JP3918336B2 - Reinforcing member, reinforcing structure of IC chip mounting portion, IC card and reinforcing member assembling method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a reinforcing structure for an IC chip mounting portion, a reinforcing member used for the reinforcing structure, an IC card including the reinforcing structure, and a method for assembling the reinforcing member in the reinforcing structure.
[0002]
[Prior art]
Conventionally, there is provided a reinforcing structure for an IC chip mounting portion in which an IC chip mounted on a resin sheet is covered with a reinforcing resin, and a thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. IC cards are known. This is to improve the mechanical strength against bending in order to prevent the IC chip from being destroyed by the bending force when only the resin sheet is used. For example, it is conceivable to use metal, resin, ceramics, or the like as the reinforcing member.
[0003]
Here, from the viewpoint of improving the strength for protecting the IC chip, it is necessary to improve not only the reinforcing member itself but also the elastic modulus of the reinforcing resin itself. An increase in the elastic modulus of the reinforcing resin means that its viscosity also increases.
[0004]
[Problems to be solved by the invention]
However, when the elastic modulus of the reinforcing resin is increased, the following inconvenience occurs. That is, in the above-described reinforcing structure, the reinforcing member is arranged on the reinforcing resin covering the IC chip. However, when the viscosity of the reinforcing resin increases, air is interposed between the reinforcing member and the reinforcing resin. The possibility of remaining is increased. As the cause, for example, the following can be considered. First, when the viscosity of the reinforcing resin is high, the surface of the IC chip is not easily smoothed when the IC chip is coated. Therefore, when a smooth reinforcing member is placed, air is easily trapped between the two. Also, when the reinforcing member side is not smooth and has irregularities, air is easily confined in the same manner. Once confined, even if the reinforcing member is pressed to let the air escape to the outside, the high-viscosity reinforcing resin hardly flows and becomes residual air (void). Since such residual air weakens the reinforcing effect in the reinforcing structure, it is desired to eliminate it as much as possible.
[0005]
Therefore, the present invention solves such problems and eliminates as much residual air as possible to weaken the reinforcing effect in the reinforcing structure of the IC chip mounting portion. Therefore, a reinforcing member effective in realizing such a reinforcing structure is provided. The first purpose is to provide it.
It is a second object of the present invention to provide an IC chip reinforcing structure realized using the reinforcing member.
[0006]
It is a third object to provide an IC card having a reinforcing structure for the IC chip.
Furthermore, it is a fourth object to provide a method for assembling a reinforcing member in the reinforcing structure of the IC chip mounting portion.
[0007]
[Means for Solving the Problems and Effects of the Invention]
The reinforcing member according to claim 1, which is made to achieve the first object. , Supplement Surface facing strong resin And on the other side A groove that communicates from the vicinity of the center of the surface to the outer periphery is provided. For this reason, when the reinforcing member is disposed on the reinforcing resin covering the IC chip, air that has been highly likely to remain between the reinforcing member and the reinforcing resin in the past is passed through the groove portion. Makes it easier to escape to the outside. In other words, if there is no such groove, the gap between the reinforcing member and the reinforcing resin will not communicate with the outside at all, so even if the reinforcing member is pressed and air is allowed to escape to the outside, the high-viscosity reinforcement Resin is difficult to flow and becomes residual air.
[0008]
On the other hand, in the case of the reinforcing member of the present invention, even if the reinforcing member and the reinforcing resin are in close contact with each other in the portion other than the groove portion, the gap between the reinforcing member and the reinforcing resin is outside the groove portion. The possibility of communication is increased. Therefore, even if the reinforcing resin has a high viscosity, it is relatively easy to flow, and the residual air in the gap escapes to the outside through the groove portion, and as a result, there is a high possibility that the residual air disappears. Thus, since residual air can be eliminated as much as possible, it can prevent that the reinforcement effect in a reinforcement structure weakens.
[0009]
And As described above, the groove Is a supplement Surface facing strong resin And on the other side Provided Yes. The presence of such a groove has the following advantages. In assembling work, it is conceivable that the reinforcing members are stacked and picked up one by one. However, if the surface of the reinforcing member is completely smooth, for example, the reinforcing member is merely left with some oil and fat. They may be in close contact with each other and may interfere with the picking up work one by one. Therefore, if there is a groove portion, it is effective in preventing the reinforcing members from coming into close contact with each other.
