JP4076687B2 - Magneto-impedance effect element and circuit board equipped with magneto-impedance effect element - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a magneto-impedance effect element that detects an external magnetic field using the magneto-impedance effect.
[0002]
[Prior art]
Since the magneto-impedance effect element has high external magnetic field detection sensitivity, it has begun to be applied as a magnetic detection element to an automobile orientation sensor, a motor rotation sensor, or the like. FIG. 16 is a perspective view showing the structure of such a conventional magneto-impedance effect element. The magneto-impedance element 31 is fixed to an insulating substrate 35 on which a non-magnetic substrate 32 has a pair of wiring patterns 33 and 34 formed thereon. The electrodes 37 and 38 provided at both ends in the longitudinal direction of the magnetic thin film 36 having a high magnetic permeability formed on one end surface of the nonmagnetic substrate 32 are connected to the pair of wiring patterns 33 and 34 by the solder 39, respectively. ing. A bias coil 40 for generating an AC bias magnetic field is wound and mounted on the nonmagnetic substrate 32 in a form including the insulating substrate 35, and the magnetic thin film 36 is located in the wound portion 40a. ing.
[0003]
The magneto-impedance effect element 31 configured as described above is arranged so that the longitudinal direction of the magnetic thin film 36 is along an external magnetic field H emitted from a detection object (not shown), and magnetically passes through a pair of wiring patterns 33 and 34. When a high-frequency current in the MHz band is passed through the thin film 36, the impedance between both ends in the longitudinal direction of the magnetic thin film 36 changes, and this change is converted into an electric signal so that a detection output of the external magnetic field H can be obtained. .
[0004]
When a high-frequency current is applied, an alternating current having a frequency lower than the high-frequency current is applied to the bias coil 40 to apply a bias magnetic field to the magnetic thin film 36, and linearly changes in impedance between both longitudinal ends of the magnetic thin film 36. The direction of the external magnetic field H can be detected.
[0005]
In this magneto-impedance effect element 31, a nonmagnetic substrate 32 is fixed to an insulating substrate 35, electrodes 37 and 38 and a pair of wiring patterns 33 and 34 are connected to each other by solder 39, and then the nonmagnetic substrate including the insulating substrate 35 is included. It is manufactured by winding the bias coil 40 around 32.
[0006]
[Problems to be solved by the invention]
However, in the conventional magneto-impedance effect element 31 described above, since the magnetic thin film 36 is exposed on one end surface of the nonmagnetic substrate 32, the bias coil 40 is wound around the nonmagnetic substrate 32 and attached. During the operation, the operator's finger touches the magnetic thin film 36 while the bias coil 40 is being wound, causing damage such as disconnection.
[0007]
The present invention has been made in view of the above-described prior art, and an object thereof is to provide a magneto-impedance effect element capable of mounting a bias coil on a nonmagnetic substrate without damaging a magnetic thin film. .
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the magneto-impedance effect element of the present invention has electrodes provided on both ends of a magnetic thin film formed on one surface of a non-magnetic substrate, and the non-magnetic substrate is formed on a winding frame around which a bias coil is wound. The magnetic film is positioned in the winding portion of the bias coil, and the wiring patterns formed on one surface of the insulating substrate are connected to the electrodes protruding from both ends of the winding frame, respectively. The main feature is that the bias coil is connected to a coil terminal provided on the winding frame.
[0009]
Further, in the above configuration, a pair of flanges are provided at both ends of the winding frame, a notch is formed in the insulating substrate, the pair of flanges are fitted into the notch, and the insulating substrate is Attached to the reel.
[0010]
In the magneto-impedance effect element mounting circuit board according to the present invention, the winding frame in which the non-magnetic substrate and the insulating substrate in the configuration of the magneto-impedance effect element are fitted is mounted on the circuit board, and the coil A terminal is projected from the winding frame, and the magneto-impedance effect element provided by extending the wiring pattern in the same direction as the projecting direction is provided , and the wiring pattern and the coil terminal are soldered to the circuit board.
