JP3861027B2 - Mother board for manufacturing circuit board having cable portion and method for manufacturing circuit board - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a circuit board used in an electronic apparatus, and more particularly to a base board and a circuit board manufacturing method for manufacturing a circuit board in which a plurality of component mounting parts are connected by a cable part.
[0002]
[Prior art]
This type of circuit board is mounted on equipment by mounting electronic components. In electronic devices, downsizing has always been an issue, and it is necessary to mount components three-dimensionally. Therefore, it is required to bend the circuit board, and there is provided a circuit board in which component mounting parts disclosed in JP-A-2001-111225 are connected by a cable part.
[0003]
This circuit board can be three-dimensionally arranged by bending it with a flexible cable part after component mounting, and space can be used effectively, so that compactness is achieved.
[0004]
[Problems to be solved by the invention]
Here, since the cable portion is often provided with long and fine circuits in a concentrated manner, the cable portion is easily affected by electromagnetic waves from the outside. As a countermeasure, a conductive layer such as a silver vapor deposition sheet is attached.
[0005]
However, the inspection of whether or not the mounting position of the conductive layer is good is visually, and a large amount of inspection is difficult. On the other hand, mounting of the conductive layer is performed manually, and misalignment, wrinkles, forgetting to stick, and the like are likely to occur.
[0006]
For this reason, it is desired to be able to easily detect the quality of the mounting position of the conductive layer.
[0007]
The present invention has been made in consideration of the above-described points, and can easily and accurately detect whether or not the conductive layer provided on the cable portion connecting the component mounting portion on the circuit board is mounted at an appropriate position. An object of the present invention is to provide a mother board for manufacturing a circuit board having a simple structure and a method for manufacturing the circuit board.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, in the present invention,
A circuit board in which a plurality of component mounting parts are connected to each other by a cable part, wherein the cable part is provided with a conductive layer for blocking electromagnetic waves, and a mother board for punching and manufacturing a circuit board A cable having a plurality of circuit pattern pairs formed so as to have a predetermined distance with respect to the cable portion at a portion of the mother board that is a waste plate portion and is very close to the cable portion. Circuit board manufacturing mother board having a portion and a circuit board in which a plurality of component mounting portions are connected to each other by a cable portion, and the cable portion is provided with a conductive layer for shielding electromagnetic waves In the manufacturing method in which the circuit board is manufactured by punching from the base substrate, the portion of the base plate that is a discarded plate portion and very close to the cable portion, Forming a plurality of circuit pattern pairs having a predetermined distance with respect to the cable portion, covering the cable portion, and forming a conductive path of a predetermined dimension between the tip portions of the plurality of circuit pattern pairs. A method of manufacturing a circuit board, wherein a portion between a connection portion between the plurality of circuit pattern pairs and the conductive layer and the cable portion is punched and removed,
Is to provide.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a plan view showing an embodiment of the present invention. In the state shown in FIG. 1, the component mounting portions 1a and 1b and the cable portion 2 are formed on the mother board 10, and the circuit patterns 3a to 3h for inspection are provided in the vicinity of the cable portion 2 in the discarded plate portion of the mother board 10. And the alignment guide hole 4 is formed, and shows a state before the conductive layer is mounted.
[0010]
The inspection circuit patterns 3a to 3h are formed in a total of four pairs, one pair at four positions at a predetermined distance from the cable portion 2. The inspection circuit patterns 3a to 3h are provided so that the ends of each pair are located at a predetermined distance from a conductive layer described later. In addition, the number is four pairs in the case of illustration, but more can be detected more accurately. On the other hand, if it is not necessary, it may be 3 pairs or less.
[0011]
The base substrate 10 is a four-layer substrate, and cables connected to the cable portion 2 are formed on the second and third layers of the component mounting portions 1a and 1b.
[0012]
FIG. 2 shows a state in which the conductive layer 5 is provided so as to cover the cable portion 2 and the vicinity thereof in the base substrate 10 in the state of FIG. The conductive layer 5 has a shape that is slightly larger than the cable portion 2 in the range surrounded by the symbols a, b, c, and d, so that the peripheral edge thereof overlaps the tip portions of the inspection circuit patterns 3a to 3h. Provided. When the conductive layer 5 is correctly mounted, the conductive layer 5 covers the tip portions of the inspection circuit patterns 3a to 3h by a predetermined length S.
[0013]
As a result, if an inspection jig with an inspection probe is brought into contact with the pair of inspection circuit patterns, for example, 3a and 3b are connected by the conductive layer 5, and the other pairs are also connected in the same manner. Become. As a result, the inspection circuit pattern pairs provided at the four corners of the cable portion 2 are all connected.
[0014]
And the smaller the predetermined length S is set, the easier it is that a non-connected state will occur, and the mounting accuracy of the conductive layer 5 will be severely questioned.
[0015]
If even one place is in a disconnected state, the conductive layer 5 is inclined and attached. Further, if there is no attached conductive layer 5, all circuit pattern pairs are disconnected, and forgetting to stick is detected.
[0016]
In addition, the part shown with the code | symbol 6 on the both sides of the cable part 2 is removed by stamping later. At this time, the conductive layer 5 which is in the discarded plate portion of the base substrate 10 is also removed together.
[0017]
FIG. 3 shows a state in which the conductive layer 5 is mounted with a considerable displacement. As shown in the figure, among the four pairs of test circuit patterns, the patterns 3c and 3d are not connected, and the other three pairs are connected. In the illustrated case, this occurs when the conductive layer 5 is tilted to the left in the drawing. If it is further tilted to the left, the patterns 3e and 3f are in a disconnected state, and if it is tilted to the right, the other patterns in the currently connected state are disconnected.
[0018]
As described above, one of the circuit pattern pairs is in a disconnected state in accordance with the inclination state of the conductive layer 5.
[0019]
(Modification)
In the above embodiment, an example of a four-layer circuit board is shown, but the present invention can be applied to a circuit board connected by a cable portion regardless of the layer configuration.
[0020]
【The invention's effect】
As described above, the present invention detects whether or not the mounting position of the conductive layer provided on the cable portion of the circuit board formed by connecting the plurality of component mounting portions with each other by the cable portion is based on the connection of the circuit pattern pair for inspection. As a result, it is possible to perform defect inspection much more accurately and quickly than conventional visual discrimination.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration before a conductive layer according to an embodiment of the present invention is formed.
FIG. 2 is a plan view showing a configuration after a conductive layer of the embodiment of FIG. 1 is formed.
FIG. 3 is a plan view showing a case where the conductive layer is similarly inclined.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component mounting part 2 Cable part 3 Inspection circuit pattern 4 Positioning guide hole 5 Conductive layer 6 Punching part 10 Base substrate S Overlap length of inspection circuit pattern and conductive layer