[0010]
And , Provide grooves on both sides Because This is effective in the following points. First, if the groove is provided only on one side, when assembling the reinforcing member, the surface on which the groove is provided must be directed to the reinforcing resin side. No consideration is required. In other words, the surface on which the groove is not provided is not mistakenly opposed to the reinforcing resin.
[0011]
Further, as described above, when picking up the stacked reinforcing members one by one, even if there is a groove on only one side, smooth surfaces without the groove may be in close contact with each other. On the other hand, if there are groove portions on both sides, such close contact will not occur, which will contribute to improvement of work efficiency.
[0012]
On the other hand, for the groove, for example, the claim 2 As shown in FIG. 5, it is preferable that the cross-sectional area be increased from the vicinity of the center of the surface provided with the groove portion toward the outer periphery. As described above, this is an idea from the viewpoint of facilitating movement because the reinforcing resin needs to move when the residual air is allowed to escape to the outside.
[0013]
Specifically, the claims 3 As shown in FIG. 5, it is conceivable that the groove portion is formed so that the cross-sectional area increases as the width increases from the vicinity of the center toward the outer periphery. Of course, the depth (height) of the groove may be changed. However, in reality, since it is used in an IC card, the reinforcing member itself cannot be too thick. Therefore, it is easier to add a larger degree of change in cross-sectional area when the width of the groove is changed.
[0014]
There are various ways of providing the groove on the surface. As described above, since it is a major premise to communicate from the vicinity of the center to the outer periphery, for example, it may be provided linearly in the diameter direction passing through the center. However, in actual use when applied to an IC card, an external force is often applied linearly. Therefore, it is considered that stress concentration that would divide the reinforcing member itself is likely to occur if it is provided linearly in the diameter direction. Therefore, it is preferable that the reinforcing member itself is provided so as not to generate stress concentration that divides the reinforcing member itself. For example, claims 4 As shown in FIG. 5, it is conceivable to provide the groove portion in a curved manner on the surface. Moreover, even if it is a straight line, it does not have to be arranged on one straight line connecting the outer peripheral parts.
[0015]
In addition, as a cross-sectional shape of the groove portion, for example, claims 5 As shown in FIG. 5, it is conceivable to form a substantially arc shape or a triangle shape. Of course, it may be a quadrilateral or a polygon more than that, but it is considered that it is appropriate that the number of corners is as small as possible in terms of the cross-sectional shape of the groove from the viewpoint of generating as little residual air as possible.
[0016]
Further, the concept of “the groove portion communicating from the vicinity of the center of the surface to the outer periphery” described above includes the following. That is, the claim 6 As shown in FIG. 5, by forming fine convex portions on the surface, a groove portion communicating to the outer periphery is provided by connecting gaps between the convex portions. With this configuration, there are many paths that communicate with the outside, and the paths also communicate with each other, so even if there is a path that is blocked by the reinforcing resin, the remaining air can escape to the outside through other paths. This is effective in that the possibility that Of course, the size and arrangement of the convex portions need to be taken into account for a proper purpose (in this case, meaning that the residual air can be released through the gap).
[0017]
Next, claims made to achieve the second object 7 The IC mounting portion reinforcing structure described is an IC chip in which an IC chip mounted on a resin sheet is covered with a reinforcing resin, and a thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. The reinforcing structure of the mounting portion, and as the reinforcing member, claims 1 to 6 The reinforcing member according to any one of the above is used.
[0018]
As mentioned above On both the surface facing the reinforcing resin and the opposite surface By using the reinforcing member provided with the groove portion, there is a high possibility that residual air will disappear between the reinforcing resin and the reinforcing member, so that it is possible to prevent the reinforcing effect in the reinforcing structure from being weakened. In order to further improve the reinforcing effect, the claims 8 A structure as shown in FIG. That is, not only the reinforcing resin and the reinforcing member are arranged on the side on which the IC chip is mounted, but also the surface of the resin sheet opposite to the surface on which the IC chip is mounted. The reinforcing resin is also applied to the portion corresponding to the position, and further from above the reinforcing resin. 6 The reinforcing member according to any one of the above is disposed. Thus, if a reinforcing member is arrange | positioned on both sides on both sides of an IC chip, the reinforcement effect will improve more. However, in this case, in addition to the resin sheet for mounting the IC chip, two exterior resin sheets are required, which can be used only for a so-called three-sheet type IC card. On the other hand, if the reinforcing resin and the reinforcing member are arranged only on the side where the IC chip is mounted, the resin sheet for mounting the IC chip also serves as the resin sheet for the exterior, so 2 It can also be used for sheet-type IC cards.
