JP3934295B2 - Magneto-impedance effect element - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a magneto-impedance effect element that detects an external magnetic field using the magneto-impedance effect.
[0002]
[Prior art]
Since the magneto-impedance effect element has high external magnetic field detection sensitivity, it has begun to be applied as a magnetic detection element to an automobile orientation sensor, a motor rotation sensor, or the like. FIG. 20 is a perspective view showing the structure of such a conventional magneto-impedance effect element. This magneto-impedance element 31 is fixed to an insulating substrate 35 on which a non-magnetic substrate 32 has a pair of wiring patterns 33 and 34 formed thereon. The electrodes 37 and 38 provided at both ends in the longitudinal direction of the magnetic thin film 36 having a high magnetic permeability formed on one end surface of the nonmagnetic substrate 32 are connected to the pair of wiring patterns 33 and 34 by the solder 39, respectively. ing. A bias coil 40 for generating an AC bias magnetic field is wound and mounted on the nonmagnetic substrate 32 in a form including the insulating substrate 35, and the magnetic thin film 36 is located in the wound portion 40a. ing.
[0003]
The thus configured magneto-impedance effect element 31 is arranged so that the longitudinal direction of the magnetic thin film 36 is along an external magnetic field H emitted from a detection object (not shown), and a pair of wiring patterns 33 and 34 are not shown. When a high frequency current in the MHz band is supplied from the external power source to the magnetic thin film 36 through the pair of wiring patterns 33 and 34 while being connected to the external power supply, the impedance between the longitudinal ends of the magnetic thin film 36 changes. The detection output of the external magnetic field H is obtained by converting this change into an electric signal.
[0004]
When a high frequency current is applied, an alternating current having a frequency lower than that of the high frequency current is applied to the bias coil 40 to apply a bias magnetic field to the magnetic thin film 36, so that the impedance between both longitudinal ends of the magnetic thin film 36 becomes an external magnetic field H. It is possible to give a linearity to the impedance change between both ends in the longitudinal direction of the magnetic thin film 36 so as to change linearly with respect to the change of the magnetic thin film 36, and to detect the strength of the external magnetic field H with a good linearity. It becomes.
[0005]
The magneto-impedance effect element 31 positions the nonmagnetic substrate 32 on the insulating substrate 35 so that the electrodes 37 and 38 correspond to the pair of wiring patterns 33 and 34, and the electrodes 37 and 38 and the pair of wiring patterns 33 and 34. And the non-magnetic substrate 32 is fixed to the insulating substrate 35, and the bias coil 40 is wound around the non-magnetic substrate 32 including the insulating substrate 35.
[0006]
[Problems to be solved by the invention]
In the conventional magneto-impedance effect element 31 described above, the non-magnetic substrate 32 is formed by connecting the electrodes 37 and 38 and the pair of wiring patterns 33 and 34, which are external connection members, using the solder 39, respectively. Although it is fixed to the insulating substrate 35, which is a member to be attached, the solder 39 is excellent in electrical characteristics, but it is difficult to obtain sufficient mechanical strength. When a force is applied, the nonmagnetic substrate 32 is detached from the insulating substrate 35, and the connection between the electrodes 37, 38 and the pair of wiring patterns 33, 34 may be broken. In order to prevent this, it is conceivable to fix the nonmagnetic substrate 32 to the insulating substrate 35 using an adhesive. However, since the adhesive is troublesome to handle and takes a lot of time to apply and dry it, there is a concern that the manufacturing process of the magneto-impedance effect element 31 as a whole will be long, and it is insufficient as a measure for preventing detachment.
[0007]
The present invention has been made in view of the above-described prior art, and an object of the present invention is to provide a magneto-impedance effect element that can reliably prevent a nonmagnetic substrate from coming off from a member to be attached and can simplify the manufacturing process. There is to do.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the magneto-impedance effect element of the present invention includes a magnetic thin film formed on one surface of a nonmagnetic substrate and first and first electrodes connected to electrodes provided at both ends of the magnetic thin film, respectively. Two terminal pins and a winding frame provided with a coil terminal around which the bias coil is wound and to which the bias coil is connected, at least one of the first and second terminal pins is attached to the winding frame, The non-magnetic substrate is inserted into the through hole of the winding frame, and the magnetic thin film is positioned in the winding portion of the bias coil, and at least one of the first and second terminal pins attached to the winding frame The most important feature is that the nonmagnetic substrate is held in contact with the inner wall surface of the through hole by the elastic force of one side.
