JP3859774B2

JP3859774B2 - Rotating substrate holder

Info

Publication number: JP3859774B2
Application number: JP19610596A
Authority: JP
Inventors: 宗憲石見
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 1996-07-25
Filing date: 1996-07-25
Publication date: 2006-12-20
Anticipated expiration: 2016-07-25
Also published as: JPH1036965A

Description

【０００１】
【発明の属する技術分野】
本発明は回転基板ホルダーに関し、特に被処理物を載置する凹部の形状に改良を施した回転基板ホルダーに関する。
【０００２】
【従来の技術】
従来、基板を回転させながら被処理物としての基板上に被膜を形成する場合、図１に示すような回転基板ホルダー１が用いられている。ここで、回転基板ホルダー１は、回転駆動部（図示せず）に回転軸２を介して連結されている。前記回転基板ホルダー１の表面部には、回転によって基板３が移動しないように基板３とほぼ同一形状で基板３の厚み（Ｔ）より深い深さ（Ｄ）の凹部４が設けられている。
【０００３】
【発明が解決しようとする課題】
しかしながら、従来の回転基板ホルダー１においては、基板３上に被膜５を形成する際、被膜５は基板３上のみならず、凹部４側面にも形成され、凹部４の内径寸法が減少する。そして、ついには、凹部４の内径寸法が基板３の外径寸法より小さくなり、被膜５を形成した基板３を回転基板ホルダー１から取り出すことができなくなり、あるいは挿入載置できなくなる。また、被膜５の強度が弱い場合、基板３の挿入載置あるいは取り出しの際、凹部４側面の被膜５を破壊し、基板３を汚染するという問題がある。
【０００４】
本発明はこうした事情を考慮してなされたもので、凹部を少なくとも２段の階段形状とすることにより、凹部の寸法が繰り返し堆積する被膜によって変化したり、あるいは基板が汚染するのを回避しえる回転基板ホルダーを提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明は、被処理物を載置する，該被処理物と略同形状の凹部を有し、回転させながら前記被処理物上に被膜を形成する回転基板ホルダーにおいて、前記凹部が少なくとも２段の階段形状であることを特徴とする回転基板ホルダーである。
【０００６】
本発明において、前記凹部は２段の階段形状でかつその段差部の高さは被処理物の厚みより小さいことが好ましい。図２を例にとって説明すれば、凹部の底面から段差１４ｂまでの高さをＨ_１，基板１３の厚みをＨ _２とすれば，Ｈ_２＞Ｈ_１であることが好ましい。しかし、Ｈ_２＞Ｈ_１の場合であっても、Ｈ_２，Ｈ_１の値の差が小さい場合は、被膜形成後の基板を凹部から取り出す際、基板が被膜により汚染される恐れがあるので、Ｈ_１を（1／3）Ｈ_２〜（1／2）Ｈ_２程度にすることがより好ましい。
【０００７】
本発明において、被膜は回転基板ホルダー上面，回転基板ホルダー側面，回転基板ホルダー階段部，基板に同一厚さで形成される。しかるに、凹部が例えば図２に示すように２段の階段形状である場合、基板を載置する凹部１４の底面から段差１４ｂまでの高さＨ _１は基板１３の厚みＨ _２より低く、かつ側面には基板が接しているため、基板載置部には被膜は形成されない。したがって、被膜の形成を繰り返し行なっても基板を載置する凹部の内径寸法は変化しない。一方、段差１４ａは、回転基板ホルダー１１の回転による遠心力によって基板が段差１４ｂを越え基板ホルダーから離脱するのを防止するために設けたものである。
【０００８】
【発明の実施の形態】
以下、本発明の一実施例を図２を参照して説明する。
図中の符番１１は、回転軸１２を介して回転駆動部（図示せず）に連結したステンレス製の回転基板ホルダーである。この回転基板ホルダー１１の上面部には、回転によって被処理物としての基板１３が移動しないように該基板１３とほぼ同一形状の階段状の凹部１４が設けられている。前記凹部１４は段差１４ａとこの段差１４ａの内側に設けられた階段形状の段差１４ｂにより構成されており、基板１３は段差１４ｂの内側に挿入載置される。
ここで、段差１４ａは、回転基板ホルダー１１の回転による遠心力によって基板１３が段差１４ｂを越えて回転基板ホルダー１１から離脱するのを防止するために設けたものであり、その高さは基板１３の上面位置より高く設定してある。他方の段差１４ｂの高さ（凹部１４の底面から段差１４ｂ上面までの高さ）Ｈ _１は基板１３の厚みＨ _２よりも低く、段差１４ｂの側面に基板１３が接するように載置される。上記Ｈ_１及びＨ_２の寸法は、例えばＨ_１＝０．３ｍｍ、Ｈ_２＝０．６ｍｍである。
【０００９】
このように、上記実施例に係る回転基板ホルダーによれば、段差１４ａと階段形状の段差１４ｂからなる凹部１４を設けた構成となっているため、以下に述べる効果を有する。
【００１０】
（１）被膜１５は基板１３及び回転基板ホルダー１１の上面に形成されるが、段差１４ｂの側面には基板１３が接している為、被膜１５が形成されることはない。
また、段差１４ｂ上面にも被膜１５が形成されるが、段差１４ｂの高さが基板１３の厚みより低いため、前記被膜１５が段差１４ｂの内側の基板載置部に形成されることはなく、段差１４ｂの内径寸法は維持される。
【００１１】
（２）回転基板ホルダー１１の回転による遠心力によって基板１３が段差１４ｂから離脱しようと傾いた場合、基板１３の傾きが段差１４ａによって制限されるため、段差１４ａの凹部から基板１３が離脱することがない。
【００１２】
なお、上記実施例では、回転基板ホルダーの凹部が２段の階段形状である場合について述べたが、これに限らず、３段以上の階段形状でも実施例と同様な効果が期待できる。
【００１３】
また、上記実施例では、回転基板ホルダーに１つの凹部が設けられている場合について述べたが、これに限らず、複数の凹部を設ける場合についても同様に適用できる。
【００１４】
以上詳述した如くこの発明によれば、凹部を少なくとも２段の階段形状とすることにより、凹部の寸法が繰り返し堆積する被膜によって変化したり、あるいは基板が汚染するのを回避しえる回転基板ホルダーを提供できる。
【図面の簡単な説明】
【図１】従来の回転基板ホルダーの断面図。
【図２】本発明の一実施例に係る回転基板ホルダーの断面図。
【符号の説明】
１１…回転基板ホルダー、１２…回転軸、１３…基板、
１４…凹部、 14ａ，14ｂ…段差、１５…被膜。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a rotating substrate holder, and more particularly to a rotating substrate holder in which the shape of a recess for placing an object to be processed is improved.
[0002]
[Prior art]
Conventionally, when a film is formed on a substrate as an object to be processed while rotating the substrate, a rotating substrate holder 1 as shown in FIG. 1 is used. Here, the rotary substrate holder 1 is connected to a rotary drive unit (not shown) via a rotary shaft 2. The surface portion of the rotating substrate holder 1 is provided with a recess 4 having substantially the same shape as the substrate 3 and a depth (D) deeper than the thickness (T) of the substrate 3 so that the substrate 3 does not move by rotation.
