintained. For this reason, conventionally, an electronic component mounting apparatus using a suction nozzle is known which includes a mechanism such as an air blow for removing such foreign matter (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Application Laid-Open No. Sho 61-252643
[0005]
[Problems to be solved by the invention]
However, in the above-described conventional example, foreign matters adhering to the end of the suction nozzle can only be removed, and it is not effective for foreign matters existing inside the vacuum suction circuit due to clogging of the filter or the like. In addition, since air is blown to the suction nozzle, scattering of foreign matter is unavoidable at the same time as removing foreign matter, and a new problem may be caused by the scattered foreign matter adhering to the mounting surface of the substrate. As described above, in the conventional electronic component mounting apparatus, it is sometimes difficult to perform a stable mounting operation due to the influence of the foreign substance in the vacuum suction system that performs vacuum suction from the suction nozzle.
[0006]
Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can reduce the influence of foreign matter in a vacuum suction system as much as possible and maintain a stable mounting operation.
[0007]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is provided by the suction nozzle of the transfer head from the component supply unit.
An electronic component mounting apparatus for picking up electronic components by vacuum suction and mounting them on a substrate, wherein a vacuum suction means for vacuum suction from the suction nozzle and a vacuum disconnection circuit for connecting and disconnecting a vacuum suction circuit from the vacuum suction means to the suction nozzle Contact means, a flow rate sensor that measures the flow rate of air that is interposed in the vacuum suction circuit and passes through the vacuum suction circuit, and controls the connection / disconnection timing of the vacuum connection / disconnection means based on the flow rate measurement result of the flow rate sensor. Timing control means, from the flow rate measurement results Indicates the flow rate under normal vacuum suction conditions The flow rate deviation with respect to the reference flow rate value is obtained, and the connection / disconnection timing of the vacuum connection / disconnection means is controlled based on the timing correction value corresponding to the flow rate deviation.
[0008]
The electronic component mounting method according to claim 2 is an electronic component mounting method in which the electronic component of the component supply unit is sucked and held by vacuum suction from the suction nozzle of the transfer head through the vacuum suction circuit and mounted on the substrate. A flow rate measuring step for measuring a flow rate of air passing through the vacuum suction circuit by a flow rate sensor provided in the vacuum suction circuit during vacuum suction, which is a specific state of the suction nozzle, and disconnecting the vacuum suction circuit. A pick-up process for picking up and holding the electronic component by sucking and holding the electronic component by sucking the nozzle by bringing the vacuum connecting and disconnecting means into contact, moving the suction nozzle holding and sucking the electronic component up and down relative to the substrate, and A mounting step of releasing the electronic component from the suction nozzle by mounting the contact means in a disconnected state and mounting the electronic component on the substrate. From the measurement results Indicates the flow rate under normal vacuum suction conditions The flow rate deviation with respect to the reference flow rate value is obtained, the connection / disconnection timing of the vacuum connection / disconnection means is controlled based on the timing correction value corresponding to the flow rate deviation, and the flow rate measurement result in the pickup step and / or mounting step. Based on the above, the connection / disconnection timing of the vacuum connection / disconnection means is controlled.
[0009]
According to the present invention, the suction flow is measured by measuring the flow rate of air passing through the vacuum suction circuit by the flow rate sensor in a specific state of the suction nozzle, and controlling the connection / disconnection timing of the vacuum suction circuit based on the flow rate measurement result. The influence of foreign matter in the vacuum suction system for vacuum suction from the nozzle can be reduced as much as possible, and a stable mounting operation can be maintained.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a diagram illustrating a configuration of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing the configuration of the vacuum suction / air blow system of the electronic component mounting apparatus of one embodiment, and FIG. 4 is the time of the degree of vacuum inside the vacuum suction circuit in the pickup operation by the electronic component mounting apparatus of one embodiment of the present invention. FIG. 5 is a graph showing a temporal change in the degree of vacuum inside the vacuum suction circuit in the component mounting operation by the electronic component mounting apparatus according to the embodiment of the present invention. FIG. FIG. 6B is a graph showing the relationship between the degree of vacuum inside the vacuum suction circuit and the flow rate of air in the electronic component mounting apparatus of one embodiment, and FIG. 6B is a vacuum suction circuit in the electronic component mounting apparatus of one embodiment of the present invention. Internal flow rate deviation and switching Graph showing the relationship between the timing correction value of the valve, Fig 7 is a flow diagram of a valve actuation timing setting process in the electronic component mounting method of an embodiment of the present invention.