[0019]
Next, claims made to achieve the third object 9 In the described IC card, the IC chip mounted on the resin sheet is covered with a reinforcing resin, and a reinforcing member in the form of a thin plate is disposed so as to cover the IC chip from above the reinforcing resin. An IC card having a structure, and as a reinforcing structure thereof, the claim 7 Or 8 The described reinforcing structure is used.
[0020]
As described above, the use of a reinforcing structure that eliminates residual air as much as possible between the reinforcing resin and the reinforcing member can prevent the reinforcing effect in the reinforcing structure from being weakened. Therefore, an IC card including the reinforcing structure The strength of the is also improved. Therefore, when an IC card is used, even if an external force such as a bending force is applied, the IC chip is not easily damaged, and the durability is excellent.
[0021]
Next, claims made to achieve the fourth object 10 The method of assembling the reinforcing member described in claim 7 Or 8 A method for assembling a reinforcing member in the reinforcing structure of the IC chip mounting portion described above, wherein the reinforcing resin and the reinforcing member are pressed by pressing the reinforcing member placed on the reinforcing resin toward the IC chip. The residual air is assembled in a state in which it is released to the outside through a groove provided in the reinforcing member.
[0022]
As mentioned above On both the surface facing the reinforcing resin and the opposite surface By using the reinforcing member provided with the groove portion, there is a high possibility that residual air is eliminated between the reinforcing resin and the reinforcing member. However, as in the present invention, the reinforcement placed on the reinforcing resin is used. If the member is pressurized in the IC chip direction, the residual air between the reinforcing resin and the reinforcing member can easily escape to the outside through the groove due to the movement of the reinforcing resin. Therefore, this assembling method is effective in that the residual air is minimized to prevent the reinforcing effect in the reinforcing structure from being weakened.
[0023]
In addition to pressurizing in this way, the claims 11 As shown in FIG. That is, the reinforcing member placed on the reinforcing resin is vibrated in a direction orthogonal to the pressing direction in a state where the reinforcing member is pressed in the IC chip direction. In this way, in terms of the relative movement direction of the reinforcing resin with respect to the reinforcing member, various directions can be obtained as compared with the case of simply pressurizing in the IC chip direction. The possibility of escaping outside increases.
[0024]
In addition to pressurization, claims 12 As shown in FIG. That is, the reinforcing member placed on the reinforcing resin is pressed in the IC chip direction while heating the reinforcing resin. Heating lowers the viscosity of the reinforcing resin and makes it easier to flow. Therefore, if pressure is applied in such a state, there is a high possibility that residual air can escape through the groove.
[0025]
And claims 13 If an assembling method as shown in FIG. 4 is employed, it is possible to let the residual air escape to the outside even if a reinforcing member without a groove is used. That is, the reinforcing member in the reinforcing structure of the IC chip mounting portion in which the IC chip mounted on the resin sheet is covered with the reinforcing resin and the thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. In this method, the reinforcing member placed on the reinforcing resin is pressed in the direction of the IC chip by applying a force only to its central portion. And bend the central part of the reinforcing member in the pressing direction relative to the peripheral part. Thus, the residual air between the reinforcing resin and the reinforcing member is assembled in a state in which it escapes to the outside.
[0026]
According to this assembling method, the reinforcing member placed on the reinforcing resin is pressed toward the IC chip by applying a force only to the central portion thereof. Therefore, the central portion of the reinforcing member bends in the pressing direction relative to the peripheral portion. For this reason, the reinforcing resin easily flows in the direction from the central portion to the peripheral portion of the reinforcing member, and the residual air in the gap that existed between the reinforcing member and the reinforcing resin escapes to the outside. Therefore, there is a high possibility that there will be no residual air.