[0011]
Further, in the above configuration, the coil terminal protrudes substantially perpendicular to the longitudinal direction of the magnetic thin film provided in a line, and the wiring pattern extends substantially perpendicular to the longitudinal direction of the magnetic thin film, The circuit board was arranged substantially parallel to the longitudinal direction of the magnetic thin film.
[0012]
In the above configuration, the coil terminal protrudes substantially parallel to the longitudinal direction of the magnetic thin film provided in a line, and the wiring pattern extends substantially parallel to the longitudinal direction of the magnetic thin film. The circuit board was arranged substantially perpendicular to the longitudinal direction of the magnetic thin film.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a magneto-impedance effect element according to the present invention will be described with reference to FIGS.
[0014]
In this magneto-impedance element 1, a bias coil 11 is wound around a winding frame 6 fitted with a nonmagnetic substrate 2 having a magnetic thin film 3 provided with electrodes 4 and 5 at both ends. The wiring patterns 15 and 16 formed on the insulating substrate 12 are connected to the electrodes 4 and 5 protruding from the portion, respectively.
[0015]
The non-magnetic substrate 2 is formed by molding a non-magnetic material such as ceramic into a rectangular shape. As shown in FIG. 4, a magnetic thin film having a high magnetic permeability mainly including bccFe fine crystal grains including FeHfC on one surface thereof. 3 is formed in a straight line, and copper electrodes 4 and 5 are provided at both ends in the longitudinal direction of the magnetic thin film.
[0016]
The winding frame 6 is formed in a cylindrical shape from an insulating synthetic resin material, and as shown in FIGS. 5 to 7, a pair of flange portions 7 and 8 are provided at both ends thereof. Are integrally formed with terminal support portions 7a and 8a to which the coil terminals 9 and 10 are respectively fixed.
[0017]
The nonmagnetic substrate 2 is inserted into the through-hole 6a of the winding frame 6 with a strong fit, and the electrodes 4 and 5 protrude from both end portions of the winding frame 6 and are exposed to the through-hole 6a. While the magnetic thin film 3 is located, a slight clearance is provided between the inner wall surface of the through hole 6 a and the magnetic thin film 3. Further, as shown in FIGS. 1 to 3, a bias coil 11 for generating an AC bias magnetic field made of a conductive wire is wound around the winding frame 6 between the pair of flanges 7 and 8, and the bias is applied. One end and the other end of the coil 11 are connected to the coil terminals 9 and 10 respectively.
[0018]
As shown in FIG. 8, lands 13 and 14 are formed on both sides of one surface of the insulating substrate 12, and the wiring patterns 15 and 16 extend from the lands 13 and 14 to one end of the insulating substrate 12. One end portion side of the wiring patterns 15 and 16 is formed as connection portions 15a and 16a which are wider than the other end portion side. Further, a rectangular cutout portion 12a is formed at the other end portion of the insulating substrate 12, and the lands 13 and 14 are opposed to each other with the cutout portion 12a interposed therebetween, as shown in FIG. In addition, a plurality of solder bumps 17 each having a copper protrusion 17b whose surface is plated with solder 17a are provided. The lands 13 and 14 and the wiring patterns 15 and 16 are all formed of copper foil, and the portions other than the connection portions 15a and 16b of the wiring patterns 15 and 16 and the portions other than the solder bumps 17 of the lands 13 and 14 are polyimide. It is covered with an insulating film 20 made of resin or the like.
[0019]
As shown in FIGS. 1 to 3, the insulating substrate 12 is attached to the winding frame 6 by fitting a pair of flanges 7 and 8 into the notch 12a, and the lands 13 and 14 are respectively magnetic substrates. The second electrodes 4 and 5 are connected to the solder 17a. As a result, the connecting portions between the lands 13 and 14 and the electrodes 4 and 5 are covered and protected by the insulating substrate 12 and the nonmagnetic substrate 2, and the wiring patterns 15 and 16 are connected to the lands 13, the electrodes 4, the magnetic thin film 3, It is in a conductive state via the electrode 5 and the land 14.
