JP3907877B2 - Parts mounting method and equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method and apparatus, and is applied to a case where an electronic circuit board is manufactured by mounting a plurality of types of electronic components on a circuit board.
[0002]
[Prior art]
For example, electronic circuit boards are equipped with various types of components such as large and small connectors and electronic components as electronic devices become more multifunctional and electronic components become more and more complex. In order to supply all of these various types of components to a working device that stably and quickly mounts and mounts them, handling in a package corresponding to the form and size of each component is performed.
[0003]
Referring to FIG. 1 showing an embodiment of the present invention, many small electronic components are taping components that are stored in a tape in a longitudinal direction, and are wound around a reel 2 to be handled. By attaching the tape to the taping parts supply cassette 3 and feeding out the taping parts, the electronic parts housed in the tape are sent and supplied to the parts supply position one by one whenever necessary.
[0004]
Large electronic parts and odd-shaped parts that are not suitable for taping are stored in a pallet 4 in a state where they are aligned vertically and horizontally, and are handled as pallet storage parts. The pallet 4 necessary for supplying the parts is moved to the loading / unloading position by the lifting mechanism 6 so that it can be pulled out by the loading / unloading mechanism 7 and stored in the pallet 4 in this pulled-out state. The electronic component 10 can be supplied.
[0005]
These pallet storage parts have limitations on the speed at which each part can be supplied and the delivery speed between the parts to be supplied and the work device 8 due to the packaging and the size and shape of the electronic part 10. Since it is lower than when handling taping parts, the frequency of parts supply is relatively low, but it does not correspond to the supply speed of taping parts and causes a reduction in the overall part supply speed.
[0006]
Therefore, conventionally, in order to supply the pallet storage parts to the work device 8, a plurality of types of electronic components 10 supplied by the component supply unit 13 equipped with the pallet storage cassette 5 are transferred by the component transfer means 9 to the work device 8. Are sequentially picked up in accordance with the order of the types of electronic components 10 required, and are transferred in advance to a plurality of component holders 12 on the component transfer table 11 and placed on standby, each time the component transfer table 11 is moved. By picking up the electronic component 10 in which the working device 8 is positioned at the component supply position by positioning the component holding unit 12 on which the required type of electronic component 10 is transferred at the component supply position to the working device 8. Thus, the electronic circuit board 16 is manufactured by being mounted on the circuit board 15 to be mounted. As a result, the supply speed of the electronic component 10 as the pallet storage component corresponds to that of the taping component, so that the work on the working device 8 can be speeded up and the handling of the electronic component 10 as the pallet storage component is stabilized. Work efficiency can be improved.
[0007]
[Problems to be solved by the invention]
Incidentally, electronic components supplied from the component supply unit include defective products. In general, the electronic device mounting device determines the quality of the electronic components supplied to the work device, the work device mounts only the non-defective products on the circuit board, discards the defective products, and supplies the electronic components and the mounting operation by the work device. It is usually done again.
[0008]
However, when the electronic component 10 is supplied to the working device 8 through the transfer operation as described above, the yield of the electronic circuit board 16 to be manufactured is improved, but the electronic component 10 that has been transferred to the component transfer table 11 is improved. Is moved to the supply position to the working device 8 by the movement of the component transfer table 11, and when the supplied electronic component 10 is determined to be defective and discarded, the component transfer table 11 is transferred to the component transfer table 11. After receiving the transfer of the same type of electronic component 10 again at the component transfer position by means 9, the electronic component 10 is re-supplied by moving to the component supply position to the working device 8 and supplying it again. It takes a long time to operate and the production efficiency decreases.
[0009]
An object of the present invention is to provide a component mounting method in which a component can be mounted in a short time by re-supplying the component when the supplied component is defective, even when the component is supplied and mounted through a transfer operation. To provide an apparatus.