[0027]
And this claim 13 The above-mentioned claim is also assumed when the assembling method shown in FIG. 11 The reinforcing member placed on the reinforcing resin may be vibrated in a direction orthogonal to the pressing direction in a state where the reinforcing member is pressed in the direction of the IC chip. 12 The reinforcing member placed on the reinforcing resin may be pressurized toward the IC chip while heating the reinforcing resin as shown in FIG. Of course, this claim 13 In the case of the assembling method shown in FIG. 4, if the grooved reinforcing member described above is used, the possibility that the residual air can be released to the outside is increased.
[0028]
In addition, as a shape of a reinforcement member, it is thought that a disk shape is preferable. This is because if there are corners, cracks are likely to occur in the reinforcing resin starting from the corners, so that a disc shape without corners is appropriate in terms of preventing such cracks. Further, the size of the reinforcing member is preferably larger than the size of the IC chip. When bending force is applied to the IC card, it is preferable to prevent the bending force from being applied to the IC chip as much as possible. From this point of view, the reinforcing member should be larger than the IC chip. Is appropriate.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments to which the present invention is applied will be described below with reference to the drawings. Needless to say, the embodiments of the present invention are not limited to the following examples, and can take various forms as long as they belong to the technical scope of the present invention.
[0030]
FIG. 1A is a schematic external view of a reinforcing member 10 of the present embodiment, FIG. 1B is a cross-sectional view showing a reinforcing structure of the present embodiment using the reinforcing member 10, and FIG. 1C is a book including the reinforcing structure. It is sectional drawing which shows IC card 1 of an Example.
As shown in FIG. 1C, the overall configuration of the IC card 1 is configured by laminating two exterior resin sheets 2 and 3 with an adhesive layer 4 interposed therebetween. One exterior resin sheet 2 is provided with a circuit pattern 6 (see FIG. 1B), and an IC chip 5 is mounted facing the circuit pattern 6. Since the “front surface” of the IC chip 5 generally indicates the side facing the circuit pattern 6, the “back surface” side of the IC chip 5 is exposed. Then, a reinforcing resin 7 is applied from above the IC chip 5 so as to cover the exposed portion. Further, a reinforcing member 10 having a thin plate shape is disposed on the reinforcing resin 7 covering the IC chip 5 so as to cover the IC chip 5 to constitute a reinforcing structure of the IC chip mounting portion. Accordingly, as shown in FIG. 1C, the adhesive layer 4 and the above-described “reinforcing structure” are arranged between the two exterior resin sheets 2 and 3.
[0031]
In addition, the resin sheets 2 and 3 are comprised with insulating synthetic resins, such as PET (polyethylene terephthalate), PPS (polyphenylene sulfide), PVC (polyvinyl chloride), for example.
The vertical and horizontal dimensions of these parts that determine the size of the card surface of the IC card 1 are set to 54 mm × 85.6 mm, and the thicknesses of the respective parts are set so that the total is 0.76 ± 0.08 mm. ing. In addition, this size is a value standardized as the size of an IC card by Japanese Industrial Standards (JIS), International Organization for Standardization (ISO), etc., and conforms to these standards. If it is not necessary to produce a card, it can be changed as appropriate.
[0032]
Next, the reinforcing member 10 will be described. As shown in FIG. 1A, the reinforcing member 10 is roughly a thin disk shape, and is basically formed to have a constant thickness. In addition, as a property requested | required about the reinforcing member 10, it is preferable to have an elasticity modulus of about 100-300 MPa. For example, SUS304 (stainless steel plate) is appropriate as the material. In addition, aluminum, copper, resin, ceramics, glass epoxy, or the like can be used.
[0033]
The size (size) of the reinforcing member 10 is preferably larger than the size of the IC chip 5. In the case of this embodiment, as shown in FIG. 2A, the diameter Ra of the reinforcing member 10 is set to be twice or more the diagonal length Rb of the square IC chip 5. This is a device for preventing the bending force from being applied to the IC chip 5 as much as possible when a bending force is applied to the IC card 1. As shown in FIG. 2B, when the resin sheet 2 is moved in the direction of the arrow by the bending force, the boundary portion where the reinforcing resin 7 is applied to the resin sheet 2 (indicated by α in FIG. 2B). A bending force is applied to the area. In that case, if the IC chip 5 is present in the portion indicated by α in FIG. 2B, it may cause a breakage in which a bending force is directly applied. Therefore, if the size of the reinforcing member 10 is sufficiently large with respect to the IC chip 5, the above-described disadvantage can be avoided.
