JP3850204B2 - Solder materials - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a soldering member (hereinafter, also referred to as “member”) to which solder is applied for mounting an electrical component such as a printed circuit board or a chassis or connecting to another member.
[0002]
[Prior art]
Conventionally, for example, tin-lead eutectic solder containing lead (hereinafter sometimes referred to as “leaded solder”) is generally used to attach electrical components to printed circuit boards or the like printed with circuit patterns. It had been.
[0003]
On the other hand, in recent years, due to consideration for the natural environment and the human body, there has been an active movement to eliminate lead, which is said to be particularly harmful, and for the disposal of lead-soldered parts. Special treatments are performed to reduce adverse effects on the environment.
[0004]
From such a background, lead-free solder (hereinafter sometimes referred to as “lead-free solder”) is in a trend of being used. However, when discarding a soldered member, it has been common in the past. There is no point if it is not possible to separate a member that is soldered and distributed from a member that is lead-free soldered.
[0005]
[Problems to be solved by the invention]
Therefore, for example, Japanese Patent Application No. 12-169150 proposes a solder member having an identification means that can identify the type of solder. However, since this identification means differs for each type of solder, There will be a wide variety of discrimination among harmless or harmful solders. And when this member is used to classify the member with respect to the presence or absence of the harmfulness of the solder, for example, it is judged by visually comparing with a list on which the identification corresponding to the type of solder is written, or by a special device. The identification is read, and collation is determined.
[0006]
In such a case, it is difficult to determine at a glance whether or not there is a hazard from among the many types of identification, and it is very likely that it will be confused by mistake. When the special equipment is introduced, an extra cost is incurred. Therefore, it cannot be said that the presence or absence of the harmfulness of the solder applied to the member can be easily and reliably distinguished.
[0007]
By the way, lead-free solder is often used properly from various kinds of solders with different chemical components and compositions in consideration of the heat resistance, compatibility, application, etc. of the member to be applied or the electrical component to be attached. From the viewpoint of the reliability of connection in repair or part replacement, it is desirable to apply the same type of solder as originally applied.
[0008]
Therefore, the present invention has been made in view of the above-described problems, and provides a member that can easily and reliably distinguish the presence or absence of harmfulness on the solder applied to the member, and further distinguish the type of solder. It is intended to do.
[0009]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, a member using solder according to the present invention is a member that is soldered for mounting an electrical component or connecting to another member, and at least a part of the surface of the member is provided with the solder. Display means for representing information is provided.
[0010]
For example, in order to distinguish a member on which harmless lead-free solder is applied, it is preferable to represent lead-free solder on the member. Furthermore, in order to specify the type of lead-free solder applied to the member, the type of solder or chemical component may be represented on the member.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described. FIG. 1 is a plan view of a printed circuit board showing a first embodiment of the present invention. In addition, description is abbreviate | omitted about the attached electrical component or the other member connected. A printed circuit board (hereinafter may be referred to as a “board”) 1 has a circuit pattern 2 and a land 3 on which electrical components are attached and connected to other members using solder. It is prepared side by side. A display 11 indicating solder information and a display 12 indicating the type of solder adjacent to the display 11 are provided at the position of the upper right corner of the substrate, and the solder is displayed at the position of the lower right corner of the substrate. It has the structure which has the display 13 showing the chemical component of these.
[0012]
If the display 11 representing the solder information represents “LF” (leading for “Lead Free”) indicating lead-free, it can be understood that it is a member that has been subjected to harmless lead-free solder at a glance. In addition to the presence or absence of properties, it can be distinguished from leaded solder. As another embodiment, for example, if “Pb” representing lead is displayed on the display 11, it can be determined at a glance that the member is subjected to harmful leaded solder.
[0013]
The display 11 of the present embodiment is expressed in a form in which “L” is a bold white character on a black background and “F” is inverted to a black bold character on a white background from the viewpoint of increasing the degree of attention. As long as it is, the display form of other characters, figures, symbols, patterns, colorings or sizes thereof is not limited. In addition, since it is an alternative to distinguish between harmless and harmful, or lead-free and leaded, it is sufficient to display one of the two, and the other does not have to be displayed.
[0014]
Next, a display 12 representing the type of solder and a display 13 representing the chemical component of the solder will be described. In the present embodiment, the types of solder are classified and used by chemical components. FIG. 2 is a table showing an example in which the types of lead-free solders are classified by chemical components, and an example in which one alphabetic character is substituted corresponding to the classified chemical components is also shown. For example, “Sn—Ag—Cu” -based lead-free solder indicates that “Ag” can be selected as a representative element and replaced with the acronym “a”. Therefore, when “a” is displayed on the display 12, it can be inferred that the solder applied to the member contains “Ag”, and the type of solder is specified by standardizing the table as shown in FIG. You can also.
[0015]
The display 12 of the present embodiment is represented by replacing the type of solder with one alphabetic character, but other characters, figures, symbols, patterns, colorings, or restrictions on the size, etc., are possible as long as they are clear and simple. There is no.
[0016]
Furthermore, the type of solder applied to the member can also be specified by displaying the chemical components of solder as shown in FIG. For example, if the solder applied to the member is “Sn—Ag—Cu” lead-free solder, the display 13 may represent “Sn—Ag—Cu” as it is.