[0010]
[Means for Solving the Problems]
In order to achieve the above-described object, the component mounting method of the present invention is configured such that a plurality of types of components supplied by the component supply unit are sequentially transferred according to the order of the types of components required by the work device by the component transfer means. Picked up and transferred to a plurality of parts holding parts on the parts transfer table in advance,
The part in which the work device is positioned at the part supply position by positioning the part holding unit on which the parts of the type required by the movement of the part transfer table are transferred at the part supply position to the work apparatus In the component mounting method in which only the non-defective product is mounted on the mounting target, the defective product is discarded , the component supply method and the mounting operation are repeated, Two sets of component supply units, a component transfer table, and a component transfer means are provided. In one set of component supply units, components supplied from the component supply unit by the component transfer means are transferred to the component transfer table. multiple while transferring, the other set moves the component transfer table of the same type components are transferred by a plurality in the component holding section to a component supply position, in this component transfer table From the types of parts One type of component is supplied to the working device, it is judged as defective in the working device, when discarded, supplying the remaining components of the same type in the component holder on the component placing table to the working device It is characterized by performing control so as to be mounted on the mounting target when it is determined as a non-defective product .
[0011]
In such a configuration, the parts picked up from the part supply unit according to the order of the types of parts required by the working device are cooperated with the part transfer table and the part transfer means. The product is transferred to the parts holder in advance and placed on standby to ensure that it is efficiently and stably supplied to the work equipment. Can increase the yield of products manufactured by mounting components by repeating the operation of discarding and supplying components, and in particular, the same type of each of the component holders in the component transfer table. When parts are transferred and one type of parts is supplied to the working device, it is determined that the working device is defective and discarded, and the same type in the parts holding part on the parts transfer table The remaining parts The parts transfer table receives the parts transferred by the parts transfer means for resupply of the parts, and then returns to the parts supply position to the work equipment. Since the returning operation can be omitted, it is possible to shorten the time for supplying the parts again when supplying the parts via the transfer operation, and it is possible to increase the productivity without reducing the yield.
[0012]
As a component mounting apparatus that achieves such a method, a working device that picks up a plurality of types of supplied components and mounts them on a mounting target, a component supply unit that supplies a plurality of types of components, and In response to the transfer of a plurality of types of components supplied by the component supply unit, the component holding unit holds in advance a plurality of types of component holding units, and holds the types of components required by the work device each time. The work device needs a part transfer table for switching the parts supply position to the work device by movement and supplying the held parts to the work device, and a plurality of types of parts supplied by the parts supply unit. Prior to the work of picking up the parts supplied to the mounting target and mounting them on the mounting target, the parts transfer means for picking up sequentially according to the order of the types of parts to be transferred and transferring them to the part holder on the parts transfer table So A determination means for determining the quality of the picked-up component, and when the determination by the determination means is a non-defective product, the work device mounts the component, and if the determination is a defective product, the work device discards the component, In a component mounting apparatus in which parts supply and mounting operations are performed again, one working device includes two sets of a component supply unit, a component transfer table, and a component transfer means. In the component supply unit, while the components supplied from the component supply unit are transferred to the component transfer table by the component transfer means, a plurality of components of the same type are transferred to the component holding unit of the other set. moving the mounting has been component transfer table to the component supply position, from among a plurality of types of components in the component transfer table, one type of component fed to the working device, it is defective in the working device determination It is, discarded At this time, it is provided with a control means for controlling the supply of the remaining parts of the same type in the parts holding part on the parts transfer table to the work apparatus again when the parts are determined to be non-defective . The above-described configuration is sufficient, and the above method can be achieved automatically and stably.
[0013]
Further objects and features of the present invention will become apparent from the following detailed description and drawings. Each feature of the present invention can be used alone or in combination in various combinations as much as possible.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a component mounting method and apparatus according to an embodiment of the present invention will be described in detail with reference to FIG. 1 to FIG. 3 together with examples thereof for understanding of the present invention.