[0009]
Further, in the above configuration, the first terminal pin has a fixed portion fixed to the winding frame, and a bent portion formed by bending from one end portion of the fixed portion, and the first terminal pin is The electrode to be connected is exposed from the winding frame, and the bent portion is pressed by the elastic force of the electrode, and the coil terminal is protruded from the winding frame, and the first direction is the same as the protruding direction. A terminal pin and the second terminal pin were protruded from the winding frame.
[0010]
In the above configuration, a protrusion is formed on the second terminal pin on the side opposite to the electrode to which the second terminal pin is connected, and the protrusion contacts the inner wall surface of the through hole. The electrode to which the second terminal pin is connected is pressed.
[0011]
Further, in the above configuration, a terminal pin insertion opening is formed in each of the pair of flanges provided at both ends of the winding frame, the fixing portion is inserted into the insertion opening, and the first terminal pin is attached to the winding. Fixed to the frame.
[0012]
Further, in the most main configuration, the electrode is exposed from both ends of the winding frame, and both the first and second terminal pins are fixed to both ends of the winding frame, and the first and first terminals are fixed. By pressing the electrodes with spring pieces formed on the terminal pins 2, the nonmagnetic substrate was held in contact with the inner wall surface of the through hole.
[0013]
Further, in the above configuration, a terminal pin insertion port is formed in each of the pair of flanges provided at both ends of the winding frame, and the first and second terminal pins are inserted into the insertion port, so that the first The second terminal pin was fixed to the winding frame.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
A magneto-impedance effect element according to a first embodiment of the present invention will be described below with reference to FIGS.
[0015]
In this magneto-impedance effect element 1, a non-magnetic substrate 2 having a magnetic thin film 3 provided with electrodes 4 and 5 at both ends is inserted into a through hole 6a of a winding frame 6 around which a bias coil 7 is wound. The nonmagnetic substrate 2 is configured to be held in contact with the inner wall surface of the through hole 6a by the elastic force of the first terminal pin 12 attached to the winding frame 6.
[0016]
The nonmagnetic substrate 2 is formed by molding a nonmagnetic material such as ceramic into a rectangular shape. As shown in FIG. 5, the nonmagnetic substrate 2 has a magnetic permeability made of a material mainly containing bccFe fine crystal grains including FeHfC on one surface. The high magnetic thin film 3 is linearly formed, and copper electrodes 4 and 5 are provided at both ends in the longitudinal direction of the magnetic thin film.
[0017]
The winding frame 6 is a member to be attached and is formed in a cylindrical shape from an insulating synthetic resin material. As shown in FIG. 6, a bias coil 7 made of a conductive wire for generating an AC bias magnetic field is wound around the winding frame 6. A pair of flanges 8 and 9 are provided at both ends of the frame 6. One notch 8a has a notch 8a formed continuously with the through hole 6a of the winding frame 6, and a terminal pin insertion port 8b is formed in the notch 8a. Further, a terminal pin insertion port 9a is formed in the other flange portion 9 at a position facing the terminal pin insertion port 8b, and a coil is provided on the opposite side of the terminal pin insertion port 9a via the winding portion 7a of the bias coil 7. Terminals 10 and 11 are provided so as to project, and one end and the other end of the bias coil 7 led out through a notch 9b formed in the side portion of the flange portion 9 are entangled with the coil terminals 10 and 11, respectively. It is connected. As shown in FIGS. 1 to 4, the nonmagnetic substrate 2 is inserted into the through hole 6 a of the winding frame 6, the magnetic thin film 3 is located in the winding part 7 a of the bias coil 7, and the notch part The electrode 4 is exposed from 8a.