[0011]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed in the center of the base 1 in the X direction. The conveyance path 2 conveys the board 3 and positions it at the mounting position of the electronic component. On both sides of the conveyance path 2, component supply units 4 are arranged, and each component supply unit 4 has a large number of tape feeders 5 arranged in parallel. The tape feeder 5 accommodates electronic components held on the tape, and supplies the electronic components by pitch feeding the tape.
[0012]
Y-axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. The X-axis tables 7A and 7B are equipped with a transfer head 8 and a camera 9 that moves integrally with the transfer head 8, respectively.
[0013]
When the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B are driven in combination, the transfer head 8 moves horizontally, and electronic components are picked up from the respective component supply units 4 by suction nozzles 10 ( 2) and is mounted on the substrate 3 positioned in the transport path 2. The camera 9 that has moved onto the substrate 3 captures and recognizes the substrate 3. A line camera 11 is disposed along the path from the component supply unit 4 to the conveyance path 2. The line camera 11 images the electronic components held by the respective transfer heads 8 from below.
[0014]
Next, the transfer head 8 will be described with reference to FIG. As shown in FIG. 2, the transfer head is multi-type, and has eight unit transfer heads 8a as component holding means. Each of these unit transfer heads 8a is provided with a suction nozzle 10 that sucks and holds an electronic component at its lower end, and can be moved up and down individually. Here, the suction nozzle 10 is detachably mounted on a mounting portion 8b (see FIG. 3) provided at the lower portion of the unit transfer head 8a, and is exchanged according to the type of electronic component.
[0015]
Here, with reference to FIG. 3, the configuration of a vacuum suction / air blow system that performs vacuum suction from the suction nozzle 10 will be described. As shown in FIG. 3, a switching valve 13 is connected via a flow sensor 12 to the mounting portion 8 b where the suction nozzle 10 is mounted in the unit transfer head 8 a. The switching port a on one side of the switching valve 13 is connected to the vacuum pump 14, and the switching port b on the other side is connected to the air supply source 17 via the blow valve 16. By controlling the switching valve 13 by the control unit 20, the suction nozzle 10 can be selectively connected to one of the switching ports a and b.
[0016]
The suction nozzle 10 is mounted on the mounting portion 8b, and the switching valve 13 is switched to the switching port a side while the vacuum pump 14 is driven, whereby a vacuum is applied from the suction hole 10a provided on the suction surface of the lower end portion of the suction nozzle 10. Suction. A filter 15 is built in the mounting portion 8b, and the foreign matter sucked together with air from the suction nozzle 10 when vacuum suction is collected by the filter 15.
[0017]
In the above configuration, the circuit from the suction nozzle 10 to the vacuum pump 14 is a vacuum suction circuit through which air passes during vacuum suction, and the vacuum pump 14 is a vacuum suction means for vacuum suction from the suction nozzle 10. The switching valve 13 is a vacuum connection / disconnection means for connecting / disconnecting the vacuum suction circuit. That is, by switching to the switching port a side, the vacuum suction circuit is brought into a contact state and vacuum suction is performed from the suction nozzle 10, and by switching to the switching port b side, the vacuum suction circuit is disconnected and the suction nozzle 10 is turned off. Vacuum suction stops.
