JPS6142421B2 - - Google Patents
Info
- Publication number
- JPS6142421B2 JPS6142421B2 JP57052403A JP5240382A JPS6142421B2 JP S6142421 B2 JPS6142421 B2 JP S6142421B2 JP 57052403 A JP57052403 A JP 57052403A JP 5240382 A JP5240382 A JP 5240382A JP S6142421 B2 JPS6142421 B2 JP S6142421B2
- Authority
- JP
- Japan
- Prior art keywords
- rotating body
- wafer
- plate
- seating portion
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Jigs For Machine Tools (AREA)
Description
【発明の詳細な説明】
この発明は半導体ウエハ(以下ウエハと言う)
を真空吸着させて回転させる為のウエハの回転保
持具の改良に関する。[Detailed Description of the Invention] This invention relates to semiconductor wafers (hereinafter referred to as wafers).
This invention relates to an improvement of a rotating holder for wafers for vacuum suction and rotation.
従来の回転保持具は第1図に示す様な一体形成
の回転体1からなり、その上面1aはウエハ2を
安定して保持出来る様に比較的幅広く且つ平坦に
なつており、脚部1bは高速回転しやすい様に細
い円柱状になつている。回転体1の中央には空気
の通路(IC)が回転軸に沿つて堀設されてお
り、脚部1bにはこの回転体1を駆動させ、且つ
真空源を具備したモーターにはめ込まれる様に比
較的大口径の穴1dが形成され、上面1aには皿
取り状に開口した穴1eが形成されてウエハ2を
吸着しやすい様になつている。 A conventional rotating holder consists of an integrally formed rotating body 1 as shown in FIG. 1, and its upper surface 1a is relatively wide and flat so as to stably hold a wafer 2, and its legs 1b are It has a thin cylindrical shape that makes it easy to rotate at high speeds. An air passage (IC) is provided in the center of the rotating body 1 along the rotation axis, and an air passage (IC) is provided in the leg 1b so as to drive the rotating body 1 and fit into a motor equipped with a vacuum source. A relatively large-diameter hole 1d is formed, and a countersunk-shaped hole 1e is formed in the upper surface 1a so that the wafer 2 can be easily attracted.
さて、この回転体1の主たる用途は、写真製版
に使用するホトレジストの塗布工程である。即
ち、ホトレジストの塗布工程に於ては、第1図の
様にウエハ2を吸着してホトレジストをウエハ2
の中心部、即ち回転体1の中心軸上に滴下したの
ち、2000乃至4000rpmで回転することにより均一
な膜厚のホトレジスト膜をウエハ2表面に形成す
る訳である。 Now, the main use of this rotating body 1 is a photoresist coating process used in photolithography. That is, in the photoresist coating process, as shown in FIG.
The photoresist film is dropped onto the center of the rotating body 1, that is, on the central axis of the rotating body 1, and then rotated at 2000 to 4000 rpm to form a photoresist film with a uniform thickness on the surface of the wafer 2.
この場合、ウエハ2を回転させている間は、回
転体1としては空気の通路1c内を真空に保つて
いなければならないのであるが、ウエハ2は一般
に100乃至300μm程度の厚みのものが多く、真空
保持直後や回転中に割れたり、あるいは誤動作で
割れたウエハを保持することが多々ある。従つて
この様な場合にホトレジストが滴下されると、空
気の通路1c内にホトレジストが入つてしまう事
故が発生する。この事故は実際には非常に生産性
を落す事になる。何故ならば、この空気の通路1
cは真空に保たれている為に、誤つて滴下された
ホトレジストは、真空回路の奥深く侵入し、真空
度を制御しているセンサーや、真空発生源を傷め
るからである。従つてこの様な事故が発生する
と、その都度、装置を分解掃除することを余儀な
くされ、その分だけ大きく生産性を損うのであ
る。 In this case, while the wafer 2 is being rotated, the rotating body 1 must maintain a vacuum in the air passage 1c, but the wafer 2 is generally about 100 to 300 μm thick; Wafers that are broken immediately after vacuum holding, during rotation, or broken due to malfunction are often held. Therefore, if photoresist is dropped in such a case, an accident may occur in which the photoresist gets into the air passage 1c. This accident actually results in a huge drop in productivity. The reason is that this air passage 1
Since c is kept in a vacuum, photoresist dropped by mistake will penetrate deep into the vacuum circuit and damage the sensor controlling the degree of vacuum and the vacuum source. Therefore, whenever such an accident occurs, the equipment must be disassembled and cleaned, which greatly reduces productivity.
この発明はこのような従来のものの欠点を除去
するためになされたもので、回転保持具の上部に
おいては空気の通路を中心部から回避させて設け
ることにより、ウエハが割れたりしてもホトレジ
ストが空気の通路内に侵入することがないように
した回転保持具を提供することを目的としてい
る。 This invention was made in order to eliminate the drawbacks of the conventional ones.By providing an air passage in the upper part of the rotating holder to avoid the center part, the photoresist can be maintained even if the wafer breaks. It is an object of the present invention to provide a rotating holder that prevents air from entering the passageway.