[0020]
Next, a method for assembling the magneto-impedance effect element 1 configured as described above will be described. First, the non-magnetic substrate 2 is inserted into the through hole 6a of the winding frame 6 and is strongly fitted to the inner wall surface of the through hole 6a. Then, the nonmagnetic substrate 2 is attached to the winding frame 6 so that the electrodes 4 and 5 protrude from both ends of the winding frame 6. Next, the bias coil 11 is wound between the pair of flange portions 7 and 8 of the winding frame 6, and one end and the other end of the bias coil 11 are connected to the coil terminals 9 and 10, respectively. At this time, since the magnetic thin film 3 is positioned in the through hole 6a and covered with the winding frame 6, the finger of the operator who winds the bias coil 11 does not touch the magnetic thin film 3, and the finger touches the finger. The resulting damage such as disconnection of the magnetic thin film 3 can be prevented.
[0021]
Next, as shown in FIG. 10, the insulating substrate 12 is positioned on the side of the winding frame 6, and the pair of flange portions 7 and 8 are fitted into the notch portion 12 a, whereby the insulating substrate 12 is attached to the winding frame 6. Attach to. Thereafter, when the other surface of the insulating substrate 12 corresponding to the lands 13 and 14 is heated and pressurized with a chip heater (not shown), the solder 11a is melted and the lands 13 and the electrodes 4 and the lands 14 and the electrodes 5 are connected. The
[0022]
Thus, although the assembly of the magneto-impedance effect element 1 is completed, after the assembly, the magnetic thin film 3 is located in the winding portion 11a of the bias coil 11, and the coil terminal 9 is arranged with respect to the longitudinal direction of the magnetic thin film 3. , 10 protrudes substantially perpendicularly from the winding frame 6, and wiring patterns 15, 16 extend from the lands 13, 14 in the same direction as the protruding direction, and the wiring pattern 15 extends in the longitudinal direction of the magnetic thin film 3. 16 are extended substantially vertically.
[0023]
The magneto-impedance effect element 1 constructed and assembled as described above is mounted on a circuit board 18 arranged in parallel to the longitudinal direction of the magnetic thin film 3 as shown in FIGS. The connection portions 15a and 16a of the wiring patterns 15 and 16 and the coil terminals 9 and 10 are electrically connected to the circuit board 18 by soldering.
[0024]
The magneto-impedance effect element 1 is arranged from the circuit board 18 via the wiring patterns 15 and 16 in a state where the longitudinal direction of the magnetic thin film 3 is arranged along the external magnetic field H emitted from a detection object (not shown). When a high-frequency current in the MHz band is applied to the magnetic thin film 3, the impedance between both ends in the longitudinal direction of the magnetic thin film 3 changes, and this change is converted into an electric signal by the circuit board 18 to obtain a detection output of the external magnetic field H. It is supposed to be.
[0025]
When the high frequency current is applied, an alternating current having a frequency lower than the high frequency current is applied from the circuit board 18 to the bias coil 11 via the coil terminals 9 and 10 to apply a bias magnetic field to the magnetic thin film 3. The change in impedance between both ends in the longitudinal direction can be made linear, and the direction of the external magnetic field H can be detected.
[0026]
In the magneto-impedance effect element 1, the projecting direction of the coil terminals 9 and 10 and the extending direction of the wiring patterns 15 and 16 are aligned. Therefore, an operation of soldering these to the circuit board 18 is performed. This can be performed continuously on the back side of the circuit board 18, and the coil terminals 9, 10 and the wiring patterns 15, 16 can be quickly connected to the circuit board 18. Further, the insulating substrate 12 can be attached to the winding frame 6 simply by fitting the pair of flange portions 7 and 8 into the notch portion 12a, and the wiring patterns 15 and 16 are both insulated substrates. 12 is provided on one surface, the soldering operation between the connection portions 15a and 16a of the wiring patterns 15 and 16 and the circuit board 18 can be continuously performed on the one surface side of the insulating substrate 18.
