JP3857780B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for mounting an electronic component on a circuit board.
[0002]
[Prior art]
There are various dimensions and shapes of electronic components mounted on a circuit board. When a short electronic component is mounted near a tall electronic component, component holding means such as a suction nozzle for holding the electronic component is provided. If it touches a tall electronic component, it will be damaged or flipped off. In order to solve such problems, the conventional mounting method has already been mounted when the mounting order is restricted due to the interference between the shape and position of the electronic component and the shape of the component holding means. A mounting program is set in a mounting order such that the electronic component and the component holding means do not interfere with each other. According to this mounting program, multiple electronic components are held by multiple component holding means, and if a mounting error occurs during the mounting operation, the electronic component in which the mounting error has occurred is recovered and then held. The mounting operation of all the electronic components is terminated, and then the next mounting operation is started.
[0003]
An example of an electronic component mounting machine will be shown and described specifically. FIG. 2 is a perspective view showing an example of an electronic component mounting machine. The mounting head 5 is movable on the XY plane, and is configured so that the four suction nozzles (component holding means) 1, 2, 3, 4 mounted as shown in FIG. Has been. The mounting head 5 moves to the component supply unit 7 and sucks the electronic components by the suction nozzles 1 to 4, and the component recognition unit 6 recognizes the suction posture of each electronic component. Therefore, the posture correction is performed based on the recognition result. After performing the above, the electronic components sucked in the predetermined mounting position of the printed board carried in from the transfer device 8 and positioned at the predetermined position are sequentially mounted.
[0004]
When mounting is performed using the mounting head 5 having a plurality of suction nozzles 1 to 4 as described above, for example, when an electronic component to be mounted first has a suction error, a recognition error, etc., and cannot be mounted. If the mounting of the second electronic component is executed, the mounted electronic component and the suction nozzles 1 to 4 may interfere with each other when the first electronic component is mounted later. The second and subsequent electronic components are not mounted, but the first electronic component to be mounted is picked up again from the component supply unit 3 and all the electronic components are re-recognized by the component recognition unit 4 to be mounted first. After mounting the electronic component to be mounted, mounting of the second and subsequent electronic components is executed.
[0005]
[Problems to be solved by the invention]
As described above, in the conventional technology, if the mounting of the electronic component to be mounted first cannot be executed due to a suction error or the like, if the electronic component to be mounted second is mounted, the first electronic component to be mounted later If the mounted electronic component interferes with the suction nozzles 1 to 4 when the component is mounted, the third and fourth mounted electronic components are not near the mounting position of the first electronic component, but the first electronic Even if there was no interference with the component or the component holding means, the mounting could not be executed, and the recovery operation of the electronic component to be mounted first had to wait.
[0006]
As described above, in the conventional electronic component mounting method, in order to avoid interference between the mounted electronic component and the component holding means, the set mounting order must be observed even when the mounting order changes. However, there is a problem in that it is necessary and inflexible and reduces productivity.
[0007]
The present invention was devised in view of the problems of the conventional electronic component mounting method, and can efficiently mount the electronic component held in the component holding means even if the mounting order changes. The object is to provide an electronic component mounting method.
[0008]
[Means for Solving the Problems]
In the present invention, mounting is performed so that the component holding means does not interfere with the previously mounted electronic component from the relationship between the shape and mounting position of the electronic component and the shape of the component holding means that holds the electronic component and performs the mounting operation. In an electronic component mounting method for mounting a plurality of electronic components held by a plurality of component holding means according to the mounting order based on a mounting program set in order, a plurality of electronic components held by the plurality of component holding means In this case, a pair is extracted to keep the mounting order, and when a mounting error occurs, mounting of other electronic components other than the electronic component that is the target of pairing with the electronic component that caused the mounting error is performed. Thereafter, the electronic component in which the mounting error has occurred and the electronic component to be paired are held by the plurality of component holding units together with the electronic components to be mounted subsequently, and mounted.
