JP3904627B2 - Substrate transfer control method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate transfer control method for performing transfer processing of a substrate by a transfer device in a semiconductor manufacturing apparatus that performs a predetermined process such as a film forming process on a substrate, and more particularly to control when stopping the operation of the transfer device. .
[0002]
[Prior art]
In a semiconductor manufacturing apparatus that performs a predetermined process such as a film forming process on a substrate such as an LCD glass substrate or a semiconductor wafer, the substrate is transferred to a process module or the like by a transfer device such as a robot arm. In this carrying process, the operation of the carrying device is controlled by the control device in accordance with a program describing the control procedure, and the carrying process is automatically performed according to a preset procedure.
[0003]
An example of a semiconductor manufacturing apparatus that implements such a substrate transfer control method will be described with reference to FIG.
The semiconductor manufacturing apparatus controls process modules 1 and 2 that perform predetermined processing on a substrate, a transfer device 3 that transfers a substrate, a transfer module 4 that houses the transfer device 3, and a transfer process of the substrate by the transfer device 3. A control device 9 for controlling the substrate, a substrate sensor 6 for detecting whether or not the transport device 3 grasps the substrate, a substrate management means 7 for managing the position of the substrate, and a transport stop means 8 for instructing to stop the substrate transport processing. And.
[0004]
The control of the substrate transfer process performed by the control device 9 of the semiconductor manufacturing apparatus will be described with reference to FIG. 4A, taking as an example the case where the substrate is transferred from the process module 1 to the process module 2.
First, after the transfer device 3 is turned from the predetermined standby position toward the transfer process module 1 (step S20), the process module 1 is prepared to carry out the substrate (step S21). Then, the transfer device 3 is extended to enter the process module 1 to grasp the substrate to be transferred, and then the transfer device 3 is contracted to leave the process module 1 (step S22). When the transfer device 3 is withdrawn from the process module 1, the substrate sensor 6 detects that the substrate is grasped by the transfer device 3, and changes the substrate position information of the substrate management means 7 to the transfer module 4 (step S23). ).
[0005]
Then, after the transfer apparatus is turned in the direction of the process module 2 that is the transfer destination (step S24), the process module 2 is prepared to carry in the substrate (step S25). Then, after the transfer device 3 is extended and moved into the process module 2 to transfer the grasped substrate, the transfer device 3 is contracted to leave the process module 2 (step S26). When the transfer device 3 leaves the process module 2, the substrate sensor 6 detects that the substrate is not grasped by the transfer device 3, and changes the substrate position information of the substrate management means 7 to the process module 2 (step 27). . Then, in preparation for the next transport process, the transport device 3 is swung to a predetermined standby position of the transfer module 4 (step 28).
[0006]
Here, when a failure occurs in the production process including the semiconductor manufacturing apparatus during the above-described transfer process, the transfer stop unit 8 detects the occurrence of the failure and instructs the control device 9 to stop the transfer process. Do. Receiving this stop instruction, the control device 9 performs the interrupt process shown in FIG. 4B, and the control means 9 performs the transfer device 3 during the execution of any of the transfer processes (steps S20 to S28). All processes including stopping are stopped (step S29).
[0007]
[Problems to be solved by the invention]
In the above-described conventional substrate transfer control method, the transfer process is forcibly stopped when there is a stop instruction from the transfer stop means 8, so that the transfer device 3 stops its operation on the spot. For this reason, for example, when there is a stop instruction in the process of entering and leaving the process module, the transfer device 3 remains in the process module in a high temperature state by performing a film forming process or the like. There has been a situation in which the transport device 3 is damaged.
[0008]
Further, for example, when a stop instruction is given before the carry-in operation shown in step S26 is finished and the substrate detection and position information changing process shown in the next step S27 is finished, before the substrate position management is performed. The function stops. Therefore, although the substrate is located in the process module 2, the substrate position managed by the substrate management unit 7 is not the transfer module 4, and the actual substrate position and the substrate management unit 7 manage it. The position of the existing board has shifted. As described above, when the substrate position is shifted, it is difficult to specify the position of the substrate in the apparatus, and it takes a long time for the recovery process such as removing the substrate in the apparatus, and the operation efficiency of the semiconductor manufacturing apparatus. There was also a situation that brought about a decline.
[0009]
The present invention has been made in view of the above-described conventional circumstances, and an object of the present invention is to provide a substrate transfer control method that can prevent the transfer device from being damaged and can reliably manage the position of the substrate.