[0027]
FIGS. 13 to 15 are views showing other application examples of the present invention. The magneto-impedance effect element 19 is different from the above-described magneto-impedance effect element 1 in that the coil terminals 9 and 10 are connected to both terminal support portions 7a. 8a and 8a, the coil terminals 9 and 10 are protruded substantially parallel to the longitudinal direction of the magnetic thin film 3 from the winding frame 6, and the shape of the insulating substrate 12 is slightly changed. The other points are the same as those of the magneto-impedance effect element 1 except that the wiring patterns 15 and 16 are provided so as to extend to one side of the insulating substrate 12 substantially parallel to the longitudinal direction. .
[0028]
The magneto-impedance effect element 19 is mounted on a circuit board 18 disposed substantially perpendicular to the longitudinal direction of the magnetic thin film 3, and the connection portions 15 a, 16 a of the wiring patterns 15, 16 and the coil terminals 9, 10 is soldered and electrically connected to the circuit board 18. The magneto-impedance effect element 19 is arranged so that the longitudinal direction of the magnetic thin film 3 is along an external magnetic field H emitted from a detection object (not shown), and operates in the same manner as the magneto-impedance effect element 1.
[0029]
In the magneto-impedance effect element 19 configured as described above, the height is higher in the front and back direction (arrow A direction) of the circuit board 18 than the magneto-impedance effect element 1, but the mounting on the circuit board 18 is increased. Since the area can be reduced, it is effective in reducing the size of the circuit board 18.
[0030]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0031]
Electrodes are provided on both ends of the magnetic thin film formed on one surface of the non-magnetic substrate, and the non-magnetic substrate is fitted and attached to a winding frame around which the bias coil is wound. A wiring pattern formed on one surface of an insulating substrate is connected to the electrodes protruding from both ends of the winding frame, the magnetic film is located, and the bias coil is connected to a coil terminal provided on the winding frame. Since it is connected, the magnetic thin film can be covered with the winding frame, and it is possible to eliminate the worry that the finger of the operator who winds the bias coil around the winding frame touches the magnetic thin film. The bias coil can be mounted on the nonmagnetic substrate without causing damage to the magnetic thin film due to disconnection or the like caused by the above.
[0032]
Since a pair of flanges are provided at both ends of the winding frame, a notch is formed in the insulating substrate, and the pair of flanges are fitted into the notch, and the insulating substrate is attached to the winding frame. The insulating substrate can be easily attached to the winding frame simply by fitting the pair of flanges to the notch, and the assembly of the element can be simplified.
[0033]
A winding frame in which the non-magnetic substrate and the insulating substrate are fitted is mounted on a circuit board. The coil terminal protrudes from the winding frame, and the wiring pattern extends in the same direction as the protruding direction. Provided, the projecting direction of the coil terminal and the extending direction of the wiring pattern are soldered to the circuit board, and the wiring pattern and the coil terminal are soldered to the circuit board. The coil terminals and the wiring pattern can be quickly connected to a circuit board or the like.
[0034]
The coil terminal is protruded substantially perpendicular to the longitudinal direction of the magnetic thin film provided in a line, and the wiring pattern is extended substantially perpendicular to the longitudinal direction of the magnetic thin film so that the coil terminal extends in the longitudinal direction of the magnetic thin film. On the other hand, since the circuit board is arranged substantially in parallel, the height of the element in the front and back direction of the circuit board can be reduced.
[0035]
The coil terminals are protruded substantially parallel to the longitudinal direction of the magnetic thin film provided linearly, and the wiring pattern is extended substantially parallel to the longitudinal direction of the magnetic thin film so as to extend in the longitudinal direction of the magnetic thin film. On the other hand, since the circuit board is arranged substantially vertically, the mounting area of the elements occupying the circuit board can be reduced, so that the circuit board can be miniaturized.