[0018]
The first terminal pin 12 is an external connection member, which is formed by bending a conductive wire spring material into an L shape, and as shown in FIG. 6, a fixed portion 12a and one end of the fixed portion 12a. The bent portion 12b is bent in a right angle from the side, and a connecting portion 12c is bent at one end of the bent portion 12b. As shown in FIG. 3, the first terminal pin 12 has a so-called two-point fixing structure in which the fixing portion 12a is inserted into the terminal pin insertion openings 8b and 9a by strong fitting. The bent portion 12b, which is firmly attached and located in the notch portion 8a of the flange portion 8, presses the electrode 4 through the connecting portion 12c by its own elastic force, and the nonmagnetic substrate 2 is inserted into the through hole 6a. It is held in contact with the wall surface.
[0019]
The second terminal pin 13 is a member for external connection and is made of a conductive wire. As shown in FIG. 6, a connection portion 13 a wider than the other portion is provided at one end portion thereof. A protrusion 13b is formed on the connecting portion 13a. The second terminal pin 13 is inserted into the through hole 6a of the reel 6 together with the nonmagnetic substrate 2 by soldering the surface opposite to the protruding portion 13b of the connecting portion 13a to the electrode 5, as shown in FIG. Further, the protrusion 13b contacts the inner wall surface of the through hole 6a to press the electrode 5, and cooperates with the first terminal pin 12 to hold the nonmagnetic substrate 2 in contact with the inner wall surface of the through hole 6a. is doing.
[0020]
Next, a method for assembling the magneto-impedance effect element 1 configured as described above will be described. First, the connection portion 13a of the second terminal pin 13 is soldered to the electrode 5 provided on the non-magnetic substrate 2 and non-coated. The second terminal pins 13 are fixed to the magnetic substrate 2. Next, the nonmagnetic substrate 2 and the second terminal pin 13 were inserted into the through hole 6 a from the other end side where the other flange 9 of the winding frame 6 was provided, and formed into the second terminal pin 13. The protrusion 13b is fitted into the through hole 6a.
[0021]
After that, the fixing portion 12a of the first terminal pin 12 is inserted into the terminal pin insertion openings 8b and 9a by strong fitting from one end side where the one flange portion 8 of the reel 6 is provided. By positioning the bent portion 12b in the portion 8a and attaching the first terminal pin 12 to the reel 6, the contact portion 12c is brought into contact with the electrode 4 and the electrode 4 is pressed by the elastic force of the bent portion 12b. The nonmagnetic substrate 2 is held in contact with the inner wall surface of the through hole 6a. The connection portion 12c of the first terminal pin 12 and the electrode 4 are sufficiently abutted and held by the elastic force of the bent portion 12b. However, if necessary, an adhesive, solder, resin, or the like is used. It may be fixed with.
[0022]
Thus, although the assembly of the magneto-impedance effect element 1 is completed, after the assembly, the first and second terminal pins 12 and 13 are conducted through the electrode 4, the magnetic thin film 3 and the electrode 5. Also, since these first and second terminal pins 12 and 13 protrude from the winding frame 6 in the same direction as the protruding direction of the coil terminals 10 and 11 from the winding frame 6, the first and second terminal pins 12, 13 can be soldered to the circuit board (not shown) or the like continuously with the coil terminals 10 and 11 on the other end side of the winding frame 6. Further, since one end and the other end of the bias coil 7 are led out through the notch 9 b and connected to the coil terminals 10 and 11, the bias coil is formed on the side of the flange 9 when the magneto-impedance effect element 1 is handled. 7, there is no concern that the operator's fingers or jigs may be caught, and the disconnection between the bias coil 7 and the coil terminals 10 and 11 due to this can be reliably prevented. Further, during this handling, the magnetic thin film 3 of the nonmagnetic substrate 2 is covered with the winding frame 6 and is located in the winding portion 7 a of the bias coil 7, so that the operator's fingers touch the magnetic thin film 3. In this way, damage such as disconnection of the magnetic thin film 3 due to finger contact can be prevented.
[0023]
The magneto-impedance effect element 11 assembled and configured in this way is mounted on a circuit board 14 arranged perpendicular to the longitudinal direction of the magnetic thin film 3, as shown in FIGS. The first and second terminal pins 12 and 13 and the coil terminals 10 and 11 are electrically connected to the circuit board 14 by soldering.
