JP4675153B2 - IC card manufacturing method - Google Patents

Description

  The present invention relates to an IC card manufacturing method in which a reinforcing plate for preventing damage is provided on an IC chip when an IC card is manufactured.

  In recent years, for example, a technology related to a non-contact type IC card called RF-ID (Radio Frequency Identification) has been rapidly advanced, and an IC chip to be used is also reduced in size and thickness. An IC card using such an IC chip needs some reinforcement because the IC chip is easily damaged during manufacture and use. For this reason, when reinforcing the IC chip, it is desirable not to adversely affect other members such as an antenna portion during mounting.

  An example in which a reinforcing member is provided on an IC chip used for the IC card or the like is proposed in Patent Document 1 below. In Patent Document 1, for the purpose of minimizing residual air that causes a weakening of the reinforcing effect in the reinforcing structure of the IC chip mounting portion, a groove portion is provided in the reinforcing member to generate in the reinforcing resin by pressurization. It is disclosed that the air gap communicates with the outside.

  By the way, an IC chip mounted with an IC card is required to be thin including a reinforcing member. Therefore, an example of a general one for reducing the thickness of an adhesive in mounting an IC chip or the like is proposed in Patent Document 2 below. Patent Document 2 discloses that a chip component is pressed against a thermosetting adhesive on a circuit board, and one or both of the chip component and the circuit board are slightly vibrated for a short time.

JP 2000-194815 A Japanese Unexamined Patent Publication No. 6-69639

  However, in order to reduce the thickness of an IC chip mounted on an IC card including a reinforcing member, in particular, bumps for mounting are formed on the IC chip, and the IC chip is used as a flexible member such as paper or film. When reinforcing and mounting on a pattern formed of a conductive thin film member (conductive ink, conductive toner, vapor deposited metal thin film, etching metal thin film), the reinforcing member described in Patent Document 1 is used. The adhesion by the pressure vibration described in 1) has the problem that the pattern is scraped by the bumps of the IC chip and becomes non-conductive, leading to a decrease in quality and a decrease in yield.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an IC chip manufacturing method that secures conduction during mounting and prevents deterioration in quality and yield.

In order to solve the above problems, the invention of claim 1 is a method of manufacturing an IC card in which an IC chip having bumps for mounting is mounted on a pattern formed of a conductive thin film member on a base material. A predetermined large reinforcing plate for bonding to the surface opposite to the bump forming surface of the IC chip, and supplying a predetermined amount of adhesive to the bonding surface of the reinforcing plate; and the adhesive of the reinforcing plate A step of bringing the IC chip bonding surface into contact with the surface to which the IC chip bonding surface is exposed by holding means for exposing and holding the IC chip bonding surface; and shape and a step of adhering the combined shake while pressing at a pressure of ^{5.17g / mm 2 ~15.50g / mm 2} , an IC chip in which the reinforcing plate is adhered, the bumps of the IC chip to the substrate Pattern on to electrical connection configured to include a step of implementation, the.

According to the present invention, a predetermined amount of adhesive is supplied to the adhesive surface of the reinforcing plate, and the IC chip adhesive surface is held by the holding means that exposes the IC chip adhesive surface to the adhesive surface of the reinforcing plate. IC in which the reinforcing plate is bonded by contacting and holding the IC chip against the bonding surface of the reinforcing plate while pressing the IC chip with a pressure of 5.17 g / mm ^{2 to} 15.50 g / mm ^2. Since the chip is mounted by electrically connecting the bumps of the IC chip onto the pattern formed on the base material, the reinforcing plate is bonded before mounting, so that the bump is applied to the mounting pattern more than necessary during mounting. Therefore, it is possible to ensure conduction, thereby preventing deterioration in quality and yield.

Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a configuration diagram of a manufacturing apparatus for realizing an IC card manufacturing method according to the present invention. FIG. 1A is a conceptual diagram of a first process manufacturing apparatus for connecting a reinforcing plate to an IC chip in an IC card manufacturing apparatus, and FIG. 1B is a conceptual diagram of a second manufacturing apparatus for mounting an IC chip with a reinforcing plate. . In FIG. 1A, a first process manufacturing apparatus 11A of an IC card manufacturing apparatus 11 is an apparatus for adhering a reinforcing plate to an IC chip, and a continuous reinforcing plate provided with a reinforcing plate, which will be described later, is transferred to a tractor (drive source). (Not shown) is provided, and an adhesive supply nozzle 13 that constitutes a part of the adhesive supply means is provided in the information of the first predetermined position in the transport direction.

  A collet 14 constituting a part of the holding means is disposed above the rear stage of the position where the adhesive supply nozzle 13 is disposed in the transport direction of the transport device 12. This holding means is connected to a suction means such as an air compressor (not shown) and a suction hole (see FIG. 3B) formed in the collet 14, and moves the collet 14 up and down and two-dimensionally (not shown). A known mechanism is provided. Note that the mechanism appropriately includes a function of swinging the collet 14 (reciprocating rotation within a range of two-dimensional horizontal 360 degrees) (applied to FIG. 6).

  A chip tray 16 is disposed in the vicinity of the collet 14, and an IC chip 17A with bumps facing upward is stored in the chip tray 16. That is, the collet 14 is formed with a substantially quadrangular pyramid-shaped space inside the tip and the suction hole communicating with the space, and the IC chip 17A housed in the chip tray 16 is bumped in the space. The adhesive surface opposite to the surface is exposed and held by suction (see FIG. 3B).

  Two cutting blades 15A (15B) constituting a part of the cutting means are arranged above and below the position where the collet 14 is arranged in the conveying direction of the conveying device 12 so as to be movable up and down by a conventional mechanism (not shown). The cutting blade 15A (15B) is separated from the continuous reinforcing plate after the IC chip 17A is bonded (described later).

  And the adhesion auxiliary stand 19 is arranged below the moving range of the collet 14 and below the continuous reinforcing plate conveyed by the conveying device 12. Further, the cutting auxiliary base 20 is disposed below the cutting blade 15A (15B) and below the continuous reinforcing plate conveyed by the conveying device 12.

  On the other hand, in FIG. 1B, the second process manufacturing apparatus 11B of the IC card manufacturing apparatus 11 is an apparatus for mounting an IC chip with a reinforcing plate, and a mounting attachment provided with a predetermined number of mounting attachments for mounting an IC chip with a reinforcing plate. A group 21 is disposed, a suction fixing stage 22 is disposed below the group 21, and a protective member, for example, a fluorine-based resin sheet 23 is disposed directly below the mounting attachment group 21. The mounting attachment group 21 pressurizes and heats the IC chip with a reinforcing plate on the antenna portion formed on the inlet sheet (broken line portion, see FIG. 5B) conveyed on the suction fixing stage 22. It is to be implemented.

  FIG. 2 shows a manufacturing flowchart of the IC card manufacturing method according to the present invention used in the manufacturing apparatus of FIG. 1, and FIGS. 3 to 5 show process explanatory diagrams related to the manufacturing flowchart of FIG. In FIG. 2, first, when the continuous reinforcing plate continuously provided by the conveying device 12 is conveyed and one reinforcing plate is positioned below the adhesive supply nozzle 12, a predetermined amount of adhesive is placed on the reinforcing plate. (Step (S1)).

    That is, as shown in FIG. 3A, the continuous reinforcing plate 31 is integrated with the marginal portions 34A and 34B in which the reinforcing plates 32 are continuously arranged and the conveying holes are formed through the holding communication portions 33A and 33B. Is formed. The continuous reinforcing plate 31 is made of stainless steel having a thickness of 50 μm to 150 μm, for example, and is formed as shown in the figure by, for example, die pressing.