[0034]
Moreover, in the specific example shown to Fig.1 (a), the four groove parts 11 are provided in the surface. The groove portion 11 communicates from the vicinity of the center of the surface to the outer periphery, but the shape and arrangement of the groove portion 11 have various points to consider and will be described in detail.
First, regarding the arrangement (planar shape) of the groove portion 11, it is a major premise that the groove portion 11 communicates from the vicinity of the center of the surface to the outer periphery. In the case shown in FIG. 1A, the four groove portions 11 are all linear, but a curved groove portion 211 may be provided as in the reinforcing member 210 shown in FIG. Moreover, you may provide the groove part 311 (in this case eight) in the diameter direction like the reinforcement member 310 shown in FIG.3 (b).
[0035]
However, since an external force is often applied linearly when the IC card 1 is actually used, if the groove 311 is linearly provided in the diameter direction as shown in FIG. 3B, the reinforcing member 310 itself is divided. It is considered that such stress concentration that tends to occur tends to occur “relatively”. Therefore, since the groove 11 shown in FIG. 1A is arranged so that two or more of the four do not line up on one straight line, the stress that may divide the reinforcing member 10 itself. Concentration is less likely to occur. Similarly, since the groove portions 211 shown in FIG. 3A are arranged in a curved line, stress concentration that divides the reinforcing member 10 itself is relatively unlikely to occur. The reason for “relatively” is that even if the groove 311 as shown in FIG. 3B is used, there is no problem if the reinforcing member 310 itself has sufficient strength.
[0036]
In addition, you may provide the groove part 411 by forming a fine convex part on the surface of the reinforcement member 410 like the reinforcement member 410 shown in FIG.3 (c). That is, the groove part 411 connected to the outer periphery is obtained by connecting the gaps between the convex parts. If configured in this way, there are many routes that communicate with the outside, and the routes are also communicated with each other, so even if the middle of the route is interrupted, there is a high possibility of being communicated to the outside through another route. This is effective.
[0037]
Then, as the cross-sectional shape of the groove part 11, it can be considered to form, for example, a substantially arc shape as shown in FIG. 4 (a) or a triangular shape as shown in FIG. 4 (b). Of course, it may be a quadrilateral or more polygons. However, from the viewpoint of generating as little residual air as possible, it is considered appropriate that the corners are as few as possible as the cross-sectional shape of the groove 11. 4 (a) is formed in a substantially arc-shaped cross-sectional shape.
[0038]
Further, as can be seen from FIG. 1A, the groove 11 is formed so that its width increases from the vicinity of the center toward the outer periphery. This is a device for increasing the cross-sectional area of the groove 11 from the vicinity of the center of the surface toward the outer periphery. Of course, in order to change the cross-sectional area of the groove 11, the depth (height) D of the groove 11 may be changed as shown in FIG. However, practically, since the IC card 1 itself is thin, the reinforcing member 10 itself cannot be too thick. Therefore, it is easy to give a larger degree of change in cross-sectional area when the width of the groove 11 is changed.
[0039]
On the other hand, since the reinforcing resin 7 has the purpose of reinforcement, the elastic modulus is set to be relatively high. As a technique for increasing the elastic modulus, a known technique such as adding a filler or adjusting the molecular weight of the resin itself may be employed.
Next, a method for assembling the reinforcing member 10 in the above-described reinforcing structure will be described with reference to FIG.
[0040]
First, as a 1st process, IC chip 5 is mounted in the predetermined position of the resin sheet 2 in which the circuit pattern 6 was provided (refer Fig.5 (a)).
In a subsequent second step, a reinforcing resin 7 is applied (potted) so as to cover the IC chip 5 (see FIG. 5B). At this time, the surface of the reinforcing resin 7 is generally not smooth and has irregularities. This is because, as described above, the viscosity of the reinforcing resin 7 is increased because the elastic modulus is increased by adding a filler to improve the reinforcing effect.
[0041]
In the third step, the reinforcing member 10 is placed on the reinforcing resin 7 by the mounting head H (see FIG. 5C), and the reinforcing member 10 is mounted by the mounting head H in the subsequent fourth step. Pressure is applied toward the IC chip 5 (see FIG. 5D).