[0010]
[Means for Solving the Problems]
In order to achieve the above-described object, a substrate transfer control method according to claim 1 is a substrate transfer control method in which a transfer apparatus performs an entrance / exit operation to a process module to transfer a substrate to the process module. If there is a stop instruction to stop the operation of the transfer device at a time when the entry / exit operation processing has not been completed, the transfer device's operation is terminated based on the stop instruction after the transfer / exit operation processing of the transfer device is completed. The operation is stopped.
Here, the stop instruction is given when a failure occurs in a production process including a semiconductor manufacturing apparatus that implements the substrate transfer control method of the present invention.
[0011]
In the substrate transfer control method according to claim 1 described above, when there is a stop instruction for stopping the operation of the transfer apparatus during the process of entering and leaving the process module by the transfer apparatus, the stop instruction is temporarily suspended. Thus, after the entrance / exit operation of the transfer device is completed, the transfer device is prevented from remaining in the process module by stopping the operation of the transfer device based on the stop instruction.
[0012]
According to a second aspect of the present invention, there is provided a substrate transport control method for transporting a substrate by a transport device and performing transport processing for detecting whether the transport device grasps the substrate and managing a substrate position. In the method, if there is a stop instruction to stop the transfer process when the substrate position management process after the transfer process by the transfer apparatus is not completed, the management process is ended, and then based on the stop instruction. The conveyance process is stopped.
[0013]
In the substrate transfer control method according to claim 2, there is a stop instruction to stop the transfer process when the substrate position information management process is not completed after the transfer process of the substrate by the transfer device is completed. In this case, the stop instruction is temporarily suspended, and after the position information of the substrate is changed to the actual position of the substrate by the management process, the transfer process is stopped based on the stop instruction. The information matches the actual substrate position.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An example of a semiconductor manufacturing apparatus that implements the substrate transfer control method of the present invention will be described with reference to FIG.
The semiconductor manufacturing apparatus includes process modules 1 and 2 that perform predetermined processing on a substrate, a transfer device 3 that transfers the substrate, a transfer module 4 that houses the transfer device 3, and a control that controls transfer processing by the transfer device 3. An apparatus 5; a substrate sensor 6 for detecting whether or not the transfer apparatus 3 grasps the substrate; a substrate management means 7 for managing the position information of the substrate; and a transfer stop means 8 for instructing to stop the substrate transfer process. It is equipped with.
[0015]
The process modules 1 and 2 are modules for performing a predetermined process process such as a film forming process on a substrate, and include a substrate mounting unit (not shown) for mounting a substrate to be processed.
The transfer device 3 is composed of, for example, a robot arm, and includes a turning unit 3a that performs a turning operation that changes the orientation of the entire device, an expansion / contraction unit 3b that performs expansion and contraction operations, and a substrate grasping unit 3c that holds a substrate. , And each unit operates under the control of the control device 5.
[0016]
The control device 5 temporarily receives a procedure holding means 5a for holding a program as a control procedure for the transport process, a processing means 5b for controlling the transport process according to the control procedure, and a transport process stop instruction from the transport stop means 8. Stop instruction holding means 5c for storing.
In a series of transfer processing procedures stored in the procedure holding means 5a, a procedure for transferring the substrate from the transfer source to the transfer destination and a procedure for stopping the substrate transfer process are set. The transfer processing stop procedure includes a procedure for stopping the transfer device 3 after the entrance / exit operation is completed without stopping the transfer device 3 during the processing of the entrance / exit operation to the process module by the transfer device 3, and transferring the substrate. Then, after the position of the substrate is changed, the substrate position management process by the substrate management means 7 includes a procedure to be performed after the end of the management process without performing the stop operation based on the stop instruction.
[0017]
The processing unit 5b controls the transfer operation for the transfer device 3, the control of the substrate transfer preparation process performed by the process modules 1 and 2, and the substrate performed by the substrate sensor 6 according to the control procedure held in the procedure holding unit 5a. Control of detection and control of substrate management processing performed by the substrate management means 7 are performed, and processing for detecting whether or not a stop instruction flag based on the stop instruction is set in the stop holding means 5c is also performed.
[0018]
The stop holding unit 5c detects a conveyance process stop instruction from the conveyance stop unit 8, sets a conveyance stop instruction flag, and maintains the flag until the conveyance process ends.
This stop instruction is output from the transport stop means 8 when, for example, some trouble occurs in the production line including the semiconductor manufacturing apparatus, and stops the operation of the semiconductor manufacturing apparatus.