[0018]
Then, by opening the blow valve 16 with the switching valve 13 switched to the switching port b side, positive pressure air is discharged from the suction hole 10a provided in the suction surface at the lower end of the suction nozzle 10. . A circuit from the suction nozzle 10 to the air supply source 17 is an air blow circuit, and the air supply source 17 is an air blow means for discharging positive pressure air from the suction nozzle 10.
[0019]
The flow rate of the vacuum suction circuit during vacuum suction and the flow rate of the air blow circuit during air blow are measured by the flow rate sensor 12. The flow rate sensor 12 measures the amount of air passing through the vacuum suction / air blow circuit per unit time by vacuum suction / air blow by detecting the temperature difference of the fluid flowing inside. This flow rate measurement can be performed for both the air flow rate in the direction of vacuum suction from the suction nozzle 10 and the air flow rate in the direction of discharging air from the suction nozzle 10. The flow rate measurement result is sent to the valve operation timing setting unit 18.
[0020]
The valve operation timing setting unit 18 uses the valve operation timing correction data stored in the storage unit 19 based on the flow rate measurement result of the flow sensor 12, so that the operation timing of the switching valve 13, that is, the connection / disconnection of the vacuum connection / disconnection means. Set the timing. The operation timing setting result is sent to the control unit 20, and the control unit 20 controls the switching valve 13 based on the setting result. Therefore, the valve operation timing setting unit 18 and the control unit 20 are timing control means for controlling the connection / disconnection timing of the vacuum connection / disconnection means based on the flow rate measurement result of the flow sensor 12.
[0021]
Here, the valve operation timing and the valve operation timing setting data will be described with reference to FIG. 4, FIG. 5, and FIG. 4 (a) and 4 (b) show that the switching valve 13 is switched from the switching port b side (vacuum suction OFF) to the switching port a side in a state where the vacuum pump 14 is driven in the pickup operation for picking up an electronic component by the suction nozzle 10. The time change of the vacuum pressure P in the suction nozzle 10 when switched to (vacuum suction ON) is shown.
[0022]
5A and 5B show the switching valve 13 on the switching port a side (vacuum suction) with the vacuum pump 14 driven in the mounting operation of mounting the electronic component held by the suction nozzle 10 on the substrate 3. ON) shows the temporal change of the vacuum pressure P in the suction nozzle 10 when switching from the switching port b side (vacuum suction OFF). In any case, the vacuum pressure P indicates a differential pressure from the atmospheric pressure, and the positive pressure direction of the vacuum pressure P is the direction in which the absolute pressure decreases and the differential pressure increases.
[0023]
First, the valve operation timing in the pickup operation will be described. When the electronic component is picked up by the transfer head 8 in the electronic component mounting operation, the switching valve 13 is switched to the switching port a side (vacuum suction ON) as described above and vacuum suction is performed from the suction nozzle 10. In this component suction operation, in order to securely hold the electronic component by the suction nozzle 10, the vacuum pressure inside the suction nozzle 10 is set to a predetermined pressure sufficient to hold the electronic component by the differential pressure from the atmospheric pressure. It is necessary to reach.
[0024]
At this time, there is a time lag from the timing when the switching valve 13 is switched to the vacuum suction side until the vacuum pressure in the suction nozzle 10 reaches a predetermined pressure. That is, as shown in FIG. 4A, the vacuum pressure P in the suction nozzle 10 is set to a predetermined pressure (of the electronic component) at a timing tb delayed by a time lag t1 from the timing ta at which the switching valve 13 is switched to vacuum suction ON. The reference vacuum pressure Ps1) for adsorption holding is reached (see the pressure curve p1 indicated by the solid line). After confirming that the reference vacuum pressure Ps1 has been reached, the suction nozzle 10 is raised and an electronic component is picked up.
[0025]
However, in the process of repeatedly performing vacuum suction from the suction nozzle 10, if the clogging of the filter 15 or adhesion of foreign matter inside the suction nozzle 10 proceeds, the response state of the vacuum suction system deteriorates and reaches the reference vacuum pressure Ps1. The timing tends to be delayed (see the pressure curve p2 shown by the broken line), and at the timing tb when the pickup should be performed, the vacuum pressure is lower than the reference vacuum pressure Ps1 by the difference ΔP1.