In the fifth step, the reinforcing member 10 placed on the reinforcing resin 7 is vibrated (scrubbed) in a direction perpendicular to the pressing direction while being pressed in the direction of the IC chip 5 (FIG. 5). (See (e)). FIG. 5E is a schematic view seen from above, and vibrates the reinforcing member 10 in the front-rear and left-right directions. Actually, the head is not moved in each direction alone, but is moved in a figure-like motion to vibrate. The mounting head H in the fourth step and the scrub head in the fifth step may be the same, or different heads may be used depending on the convenience of the equipment.
[0042]
After such an assembling process, a reinforcing structure as shown in FIG. 1B is completed.
As shown in FIG. 5C, in a state where the reinforcing member 10 is placed on the reinforcing resin 7, a gap 20 is formed between the reinforcing resin 7 and the reinforcing member 10, and residual air is present there. (Void) may exist, but if the assembling method described with reference to FIG. 5 is performed using the reinforcing member 10 of this embodiment, the residual air can be released to the outside. This will be described with reference to FIG.
[0043]
The reinforcing member 10 of the present embodiment has a groove portion 11 which is disposed opposite to the reinforcing resin 7 side. If there is no such groove 11 and the surface is smooth, the gap 20 between the reinforcing member 10 and the reinforcing resin 7 will not communicate with the outside at all when the state shown in FIG. Even if it pressurizes after that and it tries to let residual air escape outside, the high-viscosity reinforcing resin 7 does not flow easily and becomes residual air.
[0044]
On the other hand, in the case of the present embodiment, since the groove portion 11 is provided in the reinforcing member 10, as shown in FIG. 6A, the reinforcing member 10 and the reinforcing resin 7 are provided in portions other than the groove portion 11. Even in the case, the gap 20 communicates with the outside in the groove 11. For this reason, even the reinforcing resin 7 having a high viscosity becomes relatively easy to flow, and the residual air in the gap 20 escapes to the outside through the groove portion 11, and as a result, there is a high possibility that the residual air disappears.
[0045]
In particular, since the pressure is applied in the fourth step as in this embodiment and scrubbing is further performed in the fifth step, the reinforcing resin 7 moves from the vicinity of the center of the lump to the peripheral direction as shown in FIG. As shown in FIG. 6 (b), it also enters the groove 11 of the reinforcing member 10 so that residual air can be eliminated as much as possible.
[0046]
Thus, eliminating residual air as much as possible can prevent the reinforcing effect in the reinforcing structure from being weakened. And the intensity | strength of IC card 1 provided with the reinforcement structure improves. Therefore, when the IC card 1 is used, the IC chip 5 is not easily damaged even if an external force such as a bending force is applied, and the durability is excellent.
[0047]
Moreover, in the case of a present Example, the shape of the reinforcement member 10 is made into disk shape. If there is a corner, cracks are likely to occur in the reinforcing resin 7 starting from that portion, which is effective in preventing such cracks.
By the way, not only when it is used for the reinforcing structure, but also when paying attention to the reinforcing member 11 alone, there are the following secondary effects.
[0048]
That is, in the assembling work, as shown in FIG. 7A, it is conceivable that the reinforcing members 10 are stacked and picked up one by one. If the surface of the reinforcing member 10 is completely smooth, for example, only a small amount of oil or fat remains, the reinforcing members 10 come into close contact with each other, and there is a possibility that the pickup work for each sheet may be hindered. On the other hand, in this embodiment, since the groove portion 11 is provided as shown in FIG. 7B, it is effective in preventing the reinforcing members 10 from being in close contact with each other during the pick-up operation.
[Others]
(1) In the embodiment described above, it is desired to provide the groove 11 only on one side of the reinforcing member 10, but the groove 11 may be provided on both sides of the reinforcing member 10 as shown in FIG. This is effective in the following points.
[0049]
(1) If the groove 11 is provided only on one side, when the reinforcing member 10 is assembled, the surface on which the groove 11 is provided must be surely placed toward the reinforcing resin 7 side. Such considerations are unnecessary if both sides are present. That is, it is possible to prevent the surface on which the groove portion 11 is not provided from being erroneously disposed opposite to the reinforcing resin 7.
[0050]
{Circle around (2)} When picking up the stacked reinforcing members one by one, even if the groove 11 is on only one side, smooth surfaces without the groove 11 may be in close contact with each other. On the other hand, if there are the groove portions 11 on both surfaces, they will not be in close contact with each other, and this will contribute to an improvement in work efficiency.