[0015]
In the present embodiment, a pallet storage component that is a non-taping component represented by the large electronic component 10 shown in FIG. 2 and stored mainly in the pallet storage cassette 5 is supplied via a transfer operation. A circuit board 15 as shown in FIG. 1 is used for various electronic components 10 to which the working device 8 is supplied by combining a taping component (not shown) stored and held in the component supply cassette 3 without a transfer operation. This is an example of manufacturing the electronic circuit board 16 by mounting the electronic component 10 in a temporarily fixed state or a fixed state. However, the present invention is not limited to this, and various types of products are received by supplying various components, including the case of handling only components supplied with a transfer operation, and various products are manufactured. In some cases, the present invention is effectively applied.
[0016]
For the sake of simplicity, the component supply method according to the embodiment of the present invention will be described with reference to the component mounting operation by the supply through the pallet storage component transfer operation. The plurality of types of electronic components 10 supplied at 13 are moved by the component transfer means 9 according to the order of the types of the electronic components 10 required by the work device, and the transfer head 21 is moved to the required position and the suction nozzle 22 is moved. The pickup is sequentially picked up by the downward movement, the suction, and the upward movement, and the movement of the transfer head 21, the processing of the suction nozzle 22, the suction release, and the upward movement are previously performed on the plurality of component holding portions 12 on the component transfer table 11. Transfer and wait. On the other hand, by positioning the component holding unit 12 on which the electronic component 10 of the type required for each movement of the component transfer table 11 is positioned at the component supply position to the work device 8, the work device 8 can After picking up the electronic component 8 located at the component supply position and determining pass / fail based on the information captured by the recognition camera 23 as shown in FIG. 1, only the non-defective product is mounted on the circuit board 15 to be mounted. Then, the defective product is discarded to the disposal unit 24 or the like, and after waiting for the supply of the electronic component 10 to be the next substitute component, the pickup in the working device 8 is performed again and only the non-defective product is mounted on the circuit board 15. By such cooperation of the component transfer table 11 and the component transfer means 9, the electronic component 10 required by the work device 8 is transferred efficiently and stably and reliably supplied to the work device 8. However, the yield of the electronic circuit board 16 manufactured by the working device 8 can be increased.
[0017]
In particular, in the present embodiment, the same type of electronic components 10A, 10A, 10B, 10B, and 10E as shown in FIG. 2 for each of the plurality of component holding units 12 in the component transfer table 11. 10E is transferred, and one kind of electronic component, for example, one of 10A is supplied to the working device 8 and when it is determined to be defective by the working device 8 and discarded, the component transfer table 11 is displayed. The remaining electronic component 10 </ b> A of the same type in the component holder 12 is supplied again to the work device 8 and used for mounting the electronic component 8.
[0018]
In this way, the same type of electronic component, for example, 10A, 10A, 10B, 10B, -10E, and 10E of the above example is transferred to each of the plurality of component holding units 12 in the component transfer table 11, When one kind of electronic component, for example, one of 10A and 10A is supplied to the working device 8 and determined to be defective by the working device 8, it is in the component holding unit 12 on the component transfer table 11. By supplying the remaining electronic component 10A of the same type to the working device 8 and using it for mounting of the component, the component transfer table 11 is used by the component transfer means 9 to supply the electronic component 10 again. Since the operation of returning to the component supply position to the working device 8 again can be omitted, the time for supplying the electronic component 10 again when the electronic component 10 is supplied via the transfer operation can be omitted. But It can decrease, it is possible to increase the reduction without productivity yield. As described above, in the illustrated embodiment, the same type of electronic component 10 is transferred two by two on the component transfer table 11, but for each electronic component 10 having a high defect rate, three by three, Or you can transfer more than that. In this case, if the installation space of the component transfer table 11 is a problem, it can be easily handled by arranging the arrangement of the component holding portions 12 in an internal / external double or by various measures.
[0019]
Note that, in the component mounting method according to the present embodiment, the component supply cassettes 3 of the component supply unit 25 that holds the component supply cassette 3 are arranged in the same manner as the taping components stored in the component supply cassette 3 as described above. The component supply cassette 3 that stores the electronic component 10 required by the work device 8 is positioned at the component supply position to the work device 8 and the electronic component 10 is sent out and supplied. In this case, when the electronic component 10 to be supplied is defective, supply can be performed again easily and in a short time by feeding the next electronic component 10 while the component supply cassette 3 is positioned at the component supply position.