  Further, each reinforcing plate 32 is formed so that its size is at least the size of the adhesion surface of the IC chip 17A, or more appropriately. For example, when the IC chip 17A is a large IC chip having a bonding surface size of 4 mm × 4 mm or more (thus, a thickness of 50 μm to 200 μm), the IC chip 17A is formed with a size larger than this size. When the reinforcing plate 32 is smaller than the size of the bonding surface of the IC chip 17A, a chip is generated in a portion other than the portion where the reinforcing plate 32 is provided when there is an impact at the time of manufacturing or holding an IC card. It is considered that there is.

  Then, a predetermined amount of adhesive 41 is supplied onto each reinforcing plate 32. As the adhesive 41, for example, a silicon-based or epoxy-based thermosetting type is employed. The predetermined amount is appropriately set to an amount that does not protrude from the periphery when the IC chip 17A is bonded.

  Subsequently, in FIG. 2, the collet 14 of the holding means sucks and holds the IC chip 17A to be bonded from the chip tray 16, and the bonding surface of the IC chip 17A is on the reinforcing plate 32 to which the adhesive 41 is supplied. (S2). That is, as shown in FIG. 3B, the IC chip 17A is held in a fitted state in the recess 16A formed individually on the chip tray 16, and the holding is performed by the bump 18A of the IC chip 17A. , 18B are facing upward. As a result, the IC chip 17A can be removed from the suction hole 14B formed in the collet 14 in a form in which the adhesive surface is exposed in the space 14A inside the tip of the collet 14, as shown in FIG. It is held by suction force.

  As described above, when the IC chip 17A held by the collet 14 is moved onto the corresponding reinforcing plate 32, the IC chip 17A is pressed (pressure P) onto the reinforcing plate 32 by holding means (not shown). Then, they are shaken and bonded (S3). As shown in FIG. 4A, the shaking is performed in one or both of one direction (X-axis direction) and the other direction (Y-axis direction) in the two-dimensional horizontal direction. The rocking in this case is a concept including rocking, for example, reciprocating (including rotation shown in FIG. 6 described later) about 3 to 5 times regardless of regular or irregular. . In the case of the present invention, it is not always necessary to vibrate periodically.

The pressing force P is, 100g (5.17g / mm ²⁾ with respect to (4.4 mm × 4.4 mm As an Example) the IC chip 17A to 300 g (15.50 g / mm ²⁾ but is optimal, 300 g This is merely considering the adverse effect of stress due to the weight applied to the IC chip 17A for a pressing force exceeding 1, but it is not excluded and may be set realistically. In the range of the pressing force P, the thickness of the adhesive 41 positioned between the IC chip 17A and the reinforcing plate 32 can be set to 13 μm on average. Incidentally, the thickness of the adhesive 41 was able to be 10 μm or less when it was shaken with a pressing force P of 200 g.

  Subsequently, in FIG. 2, when the IC chip with a reinforcing plate in which the IC chip 17A is bonded onto the corresponding reinforcing plate 32 of the continuous reinforcing plate 31 is conveyed and positioned below the cutting blade 15A (15B), the cutting is performed. The blade 15A (15B) descends and cuts the holding communication portions 33A and 33B, so that they are separated from the marginal portions 34A and 34B and separated into pieces (S4). That is, as shown in FIG. 4B, the reinforcing plate 32 connected to the marginal portions 34A and 34B by the holding communication portions 33A and 33B is cut by the cutting blade 15A (15B) after the IC chip 17A is bonded. It will be separated into pieces. The singulated IC chip 17 with a reinforcing plate is held on a chip tray 16 as shown in FIG. 3B, for example, and used for a mounting apparatus 11B described later.

