JP4580715B2 - Component supply method and component supply device - Google Patents

Description

  The present invention relates to a method of supplying a part to a part processing means for processing the part. In particular, the present invention relates to a component supply method for supplying a predetermined number of different types of components.

  In recent years, a display device called a flat panel display (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP) has been widely used as a monitor for a television or a monitor for a computer.

  When manufacturing these FPD substrates, it is necessary to attach electronic components used to control the direction of liquid crystal to display images and videos or to control the generation of plasma to the periphery of the substrate. Industrially, a process is adopted in which a necessary number of electronic components are automatically supplied and arranged on the periphery of the substrate, and then the electronic components are attached by being completely crimped.

  In the manufacturing process of the FPD substrate, as an apparatus for supplying electronic components to the periphery of the FPD substrate, an electronic component obtained by punching a TAB (Tape Automated Bonding) tape is received by a first receiving unit, and the electronic component is received by a conveyor. An invention relating to a supply device that transports and delivers electronic components to a turntable at a second receiving unit and supplies the electronic components to an FPD substrate is disclosed (Patent Document 1).

In addition, since the FPD has different contents to be controlled in the vertical direction and the horizontal direction, the electronic components supplied to the FPD board also need different electronic parts in the vertical direction and the horizontal direction of the FPD board. The device for supplying components is configured so that a plurality of electronic components can be supplied by a single device.
JP 2002-299375 A

  In the component supply apparatus as described in Patent Document 1, the tact time of component supply is an important factor in the configuration of the apparatus. Therefore, each apparatus always holds electronic components in order to efficiently supply electronic components. A method of supplying parts continuously is adopted.

  When supplying electronic components to an FPD board or the like, it is necessary to supply different components after supplying a predetermined number of components. Even when such supply components are changed, as shown in FIG. Each device in the device employs a method of successively holding different types of electronic components and sequentially supplying the components.

  However, in the conventional parts supply method, when a different type of electronic component is held in each device in the supply device and a failure occurs in the previously supplied component, the failed component is discarded. In order to replenish a new part, it is necessary to dispose of a part that is different from the defective part held by each device in the supply unit and then supply the part. Will result in an increase in cost.

  On the other hand, it is conceivable to supply all the same amount of the same parts and confirm that no problems occur, and then start the supply of the next different parts. There is a problem that the tact time is delayed because it must be stopped.

  The present invention has been made in view of the above problems, and even when a component failure occurs at the change of the type of component to be supplied, the tact time is not significantly delayed, and an increase in cost can be avoided. An object is to provide a component supply method, a component supply apparatus, and a component supply program.

  In order to achieve the above object, the parts supply method according to the present invention sequentially takes out parts from the parts stock means for stocking parts, supplies a predetermined number of parts to the parts processing means, and then supplies a predetermined number of different types of parts. A component supply method applied to a component supply device to be supplied, wherein the component supply device detects that the component supply device intends to supply a different component from a component held by a component processing unit that is a supply destination. If it is detected in the different parts detection step that the supply of the different parts is detected, the supply work stopping step for stopping the supply work of the different parts, and all the parts held in the part processing means are normally A supply operation resuming step of restarting the supply operation of the different parts when supplied.

  In addition, the component supply apparatus according to the present invention sequentially extracts components from the component stock means for storing the components, supplies a predetermined number of components to the component processing means, and then supplies a predetermined number of different types of components. The parts supply device detects different parts different from the parts held in the parts processing means of the supply destination, and supplies different parts by the different parts detection means. And a supply work stopping means for stopping the supply work of different parts.

  In addition, the parts supply program according to the present invention can simultaneously hold different parts, a part take-out means for taking out parts from the part stock means for stocking parts, a part transfer means for transferring parts taken out by the part take-out means, and different parts. A component supply apparatus that supplies parts to a component processing means that processes parts, and is applied to a component supply apparatus that supplies a predetermined number of parts after supplying a predetermined number of parts. In the component supply program, a different component detection step for detecting that a component different from the component held by the component processing unit exists in the components held by the component pick-up unit, the component transfer unit, and the relay unit If a different part is detected in the different part detection step, the supply work is stopped to stop the part pickup operation of the part pickup means. And step, the part to be held in the component processing means, characterized in that to realize a computer and resuming supply operations resume step the operation of supplying the different components when it is normally supplied all.