[0020]
As the component mounting apparatus of the present invention that achieves such a method, the work device 8 that picks up a plurality of types of electronic components 10 to be supplied and mounts them on the circuit board 15, and a plurality of the above-described work devices 8. The component supply units 13 and 25 that supply the various types of electronic components 10, and the plurality of types of electronic components 10 that are supplied by the component supply unit 13 are transferred and held in advance in a plurality of component holding units 12. The component holding unit 12 holding the electronic component 10 of the type necessary for each time 8 is moved to the component supply position to the working device 8 by moving and the held electronic component 10 is moved to the working device 8. The component transfer table 11 supplied to the component supply unit 13 and a plurality of types of electronic components 10 supplied by the component supply unit 13 are sequentially picked up according to the order of the types of electronic components 10 required by the work device 8. The component transfer means 9 for transferring to the component holding part 12 on 1 and the electronic component 10 supplied with the work device 8 are picked up and mounted on the circuit board 15 before the picked-up electronic component 10 is accepted or rejected. In addition to providing the recognition camera 23 as a basic configuration for the determination, the determination unit 26 that determines based on the imaging information of the recognition camera 23 and the determination by the determination unit are non-defective, and the work device 8 uses the electronic component 10. If the determination is a defective product, the electronic device 10 may be discarded by the work device 8, and the electronic device 10 may be provided with control means 27 for re-supplying and mounting.
[0021]
Here, in particular, the control means 27 supplies the electronic component 10 via the transfer operation by the component transfer means 9, and the same type of electronic is supplied to each of the component holding portions 12 in the component transfer table 11. When the component 10 is transferred and one of the electronic components 10 of one kind is supplied to the work device 8 and determined to be defective by the work device 8 and discarded, the component on the component transfer table 11 The remaining electronic component 10 of the same type in the holding unit 12 is supplied again to the working device 8 and used for mounting the component. Thereby, the mounting method of the characteristic parts as described above can be achieved automatically and stably.
[0022]
Further, in the embodiment shown in the figure, the working device 8 is supplied with the circuit boards 15 one by one from the circuit board storage cassette 31, and sequentially introduces them from the loading section 32 to position them at the component mounting positions as shown in FIG. The electronic component 10 is mounted by the mounting head 34, and the electronic circuit board 16 that has been mounted is sequentially discharged through the unloading unit 33. The mounting head 34 repeatedly moves the plurality of suction nozzles 35 between the component supply position and the component mounting position, and the electronic component 10 supplied at the component supply position is moved downward, suctioned, and moved upward. After picking up the electronic component 10, it is carried to the component supply position and mounted on the circuit board 15, and the quality of the electronic component 10 picked up is determined between the component supply position and the component mounting position. The part 10 is mounted or discarded and picked up again. The method of mounting operation of the electronic component 10 is not particularly limited.
[0023]
In addition, the movement of supplying the electronic component 10 of the component transfer table 11 and the component supply unit 25 to the working device 8 is a reciprocating linear movement, and both are reciprocating linearly moving together to make the electronic component 10 occasional need. It can be supplied as required. However, this is not particularly limited, and various operation methods may be employed. The component transfer table 11 has an individual passage switching mechanism 36 corresponding to each component holding unit 12 and individually switched and connected to a suction path and a suction release path (not shown) as shown in FIG. The electronic component 10 is held by suction, and the suction is released to supply the electronic component 10 held by suction to the work device 8 so as not to disturb the pickup on the work device 8 side. However, this is not an essential configuration. Further, the component supply unit 13, the component transfer means 9, the component transfer table 11, and the component supply unit 25 are provided on both the left and right sides of the work device 8, and more types of electronic components 10 can be obtained by alternately working these components. It can be supplied.