[0026]
In this case, an additional time lag Δt1 is required until the arrival of the reference vacuum pressure Ps1 is confirmed, and the electronic component is picked up by the suction nozzle 10 at a timing when the time lag Δt1 further elapses from the timing tb. . That is, the deterioration of the response state of the vacuum suction system causes a delay in the pickup operation by the time lag Δt1. Here, within the actually used condition range, the difference ΔP1 and the time lag Δt1 are substantially proportional.
[0027]
In order to prevent such a delay in the pickup operation, in the electronic component mounting method of the present embodiment, by changing the setting of the valve operation timing of the switching valve 13 using the valve operation timing correction data shown below, An increase in tact time due to a delay in the pickup operation is prevented.
[0028]
FIG. 6A shows the relationship between the air flow rate Q (horizontal axis) in the vacuum suction circuit and the vacuum pressure P (vertical axis) in the suction nozzle 10. As shown in FIG. 6A, the air flow rate Q in the state of being vacuum-sucked from the suction nozzle 10 has a substantially linear correspondence relationship with the vacuum pressure P within the range of conditions used for actual vacuum suction. That is, when the flow rate Q decreases by the flow rate deviation ΔQ1 from the reference flow rate value Q1 indicating the flow rate in the normal vacuum suction state, the vacuum pressure P decreases by the difference ΔP1 proportional to the flow rate deviation ΔQ1.
[0029]
In other words, if it is desired to detect the change state of the vacuum pressure P in the suction nozzle 10, the change in the flow rate Q may be measured. In the valve operation timing correction data shown in the present embodiment, using this relationship, the flow rate deviation ΔQ1 with respect to the reference flow rate value Q1 of the flow rate Q is obtained from the measurement result of the flow rate Q, and then the suction nozzle corresponding to this flow rate deviation ΔQ1 A difference ΔP1 of the vacuum pressure P within 10 is obtained, and a time lag Δt1 corresponding to the difference ΔP1 (that is, a timing correction value Δt1 corresponding to the flow rate deviation ΔQ1) is obtained.
[0030]
The graph of FIG. 6B omits the vacuum pressure P from the proportional relationship between the flow rate deviation ΔQ and the timing correction value Δt1 in the mutual relationship between the flow rate deviation ΔQ, the difference ΔP in the vacuum pressure P, and the timing correction value Δt1. It is shown. By preparing such valve operation timing correction data, the flow rate sensor 12 measures the flow rate Q in the vacuum suction circuit at an appropriate interval during operation of the electronic component mounting apparatus, and calculates the difference from the reference flow rate value Q1. Thus, a flow rate deviation ΔQ1 is obtained, and a timing correction value Δt1 corresponding to the flow rate deviation ΔQ1 is obtained.
[0031]
Then, the operation timing of the switching valve 13 is advanced by the determined timing correction value Δt1. As a result, as shown in FIG. 4B, the pressure curve p2 moves to the left by Δt1, and the vacuum pressure P reaches the reference vacuum pressure Ps1 at the original pickup timing tb. Therefore, even when the response state of the vacuum suction circuit changes due to factors such as clogging of the filter 15, the electronic component can be picked up without causing a time delay. In FIG. 6B, the relationship for making the timing correction value correspond to the flow rate deviation is indicated by a linear correlation line. However, in addition to this, a correlation line suitable for practical use, such as a step-like correlation line. May be selected and used.
[0032]
The above-described valve operation timing correction is similarly applied to the component mounting operation. That is, as shown in FIG. 5, in this component mounting operation, the switching valve 13 is switched to the switching port b side (vacuum suction OFF) as described above to release the suction state of the suction nozzle 10. In this component mounting operation, in order to reliably detach the electronic component from the suction nozzle 10, the vacuum inside the suction nozzle 10 is broken to a reference vacuum pressure value Ps2 (set to a pressure substantially equal to atmospheric pressure). Is needed.