In this control device 5, the processing means 5 b causes the transport device 3 to perform a transport operation according to the control procedure held by the procedure holding means 5 a, and based on the transport stop flag set in the stop holding means 5 c. And stop the operation of the entire semiconductor manufacturing apparatus.
[0019]
The substrate sensor 6 is a device that detects whether or not the transfer device 3 is grasping the substrate, and includes, for example, an optical sensor that detects whether or not the substrate grasping unit 3c grasps the substrate. .
The substrate management means 7 manages the position of the substrate in the semiconductor device based on the operation information of the transfer device 3 and the detection result of the substrate sensor 6. For example, the position information of the managed substrate is displayed. By displaying the output on a display means (not shown) such as an apparatus, the position information of the substrate is provided to the manager of the semiconductor manufacturing apparatus.
[0020]
Next, the transfer process of the semiconductor manufacturing apparatus described above will be described with reference to FIG. In the transfer process, the processing unit 5b performs control as follows based on the control procedure of the procedure holding unit 5a, and repeatedly performs a confirmation process on a stop instruction flag for performing the stop process at a predetermined time.
[0021]
First, after turning the transfer device 3 from the predetermined standby position toward the process module 1 that is the substrate transfer source by the turning unit 3a (step S1), is a stop instruction flag set in the stop holding means 5c? It is confirmed whether or not (step S2).
If the stop instruction flag is not set, after preparing for transfer such as opening the module door (step S3), it is again determined whether the stop instruction flag is set in the stop holding means 5c. Confirm (step S4). When the stop instruction flag is not set, the expansion / contraction part 3b is extended to bring the transfer device 3 into the transfer source process module, and the substrate grasping part 3c is moved to a position where the substrate can be held. The grasping unit 3c grasps the substrate, the contracting unit 3b is contracted, and the transfer device 3 is moved away from the transfer source module (step S5). Then, after changing the position information of the substrate of the substrate management means 7 from the process module 1 to the transfer module 4 based on the substrate detection by the substrate sensor 6 (step S6), a stop instruction flag is set in the stop holding means 5c. It is confirmed whether it is (step S7).
[0022]
If the stop instruction flag is not set, the turning unit 3a turns the transfer device 3 in the direction of the transfer destination process module 2 (step S8), and whether or not the flag is set in the stop holding means 5c. (Step S9). If the stop instruction flag is not set, the process module 2 is prepared to carry in the substrate (step S10), and then it is confirmed whether or not the flag is set in the stop holding means 5c (step S10). S11). If the stop instruction flag is not set, the expansion / contraction part 3b is extended to cause the transfer device 3 to enter the transfer destination process module 2 so that the substrate grasping unit 3c is placed at the position where the substrate is placed, and the substrate grasping unit 3c. After the substrate is placed on the substrate, the expansion / contraction part 3b is contracted to move the transfer device 3 out of the transfer destination process module 2 (step S12).
[0023]
Then, after changing the board position information of the board management means 7 from the transfer module 4 to the process module 2 based on the board detection by the board sensor 6 (step S13), it is confirmed whether the flag is set in the stop holding means 5c. (Step S14). If the stop instruction flag is not set, the transport unit 3 is swung to the predetermined standby position of the transfer module 4 by the swivel unit 3a, and the series of transport processes is completed (step S15).
[0024]
Here, when a failure occurs in the production process including the semiconductor manufacturing apparatus during the above-described transfer process, the transfer stop unit 8 detects the occurrence of the failure and instructs the stop holding unit 5c to stop the transfer process. I do. Upon receiving this instruction, the stop holding means 5c sets a conveyance stop instruction flag (step S16), and keeps setting the flag until the conveyance process is stopped by the processing means 5b (step S17).
When the processing means 5b confirms that the stop instruction flag is set in the stop holding means 5c according to the procedure held in the procedure holding means 5a (steps S2, S4, S7, S9, S11, S14), the processing The means 5b stops the semiconductor manufacturing apparatus and finishes all processes.
[0025]
As described above, the stop instruction flag is confirmed according to the procedure set in the procedure holding means 5a, and the processing means 5b stops the conveyance process only when the stop instruction is confirmed at the time of the confirmation. For this reason, even if a stop instruction is given as in the processes in steps S5 and S7 and steps S12 and S14, the transfer device 3 operates during the entry / exit operation of the process module. The operation of the transfer device 3 is stopped after the transfer device 3 leaves the process module without stopping. Therefore, the transfer device 3 can be prevented from remaining in the process module, and the transfer device 3 can be prevented from being damaged. Further, as in the processes in steps S6 and S7 and steps S13 and S14, even when the stop instruction is given, the position of the substrate is changed but the management of the position information of the substrate by the substrate management means 7 is not completed. The transport process is stopped after the management process is completed without stopping the transport process. Therefore, there is no deviation between the substrate position managed by the substrate management means 7 and the actual substrate position.