[0024]
The specific operation control shown in FIG. 3 will be described. In step 1, the circuit board 15 is loaded and positioned at the component mounting position, and the process proceeds to steps 2 and 3. In step 2, the left-side L component supply cassette 3 is positioned at the component supply position by the component supply unit 25, and the small electronic component 10 is supplied to the work device 8 for pickup. Based on the image pick-up by the recognition camera 23 of the electronic component 10 picked up by the work device 8 in step 4, along with the recognition of the suction posture, the quality of the electronic component 10 is determined, and if it is defective, it is discharged and discarded in step 6 and then step 2 Returning to FIG. 2, the supply of the electronic component 10 from the component supply cassette 3 and the pickup by the work device 8 are performed again. If the product is a non-defective product in step 4, the process proceeds to step 5, and the electronic component 10 picked up from the component supply cassette 3 is mounted on the circuit board 15 in a fixed state, and mounting that does not require post-processing such as so-called reflow processing is performed. In the next step 7, it is determined whether or not the mounting of the electronic component 10 supplied from the component supply cassette 3 has been achieved as predetermined, and the operations of steps 2 to 7 are repeated until the predetermined mounting is completed. At the same time, after performing the operation of transferring the electronic component 10 supplied from the right-side R component supply unit 13 in step 3 to the component holding unit 12 on the component transfer table 11 by the component transfer means 9, Control goes to step 20.
[0025]
When the predetermined mounting is completed in step 7, the process shifts to step 8, and the electronic component 10 on the left L component transfer table 11 is supplied to the working device 8 and picked up. In the next step 9, the quality of the electronic component 10 is determined based on the recognition of the suction posture based on the image picked up by the recognition camera 23 of the electronic component 10 picked up in the work device 8. Returning to step 8, the same type of electronic component 10 remaining on the component transfer table 11 is supplied again. If the product is a non-defective product in step 9, the process proceeds to step 10, and the electronic component 10 picked up from the component transfer table 11 is mounted on the circuit board 15. In the next step 12, it is determined whether or not the mounting of the electronic component 10 supplied from the component transfer table 11 has been achieved as predetermined, and the operations in steps 8 to 12 are repeated until the predetermined mounting is completed. When the predetermined number of mountings are completed in step 12, the mounting of the electronic component 10 on the circuit board 15 is completed, the electronic circuit board 16 manufactured in step 13 is taken out, and the next circuit board 15 is carried in. To position at the component mounting position.
[0026]
When the electronic circuit board 16 is unloaded in step 13 and the next circuit board 15 is loaded and positioned, the process proceeds to steps 14 and 15. In step 14, the right-side R component supply cassette 3 is positioned at the component supply position by the component supply unit 25, and the small electronic component 10 is supplied to the work device 8 for pickup. Based on the image pick-up by the recognition camera 23 of the electronic component 10 picked up by the work device 8 in step 16, the quality of the electronic component 10 is determined based on the recognition of the suction posture. Returning to FIG. 2, the supply of the electronic component 10 from the component supply cassette 3 and the pickup by the work device 8 are performed again. If the product is a good product in step 16, the process proceeds to step 17, and the electronic component 10 picked up from the component supply cassette 3 is mounted on the circuit board 15. In the next step 19, it is determined whether or not the mounting of the electronic component 10 supplied from the component supply cassette 3 has been achieved as predetermined, and the operations in steps 14 to 19 are repeated until the predetermined mounting is completed. At the same time, after the electronic component 10 supplied from the left-side L component supply unit 13 in step 15 is transferred to the component holding unit 12 on the component transfer table 11 by the component transfer means 9, Move on to step 8.
[0027]
When the predetermined mounting is completed in step 19, the process proceeds to step 20, and the electronic component 10 on the right R component transfer table 11 is supplied to the work device 8 so as to be picked up. In the next step 21, the quality of the electronic component 10 is determined along with the recognition of the suction posture based on the image picked up by the recognition camera 23 of the electronic component 10 picked up in the work device 8. Returning to step 20, the electronic component 10 of the same type remaining on the component transfer table 11 is supplied again. If the product is a non-defective product in step 21, the process proceeds to step 22, and the electronic component 10 picked up from the component transfer table 11 is mounted on the circuit board 15. In the next step 24, it is determined whether or not the mounting of the electronic component 10 supplied from the component transfer table 11 has been achieved as predetermined, and the operations of steps 20 to 24 are repeated until the predetermined mounting is completed. When the predetermined number of mountings are completed in step 24, the mounting of the electronic component 10 on the circuit board 15 is completed, the electronic circuit board 16 manufactured in step 25 is taken out, and the process returns to step 1 for the same as the transition. Repeat the operation.