[0033]
At this time, there is a time lag from the timing when the switching valve 13 is switched to the switching port b side (vacuum suction OFF) until the vacuum pressure in the suction nozzle 10 returns to the atmospheric pressure as in the case of vacuum suction. That is, as shown in FIG. 5A, the vacuum pressure P in the suction nozzle 10 is the reference at a timing td delayed by a time lag t2 from the timing tc when the switching valve 13 is switched to the switching port a (vacuum suction ON). The vacuum pressure value Ps2 is reached (see the pressure curve p3 indicated by the solid line). Then, after confirming that the reference vacuum pressure Ps2 has been reached, the suction nozzle 10 from which the electronic component has been detached rises and the component mounting operation is completed.
[0034]
However, in the process of repeatedly performing vacuum suction from the suction nozzle 10, if the clogging of the filter 15 or foreign matter adhesion inside the suction nozzle 10 proceeds, the response state of the vacuum suction system deteriorates and reaches the reference vacuum pressure Ps2. The timing tends to be delayed (see the pressure curve p4 indicated by the broken line), and at the timing td at which the part should be originally removed, the vacuum pressure state is higher than the reference vacuum pressure Ps2 by the difference ΔP2.
[0035]
In this case, an additional time lag Δt2 is required until the arrival of the reference vacuum pressure Ps2 is confirmed, and the suction nozzle 10 from which the electronic component is detached is lifted at the timing when the time lag Δt2 has further elapsed from the timing td. The operation is performed. That is, the deterioration of the response state of the vacuum suction system results in a delay in the component mounting operation by the time lag Δt2 in substantially the same manner as in the pickup operation. Here, within the condition range that is actually used, the difference ΔP2 and the time lag Δt2 are approximately proportional to each other as in the case of the pickup operation.
[0036]
In order to prevent such a delay in the component mounting operation, in the electronic component mounting method of the present embodiment, the valve operation timing correction data similar to the valve operation timing correction data in the pickup operation is used. By changing the setting of the valve operation timing of the switching valve 13, an increase in tact time due to a delay in the component mounting operation is prevented.
[0037]
That is, as shown in FIG. 6B, valve operation timing correction data indicating the relationship between the flow rate deviation ΔQ2 and the timing correction value Δt2 is prepared. The flow rate sensor 12 measures the flow rate in the vacuum suction circuit at an appropriate interval during operation of the electronic component mounting apparatus, calculates the difference from the reference flow rate value Q2, finds the flow rate deviation ΔQ2, and corresponds to this flow rate deviation ΔQ2. A timing correction value Δt2 is obtained.
[0038]
Then, the operation timing of the switching valve 13 is advanced by the determined timing correction value Δt2. As a result, as shown in FIG. 5B, the pressure curve p4 moves to the left by Δt2, and the vacuum pressure P reaches the reference vacuum pressure Ps2 at the timing td when the original electronic component is detached. Therefore, even when the response state of the vacuum suction circuit changes due to factors such as clogging of the filter 15, the electronic component can be mounted without causing a time delay.
[0039]
Next, the above-described valve operation timing setting process will be described with reference to FIG. This processing is performed at predetermined intervals in an electronic component mounting method in which the electronic component of the component supply unit 4 is sucked and held by vacuum suction from the suction nozzle 10 of the transfer head 8 through a vacuum suction circuit and mounted on the substrate 3. This is executed by the valve operation timing setting unit 18 (for example, every time a substrate is replaced).