[0024]
The magneto-impedance effect element 1 is arranged from the circuit board 14 to the first and second terminals in a state where the longitudinal direction of the magnetic thin film 3 is arranged along the external magnetic field H emitted from a detection object (not shown). When a high frequency current in the MHz band is applied to the magnetic thin film 3 through the pins 12 and 13, the impedance between the longitudinal ends of the magnetic thin film 3 changes according to the change of the external magnetic field H, and this change is caused by the circuit board 14. A detection output of the external magnetic field H can be obtained by converting into an electric signal.
[0025]
When the high frequency current is applied, an alternating current having a frequency lower than the high frequency current is applied from the circuit board 14 to the bias coil 7 via the coil terminals 10 and 11 to apply a bias magnetic field to the magnetic thin film 3. The change in impedance between the longitudinal ends of the magnetic thin film 3 can be made linear so that the impedance between the longitudinal ends of the magnetic thin film 3 changes linearly with respect to the change in the external magnetic field H. It becomes possible to detect the strength of H with good linearity.
[0026]
Thus, in the magneto-impedance element 1, the nonmagnetic substrate 2 can be easily held on the reel 6 by the elastic force of the bent portion 12b of the first terminal pin 12, and due to factors such as dropping When an impact force is applied to the magneto-impedance effect element 1 from the outside, the nonmagnetic substrate 2 is detached from the reel 6 and the connection between the electrodes 4 and 5 and the first and second terminal pins 12 and 13 is broken. Can be reliably prevented. Further, the protrusion 13 b of the second terminal pin 13 cooperates with the first terminal pin 12 to hold the nonmagnetic substrate 2 on the winding frame 6, so that the nonmagnetic substrate 2 is detached from the winding frame 6. This can be prevented more reliably.
[0027]
Next, a second embodiment of the magneto-impedance effect element of the present invention will be described with reference to FIGS.
[0028]
The magneto-impedance effect element 15 uses the same non-magnetic substrate 2 as shown in the first embodiment, and the non-magnetic substrate 2 is inserted into the through hole 16a of the winding frame 16 around which the bias coil 17 is wound. The first and second terminal pins 22 and 23 attached to both ends of the winding frame 16 are pressed by the elastic force of the electrodes 4 and 5 exposed from the both ends of the winding frame 16 so that the nonmagnetic substrate 2 is transparent. The inner wall surface of the hole 16a is in contact with and held.
[0029]
The reel 16 is a member to be attached and is formed in a cylindrical shape from an insulating synthetic resin material. As shown in FIGS. 9 to 12, a bias coil 17 made of a conductive wire for generating an AC bias magnetic field is wound around the reel 16. A pair of flanges 18 and 19 are provided at both ends of the winding frame 16. The flange portions 18 and 19 are formed with through holes 18a and 19a, respectively, and the notches 18b and 19b are formed so as to be continuous with the through holes 16a of the winding frame 16. The notches 18b and 19b Terminal pin insertion openings 18c and 19c are respectively formed. Then, the nonmagnetic substrate 2 is inserted into the through hole 16 a of the winding frame 16, the magnetic thin film 3 is located in the winding portion 17 a of the bias coil 17, and the notches 18 b and 19 b at both ends of the winding frame 16. Further, the electrodes 4 and 5 are exposed.
[0030]
The winding frame 16 is integrally formed with the coil terminal 20 including a flat plate portion 20a and a narrow rising portion 20b formed integrally with the flat plate portion 20a, and the flat plate portion 21a and the flat plate portion 21a. A coil terminal 21 composed of a narrow rising portion 21b is attached by inserting the rising portions 20b and 21b into the through holes 18a and 19a by strong fitting, and the coil terminals 20 and 21 have the same shape. One end and the other end of the bias coil 17 are entangled with and connected to the leading ends of the rising portions 20b and 21b.
[0031]
The first terminal pin 22 is an external connection member, which is formed by cutting and bending a conductive thin plate into an L shape, and is formed integrally with the flat plate portion 22a and the flat plate portion 22a as shown in FIG. And the tip of the spring piece 22b is an arc-shaped connection part 22c. As shown in FIGS. 9 to 10, the first terminal pin 22 is attached to the winding frame 16 by inserting the spring piece 22b into the terminal pin insertion port 18c with a strong fit. The connection portion 22c of 22b presses the electrode 4 by its own elastic force, and holds the nonmagnetic substrate 2 in contact with the inner wall surface of the through hole 16a. Further, the contact portion between the connection portion 22c and the electrode 4 is soldered, so that the electrical connection between the first terminal pin 22 and the electrode 4 is made more reliable.