[0051]
In addition, when providing the groove part 11 in both surfaces, if it provides in the same position on the front and back, the part will become very thin and it is disadvantageous in terms of strength, so it is better to change the position on the front and back.
(3) Also, if there is a possibility that the reinforcing member 10 itself warps either on the front or back side when the groove 11 is on only one side, it is possible to provide the same groove 11 on both sides of the reinforcing member 10. This is also advantageous.
[0052]
(2) In the above-described embodiment, the example in which only one reinforcing member 10 is used has been described. However, in order to further improve the reinforcing effect, a structure as shown in FIG. 8 may be adopted. That is, not only the reinforcing resin 7 and the reinforcing member 10 are arranged on the side where the IC chip 5 is mounted, but also the surface of the resin sheet 2 opposite to the surface where the IC chip 5 is mounted. The reinforcing resin 107 is applied to the portion corresponding to the mounting position of the IC chip 5, and the same reinforcing member 110 is disposed on the reinforcing resin 107. As described above, if the reinforcing members 10 and 110 are arranged on both sides of the IC chip 5, the reinforcing effect is further improved. However, in this case, in addition to the resin sheet 2 for mounting the IC chip 5, two exterior resin sheets 3 and 103 are necessary, and it is assumed that they are used for a so-called three-sheet type IC card. To do.
[0053]
(3) In the above embodiment, as described with reference to FIG. 5, the reinforcing member 10 is pressed in the direction of the IC chip 5 and scrubbed. . Alternatively, the reinforcing member 10 placed on the reinforcing resin 7 may be pressurized in the IC chip direction while heating the reinforcing resin 7. Heating lowers the viscosity of the reinforcing resin 7 and facilitates flow. Therefore, if pressure is applied in such a state, there is a high possibility that residual air can escape to the outside via the groove 11.
[0054]
(4) Further, in the embodiments described so far, the reinforcing member 10 provided with the groove 11 is assumed. However, if the assembling method shown in FIG. 9 is adopted, the reinforcing member 510 without the groove 11 is used. Even if it is, it is possible to let the residual air escape to the outside. That is, as shown in FIG. 9, the groove-less reinforcing member 510 is placed on the reinforcing resin 7 and the central portion of the reinforcing member 510 is pressed toward the IC chip 5 by the mounting head H ′ having a narrow tip. Then, as shown in FIG. 9B, the central portion of the reinforcing member 510 pressed against the mounting head H ′ is bent relatively downward (that is, in the pressing direction) relative to the peripheral portion. Therefore, the reinforcing resin 7 is easy to flow from the central portion to the peripheral portion of the reinforcing member 510, and the gap that exists between the reinforcing member 510 and the reinforcing resin 7 in the state of FIG. The residual air in 20 escapes to the outside, and as a result, there is a high possibility that the residual air disappears.
[0055]
Also in this case, the process described with reference to FIG. That is, in a state where the reinforcing member 510 placed on the reinforcing resin 7 is pressed in the direction of the IC chip 5, it is vibrated (scrubbed) in a direction perpendicular to the pressing direction.
Needless to say, even when such a mounting head H ′ having a narrow tip is used, the use of the grooved reinforcing member 10 increases the possibility that the remaining air can be released to the outside.
[Brief description of the drawings]
1A is a schematic external view of a reinforcing member of the present embodiment, FIG. 1B is a cross-sectional view showing a reinforcing structure of the present embodiment using the reinforcing member, and FIG. 1C is a book including the reinforcing structure. It is sectional drawing which shows the IC card of an Example.
FIG. 2 is an explanatory diagram of the size and the like of a reinforcing member according to an embodiment.
FIG. 3 is an explanatory diagram of an arrangement (planar shape) of groove portions according to an embodiment.
FIG. 4 is an explanatory diagram of a cross-sectional shape of a groove portion of an example.
FIG. 5 is an explanatory view showing a method of assembling a reinforcing member in the reinforcing structure of the example.
FIG. 6 is an explanatory diagram showing that residual air can be released to the outside in the reinforcing structure of the embodiment.
FIG. 7 is an explanatory view showing a secondary effect due to the provision of a groove in the reinforcing member.
FIG. 8 is a cross-sectional view showing an IC card of another embodiment (3-sheet type).