[0040]
First, valve operation timing correction data is read from the storage unit 19 (ST1). Here, the valve operation timing in the reference state, that is, the timing corresponding to the timings ta and tc shown in FIGS. 4 and 5, the reference flow rate values Q1 and Q2 shown in FIG. Read the correct data. Here, timings ta and tc are given from the mounting sequence. The reference flow rate value Q1 is a flow rate value when the switching valve 13 is switched from vacuum suction OFF to vacuum suction ON in a normal reference state in which the filter 15 is not clogged or the suction nozzle 10 is not closed. Q2 is a flow rate value when the switching valve 13 is switched from vacuum suction ON to vacuum suction OFF. These data are measured in advance and stored in the storage unit 19.
[0041]
Next, the flow rate of the vacuum suction circuit is measured by the flow rate sensor 12 (ST2) (flow rate measurement step). In this flow rate measurement, the flow rate when the switching valve 13 is switched from the vacuum suction OFF to the vacuum suction ON in the state where the electronic component is not held in the suction nozzle 10 (a specific state for flow rate measurement) is measured. Next, the flow rate when the switching valve 13 is switched from vacuum suction ON to vacuum suction OFF is measured.
[0042]
From these flow rate measurement results, flow rate deviations ΔQ1 and ΔQ2 indicating the difference between the flow rate measurement value and the reference flow rate values Q1 and Q2 are obtained (ST3). Next, timing correction values Δt1 and Δt2 corresponding to the flow rate deviations ΔQ1 and ΔQ2 are obtained from the valve operation timing correction data (see FIG. 6B) (ST4). Then, the valve operation timing taking the timing correction values Δt1 and Δt2 into consideration is set as a new valve operation timing (ST5), and the setting result is output to the control unit 20.
[0043]
If a new valve operation timing is set in this way, the mounting operation is started. That is, the switching valve 13 is switched to the switching port a side, and the electronic component is sucked and held by the suction nozzle 10 (pickup process). As shown in FIG. 4B, the valve operation timing at this time is a timing in which the timing ta is advanced by Δt1. Thereafter, the transfer head 8 holding the electronic components moves above the line camera 11 and performs recognition here, and then moves onto the substrate 3.
[0044]
Then, the suction nozzle 10 that sucks and holds the electronic component is moved up and down with respect to the substrate 3, and the switching valve 13 is switched to the switching port b side to release the suction and holding of the electronic component by the suction nozzle 10. The electronic component is detached from the suction nozzle 10 and mounted on the substrate 3 (mounting process). As shown in FIG. 5B, the valve operation timing at this time is a timing in which the timing tc is advanced by Δt2.
[0045]
That is, in the pickup process and the mounting process of the electronic component mounting method described above, the timing correction values Δt1 and Δt2 are added to the initial timings ta and tc, respectively, based on the flow measurement result in the flow measurement process of the valve operation timing setting process. The control unit 20 controls the operation timing of the switching valve 13 using the valve operation timing.
[0046]
As described above, in the electronic component mounting apparatus shown in the present embodiment, as a countermeasure against the delay of the tact time due to the influence of the foreign substance in the vacuum suction system and the instability of the mounting operation, the conventionally used foreign substance exclusion by air blow is used. Not. Thereby, inconvenience in the conventional method, that is, only foreign matter adhering to the end of the suction nozzle can be removed, and it is not effective for foreign matter existing inside the vacuum suction system due to clogging of the filter, etc. Since air is blown to the suction nozzle, the scattering of foreign matters is unavoidable at the same time as the removal of foreign matters, and there is no problem of inducing new troubles due to the scattered foreign matters adhering to the mounting surface of the substrate.
[0047]
Therefore, the influence of foreign matter in the vacuum suction system that inevitably arises with the passage of operating time can be reduced as much as possible, the maintenance work interval can be extended and the work load can be reduced, and even when foreign matter adhesion is in progress Since the valve operation timing is updated according to the adhesion state, a stable mounting operation can always be maintained.
[0048]
In the above-described embodiment, only the operation timing of the switching valve 13 is targeted for timing correction. However, the operation timing of the air blow valve 16 that applies positive pressure to the suction nozzle 10 at the time of component removal in the mounting process is set. At the same time, the timing may be corrected. In this case, the measurement of the reference flow rate value Q2 and the flow rate measurement at the time of timing correction are performed with a positive pressure applied.