  As a result, even if a component failure occurs at the change of the type of component to be supplied, it is possible to supply the same component as the failed component without discarding the different component.

  Even if a failure occurs in a previously supplied component, a route that can supply the same component is always secured, so even if there is a different component on the supply route that is different from the defective component. It is possible to suppress an increase in cost without discarding the different parts, and it is also possible to suppress an increase in tact time because the different parts exist in the supply route.

  In addition, it is possible to avoid tact loss because there is no need to supply a different part after supplying a different part because it is not necessary to ignore the part where the problem occurred at the supplier. Become.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a temporary pressure bonding apparatus that temporarily pressure-bonds an electronic component to an FPD board provided with the component supply apparatus of the present embodiment.

  As shown in the figure, the temporary pressure bonding apparatus 100 is a device that temporarily pressure-bonds different types of electronic components 201 and 202 to two sides of the peripheral portion of the FPD substrate 200 shown in FIG. The electronic component 201, 202 supplied from the component supply apparatus 110 is received, and the temporary press-bonding head 101 as a component processing means for temporarily press-bonding the electronic component 201, 202 to the edge of the FPD substrate 200, and the electronic component 201, 202 holding the FPD substrate 200 The panel stage 102 which can change by rotating the side which should be attached, and the XY table 103 which can move this panel stage to a horizontal direction are provided.

  The component supply device 110 is a device that supplies the electronic components 201 and 202 from the component stock unit that stocks a plurality of types of electronic components to the temporary crimping head 101, and takes out the components from the component stock unit that stocks the components. A reversal supply head 111 (not shown) that is a component take-out means, and a transfer head 112 that is a component transfer means that moves and places a part taken out by the reversal supply head to a relay stage described later, are different parts. And a relay stage 113 as relay means capable of simultaneously holding

The inverting feed head 111 takes out the component stock hand stage or et electronic component is a device for supplying the transfer head 112 by reversing the front and back surfaces of the electronic components 201 and 202, electronic components 201, 202 regardless of the type , The electronic parts 201 and 202 are supplied to the transfer head 112, the emptied head is returned to the parts stocking means, and the new electronic parts 201 and 202 are taken out and held.

  The transfer head 112 includes a rail extending in the horizontal direction and a suction nozzle that is slidably held on the rail, and sucks the electronic components 201 and 202 supplied from the reversal supply head 111 with the suction nozzle. It is an apparatus that transfers to the relay stage 113, releases the suction, and places the electronic components 201 and 202 on the relay stage 113. The transfer head 112 can transfer the electronic components 201 and 202 from the reversal supply head 111 to the relay stage 113 in a state where one electronic component 201 or 202 is sucked and held regardless of the type.

FIG. 3 is a perspective view showing the relay stage 113.
The relay stage 113 includes an X-shaped mounting table 301 and component mounting means 302 provided at each tip of the mounting table 301. In addition, the relay stage 113 can supply the electronic components 201 and 202 placed on the component placing means 302 to the provisional pressure bonding head 101 by rotating the placement table 301 in the horizontal direction. While the crimping head 101 receives the electronic components 201 and 202 placed on the component placing means 302, the other component placing means 302 can receive the electronic components 201 and 202 from the transfer head.

  The component placing means 302 can place only the corresponding electronic components 201 and 202, and two kinds of component placing means 303 and 304 are placed diagonally on each tip of the placement table 301. Arranged and provided. Therefore, this relay stage 113 can place and hold a total of four electronic components 201, 202 each including two types of electronic components 201, 202.

  Depending on the type of electronic component and the shape of the component placement unit 302, different types of electronic components may be placed on the same component placement unit 302 in some cases. In this case, one type of electronic component is placed on all the component placement means 302, or one type of electronic component is placed on the component placement unit 302. Can be placed.

FIG. 4 is a block diagram illustrating functions of the control unit of the component supply apparatus.
The component supply device control unit 400 is a processing unit that monitors the flow of components and controls the movement of the component supply device, and includes a different component detection unit 401, a defect detection unit 402, and a reverse supply head control unit 403. ing.