[0032]
The second terminal pin 23 is an external connection member, which is formed by cutting and bending a conductive thin plate into an L shape, is formed in the same shape as the first terminal pin 22, and is shown in FIG. Further, the flat plate portion 23a and a thin spring piece 23b formed integrally with the flat plate portion 23a, the tip of the spring piece 23b is an arc-shaped connection portion 23c. As shown in FIGS. 9 to 11, the second terminal pin 23 is attached to the winding frame 16 by inserting the spring piece 23b into the terminal pin insertion port 19c by strong fitting. The connecting portion 23c of 23b presses the electrode 5 by its own elastic force, and holds the nonmagnetic substrate 2 in contact with the inner wall surface of the through hole 16a in cooperation with the first terminal pin 22. Further, the contact portion between the connection portion 23c and the electrode 5 is soldered, so that the electrical connection between the second terminal pin 23 and the electrode 5 is made more reliable.
[0033]
Next, a method for assembling the magneto-impedance effect element 15 configured as described above will be described. First, rising portions of the coil terminals 20 and 21 are respectively inserted into the through holes 18c and 19c of the winding frame 16 around which the bias coil 17 is wound. 20b and 21b are respectively attached by strong fitting, and one end and the other end of the bias coil 17 are connected to the leading end portions of the rising portions 20b and 21b, respectively. Next, the nonmagnetic substrate 2 is inserted into the through hole 16a of the winding frame 16, and then the first terminal pin 22 is attached to the winding frame 16 with the spring piece 22b penetrating through the terminal pin insertion port 18c with a strong fit. The contact portion 22c is brought into contact with the electrode 4 and the electrode 4 is pressed by the elastic force of the spring piece 22b, thereby bringing the nonmagnetic substrate 2 into contact with and holding the inner wall surface of the through hole 16a.
[0034]
Next, the spring piece 23b is passed through the terminal pin insertion port 19c with a strong fit, the first terminal pin 23 is attached to the winding frame 16, and the connection portion 23c is brought into contact with the electrode 5 to have the elasticity of the spring piece 23b. By pressing the electrode 5 by force, the nonmagnetic substrate 2 is held in contact with the inner wall surface of the through hole 16a in cooperation with the first terminal pin 22. Thereafter, soldering is applied to the contact portion between the connection portion 22c and the electrode 4 and the contact portion between the connection portion 23c and the electrode 5 to complete the assembly of the magneto-impedance effect element 15.
[0035]
In this way, the assembly of the magneto-impedance effect element 15 is completed, but after the assembly, the first and second terminal pins 22 and 23 are conducted through the electrode 4, the magnetic thin film 3 and the electrode 5. In addition, the flat plate portions 22 a and 23 a of the first and second terminal pins 22 and 23 and the flat plate portions 20 a and 21 a of the coil terminals 20 and 21 protrude from the winding frame 16 in a direction perpendicular to the longitudinal direction of the magnetic thin film 3. Therefore, these flat plate portions 22a, 23a, 20a, 21a can be continuously soldered to a circuit board (not shown) or the like. Further, when the magneto-impedance effect element 15 is handled, since the magnetic thin film 3 of the nonmagnetic substrate 2 is covered with the winding frame 16 and is located in the winding portion 17a of the bias coil 17, the operator's finger is magnetic. Without touching the thin film 3, damage such as disconnection of the magnetic thin film 3 due to finger contact can be prevented.
[0036]
The magneto-impedance effect element 15 assembled and configured as described above is mounted on a circuit board 24 arranged in parallel to the longitudinal direction of the magnetic thin film 3, as shown in FIGS. The first and second terminal pins 22 and 23 and the coil terminals 20 and 21 are electrically connected to the circuit board 24 by soldering.