[Brief description of the drawings]
FIG. 1 is a plan view of a magneto-impedance effect element of the present invention.
FIG. 2 is a front view of the magneto-impedance effect element of the present invention.
FIG. 3 is a side view of the magneto-impedance effect element of the present invention.
FIG. 4 is a plan view of a nonmagnetic substrate according to the magnetoimpedance effect element of the present invention.
FIG. 5 is a plan view showing a state in which a nonmagnetic substrate is attached to a winding frame according to the magneto-impedance effect element of the present invention.
FIG. 6 is a front view showing a state in which a nonmagnetic substrate is attached to a winding frame according to the magneto-impedance effect element of the present invention.
7 is a cross-sectional view taken along line 7-7 in FIG.
FIG. 8 is a plan view of an insulating substrate according to the magneto-impedance effect element of the present invention.
FIG. 9 is an explanatory diagram showing solder bumps provided on an insulating substrate according to the magneto-impedance effect element of the present invention.
FIG. 10 is an explanatory view showing assembly of the magneto-impedance effect element of the present invention.
FIG. 11 is a front view showing a state in which the magneto-impedance effect element of the present invention is attached to a circuit board.
FIG. 12 is a side view showing a state where the magneto-impedance effect element of the present invention is attached to a circuit board.
FIG. 13 is a plan view illustrating an application example of the present invention.
FIG. 14 is a front view illustrating an application example of the present invention.
FIG. 15 is a side view illustrating an application example of the present invention.
FIG. 16 is a perspective view of a conventional magneto-impedance effect element.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Magneto-impedance effect element 2 Nonmagnetic board | substrate 3 Magnetic thin film 4 Electrode 5 Electrode 6 Winding frame 6a Through-hole 7 ridge part 7a terminal support part 8 ridge part 8a terminal support part 9 coil terminal 10 coil terminal 11 bias coil 11a winding part 12 Insulating substrate 12a Notch 13 Land 14 Land 15 Wiring pattern 15a Connection 16 Wiring pattern 16a Connection 17 Solder bump 17a Solder 17b Protrusion 18 Circuit board 19 Magneto-impedance effect element

Claims (5)

  Electrodes are provided on both ends of the magnetic thin film formed on one surface of the non-magnetic substrate, and the non-magnetic substrate is fitted and attached to a winding frame around which the bias coil is wound. A wiring pattern formed on one surface of an insulating substrate is connected to the electrodes protruding from both ends of the winding frame, the magnetic film is located, and the bias coil is connected to a coil terminal provided on the winding frame. A magneto-impedance effect element characterized by being connected.   A pair of flanges are provided at both ends of the winding frame, a notch is formed in the insulating substrate, and the pair of flanges are fitted into the notch, and the insulating substrate is attached to the winding frame. The magneto-impedance effect element according to claim 1. A winding frame in which the nonmagnetic substrate and the insulating substrate are fitted is mounted on a circuit board, and the coil terminal protrudes from the winding frame, and the wiring pattern extends in the same direction as the protruding direction. 3. A magnetic impedance effect element-mounted circuit board comprising the magneto-impedance effect element according to claim 2 , wherein the wiring pattern and the coil terminal are soldered to the circuit board . The coil terminal is protruded substantially perpendicular to the longitudinal direction of the magnetic thin film provided in a line, and the wiring pattern is extended substantially perpendicular to the longitudinal direction of the magnetic thin film so that the coil terminal extends in the longitudinal direction of the magnetic thin film. 4. The magneto-impedance effect element-mounted circuit board according to claim 3, wherein the circuit board is arranged substantially in parallel. The coil terminals are protruded substantially parallel to the longitudinal direction of the magnetic thin film provided linearly, and the wiring pattern is extended substantially parallel to the longitudinal direction of the magnetic thin film so as to extend in the longitudinal direction of the magnetic thin film. 4. The magneto-impedance effect element-mounted circuit board according to claim 3, wherein the circuit board is arranged substantially vertically.

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