[0049]
【The invention's effect】
According to the present invention, the suction flow is measured by measuring the flow rate of air passing through the vacuum suction circuit by the flow rate sensor in a specific state of the suction nozzle, and controlling the connection / disconnection timing of the vacuum suction circuit based on the flow rate measurement result. The influence of foreign matter in the vacuum suction system for vacuum suction from the nozzle can be reduced as much as possible, and a stable mounting operation can be maintained.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 3 is a block diagram showing a configuration of a vacuum suction / air blow system of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 4 is a graph showing a temporal change in the degree of vacuum inside the vacuum suction circuit in the pickup operation by the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 5 is a graph showing a temporal change in the degree of vacuum inside the vacuum suction circuit in the component mounting operation by the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 6A is a graph showing the relationship between the degree of vacuum inside the vacuum suction circuit and the air flow rate in the electronic component mounting apparatus according to the embodiment of the present invention.
(B) The graph which shows the relationship between the flow volume deviation inside a vacuum suction circuit, and the timing correction value of a switching valve in the electronic component mounting apparatus of one embodiment of this invention.
FIG. 7 is a flowchart of valve operation timing setting processing in the electronic component mounting method according to the embodiment of the present invention.
[Explanation of symbols]
1 base
3 Substrate
4 Parts supply section
8 Transfer head
8a Unit transfer head
8b Wearing part
10 Suction nozzle
12 Flow sensor
13 Switching valve
14 Vacuum pump
15 Filter
16 Blow valve
18 Valve operation timing setting section
19 Memory
20 Control unit

Claims (2)

An electronic component mounting apparatus that picks up an electronic component from a component supply unit by a suction nozzle of a transfer head by vacuum suction and mounts the electronic component on a substrate, vacuum suction means for vacuum suction from the suction nozzle, and suction from the vacuum suction means A vacuum connecting / disconnecting means for connecting / disconnecting a vacuum suction circuit leading to the nozzle, a flow rate sensor for measuring a flow rate of air passing through the vacuum suction circuit provided in the vacuum suction circuit, and the flow rate measurement result of the flow rate sensor A timing control means for controlling the connection / disconnection timing of the vacuum connection / disconnection means,
A flow rate deviation with respect to a reference flow rate value indicating a flow rate in a normal vacuum suction state is obtained from a flow rate measurement result, and the connection / disconnection timing of the vacuum connection / disconnection means is controlled based on a timing correction value corresponding to the flow rate deviation. Electronic component mounting device. An electronic component mounting method in which an electronic component in a component supply unit is vacuum-sucked from a suction nozzle of a transfer head via a vacuum suction circuit to be suction-held and mounted on a substrate, and the vacuum is a specific state of the suction nozzle A flow rate measuring step for measuring the flow rate of air passing through the vacuum suction circuit by a flow rate sensor interposed in the vacuum suction circuit at the time of suction and a vacuum connection / disconnection means for connecting / disconnecting the vacuum suction circuit are brought into contact with each other. The pick-up process for picking up and holding electronic components by picking up and picking up the electronic components by the suction nozzle, and moving the suction nozzle holding and picking up the electronic components up and down relative to the substrate and releasing the suction holding by disconnecting the vacuum connection / disconnection means Including a mounting step of separating the electronic component from the suction nozzle and mounting it on the substrate,
In addition, the flow rate deviation from the reference flow rate value indicating the flow rate in the normal vacuum suction state is obtained from the flow rate measurement result, and the connection / disconnection timing of the vacuum connection / disconnection means is controlled based on the timing correction value corresponding to the flow rate deviation. And the electronic component mounting method characterized by controlling the connection / disconnection timing of the said vacuum connection / disconnection means based on the said flow measurement result in the said pick-up process and / or mounting process.

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