  The different component detection unit 401 includes two types of electronic components that are different from the electronic components held by the temporary pressure bonding head 101 among the electronic components held by the relay stage 113, the transfer head 112, and the reversal supply head 111. It is a processing unit that detects that there are more than one.

  The defect detection unit 402 outputs a signal from the temporary crimping apparatus 100 to the effect that the electronic component held by the temporary crimping head 101 has a defect, or a malfunction has occurred such that the temporary crimping head 101 cannot hold the electronic component. It is a processing part to receive.

  The reversal supply head control unit 403 is a processing unit that stops the reversal supply head 111 from taking out an electronic component from the component stocking unit when two or more different electronic components are detected by the different component detection unit 401.

  In addition, when the defect detection unit 401 detects a defect, the reversal supply head 111 is controlled so that the same type of electronic component as the defective electronic component is taken out and supplied from the component stocking means.

Next, the actual operation of the supply device 110 incorporated in the temporary pressure bonding device 100 will be described.
FIG. 5 is a flowchart for explaining the supply operation of the component supply device 110 at the transition of the electronic component to be supplied.

FIG. 6 is a diagram schematically illustrating the movement of the electronic component in each of the devices 111, 112, and 113 of the component supply device 110.
When the electronic component is temporarily pressure-bonded to the FPD substrate 200, the component supply device 110 supplies a predetermined number of the same type of electronic component (marked with a circle in FIG. 6) (S501). At this stage, as shown in FIG. 6A, the same electronic component (◯ mark) is held on all of the relay stage 113, the transfer head 112, and the reverse supply head 111.

  Next, when the predetermined number is reached (S502: Y), the reverse supply head 111 takes out another type of electronic component (marked by Δ in FIG. 6) from the component stocking means, as shown in FIGS. Other types of electronic components (Δ mark) are supplied in order (S503).

  When two or more different electronic components (Δ mark) are held in the component supply device 110 as shown in FIG. 6C, the different component detection unit 401 generates a signal (S504: Y), and the reverse supply head control unit. Based on the control of 403, the reversal supply head 111 stops taking out the different electronic component (Δ mark) from the component stocking means (S505).

  In the present embodiment, since the relay stage 113 can hold two types of electronic components two by two, even if there is one different electronic component (Δ mark) as shown in FIG. The detection unit 401 does not issue a detection signal, and the reversal supply head 111 continues to take out and supply.

After stopping the removal of the different parts (S505), only the supply operation is executed without taking out the parts from the part stocking means (S506).
If there is no failure up to the last electronic component supplied previously (S508: Y), the supply of different components is resumed as shown in FIGS. 6D and 6E (S509). .

On the other hand, when a failure occurs in the electronic components up to the final component held by the temporary pressure bonding head 101 (S508: N), component replenishment processing is performed (S507).
Next, the electronic component replenishing operation will be described by taking as an example a case where a defect has occurred in the electronic component (◯ mark) held by the temporary press-bonding head 101 at the stage of FIG.

It is assumed that a defect occurs in the electronic component (◯ mark) held by the temporary pressure bonding head 101 at the stage shown in FIG.
Since the different electronic component is detected by the different component detection unit 401 and the defect is detected by the defect detection unit 402, the reversal supply head control unit 403 controls the reversal supply head 111, as shown in FIG. As shown, an electronic component (◯ mark) of the same type as the electronic part (◯ mark) in which a defect has occurred is taken out from the part stocking means and started to be supplied. At the same time, an electronic component (Δ mark) different from the defective electronic component held in the transfer head 112 is supplied to the relay stage 113.

  Next, as shown in FIGS. 7C to 7F, only the supplied electronic components (◯ marks) are sequentially supplied until reaching the temporary press-bonding head 101, and replenishment of the defective electronic components (◯ marks) is performed. Is done.

  As described above, even if an electronic component (Δ mark) different from the electronic component in which a failure has occurred (Δ mark) is held in the supply device, the electronic component (Δ mark) is placed on the relay stage 113. As a result, it is possible to secure the supply route of the electronic component (○ mark) to the temporary crimping head, so it is possible to replenish the electronic component (○ mark) without discarding the electronic component (△ mark). It becomes.