[0009]
According to the electronic component mounting method, the mounting order set based on the relationship between the shape of the electronic component and the shape of the holding means so that the electronic component previously mounted and the holding means of the electronic component do not interfere with each other. When mounting with a plurality of electronic components held by a plurality of component holding means based on the mounting program set by the above, if a mounting error or the like occurs, the interference between the electronic component causing the mounting error or the like and the interference After prioritizing the mounting of electronic components regardless of the mounting order based on the relationship, the electronic component in which the mounting error has occurred and the paired electronic component are held together with the electronic components of the subsequent mounting in the plurality of component holding means. Implement. Therefore, since the mounting order can be changed based on the interference relationship, the mounting can be executed with flexibility and the mounting efficiency can be improved.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0011]
FIG. 1 is a flowchart showing a procedure of an electronic component mounting method according to an embodiment of the present invention. Hereinafter, the electronic component mounting method according to the present embodiment will be described with reference to FIG. This embodiment is an electronic component mounting method using the electronic component mounter shown in FIGS. 2 and 3, and the reference numerals of the constituent elements accompanying the description of the processing procedure are the same as those shown in FIG. To do. Also, # 1, # 2,... Shown in FIG. 1 are step numbers indicating processing procedures, and coincide with numbers described in the text.
[0012]
First, a mounting program representing the mounting order and mounting method of electronic components mounted on the circuit board is input to the control unit (# 1). This mounting program is a program in which the mounted electronic component and the suction nozzles (component holding means) 1 to 4 do not interfere with each other if the mounting operation is executed in the specified mounting order.
[0013]
Next, among the suction nozzles 1 to 4, component suction is performed using an empty suction nozzle on which no electronic component is sucked, and the component recognition unit 6 recognizes the component (# 2). However, all of the suction nozzles 1 to 4 are in an empty state when the mounting operation is proceeding at the beginning of mounting or according to the mounting order instructed by the mounting program.
[0014]
Next, for each electronic component sucked by each suction nozzle 1 to 4, the suction nozzle 1 to 4 derived from the relationship between the shape of the electronic component and the shape of the suction nozzle 1 to 4 and the mounted electronic component Because of the proximity distance allowed between them, a pair of electronic components that cause the suction nozzles 1 to 4 and the mounted electronic components to interfere unless the mounting order is observed is extracted (# 3). A state where the suction nozzles 1 to 4 interfere with the mounted electronic component will be described with reference to FIG.
[0015]
FIG. 4 shows a case where a large electronic component 11 which is a tall electronic component is already mounted on the circuit board 10 and a small electronic component 12 which is a short electronic component sucked by the suction nozzles 1 to 4 is mounted. The interference state is explained. FIG. 4 shows one of the suction nozzles 1 to 4, which is configured to be individually driven up and down by the mounting head 5, and a nozzle portion b is provided at the center of the nozzle base portion a. The distance from the tip of the nozzle part b to the base part a is L, the distance from the center of the base part a to the farthest part on the XY plane is R, the height of the large electronic component 11 from the circuit board 10 is h, When the distance from the center of the electronic component 11 to the farthest part on the XY plane is r and the height of the small electronic component 12 is H, the distance between the mounting positions of the large electronic component 11 and the small electronic component 12 is as follows. If it is larger than r + R, no interference occurs regardless of which one is mounted first. When the distance between the mounting positions is equal to or smaller than r + R, there is a possibility of interference, so it is necessary to compare the component height. When L + H is larger than h, there is no possibility of interference, but L + H If the small electronic component 12 is not mounted first, the nozzle base a and the large electronic component 11 interfere with each other. From the above conditions, it is possible to extract a pair of electronic components that cause the suction nozzles 1 to 4 and the mounted electronic components to interfere with each other.
[0016]
Therefore, the nozzle numbers of the suction nozzles 1 to 4 that need to be mounted first are input to the information storage area of the suction nozzles 1 to 4 in the extracted electronic component pair. For example, when the electronic component sucked by the suction nozzle 1 must be mounted before the electronic component sucked by the suction nozzle 3, N1 indicating the suction nozzle 1 is input to the storage area of the suction nozzle 3. .