Claims (4)

In a mother board for punching and manufacturing a circuit board in which a plurality of component mounting parts are connected by a cable part, and the cable part is provided with a conductive layer for blocking electromagnetic waves ,
A cable portion, wherein a plurality of circuit pattern pairs formed to have a predetermined distance with respect to the cable portion are provided in a portion of the base board that is a waste plate portion and is very close to the cable portion. A mother board for manufacturing a circuit board. In the circuit board manufacturing base substrate having the cable portion according to claim 1,
The plurality of circuit pattern pairs are circuit board manufacturing base boards having cable portions provided on both sides near both ends of the cable portion. A circuit board in which a plurality of component mounting parts are connected to each other by a cable part, and a circuit board in which a conductive layer for shielding electromagnetic waves is provided in the cable part is punched out from a base board. In the manufacturing method,
A plurality of circuit pattern pairs having a predetermined distance with respect to the cable part are formed on a portion of the mother board that is a waste plate part and very close to the cable part,
Covering the cable portion and forming a conductive layer so as to form a conductive path of a predetermined dimension between the tip portions of the plurality of circuit pattern pairs,
A method for manufacturing a circuit board, wherein a portion between a connection portion between the plurality of circuit pattern pairs and the conductive layer and the cable portion is punched and removed. In the manufacturing method of the circuit board of Claim 3,
A method of manufacturing a circuit board, wherein after the formation of the conductive layer, the plurality of circuit pattern pairs are energized and the energized state is checked to determine whether the formation position of the conductive layer is correct.

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