  In addition, as shown in FIGS. 6D to 6F, there is a device that does not always hold an electronic component at the change of the type of electronic component to be supplied regardless of whether or not a failure has occurred. Since the FPD substrate 200 held by the temporary crimping apparatus 100 needs to be rotated by the panel stage 102 at the turning point, electronic components are sequentially supplied to the apparatuses 111, 112, and 113 using the time required for the rotation. It is possible to reduce the influence on the tact time and to eliminate it.

  The present invention can be applied to a supply apparatus that supplies a predetermined number of parts of the same type after supplying a predetermined number of parts of the same type, and in particular, can be applied to a temporary crimping apparatus or the like for creating an FPD.

It is a perspective view of the temporary crimping | compression-bonding apparatus which temporarily crimps | bonds an electronic component to the FPD board | substrate provided with the component supply apparatus. It is a top view which shows the FPD board | substrate after electronic component temporary crimping | compression-bonding. It is the perspective view which showed the relay stage. It is a block diagram which shows the function of the control part of a components supply apparatus. It is a flowchart for demonstrating supply operation | movement of the components supply apparatus in the transition of the electronic component to supply. It is a figure which shows typically the motion of the electronic component in each apparatus of a components supply apparatus. It is a figure which shows typically a motion of the components supply apparatus at the time of replenishing an electronic component. It is a figure which shows typically the motion of the supply apparatus of the conventional components.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Temporary pressure bonding apparatus 101 Temporary pressure bonding head 102 Panel stage 103 XY table 110 Component supply apparatus 111 Reverse supply head 112 Transfer head 113 Relay stage 200 FPD board 201 Electronic component 202 Electronic component 301 Mounting stand 302 Component mounting means 400 Component supply apparatus Control unit 401 Different parts detection unit 402 Fault detection unit 403 Reverse feed head control unit

Claims (3)

The components are sequentially taken out from the component stocking means where the components are stocked, and the first component to be attached along the one side of the substrate is supplied to the crimping head for crimping the component to the edge of the substrate. A component supply method applied to a component supply apparatus that supplies a second part of a different type that is mounted in a second number along a side, wherein the component supply apparatus extracts a component from the component stocking means. A total number of components that can be held by each of the component extraction means and the component transfer means, and a relay means that can simultaneously hold different components. Relay means capable of holding more parts than
Detects that there is a third number of parts that is greater than or equal to the number that can be held by the relay means in the part transport path that is composed of the parts pick-up means, the parts transfer means, and the relay means. Different parts detection step to
A supply operation stopping step of stopping the supply operation of the second component when it is detected in the different component detection step that the third number of the second components exists in the component conveyance path; ,
When the first part is normally supplied, the supply work resuming step of restarting the supply work of the second part;
A failure detection step of receiving a signal indicating that a component held by the crimping head has a failure;
A component supply method comprising: a component replenishment step in which the component supply device supplies the same component as the component having the defect when a failure is detected. The relay means can hold two each of the first part and the second part, and the total number of parts that can be held by each of the part take-out means and the part transfer means is two or In the case of three,
The component supply method according to claim 1, wherein the third number is two in the different component detection step. The components are sequentially taken out from the component stocking means in which the components are stocked, and the first component to be attached along the one side of the substrate is supplied to the crimping head for crimping the component to the edge of the substrate, and then the first component A component supply device that supplies a second number of second components of a different type from the components of the substrate and is attached along the other side of the substrate,
A part take-out means for taking out the part from the part stock means for stocking the part;
Parts transfer means for taking over the parts from the take-out means and transferring the parts;
A relay means for relaying the parts taken over from the parts transfer means to the crimping head as a supply destination, and can hold more parts than the total number of parts that can be held by each of the parts take-out means and the parts transfer means. Relay means,
Detects that there is a third number of parts that is greater than or equal to the number that can be held by the relay means in the part transport path that is composed of the parts pick-up means, the parts transfer means, and the relay means. Different parts detection means to
Supplying part comprising: a supply work stopping means for stopping the supply work of the second part when the different part detecting means detects that the third number of second parts is present apparatus.

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