By displaying the indications 12 and 13 in this way, it is possible to specify the type of solder applied to the member. Therefore, when repairing or replacing the member, the same type of solder as that originally applied is used. It becomes possible to apply solder.
[0017]
Further, since any of these displays 12 and 13 can be used to determine the type of solder applied to the member, only one of the displays may be displayed. The type of solder to be classified is not limited to the chemical component of the solder as in the present embodiment, but may be classified by a characteristic value such as a chemical composition of the solder or a melting temperature.
It should be noted that if the display form of the displays 11 and 12 and the classification of the solder type that is the basis of the display of the displays 12 and 13 are limited to those that can be commonly recognized by society, anyone can easily determine the solder applied to the member. As it becomes possible, the area of use will expand.
[0018]
By the way, the positions where the indications 11 to 13 are displayed are preferably the four corners of the substrate that are not hidden by the attachment of electrical components or the connection with other members, but may be any positions as long as they can be easily confirmed. Further, when the display 11 and the display 12 are displayed adjacent to each other as in the present embodiment, it is possible to quickly confirm at a glance that the solder is lead-free and the type of the solder. However, there is no problem even if the positions are separated from each other.
[0019]
Furthermore, there is no limitation on the manufacturing method for obtaining the substrate having such a configuration, and a conventionally known manufacturing method can be used. For example, if the contents shown in the displays 11 to 13 are directly printed in the manufacturing process of the substrate, the trouble of displaying them again can be saved. Alternatively, if a sticker displaying the contents to be expressed is prepared, it can be easily completed by sticking it to an appropriate position of a necessary member at any time, so that the versatile and usable range is widened.
[0020]
In addition, this invention is not limited to said embodiment, A various change is possible in the range which does not deviate from the meaning of this invention. For example, there is no particular limitation as a member to be used for solder, and other than the above-mentioned substrate, the mounting of electrical parts such as a resistor, a capacitor, an IC chip, an LSI, or a chassis to which electrical parts such as lead wires are attached, and other members Any member may be used as long as it is soldered for connection.
[0021]
Next, the top view of the printed circuit board which shows 2nd Embodiment of this invention is shown in FIG. As in the first embodiment shown in FIG. 1, the description of the attached electrical parts or other connected members is omitted, and in the drawing, the parts having the same names as those in FIG. The same reference numerals are given. The substrate 1 is a substrate having a size smaller than that of the substrate of the first embodiment, in which only the circuit pattern 2 is provided at the center of the substrate. A display 11 indicating solder information and a display 12 indicating the type of solder are provided adjacent to each other at the upper right corner of the substrate.
[0022]
The feature compared with the first embodiment is that the size of the displays 11 and 12 is reduced and the display 13 is omitted because there are few portions representing the display according to the size of the substrate. . Since the displays 11 and 12 are clear and simple, the display can be confirmed even if the display size is small. Since both the displays 12 and 13 indicate the type of solder, the display 13 is displayed as long as the display 12 is displayed. You don't have to. Therefore, the second embodiment can produce the same functions and effects as the first embodiment.
[0023]
【The invention's effect】
As described above, according to the present invention, in a member subjected to soldering for attachment of an electrical component or connection with another member, display means for displaying information on the solder is provided on at least a part of the surface of the member. Therefore, it can be easily distinguished whether the solder used is harmless or harmful, and the certainty of separation is high. In addition, since the determination of the distinction is an alternative, if the display means displays only one of the two, the manufacturing burden can be reduced.
[0024]
Therefore, when disposing of the soldered member, it is possible to reliably separate the member subjected to harmful solder that requires special disposal, thus preventing adverse effects on the natural environment and the human body. Not only can it be used effectively for resource recycling, so-called recycling.
[0025]
In addition, the display means can specify the type of solder when it represents at least one of the type of lead-free solder or chemical component applied to the member, and is used when repairing the member or replacing parts. Incorrect use of solder should be prevented, and the reliability of maintenance services is improved.
[0026]
In addition, these display means are effective as long as they are clear and simple even if the display size is small, and can be applied to small-sized members. Moreover, if the display position is limited to a part and brought close to each other, it can be quickly confirmed at a glance.
[0027]
Furthermore, in addition to the above effects, the fact that lead-free solder that is harmless at a glance is known is positively announced to the general public about lead-free products that are part of efforts to address environmental issues. It can be said that it is preferable.
[Brief description of the drawings]
FIG. 1 is a plan view of a printed circuit board showing a first embodiment of the present invention.
FIG. 2 is a table showing an example in which lead-free solder types are classified by chemical components.
FIG. 3 is a plan view of a printed circuit board showing a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Circuit pattern 3 Land 11 Display showing the information of solder 12 Display showing the kind of solder 13 Display showing the chemical component of solder

Claims (3)

In a member to which lead-free solder is applied for attachment of an electrical component or connection with another member, display means for displaying LF meaning lead-free in a display indicating information on the lead-free solder on at least a part of the surface of the member And a display unit for displaying the type of solder adjacent to the display unit. The soldering member according to claim 1, wherein the display means displays LF as a blank display for increasing the degree of attention . The solder use member according to claim 1 , further comprising display means for indicating a chemical component of the solder.

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