[0003]
[Problems to be solved by the invention]
However, in the conventional rotating substrate holder 1 , when the coating 5 is formed on the substrate 3, the coating 5 is formed not only on the substrate 3 but also on the side surface of the recess 4, and the inner diameter of the recess 4 is reduced. And, finally, the inner diameter of the recess 4 is smaller than the outer diameter dimension of the substrate 3, it can not be taken out of the substrate 3 to form a coating film 5 from rotating substrate holder 1, or can not insert placed. In addition, when the strength of the coating 5 is weak, there is a problem that the coating 5 on the side surface of the recess 4 is destroyed and the substrate 3 is contaminated when the substrate 3 is inserted or placed .
[0004]
The present invention has been made in consideration of such circumstances. By forming the recesses in at least two steps, it is possible to avoid the dimensions of the recesses being changed by the repeatedly deposited film or contamination of the substrate. An object is to provide a rotating substrate holder.
[0005]
[Means for Solving the Problems]
The present invention provides a rotating substrate holder on which an object to be processed is placed, which has a recess having substantially the same shape as the object to be processed, and forms a film on the object to be processed while being rotated. The rotating substrate holder is characterized by a stepped shape.
[0006]
In the present invention, it is preferable that the concave portion has a two-step shape and the height of the step portion is smaller than the thickness of the object to be processed. To describe 2 as an example, the height _H 1 from the bottom surface of the recess up to the step 14b, if the thickness of the substrate 13 and H _2, it is preferable that _H 2> _{H 1.} However, even if H ₂ > H ₁ , if the difference between the values of H ₂ and H ₁ is small, the substrate may be contaminated by the coating when the substrate after forming the coating is taken out from the recess. , H ₁ is more preferably about (1/3) H ₂ to (1/2) H ₂ .
[0007]
In the present invention, the coating is formed with the same thickness on the upper surface of the rotating substrate holder, the side surface of the rotating substrate holder, the stepped portion of the rotating substrate holder , and the substrate. However, when the recess has, for example, a two-step staircase shape as shown in FIG. 2, the height H ₁ from the bottom surface of the recess 14 on which the substrate is placed to the step 14b is lower than the thickness H _{2 of the} substrate 13 and the side surface. Since the substrate is in contact with the substrate, no film is formed on the substrate mounting portion . Therefore, the inner diameter dimension of the concave portion on which the substrate is placed does not change even when the coating is repeatedly formed . On the other hand, the step 14 a is provided to prevent the substrate from exceeding the step 14 b and being detached from the substrate holder due to the centrifugal force generated by the rotation of the rotating substrate holder 11 .
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to FIG.
Reference numeral 11 in the drawing denotes a stainless steel rotating substrate holder connected to a rotation driving unit (not shown) via a rotating shaft 12. On the upper surface portion of the rotating substrate holder 11, a stepped recess 14 having substantially the same shape as that of the substrate 13 is provided so that the substrate 13 as an object to be processed does not move by rotation. The recess 14 includes a step 14a and a stepped step 14b provided inside the step 14a , and the substrate 13 is inserted and placed inside the step 14b.