[0037]
The magneto-impedance effect element 15 is arranged from the circuit board 24 to the first and second terminals in a state where the longitudinal direction of the magnetic thin film 3 is arranged along the external magnetic field H emitted from the detection target (not shown). When a high frequency current in the MHz band is applied to the magnetic thin film 3 through the pins 22 and 23, the impedance between the longitudinal ends of the magnetic thin film 3 changes according to the change of the external magnetic field H, and this change is caused by the circuit board 24. A detection output of the external magnetic field H can be obtained by converting into an electric signal.
[0038]
When a high-frequency current is applied, an alternating current having a frequency lower than the high-frequency current is applied from the circuit board 24 to the bias coil 17 via the coil terminals 20 and 21 to apply a bias magnetic field to the magnetic thin film 3. The change in impedance between the longitudinal ends of the magnetic thin film 3 can be made linear so that the impedance between the longitudinal ends of the magnetic thin film 3 changes linearly with respect to the change in the external magnetic field H. It becomes possible to detect the strength of H with good linearity.
[0039]
Therefore, in the magneto-impedance element 15, the nonmagnetic substrate 2 can be easily held on the reel 16 by the elastic force of the spring pieces 22b, 23b of the first and second terminal pins 22, 23. When an impact force is applied to the magneto-impedance effect element 15 from the outside due to a drop or the like, the nonmagnetic substrate 2 is detached from the winding frame 16, and the electrodes 4, 5 and the first and second terminal pins 22, 23 It is possible to reliably prevent disconnection. In this embodiment, the nonmagnetic substrate 2 is most securely held on the reel 16 by the elastic force of the spring pieces 22b, 23b of the first and second terminal pins 22, 23. The invention is not limited to this, and the nonmagnetic substrate 2 is held on the reel 16 only by the elastic force of one of the spring pieces 22b, 23b of the first and second terminal pins 22, 23. It may be.
[0040]
FIGS. 15 to 19 are diagrams showing another application example in the second embodiment of the present invention. The magneto-impedance element 25 is different from the above-described magneto-impedance effect element 15 in that the coil terminals 20 and 21 and The shape of the terminal pins 22 and 23 is slightly changed, and the coil terminals 20 and 21 are replaced with coil terminals 26 and 27 formed of straight conductive wires. One end and the other end of the bias coil 17 are respectively connected to the coil terminals 26 and 27. The first and second terminal pins 28 and 29 formed of conductive wire spring material are replaced with the tangled and connected points, and the first and second terminal pins 22 and 23. 28a and a spring piece 28b bent at a right angle from one end side of the fixed portion 28a. The tip of the spring piece 28b is an arc-shaped connecting portion 28c, and the second end Like the first terminal pin 28, the pin 29 includes a fixing portion 29a and a spring piece 29b bent at a right angle from one end side of the fixing portion 29a. The tip of the spring piece 29b is an arc-shaped connection portion 29c. The other configuration is the same as that of the magneto-impedance effect element 15 except for the two points.
[0041]
The first and second terminal pins 28 and 29 are attached to the winding frame 16 with the fixed portions 28a and 29a being inserted into the terminal pin insertion openings 18c and 19c by strong fitting, respectively, and the spring pieces 28b and 29b. Each of the electrodes 4 and 5 is pressed through the connecting portions 28c and 29c by its own elastic force, and the nonmagnetic substrate 2 is held in contact with the inner wall surface of the through hole 16a.
[0042]
The magneto-impedance effect element 25 is mounted on a circuit board 30 arranged in parallel to the longitudinal direction of the magnetic thin film 3, and the first and second terminal pins 28 and 29 and the coil terminals 26 and 27 are provided on the back side thereof. Are electrically connected to the circuit board 30 by soldering. The magneto-impedance element 25 is arranged so that the longitudinal direction of the magnetic thin film 3 is along an external magnetic field H emitted from a detection object (not shown), and operates in the same manner as the magneto-impedance element 15.
[0043]
Thus, the magneto-impedance effect element 25 has the same effect as the magneto-impedance effect element 15 described above. In addition, the first and second terminal pins 28 and 29 and the coil terminals 26 and 27 are connected to the circuit. Since soldering can be performed on the back side of the substrate 30, variations can be provided in the structure for mounting the product to the circuit substrate 30.