以下本発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第2図は本発明の一実施例を示し、図において
回転体3の上面3aには座取り部3fが穿つて設
けられており、座取り部3fの内周面には雌ネジ
3hが加工されている。又、3gは両主面が平坦
な板状体で、回転体3の中心軸からそれた位置に
表面部が皿取り状に加工された真空吸着穴3eが
複数個、それぞれ貫通して設けられている。又、
板状体3gの外周面には座取り部3fの雌ネジ3
hに対応する雄ネジ3iが加工されており、この
板状体3gを回転体3にネジ込んで固定する様に
なつている。更に又、この板状体3gの厚さは座
取り部3fの深さよりも短かくなつており、上面
3aを平坦に合わせた状態で空気の通路3cと上
記真空吸着穴3eとが連通するのを妨げない様に
なつている。 FIG. 2 shows an embodiment of the present invention. In the figure, a seating portion 3f is provided on the upper surface 3a of the rotating body 3, and a female thread 3h is machined on the inner peripheral surface of the seating portion 3f. has been done. Further, 3g is a plate-shaped body with both main surfaces flat, and a plurality of vacuum suction holes 3e each having a countersunk surface are provided at positions deviating from the central axis of the rotating body 3. ing. or,
On the outer peripheral surface of the plate-shaped body 3g, there is a female thread 3 of the seated part 3f.
A male screw 3i corresponding to h is machined, and this plate-shaped body 3g is screwed into the rotating body 3 and fixed. Furthermore, the thickness of this plate-shaped body 3g is shorter than the depth of the seated portion 3f, so that the air passage 3c and the vacuum suction hole 3e communicate with each other when the upper surface 3a is flat. It is designed so that it does not interfere with
本乗施例による回転体3では、板状体3gの真
空吸着穴3eが回転体3の中心軸からそれた位置
に設けられているので、ウエハ2が割れたりした
際にもホトレジストが直接空気の通路3cに侵入
する事故が減少する訳である。又、空気の通路3
cにホトレジストが侵入しても本実施例では必然
的に空気の通路が長くなる為、装置の奥深くに入
ることが少なく、それだけ保守が簡単になる。従
つて通常はこの回転体3のみをはずして板状体3
gのネジ込みを解き、有機溶剤で洗浄すれば良
い。 In the rotating body 3 according to this embodiment, the vacuum suction hole 3e of the plate-shaped body 3g is provided at a position deviating from the central axis of the rotating body 3, so that even if the wafer 2 is cracked, the photoresist is directly exposed to the air. This reduces the number of accidents caused by people entering the passageway 3c. Also, air passage 3
Even if the photoresist enters into the area c, the air passage is inevitably long in this embodiment, so it is less likely to go deep into the device, and maintenance becomes easier. Therefore, usually only this rotating body 3 is removed and the plate-like body 3 is removed.
Just unscrew g and clean it with an organic solvent.
さて、上記実施例において、パツキング3jを
座取り部3fと板状体3gとの間に設置すること
により、気密性を向上させ、より真空吸着力を高
めることが出来る。更に、第3図の様に座取り部
3fに溝を堀設して液だめ部4を形成すれば、侵
入したホトレジスト大部分この液だめ部4に捕え
ることが出来る。但しこの場合、液だめ部4は真
空吸着穴3eの直下に形成することが効果的であ
る。 Now, in the above embodiment, by installing the packing 3j between the seating portion 3f and the plate-shaped body 3g, it is possible to improve the airtightness and further increase the vacuum suction force. Furthermore, if a groove is formed in the seated portion 3f to form a liquid reservoir 4 as shown in FIG. 3, most of the invading photoresist can be captured in the liquid reservoir 4. However, in this case, it is effective to form the liquid reservoir 4 directly below the vacuum suction hole 3e.
なおこの発明の回転保持具を構成する材料とし
てはアルミニウム、、ステンレススチール等が好
適である。 Note that aluminum, stainless steel, and the like are suitable as materials constituting the rotary holder of the present invention.
また上記実施例では、半導体ウエハについてそ
の実施例を述べたが、これに限らず、ガラス,水
晶,サフアイヤその他の材料からなるウエハ状体
の回転保持具にも使用出来ることは明白である。 Further, in the above embodiment, the embodiment has been described with respect to a semiconductor wafer, but it is obvious that the present invention is not limited to this, and can also be used for a rotating holder for a wafer-shaped body made of glass, crystal, sapphire, or other materials.