[0028]
【The invention's effect】
According to the present invention, as is apparent from the above description, the supplied parts are non-defective while supplying the parts efficiently and stably to the working device by supplying the parts via the transfer operation. By attaching to the mounting target only at a certain time, the yield of the product can be increased, and when the supplied part is defective, the time for re-supplying the part via the transfer operation can be shortened, and the yield is not reduced. Productivity can be increased.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view showing a component transfer table of the apparatus of FIG.
FIG. 3 is a flowchart showing a specific control example of an operation of manufacturing the electronic circuit board of the apparatus of FIG. 1;
[Explanation of symbols]
4 Pallet 5 Pallet storage cassette 8 Working device 9 Component transfer means 10, 10A to 10E Electronic component 11 Component transfer table 12 Component holding unit 15 Circuit board 16 Electronic circuit board 22 Suction nozzle 23 Recognition camera 24 Discarding unit 26 Determination unit 27 Control means 31 Circuit board storage cassette 34 Mounting head 35 Suction nozzle

Claims (2)

A plurality of types of components supplied by the component supply unit are sequentially picked up by the component transfer means in accordance with the order of the types of components required by the work device, and are previously stored in a plurality of component holding units on the component transfer table. Transfer and wait,
The part in which the work device is positioned at the part supply position by positioning the part holding unit on which the parts of the type required by the movement of the part transfer table are transferred at the part supply position to the work apparatus In the component mounting method, after picking up the product and determining pass / fail, only the non-defective product is mounted on the mounting target, the defective product is discarded , and the component supply and mounting operations are repeated.
One working apparatus is provided with two sets of component supply units, a component transfer table, and a component transfer means, and is supplied from the component supply unit by the component transfer means in one set of component supply units. While transferring the parts to the parts transfer table,
The other part of the part transfer table in which a plurality of parts of the same type are transferred to the part holding unit is moved to the part supply position, and one of the plurality of types of parts in the part transfer table is selected. the type of component is supplied to the working device, it is judged as defective in the working device, when discarded, the remaining components of the same type in the component holder on the component placing table again supplied to the working device The component mounting method is characterized in that when it is determined that the product is non-defective, the component is controlled to be mounted on the mounting target . A working device for picking up a plurality of types of parts to be supplied and mounting them on a mounting target;
A component supply unit for supplying a plurality of types of components;
Receiving transfer of multiple types of components supplied by the component supply unit, hold them in advance in multiple component holding units, and move the component holding unit holding the types of components required by the work device each time The parts transfer table for switching to the parts supply position to the work device and supplying the held parts to the work device,
A component transfer means for sequentially picking up a plurality of types of components supplied by the component supply unit in accordance with the order of the types of components required by the working device and transferring them to the component holding unit on the component transfer table;
A determination unit for determining whether the picked-up component is acceptable before the work device picks up the supplied component and mounts it on the mounting target;
When the determination by the determination means is a non-defective product, the work device performs the mounting of the part,
In the component mounting device in which the work device discards the part and determines the supply of the component and the mounting operation again when the determination is a defective product.
One working apparatus is provided with two sets of component supply units, a component transfer table, and a component transfer means, and is supplied from the component supply unit by the component transfer means in one set of component supply units. While transferring the parts to the parts transfer table,
The other part of the part transfer table in which a plurality of parts of the same type are transferred to the part holding unit is moved to the part supply position, and one of the plurality of types of parts in the part transfer table is selected. the type of component is supplied to the working device, it is judged as defective in the working device, when discarded, the remaining components of the same type in the component holder on the component placing table again supplied to the working device A component mounting apparatus comprising control means for controlling to mount on a mounting target when it is determined to be a non-defective product .

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