[0044]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0045]
A magnetic thin film formed on one surface of a nonmagnetic substrate, first and second terminal pins connected to electrodes provided on both ends of the magnetic thin film, and a bias coil are wound to connect the bias coil. And at least one of the first and second terminal pins is attached to the winding frame, and the non-magnetic substrate is inserted into a through-hole of the winding frame so that the magnetic A thin film is located in the winding portion of the bias coil, and the nonmagnetic substrate is caused to have an inner wall surface of the through hole by elastic force of at least one of the first and second terminal pins attached to the winding frame. Since the non-magnetic substrate can be easily held by the winding frame as a member to be attached, the non-magnetic substrate is detached from the winding frame, and the electrode and the external connection member The first and first It can be connected to the terminal pins of reliably prevented from being broken.
[0046]
The first terminal pin has a fixed portion fixed to the winding frame, and a bent portion formed by bending from one end portion of the fixed portion, and the first terminal pin is connected to the first terminal pin. The electrode is exposed from the winding frame, and the bent portion is pressed by the elastic force of the electrode, and the coil terminal is protruded from the winding frame, and the first terminal pin and the first are in the same direction as the protruding direction. Since the two terminal pins protrude from the winding frame, the first and second terminal pins can be continuously soldered to a circuit board or the like.
[0047]
In addition, the second terminal pin has a protrusion on the side opposite to the electrode to which the second terminal pin is connected, and the protrusion abuts against the inner wall surface of the through-hole to form the second terminal pin. Since the electrode to which the terminal pin is connected is pressed, the protrusion of the second terminal pin cooperates with the first terminal pin to hold the nonmagnetic substrate on the reel, and from the reel It is possible to more reliably prevent the nonmagnetic substrate from coming off.
[0048]
Further, terminal pin insertion holes are formed in a pair of flange portions provided at both ends of the winding frame, respectively, and the first terminal pin is fixed to the winding frame by inserting the fixing portion into the insertion holes. Therefore, the first terminal pin can be firmly attached to the reel with a so-called two-point fixed structure.
[0049]
Further, the electrode is exposed from both ends of the winding frame, and both the first and second terminal pins are fixed to both ends of the winding frame, and the first and second terminal pins are formed. Each of the spring pieces of the first and second terminal pins cooperates because the nonmagnetic substrate is held in contact with the inner wall surface of the through hole by pressing the electrodes with spring pieces. Thus, the nonmagnetic substrate can be held on the winding frame, and the nonmagnetic substrate can be more reliably prevented from being detached from the winding frame.
[0050]
Further, terminal pin insertion holes are formed in a pair of flange portions provided at both ends of the winding frame, and the first and second terminal pins are fitted into the insertion holes, so that the first and second terminals are inserted. Since the terminal pin is fixed to the reel, the first and second terminal pins can be easily attached to the reel.
[Brief description of the drawings]
FIG. 1 is a plan view of a magneto-impedance effect element according to a first embodiment of the present invention.
FIG. 2 is a front view of the magneto-impedance effect element according to the first embodiment of the present invention.
FIG. 3 is a side view of the magneto-impedance effect element according to the first embodiment of the present invention.
FIG. 4 is a rear view of the magneto-impedance effect element according to the first embodiment of the present invention.
FIG. 5 is a plan view of a nonmagnetic substrate according to the magnetoimpedance effect element of the present invention.
FIG. 6 is an explanatory view showing assembly of the magneto-impedance effect element according to the first embodiment of the present invention.
FIG. 7 is a side view showing a state where the magneto-impedance effect element according to the first embodiment of the present invention is attached to a circuit board.
FIG. 8 is a front view showing a state in which the magneto-impedance effect element according to the first embodiment of the present invention is attached to a circuit board.
FIG. 9 is a plan view of a magneto-impedance effect element according to a second embodiment of the present invention.
FIG. 10 is a front view of a magneto-impedance effect element according to a second embodiment of the present invention.
FIG. 11 is a side view of a magneto-impedance effect element according to a second embodiment of the present invention.
FIG. 12 is an explanatory view showing the assembly of the magneto-impedance effect element according to the second embodiment of the present invention.
FIG. 13 is a front view showing a state where a magneto-impedance effect element according to a second embodiment of the present invention is attached to a circuit board.
FIG. 14 is a side view showing a state in which a magneto-impedance effect element according to a second embodiment of the present invention is attached to a circuit board.