Here, the step 14 a is provided in order to prevent the substrate 13 from separating from the rotating substrate holder 11 beyond the step 14 b due to the centrifugal force caused by the rotation of the rotating substrate holder 11. It is set higher than the upper surface position. The height of the other of the step 14b (height from the bottom surface of the recess 14 up to the step 14b upper surface) H ₁ is lower than the thickness of _{H 2} substrate 13 is placed such that the substrate 13 is in contact with the side surface of the step 14b. The dimensions of H ₁ and H ₂ are, for example, H ₁ = 0.3 mm and H ₂ = 0.6 mm.
[0009]
Thus, according to the rotating substrate holder according to the above embodiment, since the concave portion 14 including the step 14a and the stepped step 14b is provided, the following effects are obtained.
[0010]
(1) Although the coating 15 is formed on the top surfaces of the substrate 13 and the rotating substrate holder 11, the coating 15 is not formed because the substrate 13 is in contact with the side surface of the step 14b.
Further, the coating film 15 is also formed on the upper surface of the step 14b, but since the height of the step 14b is lower than the thickness of the substrate 13, the coating film 15 is not formed on the substrate mounting portion inside the step 14b. The inner diameter of the step 14b is maintained.
[0011]
(2) When the substrate 13 is inclined attempts disengaged from the step 14b by the centrifugal force generated by the rotation of the rotating substrate holder 11, since the inclination of the substrate 13 is limited by a step 14a, the substrate 13 is disengaged from the recess of the step 14a There is no.
[0012]
In the above-described embodiment, the case where the concave portion of the rotating substrate holder has a two-step staircase shape is described. However, the present invention is not limited to this, and the same effect as that of the embodiment can be expected even with a three-step staircase shape.
[0013]
Further, in the above-described embodiment, the case where one concave portion is provided in the rotating substrate holder has been described.
[0014]
As described above in detail, according to the present invention, the concave portion has a stepped shape having at least two steps, so that the size of the concave portion can be prevented from changing due to the repeatedly deposited film or the substrate can be prevented from being contaminated. Can provide.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a conventional rotating substrate holder.
FIG. 2 is a cross-sectional view of a rotating substrate holder according to an embodiment of the present invention.
[Explanation of symbols]
11 ... Rotary substrate holder, 12 ... Rotating shaft, 13 ... Substrate,
14 ... concave, 14a, 14b ... step, 15 ... coating .

Claims

In the rotating substrate holder on which the object to be processed is placed , having a concave portion having substantially the same shape as the object to be processed, and forming a film on the object to be processed while being rotated,
The recess has at least a first step and a step-shaped second step provided inside the first step,
The height of the first step is higher than the upper surface position of the object to be processed placed in the recess,
The height of the second step from the bottom surface of the recess is set to be lower than the thickness of the workpiece,
A rotating substrate holder, wherein the workpiece is placed so as to be in contact with the second step side surface.