[0017]
Returning to the description of FIG. 1, the electronic component recognized in the previous step # 2 is checked for the suction state based on the recognition result (# 4). An electronic component discarding flag is set in the information storage area of the nozzle numbers of the suction nozzles 1 to 4 being sucked (# 7). This nozzle number is input to the temporary storage area of the control unit of the electronic component mounting machine as suction nozzles 1 to 4 that could not be mounted (# 8). If it is determined in step # 4 that the suction state is normal, the nozzle number that needs to be mounted first, which is input to the information storage area of the suction nozzles 1 to 4, and the nozzle which is input to the temporary storage area If the same nozzle number exists after comparison with the number (# 5), it means that the electronic component that needs to be mounted first is not mounted, so the head number is input to the temporary storage area. The mounting is not executed (# 8). If the same nozzle number does not exist in the information storage area and the temporary storage area of the suction nozzles 1 to 4, the mounting is possible and the component mounting is executed (# 6).
[0018]
In step # 9, it is determined whether or not electronic components to be mounted remain in the suction nozzles 1 to 4. If they remain, the process returns to step # 4, and the processing from step # 4 to step # 9 is repeated. . If no electronic component remains in the suction nozzles 1 to 4, it is determined whether there is an electronic component that could not be mounted (# 10). Whether or not there is an electronic component that could not be mounted can be determined based on whether or not a nozzle number has been input to the temporary storage area. If the nozzle number has been input, there are electronic components that could not be mounted. Therefore, the suction nozzles 1 to 4 in which the electronic component discard flag is input to the information storage area of the suction nozzles 1 to 4 in step # 7. The electronic parts adsorbed on the board are discarded (# 12). After this processing, the nozzle number input in the temporary storage area is registered in the storage area of the control unit as a component suctioned nozzle (# 13). Further, after re-suctioning the discarded electronic components and clearing the temporary storage area (# 14), the process returns to step # 2, and the empty suction heads 1 to 4 that are not registered in the component-sucked nozzle information are set. Then, the electronic component in the next process of the mounting program is picked up, and mounting is executed by the processing procedure after step # 3.
[0019]
If the mounting operation is executed according to the mounting order instructed by the mounting program by the above processing operation, the mounting order is changed in the mounting program in which the mounted electronic component and the suction nozzles 1 to 4 do not interfere with each other. Even when such a situation occurs, it is possible to change the grouping of the implementation program and divide the program into groups that can be executed efficiently.
[0020]
If there is no electronic component that could not be mounted in step # 10, it is determined whether all the programs to be mounted have been completed (# 11). If the mounting has been completed, the mounting operation is ended. To do. If the mounting is not completed, the process returns to step # 2 to repeat the above process.
[0021]
【The invention's effect】
As described above, according to the present invention, it is set from the relationship between the shape of the electronic component and the shape of the holding means so that the previously mounted electronic component and the holding means of the electronic component do not interfere with each other. When mounting with a plurality of electronic components held by a plurality of component holding means based on the mounting program set according to the mounting order, if a mounting error occurs, the electronic component that caused the mounting error, etc. After prioritizing the mounting of electronic components that are not related to the mounting order based on the interference relationship, the electronic component in which the mounting error has occurred and the electronic component to be paired are held in the plurality of component holding units together with the electronic components that are subsequently mounted. Let's implement. Therefore, since the mounting order can be changed based on the interference relationship, the mounting can be performed with flexibility and the mounting efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a processing procedure of an electronic component mounting method according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration of an electronic component mounting machine.
FIG. 3 is a front view showing a configuration of a suction nozzle portion of the apparatus.
FIG. 4 is an explanatory diagram illustrating an interference relationship between a suction nozzle and an electronic component.
[Explanation of symbols]
1, 2, 3, 4 Suction nozzle (component holding means)

Claims (1)

Based on the relationship between the shape and mounting position of the electronic component and the shape of the component holding means that holds the electronic component and performs the mounting operation, the mounting order is set so that the component holding means does not interfere with the previously mounted electronic component. In an electronic component mounting method for mounting a plurality of electronic components held by a plurality of the component holding means according to the mounting order based on the mounting program described above,
A pair is extracted from the plurality of electronic components held by the plurality of component holding means to keep the mounting order, and when a mounting error occurs, the electronic component with the mounting error is paired. After mounting other electronic components excluding the electronic components that are present, the electronic components in which the mounting error has occurred and the electronic components to be paired are held together with the subsequent mounting electronic components in the plurality of component holding means and mounted. An electronic component mounting method comprising:

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