FIG. 15 is a plan view for explaining an application example of the magneto-impedance effect element according to the second embodiment of the invention.
FIG. 16 is a front view for explaining an application example of a magneto-impedance effect element according to a second embodiment of the invention.
FIG. 17 is a side view for explaining an application example of the magneto-impedance effect element according to the second embodiment of the invention.
18 is a front view showing a state in which the magneto-impedance effect element shown in FIG. 16 is attached to a circuit board.
19 is a front view showing a state in which the magneto-impedance effect element shown in FIG. 17 is attached to a circuit board.
FIG. 20 is a perspective view of a conventional magneto-impedance effect element.
[Explanation of symbols]
1 magneto-impedance effect element
2 Non-magnetic substrate
3 Magnetic thin film
4 electrodes
5 electrodes
6 reel
7 Bias coil
7a Winding part
8 Buttocks
8a Notch
8b Terminal pin insertion slot
9 Buttocks
9a Terminal pin insertion slot
9b Notch
10 Coil terminal
11 Coil terminal
12 First terminal pin
12a fixed part
12b Turn part
12c connection
13 Second terminal pin
13a connection part
13b Projection
14 Circuit board
15 magneto-impedance effect element
16 reel
16a through hole
17 Bias coil
18 Buttocks
18a Through hole
18b Notch
18c Terminal pin insertion slot
19 Buttocks
19a Through hole
19b Notch
19c Terminal pin insertion slot
20 Coil terminal
20a Flat plate part
20b Rising part
21 Coil terminal
21a Flat plate part
21b Rising part
22 First terminal pin
22a Flat plate part
22b Spring piece
22c connection part
23 Second terminal pin
23a Flat plate part
23b Spring piece
23c connection part
24 Circuit board
25 Magneto-impedance effect element
26 Coil terminal
27 Coil terminal
28 First terminal pin
28a fixed part
28b Spring piece
28c connection part
29 Second terminal pin
29a fixed part
29b Spring piece
29c connection
30 Circuit board

Claims (6)

A magnetic thin film formed on one surface of a nonmagnetic substrate, first and second terminal pins connected to electrodes provided on both ends of the magnetic thin film, and a bias coil are wound to connect the bias coil. And at least one of the first and second terminal pins is attached to the winding frame, and the non-magnetic substrate is inserted into a through-hole of the winding frame so that the magnetic A thin film is located in the winding portion of the bias coil, and the nonmagnetic substrate is caused to have an inner wall surface of the through hole by elastic force of at least one of the first and second terminal pins attached to the winding frame. A magneto-impedance effect element, wherein the magneto-impedance effect element is held in contact with the element. The first terminal pin has a fixed portion fixed to the winding frame, and a bent portion formed by bending from one end portion of the fixed portion, and the electrode to which the first terminal pin is connected is provided. The electrode is exposed from the winding frame, and the bent portion is pressed by the elastic force thereof, and the coil terminal is protruded from the winding frame, and the first terminal pin and the second direction in the same direction as the protruding direction. 2. The magneto-impedance effect element according to claim 1, wherein a terminal pin protrudes from the winding frame. A protrusion is formed on the second terminal pin on the side opposite to the electrode to which the second terminal pin is connected, and the protrusion is in contact with the inner wall surface of the through-hole. The magneto-impedance effect element according to claim 2, wherein the electrode to which the pin is connected is pressed. A terminal pin insertion port is formed in each of the pair of flanges provided at both ends of the winding frame, and the fixing portion is inserted into the insertion port to fix the first terminal pin to the winding frame. The magneto-impedance effect element according to claim 3, The electrode is exposed from both ends of the winding frame, and both the first and second terminal pins are fixed to the both ends of the winding frame, and the spring pieces are formed on the first and second terminal pins. 2. The magneto-impedance effect element according to claim 1, wherein the nonmagnetic substrate is held in contact with an inner wall surface of the through hole by pressing each of the electrodes. Terminal pin insertion holes are formed in a pair of flange portions provided at both ends of the reel, and the first and second terminal pins are inserted into the insertion holes. The magneto-impedance effect element according to claim 5, wherein is fixed to the reel.

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