以上のようにこの発明は、断面T字状の回転体
の上面に穿つた座取り部に、回転体の中心軸に設
けられた空気の通路を回避した位置に真空吸着穴
を設けた別体の板状体をねじ込んだものであるの
で、ホトレジストの塗布工程に於て、ホトレジス
トが回転体の空気の通路及び取付装置内部を損う
事故を軽減できる効果がある。又、板状体の下部
にパツキングを設置すると真空気密度が向上して
回転中にウエハがはずれる事故も軽減される。更
に又、真空吸着穴の下部に液だめ部を形成するこ
とにより、装置内部の損傷はより軽減される。 As described above, the present invention provides a separate body in which a vacuum suction hole is provided in a seating portion bored on the upper surface of a rotating body having a T-shaped cross section at a position that avoids the air passage provided in the central axis of the rotating body. This has the effect of reducing accidents in which the photoresist damages the air passage of the rotating body and the inside of the mounting device during the photoresist coating process. Furthermore, if packing is installed at the bottom of the plate-shaped body, the vacuum density will be improved, and the accident of the wafer coming off during rotation will be reduced. Furthermore, by forming a liquid reservoir at the bottom of the vacuum suction hole, damage to the inside of the device can be further reduced.
第1図は従来のウエハの回転保持具を示す断面
図、第2図及び第3図はそれぞれ本発明の実施例
を示す断面図である。
3……回転保持具、3c……空気の通路、3a
……上面部、3f……座取り部、3g……板状
体、3e……真空吸着穴、3h……雌ネジ、3i
……雄ネジ、3j……パツキング、4……溝。
尚、図中同一符号は同一又は相当部分を示す。
FIG. 1 is a sectional view showing a conventional wafer rotating holder, and FIGS. 2 and 3 are sectional views showing an embodiment of the present invention. 3...Rotating holder, 3c...Air passage, 3a
...Top part, 3f... Seat part, 3g... Plate body, 3e... Vacuum suction hole, 3h... Female screw, 3i
... Male thread, 3j... Packing, 4... Groove.
Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
を円板状に穿つて形成された座取り部と、上記回
転体の中央部に設けられ一端が上記回転体の脚部
の下端面に開口し他端が上記座取り部に開口した
空気の通路と、上記座取り部の内周面に形成され
た雌ネジに対応して外周面に雄ネジが形成され上
記座取り部に上記回転体の上面が平坦になるよう
にかつ下面が上記座取り部に当接しないようにね
じ込まれた板状体と、上記板状体に該板状体の中
心部以外の両主面を貫通して設けられた真空吸着
穴とを備え、上記回転体の上面にウエハを真空吸
着保持することを特徴とするウエハの回転保持
具。。 2 上記座取り部がその底面に堀設された溝を有
することを特徴とする特許請求の範囲第1項記載
のウエハの回転保持具。 3 上記座取り部の底面と上記板状体の下面との
間に真空気密度を向上させるパツキングが介設さ
れていることを特徴とする特許請求の範囲第1項
又は第2項記載のウエハの回転保持具。[Scope of Claims] 1. A rotating body having a T-shaped cross section, a seating portion formed by drilling the upper surface of the rotating body into a disk shape, and a seating portion provided at the center of the rotating body and having one end connected to the rotating body. An air passage that opens at the lower end surface of the leg of the body and the other end opens at the seated portion, and a male thread is formed on the outer circumferential surface in correspondence with the female thread formed on the inner circumferential surface of the seated portion. a plate-shaped body screwed into the seated part so that the upper surface of the rotating body is flat and the lower surface does not come into contact with the seated part, and a center part of the plate-shaped body 1. A wafer rotation holder, characterized in that the wafer is vacuum suction-held on the upper surface of the rotary body, the wafer being held by vacuum suction on the upper surface of the rotating body. . 2. The wafer rotation holder according to claim 1, wherein the seating portion has a groove formed in its bottom surface. 3. The wafer according to claim 1 or 2, characterized in that packing for improving vacuum density is interposed between the bottom surface of the seating portion and the lower surface of the plate-shaped body. rotating holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57052403A JPS58168253A (en) | 1982-03-29 | 1982-03-29 | Wafer rotation holding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57052403A JPS58168253A (en) | 1982-03-29 | 1982-03-29 | Wafer rotation holding tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58168253A JPS58168253A (en) | 1983-10-04 |
| JPS6142421B2 true JPS6142421B2 (en) | 1986-09-20 |
Family
ID=12913824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57052403A Granted JPS58168253A (en) | 1982-03-29 | 1982-03-29 | Wafer rotation holding tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168253A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2728766B2 (en) * | 1990-07-18 | 1998-03-18 | 株式会社東芝 | Semiconductor processing method and apparatus |
| JPH07110455B2 (en) * | 1992-10-27 | 1995-11-29 | 住友電気工業株式会社 | Wafer fixing device |
-
1982
- 1982-03-29 JP JP57052403A patent/JPS58168253A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58168253A (en) | 1983-10-04 |
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