[0026]
In the above-described embodiment of the present invention, the transport stop unit 8 is configured to instruct the stop of the transport process when the occurrence of the failure is detected. However, the transport stop unit 8 is instructed by the administrator of the semiconductor manufacturing apparatus. 8 may be configured to instruct the stop of the conveyance process.
Further, the transfer device 3 is not limited to the above-described configuration, and the present invention can be applied to any configuration as long as the transfer operation to the process module is performed in the substrate transfer process.
[0027]
In the embodiment of the present invention described above, the transfer process stop process (steps S7 and S14) is performed after the entrance / exit operation process (steps S5 and S12) and the substrate position management process (steps S6 and S13). In the invention, the conveyance process stop process may be performed after one of the processes, and even in this case, the respective effects can be achieved. However, it is practically preferable to use both in combination as in the above embodiment.
[0028]
In the above-described embodiment, a plurality of process modules are provided. However, if at least one process module is provided and the transfer process stop process is performed after the entry / exit operation process to the process module, the transfer apparatus is processed. It can be prevented from remaining in the module.
[0029]
Further, in the above-described embodiment, the process module is provided. However, the present invention is applicable to any configuration in which the substrate is transported and the position of the substrate is managed as it is transported without the process module. It is possible to match the information on the substrate position with the actual position of the substrate.
[0030]
【The invention's effect】
As described above, according to the substrate transfer control method according to claim 1, when there is an instruction to stop the transfer operation at the time when the transfer apparatus does not complete the entry / exit operation to the process module, the entry / exit operation processing is performed. Since the operation of the transfer device is stopped after the end of the process, the transfer device can be prevented from remaining in the process module, and the transfer device can be prevented from being damaged.
According to the substrate transfer control method according to claim 2, when there is an instruction to stop the transfer process when the substrate position management process is not completed after the transfer process of the substrate, the substrate position management process is performed. Therefore, when the substrate position is changed, the substrate position of the substrate management information is also changed so that the actual substrate position matches the substrate position of the managed substrate information. For this reason, since it is possible to easily grasp the substrate position inside the apparatus based on the substrate information, it is possible to reduce the time required for the operation of taking out the substrate for recovery, etc., and the operating efficiency of the semiconductor manufacturing apparatus Can be improved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a semiconductor manufacturing apparatus that implements a substrate transfer control method of the present invention.
FIG. 2 is a diagram illustrating a flow of control performed by the control device according to the embodiment.
FIG. 3 is a configuration diagram of a semiconductor manufacturing apparatus that implements a conventional substrate transfer control method;
FIG. 4 is a diagram illustrating a flow of control performed by a conventional control device.
[Explanation of symbols]
1, 2, ... Process module, 3 .... Transfer device,
4. Transfer module 5. Control device
5a ... Procedure holding means, 5b ... Processing means,
5c .. Stop holding means, 6 .. Board sensor,
7 .... Board management means, 8 .... Transfer stop means,

Claims (4)

In the substrate transfer control method for transferring the substrate to the process module by causing the transfer device to enter and exit the process module,
When a failure occurs in the process module and there is a stop instruction to stop the operation of the transfer apparatus when the process of the entry / exit operation to the process module is not completed, the process of the entry / exit operation of the transfer apparatus A substrate transfer control method, comprising: stopping the operation of the transfer device based on the stop instruction after the completion of the step. In the substrate transport control method for transporting the substrate to the process module by the transport device, detecting whether the transport device grasps the substrate and managing the substrate position,
When a failure occurs in the process module and a stop instruction for stopping the transfer process is given at a time when the substrate position management process after the transfer process by the transfer device is not completed, the management process ends. A substrate transfer control method, wherein transfer processing is stopped based on the stop instruction. The substrate transfer control method according to claim 1, further comprising: stopping transfer processing based on the stop instruction after completion of substrate position management processing after completion of transfer by the transfer device. Method. In a semiconductor manufacturing apparatus comprising a transport device and a process module, and transporting a substrate to the process module by the transport device,
  When a failure occurs in the process module and there is a stop instruction to stop the operation of the transfer apparatus when the process of the entry / exit operation to the process module is not completed, the process of the entry / exit operation of the transfer apparatus After the process is completed, the operation of the transfer device is stopped based on the stop instruction.

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