  Then, returning to FIG. 2, the IC chip 17 with the reinforcing plate that is separated into pieces is a base sheet (an inlet sheet described later) for manufacturing an IC card in the mounting apparatus 11B, and the pattern ( It is mounted on the (antenna part) (S5). That is, as shown in FIG. 5A, the inlet sheet 51 on which the IC chip 17 with the reinforcing plate is mounted is formed in a matrix on a flexible base 52 formed of, for example, a PET (polyethylene terephthalate) sheet. Further, the antenna portion 53 is formed by a printing process such as screen printing, for example, with conductive ink as a conductive thin film member with the number of turns according to the communication design. Other examples of the conductive thin film member for forming the pattern include conductive toner, vapor deposited metal thin film, and etched metal thin film.

  Therefore, as shown in FIG. 5B, the inlet sheet 51 is transported above the suction fixing stage 22 by a predetermined transport method (not shown). When the adhesive is supplied to the antenna portion 53 and the IC chip 17 with the reinforcing plate is mounted and conveyed onto the suction fixing stage 22, it is suction fixed by a suction means (not shown). Then, mounting is performed by heating and pressing each reinforcing attachment-attached IC chip 17 on the suction stage 22 with each mounting attachment of the mounting attachment group 21 through the protection member 23.

  Thus, since the reinforcing plate 32 is bonded before mounting, the bumps 18A and 18B can be kept conductive without applying excessive pressure to the pattern of the corresponding antenna portion 53 of the inlet sheet 51 during mounting. Therefore, it is possible to prevent quality deterioration and yield reduction.

  Next, FIG. 6 is an explanatory diagram of another shaking bonding in FIG. 4 (A). In FIG. 4A described above, the IC chip 17A is shown as a case where the IC chip 17A is shaken in one direction (X-axis direction) and the other direction (Y-axis direction) with respect to the reinforcing plate 32. In this case, the adhesive plate 41 is thinly adhered to the IC chip 17A by swinging the IC chip 17A with respect to the reinforcing plate 32 (reciprocating rotation within a range of two-dimensional horizontal 360 degrees). It is something that can be done. That is, similarly to the above, the bonding step of the reinforcing plate 32 is performed before mounting, and similarly to the above, conduction can be secured without applying more pressure than necessary, thereby preventing deterioration in quality and yield. It is something that can be done.

  The IC card manufacturing method of the present invention is suitable for manufacturing an IC card by providing a reinforcing plate on an IC chip to be mounted on a pattern formed of a conductive ink material.

It is a block diagram of the manufacturing apparatus which implement | achieves the IC card manufacturing method which concerns on this invention. It is a manufacture flowchart of the IC card manufacturing method based on this invention used for the manufacturing apparatus of FIG. It is process explanatory drawing (1) based on the manufacturing flowchart of FIG. It is process explanatory drawing (2) based on the manufacturing flowchart of FIG. It is process explanatory drawing (3) based on the manufacturing flowchart of FIG. It is explanatory drawing of the other shaking adhesion in FIG. 4 (A).

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 IC card manufacturing apparatus 12 Conveyance apparatus 13 Adhesive supply nozzle 14 Collet 15 Cutting blade 16 Chip tray 17A IC chip 17 IC chip with a reinforcement board 18 Bump 31 Continuous reinforcement board 32 Reinforcement board 33 Holding communication part 34 Marginal part 41 Adhesive

Claims (1)

An IC card manufacturing method for mounting an IC chip having bumps for mounting on a pattern formed of a conductive thin film member on a substrate,
A predetermined large reinforcing plate for bonding to the surface opposite to the bump forming surface of the IC chip, and supplying a predetermined amount of adhesive to the bonding surface of the reinforcing plate;
Contacting the IC chip bonding surface with a holding means for exposing and holding the IC chip bonding surface to the surface of the reinforcing plate to which the adhesive is supplied;
The holding means oscillating and bonding the IC chip against the bonding surface of the reinforcing plate while pressing the IC chip with a pressure of 5.17 g / mm ^{2 to} 15.50 g / mm ² ;
Mounting the IC chip to which the reinforcing plate is bonded by electrically connecting the bumps of the IC chip on the pattern formed on the substrate;
An IC card manufacturing method comprising:

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