FIG. 9 is an explanatory view showing a method of assembling a reinforcing member according to another embodiment.
[Explanation of symbols]
1 ... IC card 2, 3 ... Resin sheet
4 ... Adhesive layer 5 ... IC chip
6 ... Circuit pattern 7 ... Resin for reinforcement
10 ... Reinforcing member 11 ... Groove
20 ... Gap 107 ... Reinforcing resin
110, 210, 310, 410, 510 ... reinforcing member
211, 211, 311, 411 ... groove

Claims (13)

An IC having a reinforcing structure of an IC chip mounting portion in which an IC chip mounted on a resin sheet is covered with a reinforcing resin, and a thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. The reinforcing member used for a card,
Before SL on both opposed to the reinforcement resin and the opposite surface thereof, a reinforcing member, characterized in that the groove which communicates to the outer peripheral from the vicinity of the center of the surface is provided. The reinforcing member according to claim 1, wherein the groove is formed so that a cross-sectional area increases from the vicinity of the center toward the outer periphery . 3. The reinforcing member according to claim 2 , wherein the groove portion is formed so that the cross-sectional area increases as the width increases from the vicinity of the center toward the outer periphery. 4. The reinforcing member according to any one of claims 1 to 3 , wherein the groove is provided on the surface in a curved manner . 5. The reinforcing member according to claim 1, wherein a cross section of the groove is formed in a substantially arc shape or a triangular shape . The reinforcing member according to claim 1 , wherein the groove portion communicating from the vicinity of the center of the surface to the outer periphery communicates to the outer periphery by providing a fine convex portion on the surface, thereby connecting gaps between the convex portions. It is formed so that it may do. The reinforcement member characterized by the above-mentioned .   An IC chip mounting portion reinforcing structure in which an IC chip mounted on a resin sheet is covered with a reinforcing resin, and a thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. ,
  A reinforcing structure for an IC chip mounting portion, wherein the reinforcing member according to claim 1 is used as the reinforcing member. 8. The reinforcing structure of an IC chip mounting portion according to claim 7, wherein a surface of the resin sheet is opposite to a surface on which the IC chip is mounted, and also on a portion corresponding to the mounting position of the IC chip. A reinforcing structure for an IC chip mounting portion, wherein a reinforcing resin is applied, and the reinforcing member according to any one of claims 1 to 6 is disposed on the reinforcing resin .   An IC having a reinforcing structure of an IC chip mounting portion in which an IC chip mounted on a resin sheet is covered with a reinforcing resin, and a thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. A card,
  9. An IC card using the reinforcing structure according to claim 7 or 8 as the reinforcing structure.   A method for assembling a reinforcing member in the reinforcing structure of an IC chip mounting portion according to claim 7 or 8,
  By pressurizing the reinforcing member placed on the reinforcing resin in the IC chip direction, residual air between the reinforcing resin and the reinforcing member is passed through a groove provided in the reinforcing member. A method of assembling the reinforcing member, wherein the reinforcing member is assembled in a state of being released to the outside. The method of assembling a reinforcing member according to claim 10 ,
By vibrating the direction orthogonal to the pressing direction in a state where the reinforcing member is placed on the reinforcement resin and the pressure to the IC chip direction, between the reinforcing member and the reinforcement resin A method of assembling a reinforcing member, wherein the residual air is assembled in a state where it escapes to the outside via a groove provided in the reinforcing member. The method of assembling a reinforcing member according to claim 10 ,
While heating the reinforcement resin, by pressing the reinforcing member placed on the reinforcement resin to the IC chip direction, the air remaining between the reinforcing member and the reinforcement resin A method of assembling a reinforcing member, wherein the reinforcing member is assembled in a state of being released to the outside through a groove provided in the reinforcing member. A reinforcing member in a reinforcing structure of an IC chip mounting portion in which an IC chip mounted on a resin sheet is covered with a reinforcing resin and a thin plate-like reinforcing member is disposed so as to cover the IC chip from above the reinforcing resin. Assembling method of
The reinforcing member placed on the reinforcing resin is pressed in the direction of the IC chip by applying a force only to the central portion thereof, and the central portion of the reinforcing member is pressed in a direction relatively to the peripheral portion. to the Rukoto flexed, the method of assembling the reinforcing member characterized by assembling in a state where residual air venting out portion between the reinforcing member and the reinforcement resin.

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